Case Style WOG
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbols
2W005G 2W01G 2W02G 2W04G 2W06G 2W08G 2W10G
Units
Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V
Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V
Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V
Maximum average forward rectified current at
0.375" (9.5mm) lead length (See Fig 1.) IF(AV) 2.0 A
Peak forward surge current single sine-wave
superimposed on rated load (JEDEC Method) IFSM 60 A
Rating for fusing (t<8.3ms) I2t15A
2sec
Typical thermal resistance per leg (1) RΘJA 40 °C/W
RΘJL 15
Operating junction temperature range TJ-55 to +150 °C
Storage temperature range TSTG -55 to +150 °C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbols
2W005G 2W01G 2W02G 2W04G 2W06G 2W08G 2W10G
Units
Maximum instantaneous forward voltage drop
per leg at 2.0A VF1.1 V
Maximum DC reverse current at rated TA=25°C 5.0
DC blocking voltage per leg TA=125°C IR500 µA
Typical junction capacitance per leg at 4.0V, 1MHz CJ40 20 pF
Notes: (1) Ther mal resistance from junction to ambient and from junction to lead at 0.375" (9.5mm) lead length P.C.B. mounting
Features
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• This ser ies is UL listed under the Recognized
Component Index, file number E54214
• Glass passivated chip junction
• High case dielectric strength
• Typical IRless than 0.5µA
• High surge current capability
• Ideal for printed circuit boards
• High temperature soldering guaranteed:
260°C/10 seconds, 0.375 (9.5mm) lead length,
5lbs. (2.3kg) tension
Mechanical Data
Case: Molded plastic body over passivated junctions
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Mounting Position: Any
Weight: 0.04 oz., 1.1 g
Packaging codes/options:
1/100 EA. per Bulk Bag