© August 2009 Altera Corporation MAX II Device Handbook
6. Reference and Ordering Information
Software
MAX® II devices are supported by the Altera® Quartus® II design software with new,
optional MAX+PLUS® II look and feel, which provides HDL and schematic design
entry, compilation and logic synthesis, full simulation and advanced timing analysis,
and device programming. Refer to the Design Software Selector Guide for more
details about the Quartus II software features.
The Quartus II software supports the Windows XP/2000/NT, Sun Solaris, Linux Red
Hat v8.0, and HP-UX operating systems. It also supports seamless integration with
industry-leading EDA tools through the NativeLink interface.
Device Pin-Outs
Printed device pin-outs for MAX II devices are available on the Altera website
(www.altera.com).
Ordering Information
Figure 6–1 describes the ordering codes for MAX II devices. For more information
about a specific package, refer to the Package Information chapter in the MAX II Device
Handbook.
Figure 6–1. MAX II Device Packaging Ordering Information
Package Type
T:
F: Thin quad flat pack (TQFP)
FineLine BGA
240:
570:
1270:
2210:
Speed Grade
Family Signature
EPM: MAX II
Operating Temperature
Pin Count
Device T ype
240 Logic Elements
570 Logic Elements
1,270 Logic Elements
2,210 Logic Elements
ES:
Optional Suffix
Engineering sample
Indicates specific device
options or shipment method
3, 4, 5, 6, 7, or 8, with 3 being the fastest
Number of pins for a particular package
C:
I:
A:
Commercial temperature (TJ = 0° C to 85° C)
Industrial temperature (TJ = -40° C to 100° C)
Automotive temperature (TJ = -40° C to 125° C)
EPM 240 G T 100 C 3 ES
Product-Line Suffix
G:
Z:
Blank (no identifier):
Indicates device type
1.8-V VCCINT low-power device
1.8-V VCCINT zero-power device
2.5-V or 3.3-V VCCINT device
N: Lead-free packaging
M: Micro FineLine BGA
MII51006-1.6
6–2 Chapter 6: Reference and Ordering Information
Referenced Documents
MAX II Device Handbook © August 2009 Altera Corporation
Referenced Documents
This chapter references the following document:
■Package Information chapter in the MAX II Device Handbook
Document Revision History
Table 6–1 shows the revision history for this chapter.
Table 6 –1 . Document Revision History
Date and Revision Changes Made Summary of Changes
August 2009,
version 1.6
■Updated Figure 6–1. Added information for speed
grade –8
October 2008,
version 1.5
■Updated New Document Format. —
December 2007,
version 1.4
■Added “Referenced Documents” section.
■Updated Figure 6–1.
Updated document with
MAX IIZ information.
December 2006,
version 1.3
■Added document revision history. —
October 2006,
version 1.2
■Updated Figure 6-1. —
June 2005,
version 1.1
■Removed Dual Marking section. —
