STPS340U/S/B
November 1998 Ed:5A
POWER SCHOTTKY RECTIFIER
Single chip Schottky rectifier suited for Switch
Mode Power Supplies and high frequency DC to
DCconverters.
Packaged in SMB, SMC and DPAK this device is
intended for use in low and medium voltage
operation, high frequency inverters, free wheeling
and polarity protection applications where low
switching lossesare required.
DESCRIPTION
SMB
STPS340U
VERYSMALLCONDUCTION LOSSES
NEGLIGIBLESWITCHING LOSSES
LOWFORWARD VOLTAGEDROP
LOWTHERMALRESISTANCE
EXTREMELYFAST SWITCHING
SURFACE MOUNTED DEVICE
Symbol Parameter Value Unit
VRRM Repetitivepeak reversevoltage 40 V
IF(RMS) RMSforward current DPAK 6A
SMB/ SMC 10
IF(AV) Averageforwardcurrent Tc= 135°Cδ= 0.5 DPAK
3
A
TL=105°Cδ = 0.5 SMB/ SMC
IFSM Surgenon repetitiveforward
current tp = 10 msSinusoidal 75 A
IRRM Peakrepetitivereverse current tp = 2 µs F = 1kHzsquare 1A
Tstg Storagetemperaturerange - 65 to + 150 °C
Tj Maximumoperatingjunctiontemperature + 150 °C
dV/dt Criticalrateof riseof reverse voltage 10000 V/µs
ABSOLUTE RATINGS (limiting values)
SMC
STPS340S
K
A
NC
DPAK
STPS340B
IF(AV) 3A
V
RRM 40 V
Tj (max) 150 °C
VF(max) 0.57 V
MAINPRODUCT CHARACTERISTICS
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Symbol TestsConditions Tests Conditions Min. Typ. Max. Unit
IR*Reverseleakagecurrent Tj=25°CV
R
=V
RRM 20 µA
Tj = 125°CV
R
=V
RRM 210mA
V
F
*
Forward voltagedrop Tj=25°CI
F
=3A 0.63 V
Tj=25°CI
F
=6A 0.84
Tj = 125°CI
F
=3A 0.52 0.57
Tj = 125°CI
F
=6A 0.63 0.72
STATIC ELECTRICAL CHARACTERISTICS
Pulse test : * tp = 380 µs, δ<2%
To evaluate the maximum conduction lossesuse the following equation :
P = 0.42 x IF(AV) + 0.050 IF2(RMS)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
0.0
0.5
1.0
1.5
2.0
2.5
IF(av) (A)
PF(av)(W)
T
δ=tp/T tp
δ=1
δ= 0.5
δ= 0.2
δ= 0.1
δ= 0.05
Fig. 1: Average forward power dissipation versus
averageforward current.
0 25 50 75 100 125 150
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Tamb(°C)
IF(av)(A)
Rth(j-a)=65°C/W Rth(j-a)=Rth(j-l)
(SMB/SMC)
Rth(j-a)=Rth(j-c)
(DPAK)
T
δ=tp/T tp
Fig. 2: Average current versus ambient
temperature =0.5).
Symbol Parameter Value Unit
Rth (j-l) Junctionto leads SMC 20 °C/W
SMB 25
Rth (j-c) Junctionto case DPAK 5.5 °C/W
THERMAL RESISTANCES
STPS340U/S/B
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1E-3 1E-2 1E-1 1E+0
0
1
2
3
4
5
6
7
8
9
10
t(s)
IM(A)
Ta=25°C
Ta=50°C
Ta=100°C
IM
t
δ=0.5
Fig.3-1:Non repetitivesurgepeakforwardcurrent
versus overload duration (SMB) (Maximum
values).
1.0E-2 1.0E-1 1.0E+0 1.0E+1 1.0E+2 1.0E+3
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
tp(s)
Zth(j-a)/Rth(j-a)
Printed circuit board (e=35µm)
T
δ=tp/T tp
Single pulse
δ= 0.1
δ= 0.2
δ= 0.5
Fig. 4-1: Relative variation of thermal transient
impedance junction to lead versus pulse duration
(SMB).
1E-3 1E-2 1E-1 1E+0
0
2
4
6
8
10
12
Ta=25°C
Ta=50°C
Ta=100°C
t(s)
IM(A)
IM
t
δ=0.5
Fig.3-2:Non repetitivesurgepeakforwardcurrent
versus overload duration (SMC) (Maximum
values).
