MBRB2060CTT4G - ON SEMICONDUCTOR

September, 2014 − Rev. 10 1Publication Order Number:

MBRB2060CT/D

MBRB2060CTG,

MBR2060CTG,

NRVBB2060CTT4G

Switch‐mode

Power Rectifiers

TO−220/D2PAK Surface Mount Power

Package

These state-of-the-art devices employ the use of the Schottky Barrier

principle with a platinum barrier metal.

Features

•Package Designed for Power Surface Mount Applications (D2PAK)

•Center-Tap Configuration (D2PAK)

•Guardring for Stress Protection

•Low Forward Voltage

•175°C Operating Junction Temperature

•Epoxy Meets UL 94 V−0 @ 0.125 in

•Short Heat Sink Tab Manufactured − Not Sheared (D2PAK)

•Similar in Size to Industry Standard TO−220 Package

•NRVBB Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

•These are Pb−Free Devices

Mechanical Characteristics:

•Case: Epoxy, Molded, Epoxy Meets UL 94 V−0

•Weight: 1.7 Grams (Approximately) − D2PAK,

1.9 Grams (Approximately) − TO−220

•Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

•Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds (D2PAK)

•Device Meets MSL1 Requirements (D2PAK)

•ESD Ratings:

♦Machine Model = C (> 400 V)

♦Human Body Model = 3B (> 8000 V)

SCHOTTKY BARRIER

RECTIFIERS

20 AMPERES, 60 VOLTS

http://onsemi.com

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

D2PAK

CASE 418B

STYLE 3

MARKING DIAGRAMS

B2060G

AKA

A = Assembly Location

Y = Year

WW = Work Week

B2060 = Device Code

G = Pb−Free Package

AKA = Diode Polarity

AY WW

TO−220

CASE 221A

STYLE 6

AY WW

B2060G

AKA

MBRB2060CTG, MBR2060CTG, NRVBB2060CTT4G

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MAXIMUM RATINGS (Per Leg)

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

60 V

Average Rectified Forward Current

(Rated VR, TC = 11 0°C) Total Device IF(AV) 10

20 A

Peak Repetitive Forward Current

(Rated VR, Square Wave, 20 kHz, TC = 100°C) IFRM 20 A

Non-Repetitive Peak Surge Current

(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 150 A

Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) IRRM 0.5 A

Storage Temperature Range Tstg −65 to +175 °C

Operating Junction Temperature (Note 1) TJ−65 to +175 °C

Voltage Rate of Change (Rated VR) dv/dt 10,000 V/ms

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be af fected.

1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.

THERMAL CHARACTERISTICS (Per Leg)

Characteristic Symbol Value Unit

Thermal Resistance,

Junction−to−Case

Junction−to−Ambient (Note 2)

MBRB2060CTG

Junction−to−Ambient (Note 2)

MBR2060CTG

RqJC

RqJA

2.0

°C/W

2. When mounted using minimum recommended pad size on FR−4 board.

ELECTRICAL CHARACTERISTICS (Per Leg)

Characteristic Symbol Value Unit

Maximum Instantaneous Forward Voltage (Note 3)

(iF = 20 Amps, TJ = 125°C)

(iF = 20 Amps, TJ = 25°C)

vF0.85

0.95

Maximum Instantaneous Reverse Current (Note 3)

(Rated dc Voltage, TJ = 125°C)

(Rated dc Voltage, TJ = 25°C)

iR35

0.15

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.

