Application Notes for Tantalum Solid Electrolytic Capacitor
(Hermetically sealed capacitors in metal case)
1. Operating Voltage
Tantalum Solid Electrolytic Capacitor shall be operated at the rated voltage or lower.
Rated voltage: The “rated voltage” refers to the maximum DC voltage that is allowed to be continuously applied between the capacitor
terminals at the rated temperature.
Surge voltage: The “surge voltage” refers to the voltage that is allowed to be instantaneously applied to the capacitor at the rated
temperature or the maximum working temperature. The capacitor shall withstand the voltage when a 30-second cycle of application of
the voltage through a 1000 Ω series resistance is repeated 1000 times in 6-minute periods.
When designing the circuit, the equipment’s required reliability must be considered and appropriate voltage derating must be
performed. Figure 1 shows the recommended voltage derating curve for Tantalum capacitors as described by NASA APPLICATION
NOTES.
2. Application that contain AC Voltage
Special attention to the following 3 items.
(1) The sum of the DC bias voltage and the positive peak value of the AC voltage should not exceed the rated voltage.
(2) Reverse voltage should not exceed the allowable values of the negative peak AC voltage.
(3) Ripple current should not exceed the allowable values.
3. Reverse Voltage
Tantalum solid electrolytic capacitor is polarity. Please do not impress reverse voltage. As well, please confirm the potential of the tester
beforehand when both ends of the capacitor are checked with the tester etc.
4. Permissible Ripple Voltage
Permissible ripple voltage is determined by the heat loss of the element and heat radiation of the lead wire. This is influenced by
capacitance, ESR, operating temperature, and frequency or ripple. Please consult Matsuo’s Engineering Bulletin for details on
calculating ripple current values.
5. Application on low-impedance circuit
The failure rate of low impedance circuit at 0.1Ω/V is about five times greater than that of a 1Ω/V circuit. To curtail this higher failure
rate, tantalum capacitors used in low impedance circuits, such as filters for power supplies, particularly switching power supplies, or for
noise by-passing, require that operating voltage be derated to less than half of the rated voltage. Actually, less than 1/3 of the rated
voltage is recommended.
6. Non Polar Application(BACK TO BACK)
Tantalum capacitors can be used as a non-polar unit if two capacitors are connected “BACK-TO-BACK” when reserve voltage is
applied at a more than permissible value, or in a purely AC circuit. The two capacitors should both be of the same rated voltage and
capacitance tolerance, and they should both be twice the required capacitance value.
Ripple Voltage: Permissible Ripple Voltage shall not exceed the value allowed for either
C1 or C2 (This will be the same, as the capacitors should be identical.)
Capacitance: (C1 × C2) / (C1 + C2)
Leakage Current: If terminal A is (+), the Leakage Current will be equal to C1’s Leakage Current.
If terminal B is (+), the Leakage Current will be equal to C2’s Leakage Current.
7. Soldering
The soldering of Type 112 should be operated per the following recommended conditions.
(1) Flow Soldering (Direct heating from the substrate)
Solder temperature: 260°C or less
Dipping time: 10 s
Note1: Noted that solder part of hermetic could be melted If soldering temperature is too high or dipping time is too long for the operation.
(2) Soldering with a Soldering Iron
8.Example of trouble phenomenon happening by excessive heating when soldering
When mounting, the following breakdown phenomena might be caused when excessive heating that exceeds the above-mentioned
tolerance is done. Therefore, please pay attention to the operation.
In a case that solder is used for cathode connection of molding type product, Ag in silver paste could merge into solder if solder in
product have melted. That might cause excessive Leakage Current and Short etc. by changing in deterioration in DF and the high
frequency impedance or internal stresses in that case.
Mechanical stress according to heat stress and expansion shrinkage or concentrations of internal stress might increase failure rate.
Defect sealing could sometimes come for solder melting in seal entrance part of Type 112. Or, solder flows, might become a bridge
between inside and outside circles of the Hermetic seal, be good at the solder grain if inhaled, and the phenomenon such as a short
or intermittent shorts be caused.