June 2017
DocID11497 Rev 2
1/11
This is information on a product in full production.
www.st.com
STTH212
High voltage ultrafast diode
Datasheet - production data
Features
Low forward voltage drop
High reliability
High surge current capability
Soft switching for reduced EMI disturbances
Planar technology
Description
This device is an ultrafast diode based on a high
voltage planar technology, it is perfectly suited for
freewheeling, clamping, snubbering,
demagnetization in power supplies and other
power switching applications.
Housed in SMB and SMC packages, this diode
reduces the losses in high switching frequency
operations.
Table 1: Device summary
Symbol
IF(AV)
2 A
VRRM
1200 V
Tj
175 °C
VF (typ.)
1.0 V
trr (max.)
75 ns
K
A
SMB KSMC
A
K
A
Characteristics
STTH212
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DocID11497 Rev 2
1 Characteristics
Table 2: Absolute ratings (limiting values per diode at 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
1200
V
V(RMS)
RMS voltage
850
V
IF(AV)
Average forward current δ = 0.5,
square wave
SMB
Tlead = 90 °C
2
A
SMC
Tlead = 105 °C
IF(RMS)
RMS forward current
10
A
IFSM
Forward surge current tp = 8.3 ms
40
Tstg
Storage temperature range
-50 to +175
°C
Tj
Maximum operating junction temperature
175
°C
Table 3: Thermal parameters
Symbol
Parameter
Maximum
Unit
Rth(j-l)
Junction to lead
SMB
25
°C/W
SMC
20
Table 4: Static electrical characteristics (per diode)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
IR
Reverse leakage current
Tj = 25 °C
VR = VRRM
-
10
µA
Tj = 125 °C
-
100
VF
Forward voltage drop
Tj = 25 °C
IF = 2 A
-
1.75
V
Tj = 125 °C
-
1.07
1.50
Tj = 150 °C
-
1.0
-
To evaluate the conduction losses, use the following equation:
P = 1.26 x IF(AV) + 0.12 x IF2(RMS)
Table 5: Dynamic characteristics
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
trr
Reverse recovery
time
Tj = 25 °C
IF = 1 A;
dIF/dt = -100 A/μs;
VR = 30 V
-
-
75
ns
tfr
Forward recovery
time
Tj = 25 °C
IF = 2 A;
dIF/dt = 50 A/μs;
VFR = 1.1 x VFmax
-
-
500
VFP
Forward recovery
voltage
-
-
30
V
STTH212
Characteristics
DocID11497 Rev 2
3/11
1.1 Characteristics (curves)
Figure 1: Conduction losses versus average
forward current
Figure 2: Forward voltage drop versus forward
current
Figure 3: Relative variation of thermal impedance
junction to ambient versus pulse duration (Epoxy
printed circuit board FR4, SCU = 1 cm2)
Figure 4: Relative variation of thermal impedance
junction to ambient versus pulse duration (Epoxy
printed circuit board FR4, SCU = 1 cm2)
Figure 5: Reverse recovery current versus dIF/dt
(typical values)
Figure 6: Reverse recovery time versus dIF/dt
(typical values)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50
IF(AV)(A)
P(W)
δ=0.05 δ=0.1 δ=0.2 δ=0.5 δ=1
T
δ= tp/T tp
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
tp(s)
SMB
Scu = 1 cm²
Zth(j-a)/Rth(j-a)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
tp(s)
SMC
Scu = 1 cm²
Zth(j-a)/Rth(j-a)
0
1
2
3
4
5
6
7
8
9
10
11
0 20 40 60 80 100 120 140 160 180 200
dIF/dt(A/µs)
IRM(A)
VR= 600 V
Tj= 125 °C IF= 2 x IF(AV)
IF= 0.5 x IF(AV)
IF= IF(AV)
0
100
200
300
400
500
600
700
800
900
0 50 100 150 200 250 300 350 400 450 500
dIF/dt(As)
tRR(ns)
VR= 600 V
Tj= 125 °C
IF= 0.5 x IF(AV)
IF= 2 x IF(AV)
IF= IF(AV)
Characteristics
STTH212
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DocID11497 Rev 2
Figure 7: Reverse recovery charges versus dIF/dt
(typical values)
Figure 8: Softness factor versus dIF/dt
(typical values)
Figure 9: Relative variations of dynamic
parameters versus junction temperature
Figure 10: Transient peak forward voltage versus
dIF/dt (typical values)
Figure 11: Forward recovery time versus dIF/dt
(typical values)
Figure 12: Junction capacitance versus reverse
voltage applied (typical values)
0
200
400
600
800
1000
1200
1400
0 50 100 150 200 250 300 350 400 450 500
dIF/dt(A/µs)
QRR(nC)
VR= 600 V
Tj= 125 °C
IF= IF(AV)
IF= 0.5 x IF(AV)
IF= 2 x IF(AV)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0 25 50 75 100 125 150 175 200 225 250
dIF/dt(A/µs)
SFACTOR
IF= IF(AV)
VR= 600 V
Tj= 125 °C
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
0 10 20 30 40 50 60 70 80 90 100
dIF/dt(A/µs)
VFP(V)
IF= IF(AV)
Tj= 125 °C
200
220
240
260
280
300
320
340
360
380
400
420
0 20 40 60 80 100
dIF/dt(A/µs)
tFR(ns)
IF= IF(AV)
VFR = 1.1 x VFmax.
Tj= 125 °C
1
10
100
1 10 100 1000
VR(V)
C(pF)
F = 1 MHz
Vosc = 30 mVRMS
Tj= 25 °C
STTH212
Characteristics
DocID11497 Rev 2
5/11
Figure 13: Thermal resistance junction to ambient versus copper surface under each lead
(Epoxy printed circuit board FR4, eCU = 35 μm)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SCu(cm²)
Rth(j-a)C/W)
SMB
SMC
Package information
STTH212
6/11
DocID11497 Rev 2
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Epoxy meets UL94, V0
2.1 SMB package information
Figure 14: SMB package outline
STTH212
Package information
DocID11497 Rev 2
7/11
Table 6: SMB package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.0748
0.0965
A2
0.05
0.20
0.0020
0.0079
b
1.95
2.20
0.0768
0.0867
c
0.15
0.40
0.0059
0.0157
D
3.30
3.95
0.1299
0.1556
E
5.10
5.60
0.2008
0.2205
E1
4.05
4.60
0.1594
0.1811
L
0.75
1.50
0.0295
0.0591
Figure 15: SMB recommended footprint
millimeters
(inches)
1.62
0.064 1.62
0.064
2.60
(0.102)
5.84
(0.230)
2.18
(0.086)
Package information
STTH212
8/11
DocID11497 Rev 2
2.2 SMC package information
Figure 16: SMC package outline
Table 7: SMC package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.0748
0.0965
A2
0.05
0.20
0.0020
0.0079
b
2.90
3.20
0.1142
0.1260
c
0.15
0.40
0.0059
0.0157
D
5.55
6.25
0.2185
0.2461
E
7.75
8.15
0.3051
0.3209
E1
6.60
7.15
0.2598
0.2815
E2
4.40
4.70
0.1732
0.1850
L
0.75
1.50
0.0295
0.0591
STTH212
Package information
DocID11497 Rev 2
9/11
Figure 17: SMC recommended footprint
millimeters
(inches)
1.54
(0.061) 1.54
(0.061)
5.11
(0.201)
8.19
(0.323)
3.14
(0.124)
Ordering information
STTH212
10/11
DocID11497 Rev 2
3 Ordering information
Table 8: Ordering information
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STTH212U
U22
SMB
0.110 g
2500
Tape and reel
STTH212S
S12
SMC
0.243 g
2500
Tape and reel
4 Revision history
Table 9: Document revision history
Date
Revision
Changes
28-Jun-2005
1
First issue
12-Jun-2017
2
Updated cover image.
Removed DO-201AD package.
STTH212
DocID11497 Rev 2
11/11
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