Datasheet Dual Synchronous Buck Converter BD93291EFJ Description The BD93291EFJ is a dual synchronous buck converter. It integrates wide input voltage range (8.0V to 26V) synchronous buck converter and low input voltage (Vout1 : 5.0V) synchronous buck converter. The IC also incorporates a new technology called H3RegTM, a Rohm proprietary control method which facilitates ultra-high transient response against changes in load. SLLM (Simple Light Load Mode) technology is also integrated to improve efficiency when powering lighter loads. For protection and ease of use, the IC also incorporates soft start. Space-saving and high efficient switching regulator can be achieved due to built-in N-MOSFET power transistor in HTSOP-J8 package. Features Dual Synchronous Buck Converter in small package. standby mode ( Istandby = 0uA ) High Voltage Synchronous Buck Converter(Vout1) Wide input range(8.0V to 26V) *absolute voltage 30V H3RegTM DC/DC Converter Controller included Output Current 1.7A *1 FET on resistance High-side 0.175/Low-side 0.175 Internal soft-start function Switching Frequency 300 to 600kHz (*According to input/output conditions) Fixed output voltage (5.0V 1.5%; Normal Mode) Low Voltage Synchronous Buck Converter(Vout2) Input voltage range 5.0V(VOUT1) H3RegTM DC/DC Converter Controller included Output Current 0.5A *1 FET on resistance High-side 0.25/Low-side 0.25 Internal soft-start function Switching Frequency 1.5M to 2.5MHz (*According to input/output conditions) Feedback voltage (0.8V 1.5%; Normal Mode) Protection Circuits Under Voltage Lockout Protection Thermal Shutdown Over Current Protection HTSOP-J8 Package with Exposed thermal PAD. Applications Distributed Power System Pre-Regulator for Linear Regulator Typical Application Circuit VOUT2 C_UP R_DW R_UP *1 Vout1 maximum output current capability is 2.5A, and Vout2 maximum output current capability is 1.5A with the optimal PCB power consumption design. C_CO2 L2 C_CO3 GND 5 FBL 6 VOUT 8 BD93291EFJ C_VC1 Product structureSilicon monolithic integrated circuit www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211114001 2 3 4 BST EN VIN C_BS 1 C_CO1 L1 SW VOUT1 7 Thermal Pad (to be shorted to GND) SWL Structure Silicon Monolithic Integrated Circuit Package HTSOP-J8 6.00mm x 4.90mm x 1.00mm PIN Configuration (TOP VIEW) This product is not designed protection against radioactive rays 1/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet Block Diagram VIN BST EN VREG VREF VREF 14V UVLO1 UVLO TSD TSD VOUT1 VIN VOUT H3RegTM Controller Block DRV DRV LOGIC LVS Vout1(5V, Fix) SW LVS OCP Current Sense FB 0.8V + EN Soft Start TSD UVLO1 VOUT UVLO2 VOUT2 SWL H3RegTM Controller Block FBL DRV DRV Vout2(3.3V) LOGIC 0.8V + OCP EN Soft Start Current Sense UVLO2 TSD GND Pin Assignment and Pin Function No. Symbol Description 1 SW Connect the inductor switching node of high voltage buck converter. This pin is connected to the source node of High side FET and the drain node of Low side FET. 2 BST Connect 0.1uF Boot Strap capacitor between BST pin and SW pin. This capacitor is for generating the driving voltage of High-side N-channel MOSFET. 3 EN This is Enable pin of BD93291EFJ. High input (2.3V typ.) is output active. Low input (1.8V typ.) is IC shutdown. The internal impedance of EN pin is high, therefore add capacitor between EN and GND pin to reduce noise influence when this pin is connected to high-impedance node. 4 VIN Power supply pin of high voltage buck converter. This pin is connected to power FET supply and internal control blocks of high voltage buck converter. Connect to 10uF(recommended value) ceramic capacitor for bias capacitor. 