@ om TAO | Series | High-density Packaging System Connectors for Hi-PAS Mounting HP5 - 6 Series C-G* > Series HM Overview The HP5 Series and C-Gxx Series of Hi-PAS (High-density Packaging System) mounting connectors were developed to meet the demands of the high performance and trend toward high-density packaging of communications equipment. @ Features HP5 6 Series Compared with the contemporary PCN11M Series (of DS mounting connectors), the mounting density is approximately 1.5 times higher in terms of number of contacts and higher densities are planned. Package-side connectors are of a 3-stage sequenced structure in consideration of a circuit protection function. Through holes of the BWB and contact pins can be mounted without solder. Socket contacts make contact on both surfaces for high reliability. The through hole diameter and the rear surface contact diameter differ with the terminal board type and the box type and so their selection for a particular use should take into consideration such factors as pattern accommodation, wrapping quality, and the placement process. e Connectors for use with C-G* cables are of the U-groove batch pressure welding connection system which offers excellent wiring workability (including planned automatic wiring) and connection reliability. e Pressure welding work is of the loose wire pressure welding method which enables easy changes of the wiring form e.g., lead number changes, etc. e Asimple lock system which does not use tools is employed for connector assembly and permits assembly of all parts (excluding wiring work). e The lock operation of the connectors is a front-panel operation which permits high-density mounting. ( HM Applications Exchange equipment, transmission equipment, measuring instruments, control equipment, etc. rmee High-density Packaging System lS HM Diagram of Connector Mounting Conditions e : | | | | | HP5 6 Series) (<@ WM HP5~6 Series Function Diagram PKG HP5-3% S-1,27DS HP6-%S-1.27DS HP5-% P-1.27W HP5-* P-1,27C BWB <@ CLL ZL? LLLLLLLLLLAL LLL LLL LLL LLLLL : t ill ' HP5 terminal board C-GK XK HK C-Gs* connector CX-%% connectorwu High-density Packaging System | Mi Mixed Use of Optical Connectors Example 1 PKG 60 = NJoo OO OO) oo HMUB-L8PA-1 HP5-75P-1.27DS HP5-75P-1.27W or HP5-75P-1.27C HP5-terminal board 75% HMUB-L8HA-1 a HMUB-L8HB-1 BWB | C-G26HC C-G26HD C-Gx connector CX-3 connector Mi Mixed Use of Optical Connectors Example 2 PKG llc} 5-6 oo HMUB-L2PA-1 HP5-1235-1.27DS HP5-123P-1.27W or HP5-123P-1.27C HP5-terminal board 123% 0 O0 HMUB-L2HA-1 HMUB-L2HB-1 Bp CLLEGE LLL LEE EEL LLL BWB C-G34HA C-G34HB C-G%x connector CX-% > connector j| M@ Major Specifications HP5 6 Series Item Specification Remarks Mounting spacing 15.24 mm * Maximum of 567 contacts with 300-mm high package * System: without rows C and E, without rows : Number of contacts 189, 123, or 75 contacts A, C, and E, without rows A, B, C, and E BWB 2.54 mm irregular 6-row PKG staggered matrix Contact arrangement i BWB Press-fit connection See (1) next page ; Contact connections @ PKG Solder connection See (2) next page i Contact wiring Wrapping connection 0.26 mm dia. leads Insertion force 147 N max. 189 contacts Number of insertions/removals| 60 times, max. Not conducting Rated curren 08.8 With 160 contacts conducting and & nominal Connection resistance 40 mQ or less Including conductor resistance Insulation resistance 100 MQ or greater 500 V DC 500 V AC for 1 minute Withstand voltage without irregularities 1) Press-Fit Connections (a) Terminal board type Board conditions ........... Board thickness 2.4 +0.25 mm (HP5 terminal board *A, HP5 terminal board C) 3.2 0.25 mm (HP5 terminal board B) @ Through holes Cutting diameter: 0.65 mm +0.02 mm Finished diameter: 0.55 mm +383 mm Plating: Cu 30 to 70u 1.2740.05 6.3540.05 N 0.5575:03 @ Number of Contacts P N Board Reference Diagram 189 78.74 | 189 h 123 50.8 123wae High-density Packaging System es | (b) Box type (HP5-*P-1.27W) Board conditions ............ Board thickness 2.4 0.25 mm or greater Through holes Cutting diameter: 0.65 mm +0.02 mm, 1mm +0.02 mm Finished diameter: 0.55 mm +338 mm, 0.9 mm +0.05 mm Plating: Plating: Cu 30 to 70u P+0.1 1.2740.05 1.27+0.05 6.3540.05 FEDCBA N 0.5570:83 M 40.90.05 Rows A, B, C, and E Rows D and F Board Reference Diagram Number of Contacts P N M 189 78.74 125 64 123 50.8 81 42 75 30.48 49 26 (c) Box type (HP5-189PB-1.27W) Board conditions ............ Board thickness 2.4 +0.25 mm or greater Through holes Cutting diameter: 0.65 mm +0.02 mm, 1mm +0.02 mm Finished diameter: 0.55 mm +282 mm, 0.9 mm +0.05 mm Plating: Cu 30 to 70u 78.740.1 1,270.05 I othe t 1,27+0.05 6.35+0.05 ~- -- -- by FEDCBA eh r , +0.02 59:03 93- 90.5 9640.9+0.05 Rows A, C, and E Rows B, D and F@ 2) Solder Connections (HP5-S-1.27DS and HP6-S-1.27DS) Through holes Board conditions Board end 5.08+0.05 1.27+0.05 263.2+40.05 Finished diameter: 0.7 mm +0.05 mm N-0.740.05 Contact expansion forward 2 rows forward 2 rows 2 rows Suitable cable conductor diameter 0.4 mm 0.4 mm 0.4 mm Wiring system U-groove pressure welding connection U-groove pressure welding connection U-groove pressure welding connection 0.4 mm FRPE 64 pair Cable clamp system Caulking system Caulking system Suitable cable 0.4 mm 2 pair Office cable 0.26 mm 12 pair AC bus cable 0.4 mm 8 pair AC bus cable AC bus cable Metal clamp Metal clamp Metal clamp Caulking system Rated current 1A/contact, max. 6A/connector, max. 1A/contact, max. 18A/connector, max. 1A/contact, max. 6A/connector, max. Contact resistance 30 mQ, max. 30 mQ, max. 30 mQ, max. Insulation resistance 100 MQ or greater 100 MQ or greater 100 MQ or greater Withstand voltage 500 V AC rms 500 V AC rms 500 V AC rms Applications Connections between units and between racks Connections between units and between racks Connections between units and between racks Board Reference Diagram Number of Contacts P L N 189 78.74 86.36 189 123 50.8 58.42 123 75 30.48 38.1 75 Mi Major Specifications C-Gx > Series Item C-G6FA C-G18FA C-G26FA Number of contacts 6 18 26 Mounting spacing 15.24 15.24 15,24 2.54 mm - 