ORDERING INFORMATION

Device Package Shipping†

MBRB2060CTG D2PAK

(Pb−Free) 50 Units / Rail

MBRB2060CTT4G D2PAK

(Pb−Free) 800 Units / Tape & Reel

NRVBB2060CTT4G* D2PAK

(Pb−Free) 800 Units / Tape & Reel

MBR2060CTG TO−220

(Pb−Free) 50 Units / Rail

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NRVBB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

MBRB2060CTG, MBR2060CTG, NRVBB2060CTT4G

http://onsemi.com

Figure 1. Typical Forward Voltage Per Diode Figure 2. Typical Reverse Current Per Diode

Figure 3. Typical Current Derating, Case,

Per Leg Figure 4. Average Power Dissipation and

Average Current

0.01

0.1

120100806040200

VR, REVERSE VOLTAGE (VOLTS)

IR, REVERSE CURRENT (mA)

TJ = 150°C

TJ = 125°C

TJ = 100°C

TJ = 25°C

0.5

vF, INSTANTANEOUS VOLTAGE (VOLTS)

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1

iF, INSTANTANEOUS FORWARD CURRENT (AMPS)

TJ = 25°C

100°C

150°C

125°C

AVERAGE CURRENT (AMPS)

2 4 6 8 10 12 14 16 18 20

AVERAGE POWER (WATTS)

TJ = 125°C

SQUARE

WAVE

IPK/IAV = 10

IPK/IAV = 20

IPK/IAV = 5

TC, CASE TEMPERATURE (°C)

100 120 140 160

, AVERAGE FORWARD CURRENT (AMPS)

F(AV)

SQUARE WAVE

RATED VOLTAGE APPLIED

RqJC = 2°C/W

180

5.0

MBRB2060CTG, MBR2060CTG, NRVBB2060CTT4G

http://onsemi.com

PACKAGE DIMENSIONS

SEATING

PLANE

−T−

0.13 (0.005) T

231

3 PL

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.340 0.380 8.64 9.65

B0.380 0.405 9.65 10.29

C0.160 0.190 4.06 4.83

D0.020 0.035 0.51 0.89

E0.045 0.055 1.14 1.40

G0.100 BSC 2.54 BSC

H0.080 0.110 2.03 2.79

J0.018 0.025 0.46 0.64

K0.090 0.110 2.29 2.79

S0.575 0.625 14.60 15.88

V0.045 0.055 1.14 1.40

−B−

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 418B−01 THRU 418B−03 OBSOLETE,

NEW STANDARD 418B−04.

F0.310 0.350 7.87 8.89

L0.052 0.072 1.32 1.83

M0.280 0.320 7.11 8.13

N0.197 REF 5.00 REF

P0.079 REF 2.00 REF

R0.039 REF 0.99 REF

VARIABLE

CONFIGURATION

ZONE RN P

VIEW W−W VIEW W−W VIEW W−W

123

D2PAK 3

CASE 418B−04

ISSUE K

STYLE 3:

PIN 1. ANODE

2. CATHODE

3. ANODE

4. CATHODE

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

8.38

5.080

DIMENSIONS: MILLIMETERS

PITCH

16.155

1.016

10.49

3.504

MBRB2060CTG, MBR2060CTG, NRVBB2060CTT4G

http://onsemi.com

PACKAGE DIMENSIONS

TO−220

CASE 221A−09

ISSUE AH

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION Z DEFINES A ZONE WHERE ALL

BODY AND LEAD IRREGULARITIES ARE

ALLOWED.

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.570 0.620 14.48 15.75

B0.380 0.415 9.66 10.53

C0.160 0.190 4.07 4.83

D0.025 0.038 0.64 0.96

F0.142 0.161 3.61 4.09

G0.095 0.105 2.42 2.66

H0.110 0.161 2.80 4.10

J0.014 0.024 0.36 0.61

K0.500 0.562 12.70 14.27

L0.045 0.060 1.15 1.52

N0.190 0.210 4.83 5.33

Q0.100 0.120 2.54 3.04

R0.080 0.110 2.04 2.79

S0.045 0.055 1.15 1.39

T0.235 0.255 5.97 6.47

U0.000 0.050 0.00 1.27

V0.045 --- 1.15 ---

Z--- 0.080 --- 2.04

123

SEATING

PLANE

−T−

STYLE 6:

PIN 1. ANODE

2. CATHODE

3. ANODE

4. CATHODE

UBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MBRB2060CT/D

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your loc

Sales Representative

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