5 GND This pin is Low-side N-channel MOSFET power ground of high voltage buck converter, Low-side N-channel MOSFET power ground of low voltage buck converter and analog ground of other blocks. 6 FBL This pin is output voltage feed-back pin of low voltage buck converter. Refer to ---page regarding the setting of output voltage. 7 SWL Connect the inductor switching node of low voltage buck converter. This pin is connected to the drain node of High side Pch-FET and the drain node of Low side FET. 8 VOUT This pin is power supply pin of low voltage buck converter and output voltage feed-back pin of high voltage buck converter. This pin is connected to power FET supply and internal control blocks of low voltage buck converter. Connect to 10uF(recommended value) ceramic capacitor for bias capacitor. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet Absolute maximum ratings (Ta = 25C) Symbol Rating Unit Supply Voltage 1 VIN 30 V Switch Voltage 1 VSW 30 V Supply Voltage 2 VOUT 7.0 V Switch Voltage 2 VSWL 7.0 Parameter V Power Dissipation for HTSOP-J8 Pd Package thermal resistance ja *2 ja 29.27 /W Package thermal resistance jc *2 jc 3.75 /W Operating Temperature Range Topr -40 to +85 Storage Temperature Range Tstg -55 to +150 Junction Temperature 3760 *1 mW Tjmax 150 BST Voltage VBST VSW+7 V EN Voltage VEN 30 V *1 Derating in done 30.08 mW/ for operating above Ta25(Mount on 4-layer 70.0mmx70.0mmx1.6mm board) *2 Mount on 4-layer 50mm x 30mm x 1.6mm application board Operation Range(Ta= -40 to 85) Symbol Min Typ Max Unit Supply Voltage 1 VIN 8.0 14 26 V Supply Voltage 2 VOUT - 5.0 - V SW Voltage 1 VSW -0.5 - 26 V SW Voltage 2 VSWL -0.5 - 5.5 V Output voltage range 1 (Fixed) Vout1 - 5.0 - V Output voltage range 2 Vout2 0.8 3.3 4.0 V Parameter www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet Electrical characteristics (unless otherwise specified VIN=14V, VOUT1=5V, VOUT2=3.3V Ta=25) Limits Symbol Parameter Min Typ Max Unit Conditions High Voltage Synchronous Buck Converter Output Voltage VOUT1 4.925 5.0 5.075 V 1.5%,normal mode Hi-side FET On-resistance RONH1 - 0.175 - ISW= -0.8A Lo-side FET On-resistance RONL1 - 0.175 - ISW= 0.8A VIN= 26V, VSW = 0V / 26V Hi/Lo-side FET Leak current ILEAK1 - 0 10 A Switch Current Limit ILIMIT1 3.0 - - A Soft-start time VSS1 2.5 5.0 7.5 ms ON Time TON1 635 794 953 ns Minimum Off Time T OFF1 - 200 - ns Fsw1=450kHz(typ) Iout=0.3A Low Voltage Synchronous Buck Converter 1.5%,normal mode Feed-back Voltage VFBL 0.788 0.8 0.812 V FBL input bias current IFBL -1.0 0 1.0 A Hi-side FET On-resistance RONH2 - 0.25 - Lo-side FET On-resistance RONL2 - 0.25 - ISWL= 0.8A VOUT1= 5.5V, VSWL = 0V / 5.5V ISWL= -0.8A Hi/Lo-side FET Leak current ILEAK2 - 0 10 A Switch Current Limit ILIMIT2 2.0 - - A Soft-start time VSS1 1.25 2.5 3.75 ms ON Time TON2 264 330 396 ns Minimum Off Time T OFF3 - 50 - ns IEN 33 56 73 A VEN= 14V Enable Threshold voltage 1 VEN_R 2.2 2.3 2.4 V Rising Enable Threshold voltage 2 VEN_F 1.7 1.8 1.9 V Falling VIN Under Voltage Lockout threshold VUVLO1 7.1 7.5 7.9 V VIN rising VIN Under Voltage Lockout Hysteresis VHYS1 - 1.0 - V VOUT Under Voltage Lockout threshold VUVLO2 2.3 2.5 2.7 V VOUT Under Voltage Lockout Hysteresis VHYS2 - 0.2 - V Circuit Current VIN ICC_VIN - 0.6 1.5 mA ICC_VOUT - 0.6 1.5 mA VOUT= 5.5V, VEN= 14V VFBL= 1.0V, VEN= 14V 5 A VEN= 0V Fsw2=2MHz(typ) Iout=0.2A General Enable Sink current Circuit Current VOUT Standby Current IQUI 0 * This product is not designed for protection against radioactive rays www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/21 VOUT rising TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet Ta=25, VIN=14V, VOUT1=5V, VOUT2=3.3V) 100 100 95 95 90 90 85 85 Efficiency [%] Efficiency [%] Typical Performance Curves (Unless otherwise noted 80 75 70 80 75 70 65 65 60 60 55 55 50 50 10 100 1000 Iout1 [mA] 10000 Figure 4. VOUT1 Efficiency (VIN=14V, L=22H) 1000 Iout2 [mA] 10000 VOUT2(AC) 10mV/div SW 5V/div SWL 2V/div 1sec/div Figure 6. VOUT1 Ripple voltage (VIN=14V, L1=22H, COUT1=22F, Iout=1A) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 100 Figure 5. VOUT2 Efficiency (VOUT1=5V, VOUT2=3.3V, L=2.2H) VOUT1(AC) 50mV/div ISW 1A/div 10 ISWL 1A/div 1sec/div Figure 7. VOUT2 Ripple voltage (VOUT1=5V, VOUT2=3.3V, L2=2.2H, COUT2=22F, Iout=0.3A) 5/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet Typical Performance Curves (Unless otherwise noted Ta=25, VIN=14V, VOUT1=5V, VOUT2=3.3V) (Continued) 5.20 5.20 5.10 5.10 VOUT1 [V] VOUT1 [V] Iout1=10mA 5.00 5.00 4.90 Iout1=1A 4.90 4.80 4.80 0 500 1000 1500 2000 2500 8 10 12 14 16 Iout1 [mA] 18 20 22 24 26 VIN[V] Figure 8. VOUT1 Load Regulation (VIN=14V, L1=22H) Figure 9. VOUT1 Line Regulation (VIN=14V, L1=22H, Iout1=10mA / 1A) 5.20 800 700 Iout1=10mA Frequency [kHz] VOUT1 [V] 5.10 5.00 Iout1=1A 600 500 400 4.90 300 4.80 200 -40 -20 0 20 40 60 80 5 Temperature [] 15 20 25 30 VIN [V] Figure 10. VOUT1 - Temperature (VIN=14V, L1=22H, Iout1=10mA/1A) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10 Figure 11. SW_Frequency - VIN (VIN=14V, L1=22H, Iout1=1A) 6/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet Typical Performance Curves (Unless otherwise noted EN 2V/div Ta=25, VIN=14V, VOUT1=5V, VOUT2=3.3V) (Continued) VOUT1 2V/div VOUT1 2V/div VOUT2 2V/div VOUT2 2V/div EN 2V/div IIN 1A/div IIN 1A/div 4msec/div Figure 12. Start up wave form (VIN=14V, VOUT1=5V, VOUT2=3.3V, L1=22H, L2=2.2H, COUT1=22F, COUT2=2.2F, Iout1=2A, Iout2=1A) 4msec/div Figure 13. Off wave form (VIN=14V, VOUT1=5V, VOUT2=3.3V, L1=22H, L2=2.2H, COUT1=22F, COUT2=2.2F, Iout1=2A, Iout2=1A) VOUT1 (AC) 200mV/div VOUT1 (AC) 200mV/div SW 20V/div Iout1 2A/div SW 20V/div Iout1 0A->2A/10us Iout1 2A->0A/10us 10sec/div Iout1 2A/div 10sec/div 1 Figure 15. VOUT1 Transient Response (VIN=14V, VOUT1=5V, L=22H, COUT=22F) Iout=2->0A (SR=0.2A/sec) Figure 14. VOUT1 Transient Response (VIN=14V, VOUT1=5V, L=22H, COUT=22F) Iout=0->2A (SR=0.2A/sec) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet Typical Performance Curves (Unless otherwise noted Ta=25, VIN=14V, VOUT1=5V, VOUT2=3.3V) (Continued) VOUT2 (AC) 20mV/div VOUT2 (AC) 20mV/div SWL 2V/div SWL 2V/div Iout2 200mA/div Iout2 0A->200mA/10us Iout2 200mA->0A/10us 10sec/div 10sec/div Figure 16. VOUT2 Transient Response (VOUT1=5V, VOUT2=3.3V, L2=2.2H, COUT2=22F), Iout2=0->200mA (SR=20mA/sec) Figure 17. VOUT2 Transient Response (VOUT1=5V, VOUT2=3.3V, L2=2.2H, COUT2=22F), Iout2=200mA->0mA (SR=20mA/sec) VOUT1 2V/div VOUT2 200mV/div SW 20V/div SWL 2V/div Iout1 2A/div 2sec/div Figure 18. VOUT1 OCP function (VIN=14V, VOUT1=5V, VOUT2=3.3V, L1=22H, COUT1=22F) (VOUT1 is shorted to GND) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Iout2 200mA/div Iout2 2A/div 2sec/div Figure 19. VOUT2 OCP function (VIN=14V, VOUT1=5V, VOUT2=3.3V, L2=2.2H, COUT2=22F) (VOUT2 is shorted to GND) 8/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet Ta=25, VIN=14V, VOUT1=5V, VOUT2=3.3V) (Continued) 3.50 3.50 3.40 3.40 3.30 3.30 VOUT2 [V] VOUT2 [V] Typical Performance Curves (Unless otherwise noted 3.20 3.10 3.20 3.10 3.00 3.00 0 500 1000 Iout [mA] 1500 -40 0 20 40 60 80 Temperature [] Figure 20. VOUT2 Load Regulation (VOUT1=5V, L=2.2H) www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 -20 Figure 21. VOUT2 - Temperature (VOUT1=5V, L=2.2H, Iout=1.5A) 9/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet Explanation of Operation The BD93291EFJ is a dual synchronous buck converter incorporating ROHM's proprietary H3RegTM CONTROLLA system. When VOUT1 and VOUT2 drop due to a rapid load change, the system quickly restores VOUT1 and VOUT2 by increasing the frequency. 