2.54 mm 2.54 mm forwardpum High-density Packaging System ~ G Item C-G26FB CXR-26FA C-Ji8FNEY-01(08) C-J18FNET-01(08) Number of contacts 26 26 18 18 Mounting spacing 15.24 15.24 15.24 15.24 2.54 mm 2.54 mm 2.54 mm 2.54 mm Contact expansion forward 2 rows forward 2 rows forward 3 rows forward 3 rows Suitable cable conductor diameter 0.4 mm 0.4 mm 0.4 mm 0.4 mm Wiring system U-groove pressure welding connection U-groove pressure welding connection U-groove pressure welding connection U-groove pressure welding connection Suitable cable 0.4 mm FRPE 64 pair Office cable 0.4 mm 2 pair, 8 pair, and 12 pair AC bus cable 26-conductor ribbon cable (AWG 28) 18-conductor twisted lead cable (AWG 28) 0.4 mm 2 pair, and 8 pair AC bus cable Cable clamp system Nylon clamp Caulking system Metal clamp Caulking system Nylon clamp Caulking system Nyton clamp Caulking system Rated current 1A/contact, max. 18A/connector, max. 1A/contact, max. 6A/connector, max. 1A/contact, max. 18A/connector, max. 1A/contact, max. 6A/connector, max. Contact resistance 30 mQ, max. 30 mQ, max. 30 mQ, max. 30 mQ, max. Insulation resistance 100 MQ or greater 100 MQ or greater 100 MQ or greater 100 MQ or greater Withstand voltage 500 V AC rms 500. V AC rms 500 V AC rms 500 V AC rms Applications Connections between units and between racks Connections between units and between racks Connections between units and between racks Connections between units and between racksItem CX50-6FA CX50-26FA CX75-26FA Number of contacts 6 26 26 Mounting spacing 15,24 15.24 15.24 2.54 mm 2.54 mm 2.54 mm Contact expansion forward 2 rows forward 2 rows forward 2 rows Suitable cable conductor diameter 0.26 mm 0.26 mm 0.26 mm Wiring system U-groove pressure welding connection U-groove pressure welding connection U-groove pressure welding connection 50Q coaxial 50Q coaxial 75Q coaxial Suitable cable Ribbon cable Ribbon cable Ribbon cable (AWG 30) (AWG 30) (AWG 30) Metal clamp Metal clamp Metal clamp Cable clamp system Caulking system Caulking system Caulking system Rated current 1A/contact, max. 3A/connector, max. 1A/contact, max. 6A/connector, max. 1A/contact, max. 6A/connector, max. Contact resistance 30 mQ, max. 30 mQ, max. 30 MQ, max. Insulation resistance 100 MQ or greater 100 MQ or greater 100 MQ or greater Withstand voltage 500 V AC rms 500 V AC rms 500 V AC rms Applications Connections between units and between racks Connections between units and between racks Connections between units and between racksM Materials and Processing HP5 - 6 Series Material Processing Insulation | PBT resin Brown | HPS Series . . , Contacts Beryllium copper pana oti (Die monvect parts) PKG-side planing wep P connectors Insulation PBT resin Black HP6 Series Contacts Copper allo Partial gold plating (Contact parts} PP Y Solder plating (Dip parts) Insulation PBT resin Brown Terminal board} " Black (Only for board thickness of 3.2 mm) type BWB-side Contacts Copper alloy Gold plating connectors Insulation PBT resin Brown Box type Contacts Copper alloy Gold plating C-GX * Series Material