1E-3 1E-2 1E-1 1E+0
0
10
20
30
40
50
Tc=25°C
Tc=50°C
Tc=100°C
t(s)
IM(A)
IM
t
δ=0.5
Fig.3-3:Non repetitivesurgepeakforwardcurrent
versus overload duration (DPAK) (Maximum
values).
1.0E-2 1.0E-1 1.0E+0 1.0E+1 1.0E+2 1.0E+3
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
tp(s)
Zth(j-a)/Rth(j-a)
T
δ=tp/T tp
Printed circuit board (e=35µm)
Single pulse
δ= 0.1
δ= 0.2
δ= 0.5
Fig. 4-2: Relative variation of thermal transient
impedance junction to lead versus pulse duration
(SMC).
1E-3 1E-2 1E-1 1E+0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
tp(s)
Zth(j-a)/Rth(j-a)
T
δ=tp/T tp
Printed circuit board (e=35µm)
Single pulse
δ= 0.1
δ= 0.2
δ= 0.5
Fig. 4-3: Relative variation of thermal transient
impedance junction to lead versus pulse
duration(DPAK).
STPS340U/S/B
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12 51020 50
10
20
50
100
200
500
VR(V)
C(pF)
F=1MHz
Tj=25°C
Fig. 6: Junction capacitance versus reverse
voltageapplied.(Typicalvalues)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
0.01
0.10
1.00
10.00 IFM(A)
Typicalvalues
Tj=150°C
Tj=125°C
VFM(V)
Fig. 7: Forward voltage drop versus forward
current.(Maximumvalues)
0 5 10 15 20 25 30 35 40
1E-5
1E-4
1E-3
1E-2
VR(V)
IR(A)
Tj=125°C
Tj=100°C
Tj=75°C
Tj=150°C
Fig. 5: Reverse leakage current versus reverse
voltageapplied.(Typicalvalues)
012345
0
20
40
60
80
100
120
S(Cu) (cm )
Rth(j-a) (°C/W)
Fig. 8-1: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuitboardFR4,copperthickness:35µm)(SMB).
012345
0
20
40
60
80
100 Rth(j-a) (°C/W)
S(Cu)
(cm )
Fig. 8-2: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuitboardFR4,copperthickness:35µm)(SMC).
0 2 4 6 8 10 12 14 16 18 20
0
20
40
60
80
100 Rth(j-a) (°C/W)
S(Cu)
(cm )
Fig. 8-3: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuitboardFR4,copperthickness:35µm)(DPAK).
STPS340U/S/B
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PACKAGE MECHANICAL DATA
DPAK
REF.
DIMENSIONS
Millimeters Inches
Min. Typ. Max Min. Typ. Max.
A 2.20 2.40 0.086 0.094
A1 0.90 1.10 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035
B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397
L2 0.80 0.031
L4 0.60 1.00 0.023 0.039
V2 0°8°0°8°
6.7
6.7
6.7
3
1.61.6
2.32.3
FOOTPRINTDIMENSIONS (inmillimeters)
STPS340U/S/B
5/7
PACKAGE MECHANICAL DATA
SMB
E
C
L
E1
D
A1
A2
b
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.41 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.60 0.030 0.063
1.52 2.75
2.3
1.52
FOOTPRINT DIMENSIONS(inmillimeters)
STPS340U/S/B
6/7
PACKAGE MECHANICAL DATA
SMC
E
C
L
E2
E1
D
A1
A2
b
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 2.90 3.2 0.114 0.126
c 0.15 0.41 0.006 0.016
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
D 5.55 6.25 0.218 0.246
L 0.75 1.60 0.030 0.063
2.0 4.2 2.0
3.3
FOOTPRINTDIMENSIONS(inmillimeters)
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Orderingtype Marking Package Weight Base qty Deliverymode
STPS340U U34 SMB 0.107g 2500 Tapeand reel
STPS340S S34 SMC 0.243g 2500 Tape and reel
STPS340B S340 DPAK 0.30g 75 Tube
STPS340B-TR S340 DPAK 0.30g 2500 Tapeand reel
Bandindicatescathodeon SMB,SMC
Epoxymeets UL94,V0
STPS340U/S/B
7/7