3 TM 1. H Reg System 1-1. Normal Operation When FB falls below the threshold voltage (REF), a drop is detected, activating the H3RegTM CONTROLLA system. Ton V OUT V IN 1 f [sec] (1) HG (Gate of High side MOSFET) output is determined by the formula (1). LG (Gate of Low side MOSFET) output operates until FB voltage falls below REF voltage after HG becomes OFF. OFF time is restricted by MIN OFF Time ( VOUT1 : 200nsec (typ.), VOUT2 : 50nsec (typ.) ). Hence, BD93291EFJ runs with a constant on-time by using the input and output voltage to set the internal on-time timer. 1-2. VOUT drops due to a rapid load change When FB (VOUT) drops due to a rapid load change and the voltage remains below REF, the system quickly restores VOUT by shortening OFF time of HG (increasing the frequency), improving transient response as shown Figure 22 (b). FB FB REF REF HG Io LG HG LG (a) Normal operation (b) Rapid load change 3 Figure 22. H REG System www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet Timing Chart 1. Soft Start Function Soft start is utilized when the EN pin is set high. Current control takes effect at startup, enabling a moderate "ramping start" on the output voltage. Soft start time of VOUT1 is 5.0msec (typ) and VOUT2 is 2.5ms (typ). EN 5.0ms (typ) 5V(fixed) 2.5V (typ) VOUT1 2.5ms (typ) 3.3V VOUT2 Figure 23. Soft Start Timing Chart Protection Operation 1. OCP Operation Normally, when FB voltage falls below REF voltage, HG becomes high. However, if the peak current through the inductor (IL) exceeds OCP current value (IOCP) during HG=ON, HG become OFF immediately and IL is restricted by IOCP. As the result, the output voltage can decrease as the frequency and duty are changed. When OCP is released in the state that the output has decreased by OCP operation, the output voltage might rise up due to high-speed load response. Figure 24. OCP Timing Chart www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet 2. TSD Operation (Self Recovery) TSD is self-activating. If the junction temperature exceeds Tj = 175, and HG, LG, and SS become Low. The IC becomes standby when TSD operating. When Tj falls below 150, it returns to standard operation. 3. UVLO Operation UVLO operates when VIN voltage falls below 6.5V, and HG and LG become Low. The IC becomes standby when UVLO operating. UVLO is released when VIN goes up to 7.5V, and starts standard operation Selection of Components Externally Connected 1. Output LC Filter Selection (Buck Converter) 1-1. Inductor (L) Selection The Output LC filter is required to supply constant current to the output load. A larger value inductance at this filter results in less inductor ripple current (IL) and less output ripple voltage. However, the larger value inductors tend to have less fast load transient-response, a larger physical size, a lower saturation current and higher series resistance. A smaller value inductance has almost opposite characteristics above. The value of IL is shown as formula (2). The larger value of the inductance or the faster switching frequency make the lower ripple voltage. I L VIN V OUT V OUT L f V IN [A] (2) The proper output ripple current setting is about 30% of maximum output current. IL 0 . 