Processing Connector body PBT resin Brown and black Cable connectors Cover Polycarbonate resin Beige Contacts Beryllium copper Partial gold plating Housing Insulation Polycarbonate resin BeigeMi BWB (Back Wiring Board)-Side Connectors 87.5 @HP5-189P-1.27W 62X1.27=78.74 CL587-0011-0 - 1,27 Row a < Lt x os f= K Row f p| 0l-4---------~ Pin No, -------~~-~- wo] % on et o Hl a 7X10.16=71.12 x t un =) Pall IMI AI a | ! > j N o 6 et Ss eee - - - - YO 2.54 122.54=30.48 12.7 12X2.54=30,48 t 1 @HP5-123P-1.27W 59.56 CL587-0060-0 40 1,27=50.8 1.27 Row a x Dee EEE IS x = ere? 2 eee = | kK Row f 5 01-+--| Pin No..---4 + 41 U3] om ie] 10.16 & 410.16=40.64 x ww =) PALIN dad =_ I AAS p 1 N S ea gS ee 4 ee 2.54 3X2.54=7,62 | 12.7 12X2.54=30.48 1mm High-density Packaging System @ HP5-75P-1.27W 50.04 CL587-0065-0 24 1,27=30.48 1.27 Row a ~ wee om ST [5 01--4 =~ Pin No---+25 & " 10.16 | x 2X10.16=20.32 | co 1 x A Aliit -f .t | 2.54 2.54 12X2,54=30.48 @HP5-189PB-1.27W | CL587-0118-4 = 87.5 J 62X1.27=78.74 8 1.27 x Row a { eee -- -- -- -- -- ~o oe 8 Ml et l o oe -- - -- - -- - ~-oee 31X2.54=78.74@HP5 Terminal Board 189% (@ Ki . Row a 12X2.54=30.48 12.7 | 12X2.54=30.48 | | 2.54 2.54 ) _ it IAN HA xl ] L f < | a ee | 1.27 _{f1.27 / 62X1.27=78.74 5X1.27=6.35. i HRS No. Product No. A Board Thickness 587-0004-5 HP5 Terminal Board 189A 13.3 T=2.4 @ 587-0053-0 HP5 Terminal Board 189B 14.1 T=3.2 @HP5 Terminal Board 189C CL587-0117-1 ! Row a az || | {f.27 62X1,.27=78.74 5X1.27=6.35 13men High-density Packaging System @HP5 Terminal Board 123 Row a 3X2.54=7.62 254 2.54 o . | is ---- arnan ill IATA ii in] ] _ ] { | 1.27 1.27 401.27=50.8 5X1,27=6.35) HRS No. Product No. A Board Thickness 587-0017-7 HP5 Terminal Board 123A 13.3 T=2.4 587-0073-8 HPS Terminal Board 123B 14.1 T33.2 @HP5 Terminal Board 75% =n, a 12X2,54=30.48 2.54 2.54 15.5 < 1.27 24X1,27=30.48 27 5X1.27=6.35(_ HRS No. Product No. A Board Thickness 587-0018-0 HP5 Terminal Board 75A 13.3 T=2.4 587-0081-6 HP5 Terminal Board 75B 14.1 T33.2 |a is ! i | 1 @HP5->xP-1.27C (Used in Conjunction with a Terminal Board Connector) 14.34 6.35 1.27 5X1.27 on LZ HRS No. Product No. Number of Contacts A B Cc 587-0019-2 HP5-75P-1.27C 75 39,24 30.48 20.32 587-0020-1 HP5-123P-1,27C 123 59.56 50.80 40.64 587-0012-3 HP5-189P-1.27C 189 87.50 78.74 7412une High-density Packaging System Mi PKG (Package)-Side Socket Connectors @ HP5- S-1.27DS 3 A t 10.16 & > x TT aa ox = = ~ oS TT = = Ss = = 1.27 10 21.5 4.03 fh [7 Y =_ eo) | a -o- * 2, 5.08 Oo It = III boaae I q Heat nr hae q q HRS No. Product No. Number of Contacts A B c D E Configuration 587-0014-9 HP5-75S-1.27DS 75 30.32 | 3048 | 34.01 | 38.10 | 41.74 Table 1 ; 587-0015-1 HP5-1238-1.27DS 123 40.64 | 5080 | 6433 | 58.42 | 62.06 Table 2 587-0010-8 HP5-189S-1.27DS 189 71.12 | 7874 | 9227 | 8636 | 90.00 Table 3 | Pin Configuration Table Table 1 No.| 1.3 5 7 911 13 15 17 19 21 Row 2.4 6 8 10 12 14 16 18 20 Row _a 20222222222 Row b 3.3 3 3 3 3 3 3 3 3 3 Row 2222222222 Row_d 3.3 3 3 3 33 3 3 3 3 Row e 29121212 12 1 Row f 3.3.3 3 3 3.3 3 3 3 3 Table 2 No.