www.ti.com
FEATURES
Seemechanicaldrawingsfordimensions.
DCTPACKAGE
(TOP VIEW)
DCUPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
1VCC
8
1A
27
3Y 1Y
3 6
2A 3A
45
GND 2Y
3 6 3A2A
8
1VCC
1A
5
GND 42Y
271Y3Y
GND 5
42Y
3 6 3A2A
271Y3Y
8VCC
1
1A
DESCRIPTION/ORDERING INFORMATION
SN74LVC3G17TRIPLE SCHMITT-TRIGGER BUFFER
SCES470D – AUGUST 2003 – REVISED FEBRUARY 2007
•Available in the Texas Instruments •I
off
Supports Partial-Power-Down ModeNanoFree™ Package Operation•Supports 5-V V
CC
Operation •Latch-Up Performance Exceeds 100 mA PerJESD 78, Class II•Inputs Accept Voltages to 5.5 V
•ESD Protection Exceeds JESD 22•Max t
pd
of 5.4 ns at 3.3 V
– 2000-V Human-Body Model (A114-A)•Low Power Consumption, 10- µA Max I
CC
– 200-V Machine Model (A115-A)• ± 24-mA Output Drive at 3.3 V
– 1000-V Charged-Device Model (C101)•Typical V
OLP
(Output Ground Bounce) <0.8 Vat V
CC
= 3.3 V, T
A
= 25 °C•Typical V
OHV
(Output V
OH
Undershoot) >2 Vat V
CC
= 3.3 V, T
A
= 25 °C
This triple Schmitt-trigger buffer is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC3G17 contains three buffers and performs the Boolean function Y = A. The device functions asthree independent buffers but, because of Schmitt action, it may have different input threshold levels forpositive-going (V
T+
) and negative-going (V
T–
) signals.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as thepackage.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74LVC3G17YZPR _ _ _C7_0.23-mm Large Bump – YZP (Pb-free)–40 °C to 85 °C
SSOP – DCT Reel of 3000 SN74LVC3G17DCTR C17_ _ _VSSOP – DCU Reel of 3000 SN74LVC3G17DCUR C17_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.DCU: The actual top-side marking has one additional character that designates the assembly/test site.YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one followingcharacter to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, •= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
1A 1Y
1 7
2A 2Y
3 5
3A 3Y
6 2
Absolute Maximum Ratings
(1)
SN74LVC3G17
TRIPLE SCHMITT-TRIGGER BUFFER
SCES470D – AUGUST 2003 – REVISED FEBRUARY 2007
FUNCTION TABLE(EACH INVERTER)
INPUT OUTPUTA Y
H HL L
LOGIC DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 6.5 VV
I
Input voltage range
(2)
–0.5 6.5 VV
O
Voltage range applied to any output in the high-impedance or power-off state
(2)
–0.5 6.5 VV
O
Output voltage range
(2) (3)
–0.5 V
CC
+ 0.5 VI
IK
Input clamp current V
I
< 0 –50 mAI
OK
Output clamp current V
O
< 0 –50 mAI
O
Continuous output current ±50 mAContinuous current through V
CC
or GND ±100 mADCT package 220θ
JA
Package thermal impedance
(4)
DCU package 227 °C/WYZP package 102T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.(3) The value of V
CC
is provided in the recommended operating conditions table.(4) The package thermal impedance is calculated in accordance with JESD 51-7.