3 IOUTMAX L VIN V OUT V OUT IL f V IN [A] (3) [H] (4) (IL : output ripple currentf : switching frequency) A larger current than the inductor's rated current will cause magnetic saturation in the inductor, and decrease efficiency. When selecting an inductor, be sure to allow enough margins to assure that peak current does not exceed the inductor's rated current value. To minimize loss of inductor and improve efficiency, choose a inductor with a low resistance (DCR, ACR). VIN HG IL VOUT SW L LG IL COUT Figure 25. Inductor Ripple Current www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet 1-2. Output Capacitor (COUT) Selection Output Capacitor (COUT) has a considerable influence on output voltage regulation due to a rapid load change and smoothing output ripple voltage. Determine the capacitor by considering the value of capacity, the equivalent series resistance, and equivalent series inductance. Also, make sure the capacitor's voltage rating is high enough for the set output voltage (including ripple). Output ripple voltage is determined as in formula (5) below. VOUT=IL/(8xCOUTxf)+ESRxIL +ESLxIL / Ton [V] (5) (IL Output ripple currentESR: Equivalent series resistanceESL: Equivalent series inductance) Also, give consideration to the conditions in formula (6) below for output capacitance, bearing in mind that output rise time must be established within the fixed soft start time. As output capacitance, bypass capacitor will be also connected to output load side (CEXT, Figure 26). Please set the over current detection value with regards to these capacitance. C OUT SS IOCP IOUT VOUT [F] (6) (SS : Soft Start time, IOCP : OCP Current Limit, IOUT : Output Current) Note: an improper output capacitor may cause startup malfunctions. VIN HG VOUT SW L ESR Load LG CEXT ESL COUT Figure 26. Output Capacitor 2. Input Capacitor (CIN) Selection In order to prevent transient spikes in voltage, the input capacitor should have a low enough ESR resistance to fully support a large ripple current. The formula for ripple current IRMS is given in equation (7) as below. VIN CIN HG VOUT SW L COUT IRMS IOUT VOUT (VIN VOUT ) LG Where VIN =2xVOUT, IRMS= Figure 27. Input Capacitor [A] VIN (7) IOUT 2 A low ESR capacitor is recommended to reduce ESR loss and improve efficiency. Capacitor Cout between VOUT and GND must be placed near the VOUT pin. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet 3. VOUT2 Output Voltage Setting The IC controls output voltage as REFVFBL. However, the actual output voltage will also reflect the average ripple voltage value. The VOUT2 output voltage is set with a resistor divider from the output node to the FBL pin. The formula for output voltage is given in (8) below: R_UP+RD_W R_DW VOUT2 = x REF +VOUT REF = VFBL(TYP 0.8V) + 0.02 - (ON DUTY x 0.05) ON DUTY = [V] (8) [V] (9) VOUT2 (10) VOUT1 C_UP is needed to feedback output voltage ripple to FBL pin, the value is calculated to C_UP = 11e-6 (+/-30%) R_UP [F] (11) Please refer to eq. (5) regarding VOUT. VOUT1 REF H3RegTM CONTROLLA R Output Voltage VOUT2 Q Driver Circuit S VFBL R_UP C_UP R_DW Figure 28. Output Voltage VOUT2 Setting 4. Relationship between Output Voltage and ONTIME BD93291EFJ is a dual synchronous buck converter controlling constant ONTIME. The ONTIME (Ton) depends on the output voltage settings, as described by the formula (12). Ton www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 VOUT 1 VIN Frequency [sec] 14/21 (12) TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet PCB Layout Guide Two high pulsing current flowing loops exist in the buck regulator system. The first loop, when FET is ON, starts from the input capacitors, to the VIN terminal, to the SW terminal, to the inductor, to the output capacitors, and then returns to the input capacitor through GND. The second loop, when FET is OFF, starts from the low FET, to the inductor, to the output capacitor, and then returns to the low FET through GND. To reduce the noise and improve the