}| 1.3 5 7 9 11 13 16 17 19 21 23 25 27 29 31 33 35 37 39 41 Row 2.4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 | Row a 2022222222222 2222222 22 | Row b 3.3.93 333 3 3 393 3 333 3 3 3 3 3 3 3 Row _ 202222222222 22 22222 2 2 Row d 393,93 3 3 3.3 3.3 3 3 33:3 3:33 3:3 3 3 Row _e 20121 2%12712i712 121212 i121 Row f 3.333 3.3 3 3 3 3 333 33 3 3 3 3 3 3 Table 3 N oo] 13 5 7 adh 2 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 Row 2.4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 Row a a a Row _b 39393 333 3 33 3333333333333 3333 33 33 3 3 Row _c 2029222222 2222222222222 2222222222 Row_d 393.3 3 33 3 333333 3 333 33333 3 33 33 333 3 3 Row e 12012412 12712721 21271271212 121212 i1241 Row f 3.3 3 3 3 3 33 3 3 3333333 3 333333 3 3 3 3 3 3 3 3Mi PKG-Side Low Cost Socket Connectors @HP6-189S-1.27DS CL587-0501-0 7X10.16=71.12 10.02 62X1.27=78.74 82.27 Pin Configuration Table No.| 1.3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 Row 2.4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 Row a 2.2 2222222222222 2222222 22222222 2 Row b 3.393.333 33333333333 33333333 3333 3 3 *3 Row 2222222222222 22222222222222 2 2222 Row d 3.3 3 3 3 3:3 3 3 3 3 333333 3 333333333 33 3 3:3 Row e 12072057291 271271212171 212 i12i12i12 i541 212i12~21 Row f 3.3 333 3.3 3 3 3 3 3333 33 33333 33333 33 3 3 3 NOTE: Contact order of the pins is 1, 2, 3. 17pum High-density Packaging System @ HP5-BP-GK(A) CL587-0112-8 ] al NOTE: One package contains 25 pieces. @HP5-PKG-GK(A) CL587-0113-0 2.5 NOTE: One package contains 25 pieces. 18Mi Backplane Housing @HP5-96PA-2.54BP CL587-0034-6 78.74 31 X 2.54 93 83.41 == Hd be ir abd hh}-----------2-2------ Asa ASR BR ye PTT TTT TT froseescre HR a Aa RR TUTTTTTE 89 19r : uum High-density Packaging System 20 @ Backplane Function Diagram vedere VW uisne = [Oo HP -189S-1.27DS HP5-189PB-1.27W Insulation BWB(T=2.4) ws SSS F | Aeannngas TTT TT ee anannane | UAE NNO | LW LL LIT Z SS 7 \ Ke Ss J emer ili MT ee RINKS = SSS SSS SSB SSS SSS STS Aa Pua tat Wun nd PH Wi ay PMU LL LL Wuyi 4 HP5-96PA-2.54BP PCN11M>X-96S-2.54DS off]. . Ill oO \ Mount fittingM@ HP5-96PA-2.54BP Mount Fitting A mount fitting of the dimensions indicated in the diagram below should be prepared when mounting the HP5-96PA-2.54BP. $3.3 ll NOTE: The height dimension (6-85) of the mount fitting is the height from the surface of the printed board. For example, when there are patterns or pads on the mount fitting mounting surface of the board, mount with a piece of insulation in between. The height from the surface of the printed board should also be specified as 6-8, in this situation. Mount fitting Insulation Printed board 21m, rTigh-density Packaging System H@ Cable Connectors @C-G6FA (f f ib 4 E 4.2 (4.5) (19) 27.5 Cable clamp 35.5 Po =a. 12.5 ( 1 12 2.54X410.16 . 54 Pin No. 3A y | Pin No. 1A Y & q | ! Product No. HRS No. C-G6FA CL206-5086-8 @C-G18FA Mottle Cable clamp Motte Pin No. 9B processing processing 2.54 . 35.5 [, 7.3 / Pin No. 9A oth 7 HE | / s ba ! J as 7 base 7 0 : i coo exles 4 -