SPLPL90-3 - OSRAM Opto Semiconductors

SPL PL90_3

Nanostack Impuls-Laserdiode im Plastikgehäuse 75 W Spitzenleistung

Nanostack Pulsed Laser Diode in Plastic Package 75 W Peak Power

Lead (Pb) Free Product - RoHS Compliant

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Besondere Merkmale

• Kostengünstiges Plastikgehäuse

• Zuverlässiges InGaAs/GaAs kompressiv

verspanntes Halbleiter-Material

• Hochleistungslaser mit „Large-Optical-Cavity“

(LOC) Struktur für ein schmales Fernfeld

• Nanostack Lasertechnologie beinhaltet

mehrere epitaktisch integrierte Emitter

• Austrittsöffnung 200 μm × 10 μm

Anwendungen

• Entfernungsmessung

• Sicherheit, Überwachung

• Beleuchtung, Zündung

• Test- und Messsystem e

Sicherheitshinweise

Je nach Betriebsart emittieren diese Bauteile

hochkonzentrierte, nicht sichtbare Infrarot-

Strahlung, die gefährlich für das menschliche

Auge sein kann. Produkte, die diese Bauteile

enthalten, müssen gemäß den Sicherheits-

richtlinien der IEC-Norm 60825-1 behandelt

werden.

Typ

Type

Emitteranzahl

Number of Emitters

Opt. Spitzenaus-

gangsleistung

Opt. Peak Power

Wellenlänge

Wavelength

Bestellnummer

Ordering Code

SPL PL90_3 375 W 905 nm Q62702P5353

Features

• Low cost plastic package

• Reliable strained InGaAs/GaAs material

• High power large-optical-cavity (LOC) structure

for a narrow far-field

• Nanostack laser technology including multiple

epitaxially stacked emitters

• Laser aperture 200 μm × 10 μm

Applications

• Range finding

• Security, surveillance

• Illumination, ignition

• Test and measurement systems

Safety Advices

Depending on the mode of operation, these

devices emit highly concentrated non visible

infrared light which can be hazardous to the

human eye. Products which incorporate these

devices have to follow the safety precautions

given in IEC 60825-1 “Safety of laser products”

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SPL PL90_3

Grenzwerte (kurzzeitiger Betrieb) (TA = 25 °C)

Maximum Ratings (short time operation)

Parameter

Parameter Symbol

Symbol Werte

Values Einheit

Unit

min. max.

Spitzenausgangsleistung

Peak output power Ppeak – 90 W

Spitzendurchlaßstrom

Peak forward current IF–40 A

Pulsbreite (Halbwertsbreite)

Pulse width (FWHM) tp–100 ns

Tastverhältnis

Duty cycle d.c. –0.1 %

Sperrspannung

Reverse voltage VR–3V

Betriebstemperatur

Operating temperature Top - 40 + 85 °C

Lagertemperatur

Storage temperature Tstg - 40 + 100 °C

Löttemperatur

(tmax = 10 s, 2 mm von Gehäuseunterseite)

Soldering temperature

(tmax = 10 s, 2 mm from bottom edge of case)

Ts–+ 260 °C

SPL PL90_3

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Optische Kennwerte (TA = 25 °C)

Optical Char acteristics

Parameter

Parameter Symbol

Symbol Werte

Values Einheit

Unit

min. typ. max.

Zentrale Emissionswellenlänge1)

Emission wavelength1) λpeak 895 905 915 nm

Spektralbreite (Halbwertsbreite)1)

Spectr al width (FWHM )1) Δλ – 7 – nm

Spitzenausgangsleistung1)

Peak output power1) Pop 65 75 85 W

Schwellstrom

Threshold current Ith 0.5 0.75 1.0 A

Betriebsspannung1)

Operating voltage1) Vop 8 9 11 V

Minimale Anstiegs- und Abfallzeit

(10% …90%)

Minimum rise and fall time (10% … 90%)

tr, tf– 1 – ns

Austrittsöffnung

Aperture size w × h– 200 × 10 –μm

Strahldivergenz (Halbwertsbreite)

Beam divergence (FWHM) θ|| × θ⊥–11° × 25° –Grad

deg.

Temperaturkoeffizient der Wellenlänge

Temperature coefficient of wavelength ∂λ / ∂T–0.28 –nm/K

Temperaturkoeffizient der opt.

Ausgangsleistung

Temperature coefficient of optical power

∂Pop/Pop∂T–-0.4 –%/K

Thermischer Widerstand

Thermal resistance Rth JS –160 –K/W

1) Standardbetriebsbedingungen beziehen sich auf eine Pulsbreite von 100 ns bei einer Frequenz von 1 kHz und

einem Betriebsstrom von 30 A bei TA = 25 °C.

Standard operating conditions refer to pulses of 100 ns pulse width at 1 kHz rate with 30 A operating current at

TA = 25 °C.

SPL PL90_3

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Optical output power Popt and forward voltage

VF vs. forward current IF (TA = 25 °C)

Far-field distribution parallel to junction

Irel vs. θ|| (TA = 25 °C, Popt = 75 W)

Optical spectrum, relative intensity Irel vs.

wavelength λ (TA = 25 °C, Popt = 75 W)

Far-field distribution perpendicular to

junction Irel vs. θ⊥ (TA = 25 °C, Popt = 75 W)

OHF00564

10 20 30 40 50

100

120

opt

Deg-30

0.25

0.50

0.75

rel

1.00 OHL00755

-20 -10 0 10 30

880

OHF00565

0.25

0.50

0.75

1.00

Ιrel

nm890 900 910 930

OHL00756

-40

0.25

0.50

0.75

1.00

Deg

rel

-30 -20 -10 0 10 20 40

SPL PL90_3

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Maßzeichnung

Package Outlines

Maße in mm (inch) / Dimensions in mm (inch).

4.2 (0.165)

5.0 (0.197)

27.0 (1.063)

29.0 (1.142)

1.8 (0.071)

1.2 (0.047)

spacing

2.54 (0.100) mm

0.4 (0.016)

0.6 (0.024)

0.8 (0.031)

0.4 (0.016)

Cathode Chip position

Area not flat

5.5 (0.217)

5.9 (0.232)

Bottom view

0.4 (0.016)

0.6 (0.024)

Chip position

GEOY6066

3.5 (0.138)

0.1 (0.004) ... 0.7 (0.028)

5.1 (0.201)

4.8 (0.189)

1.7 (0.067)

3.7 (0.146)

1.9 (0.075)

ø0.3

Detail X Detail Y

5˚

2007-04-04 6

SPL PL90_3

Published by

OSRAM Opto Semiconductors GmbH

Wernerwerkstrasse 2, D-93049 Regensburg

www.osram-os.com

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organization.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components 1 , may only be used in life-supp ort devices or systems 2 with the express written approval of OSRAM OS.

1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected

to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.

2 Life support devices or syste ms are intended (a) to be implanted in the human body, o r (b) to support and/or maintain

and sustain human life. If they fail, it is reas onable to assume that the health of the user may be endangered.