efficiency, please minimize these two loop area. Especially input capacitor and output capacitor should be connected to GND plain. PCB Layout may affect the thermal performance, noise and efficiency greatly. So please take extra care when designing PCB Layout patterns. L VIN CIN FET VOUT COUT GND Figure 29. Current loop Buck regulator system The thermal pad on the back side of IC has the great thermal conduction to the chip. So using the GND plain as broad and wide as possible can help thermal dissipation. And a lot of thermal via for helping the spread of heat to the different layer is also effective. The input capacitors (C_VC1 and C_CO3) should be connected as close as possible to the VIN or VOUT terminal. Especially, C_CO3 between VOUT and GND must be placed near the VOUT pin, and keep the distance "b" less than 2mm. When there is unused area on PCB, please arrange the copper foil plain of DC nodes, such as GND, VIN and VOUT for helping heat dissipation of IC or circumference parts. To avoid the noise influence from AC combination with the other line, keep the switching line such as SW and SWL not extend as much as possible, and trace shortly and thickly to coil L1 and L2. Keep sensitive signal traces such as trace connected FBL away from SW and SWL pins. The inductors and the output capacitors should be placed close to SW or SWL pins as much as possible. Keep VOUT pattern width "a" more than 3mm to stable the 5V output. Figure 30. Example of PCB layout pattern www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet List of Evaluation Board Components C_UP VOUT2 R_DW R_UP C_CO2 L2 C_CO3 Thermal Pad (to be shorted to GND) L1 VOUT1 C_VC1 C_BS C_CO1 Figure 31. Typical Application Circuit Recommended Components List (VIN=14V, VOUT1=5V, VOUT2=3.3V) Symbol Part Value Manufacture Series C_VC1 Ceramic Capacitor 10uF murata GRM32DF51H106ZA01L C_BST Ceramic Capacitor 0.1uF murata GRM188F11H104ZA01 L1 Coil 22uH TDK SLF10165 220M 2R4 L2 Coil 2.2uH TDK VLF 4012S 2R2M 1R3 C_CO1 Ceramic Capacitor 22uF murata GRM21BB31A226ME51L C_CO2 Ceramic Capacitor 22uF murata GRM21BB31A226ME51L C_CO3 Ceramic Capacitor 10uF murata GRM21BB31A106ME18 C_UP Ceramic Capacitor 680pF murata GRM1882C1H681JA01 R_UP Resistance 16k ROHM MCR03 1608size Tolerance F R_DW Resistance 5.1k ROHM MCR03 1608size Tolerance F The above components list is an example. Please check actual circuit characteristics on the application carefully before use. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet I/O Equivalence circuit SW BST EN EN VIN VIN REG BST VIN SW SW FBL SWL VOUT VOUT VOUT VOUT VOUT SWL FBL www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 SWL 17/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet Operational Notes (1) Absolute Maximum Ratings Use of the IC in excess of absolute maximum ratings may result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC. (2) GND voltage The potential of the GND pin must be the minimum potential in the system in all operating conditions. (3) Thermal design Use a thermal design that allows for a sufficient margin for power dissipation (Pd) under actual operating conditions (4) Inter-pin Shorts and Mounting Errors Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by poor soldering or foreign objects may result in damage to the IC. (5) Operation in Strong Electromagnetic Fields Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications where strong electromagnetic fields may be present. (6) ASO (Area of Safe Operation) When using the IC, ensure that operating conditions do not exceed absolute maximum ratings or ASO of the output transistors. (7) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. (8) Electrical