2
Submit Documentation Feedback
www.ti.com
Recommended Operating Conditions
(1)
SN74LVC3G17TRIPLE SCHMITT-TRIGGER BUFFER
SCES470D – AUGUST 2003 – REVISED FEBRUARY 2007
MIN MAX UNIT
V
CC
Supply voltage Operating 1.65 5.5 VV
I
Input voltage 0 5.5 VV
O
Output voltage 0 V
CC
VV
CC
= 1.65 V –4V
CC
= 2.3 V –8I
OH
High-level output current –16 mAV
CC
= 3 V
–24V
CC
= 4.5 V –32V
CC
= 1.65 V 4V
CC
= 2.3 V 8I
OL
Low-level output current 16 mAV
CC
= 3 V
24V
CC
= 4.5 V 32T
A
Operating free-air temperature –40 85 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3Submit Documentation Feedback
www.ti.com
Electrical Characteristics
Switching Characteristics
SN74LVC3G17
TRIPLE SCHMITT-TRIGGER BUFFER
SCES470D – AUGUST 2003 – REVISED FEBRUARY 2007
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP
(1)
MAX UNIT
1.65 V 0.79 1.16V
T+
2.3 V 1.11 1.56Positive-going
3 V 1.5 1.87 Vinput threshold
4.5 V 2.16 2.74voltage
5.5 V 2.61 3.331.65 V 0.39 0.62V
T–
2.3 V 0.58 0.87Negative-going
3 V 0.84 1.14 Vinput threshold
4.5 V 1.41 1.79voltage
5.5 V 1.87 2.291.65 V 0.37 0.622.3 V 0.48 0.77∆V
THysteresis 3 V 0.56 0.87 VV
T+
– V
T–
4.5 V 0.71 1.045.5 V 0.71 1.11I
OH
= –100 µA 1.65 V to 5.5 V V
CC
– 0.1I
OH
= –4 mA 1.65 V 1.2I
OH
= –8 mA 2.3 V 1.9V
OH
VI
OH
= –16 mA 2.43 VI
OH
= –24 mA 2.3I
OH
= –32 mA 4.5 V 3.8I
OL
= 100 µA 1.65 V to 5.5 V 0.1I
OL
= 4 mA 1.65 V 0.45I
OL
= 8 mA 2.3 V 0.3V
OL
VI
OL
= 16 mA 0.43 VI
OL
= 24 mA 0.55I
OL
= 32 mA 4.5 V 0.55I
I
V
I
= 5.5 V or GND 0 to 5.5 V ±1µAI
off
V
I
or V
O
= 5.5 V 0 ±5µAI
CC
V
I
= 5.5 V or GND, I
O
= 0 1.65 V to 5.5 V 10 µAOne input at V
CC
– 0.6 V,∆I
CC
3 V to 5.5 V 500 µAOther inputs at V
CC
or GNDC
I
V
I
= V
CC
or GND 3.3 V 4 pF
(1) All typical values are at V
CC
= 3.3 V, T
A
= 25 °C.
over recommended operating free-air temperature range, C
L
= 30 pF or 50 pF (unless otherwise noted) (see Figure 2 )
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 V V
CC
= 5 VFROM TO
±0.15 V ±0.2 V ±0.3 V ±0.5 VPARAMETER UNIT(INPUT) (OUTPUT)
MIN MAX MIN MAX MIN MAX MIN MAX
t
pd
A Y 4.3 9.2 2 6.2 1.2 5.4 1 4.1 ns
4
Submit Documentation Feedback
www.ti.com
Operating Characteristics
SN74LVC3G17TRIPLE SCHMITT-TRIGGER BUFFER
SCES470D – AUGUST 2003 – REVISED FEBRUARY 2007
T
A
= 25 °C
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 V V
CC
= 5 VPARAMETER TEST CONDITIONS UNITTYP TYP TYP TYP
C
pd
Power dissipation capacitance f = 10 MHz 18 19 19 22 pF
5Submit Documentation Feedback
www.ti.com
PARAMETER MEASUREMENT INFORMATION
th
tsu
FromOutput
UnderTest
C
(seeNote A)
L
LOADCIRCUIT
S1
VLOAD
Open
GND
RL
DataInput
TimingInput
0V
0V
0V
tW
Input
0V
Input
Output
Waveform1
S1atV
(seeNoteB)
LOAD
Output
Waveform2
S1atGND
(seeNoteB)
VOL
VOH
0V
»0V
Output
Output
t /t
PLH PHL Open
TEST S1
Output
Control
VM
VMVM
VM
VM
1.8V 0.15V±
2.5V 0.2V±
3.3V 0.3V±
5V 0.5V±
1MW
1MW
1MW
1MW
VCC RL
2× VCC
2× VCC
6V
2× VCC
VLOAD CL
15pF
15pF
15pF
15pF
0.15V
0.15V
0.3V
0.3V
VD
3V
VI
VCC/2
VCC/2
1.5V
VCC/2
VM
£2ns
£2ns
£2.5ns
£2.5ns
INPUTS
RL
t /t
r f
VCC
VCC
VCC
VLOAD
t /t
PLZ PZL
GND
t /t
PHZ PZH
VOLTAGEWAVEFORMS
ENABLE ANDDISABLETIMES
LOW- ANDHIGH-LEVEL ENABLING
VOLTAGEWAVEFORMS
PROPAGATIONDELAY TIMES
INVERTING ANDNONINVERTINGOUTPUTS
NOTES: A. C includesprobeandjigcapacitance.
B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutputcontrol.
Waveform2isforanoutputwithinternalconditionssuchthattheoutputishigh,exceptwhendisabledbytheoutputcontrol.
C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR 10MHz,Z =50 .
D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement.