Characteristics The electrical characteristics indicated in this datasheet may change upon the conditions of temperature, supply voltage, and external components. Please validate/verify your design at the worst case conditions. (9) Not of a radiation-resistant design. (10) Back Electromotive Force If a large inductive load is connected at the output pin that might cause introducing back electromotive force at the start up and at the output disable, please insert protection diodes. OUTPUT PIN Figure 32. Back Electromotive Force (11) Regarding input pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes and/or transistors. For example (refer to the figure below): *When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode *When GND > Pin B, the PN junction operates as a parasitic transistor Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 18/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet Resistor Transistor (NPN) Pin B Pin A C Pin B B E Pin A P N P + P N + N N Parasitic element P + N P substrate Parasitic element B P P + N C E Parasitic element P substrate GND Parasitic element GND GND Other adjacent elements GND Figure 33. Example of IC structure (12) Ground Wiring Pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. Also ensure that the GND traces of external components do not cause variations on GND voltage. (13) Operating Condition The electrical characteristics indicated in this datasheet are not guaranteed for the whole operational and temperature ranges, however these characteristics do not significantly fluctuate within the operational and temperature ranges. (14) Thermal shutdown (TSD) circuit The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used after this function has activated, or in applications where the operation of this circuit is assumed. If the thermal shutdown is activated while the load current exists, the output may possibly be latched off at the release of the thermal shutdown. TSD ON Temp.[] 175 (typ.) Hysteresis Temp[] 25 (typ.) (15) Heat Sink (FIN) The heat sink (FIN) is connected to the substrate. Please connect it to GND. Status of this document The English version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 19/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet POWER DISSIPATION: PD [mW] Thermal Derating Curves 4000 (4)3760mW 3000 (3)2110mW 2000 (2)1100mW 1000 (1)820mW 0 0 50 25 75 100 125 150 AMBIENT TEMPERATURE: Ta [C] Figure 34. Thermal derating curve (HTSOP-J8) HTSOP-J8 Package On 70 70 1.6 mm glass epoxy PCB (1) 1-layer board (Backside copper foil area 0 mm 0 mm) (2) 2-layer board (Backside copper foil area 15 mm 15 mm) (3) 2-layer board (Backside copper foil area 70 mm 70 mm) (4) 4-layer board (Backside copper foil area 70 mm 70 mm) Ordering Information B D 9 3 2 9 Part Number 1 E F J - Package EFJ: HTSOP-J8 E2 Packaging and forming specification E2: Embossed tape and reel Physical Dimension Tape and Reel Information <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin Reel ) Direction of feed Order quantity needs to be multiple of the minimum quantity. Marking Diagram HTSOP-J8(TOP VIEW) Part Number Marking D 9 3 2 9 1 LOT Number 1PIN MARK www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 20/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 BD93291EFJ Datasheet Revision History Date Revision 12.Nov.2012 001 Changes New Release www.rohm.com (c) 2012 ROHM Co., Ltd. All rights reserved. TSZ2211115001 21/21 TSZ02201-0323AAJ00300-1-2 12. Nov. 2012 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. 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The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: ROHM Semiconductor: BD93291EFJ-E2