E. t andt arethesameast .
F. t andt arethesameast .
G. t andt arethesameast .
H. Allparametersandwaveformsarenotapplicabletoalldevices.
L
O
PLZ PHZ dis
PZL PZH en
PLH PHL pd
£ W
VOLTAGEWAVEFORMS
PULSEDURATION
VOLTAGEWAVEFORMS
SETUP ANDHOLDTIMES
VI
VI
VI
VM
VM
V /2
LOAD
tPZL tPLZ
tPHZ
tPZH
V – V
OH D
V +V
OL D
VM
VMVM
VM
VOL
VOH
VI
VI
VOH
VOL
VM
VM
VM
VM
tPLH tPHL
tPLH
tPHL
SN74LVC3G17
TRIPLE SCHMITT-TRIGGER BUFFER
SCES470D – AUGUST 2003 – REVISED FEBRUARY 2007
Figure 1. Load Circuit and Voltage Waveforms
6
Submit Documentation Feedback
www.ti.com
PARAMETER MEASUREMENT INFORMATION
th
tsu
FromOutput
UnderTest
C
(seeNote A)
L
LOADCIRCUIT
S1
VLOAD
Open
GND
RL
DataInput
TimingInput
0V
0V
0V
tW
Input
0V
Input
Output
Waveform1
S1atV
(seeNoteB)
LOAD
Output
Waveform2
S1atGND
(seeNoteB)
VOL
VOH
0V
»0V
Output
Output
TEST S1
t /t
PLH PHL Open
Output
Control
VM
VMVM
VM
VM
1.8V 0.15V±
2.5V 0.2V±
3.3V 0.3V±
5V 0.5V±
1kW
500 W
500 W
500 W
VCC RL
2× VCC
2× VCC
6V
2× VCC
VLOAD CL
30pF
30pF
50pF
50pF
0.15V
0.15V
0.3V
0.3V
VD
3V
VI
VCC/2
VCC/2
1.5V
VCC/2
VM
£2ns
£2ns
£2.5ns
£2.5ns
INPUTS
RL
t /t
r f
VCC
VCC
VCC
VLOAD
t /t
PLZ PZL
GND
t /t
PHZ PZH
VOLTAGEWAVEFORMS
ENABLE ANDDISABLETIMES
LOW- ANDHIGH-LEVEL ENABLING
VOLTAGEWAVEFORMS
PROPAGATIONDELAY TIMES
INVERTING ANDNONINVERTINGOUTPUTS
NOTES: A. C includesprobeandjigcapacitance.
B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutputcontrol.
Waveform2isforanoutputwithinternalconditionssuchthattheoutputishigh,exceptwhendisabledbytheoutputcontrol.
C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR 10MHz,Z =50 .
D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement.
E. t andt arethesameast .
F. t andt arethesameast .
G. t andt arethesameast .
H. Allparametersandwaveformsarenotapplicabletoalldevices.
L
O
PLZ PHZ dis
PZL PZH en
PLH PHL pd
£ W
VOLTAGEWAVEFORMS
PULSEDURATION
VOLTAGEWAVEFORMS
SETUP ANDHOLDTIMES
VI
VI
VI
VM
VM
V /2
LOAD
tPZL tPLZ
tPHZ
tPZH
V – V
OH D
V +V
OL D
VM
VMVM
VM
VOL
VOH
VI
VI
VOH
VOL
VM
VM
VM
VM
tPLH tPHL
tPLH
tPHL
SN74LVC3G17TRIPLE SCHMITT-TRIGGER BUFFER
SCES470D – AUGUST 2003 – REVISED FEBRUARY 2007
Figure 2. Load Circuit and Voltage Waveforms
7Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com 5-Mar-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74LVC3G17DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC3G17DCTRE4 ACTIVE SM8 DCT 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC3G17DCTRG4 ACTIVE SM8 DCT 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC3G17DCUR ACTIVE US8 DCU 8 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM
SN74LVC3G17DCURE4 ACTIVE US8 DCU 8 TBD Call TI Call TI
SN74LVC3G17DCURG4 ACTIVE US8 DCU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC3G17YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 5-Mar-2012
Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC3G17DCUR US8 DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3
SN74LVC3G17YZPR DSBGA YZP 8 3000 180.0 8.4 1.02 2.02 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC3G17DCUR US8 DCU 8 3000 202.0 201.0 28.0
SN74LVC3G17YZPR DSBGA YZP 8 3000 220.0 220.0 34.0
PACKAGE MATERIALS INFORMATION
www.ti.com 15-Aug-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
0,60
0,20
0,25
0°– 8°
0,15 NOM
Gage Plane
4188781/C 09/02
4,25
5
0,30
0,15
2,90 3,75
2,70
8
4
3,15
2,75
1
0,10
0,00
1,30 MAX
Seating Plane
0,10
M
0,13
0,65
PIN 1
INDEX AREA
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion
D. Falls within JEDEC MO-187 variation DA.
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated