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74LVC04A
Hex inverter
Product specification
Supersedes data of 1997 Mar 28
IC24 Data Handbook
1997 Jun 30
INTEGRATED CIRCUITS
Philips Semiconductors Product specification
74LVC04A
Hex inverter
2
1997 Jun 30 853-1953 18162
FEATURES
•Wide supply range of 1.2V to 3.6V
•Complies with JEDEC standard no. 8-1A
•Inputs accept voltages up to 5.5V
•CMOS low power consumption
•Direct interface with TTL levels
•5-volt tolerant inputs, for interfacing with 5-volt logic
DESCRIPTION
The 74LVC04A is a high-performance, low-power, low-voltage,
Si-gate CMOS device and superior to most advanced CMOS
compatible TTL families.
Inputs can be driven from either 3.3 V or 5 V devices. This feature
allows the use of these devices as translators in a mixed 3.3 V/5 V
environment.
The 74LVC04A provides six inverting buffers.
QUICK REFERENCE DATA
GND = 0 V ; Tamb = 25°C; tr = tf 2.5 ns
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
tPHL/tPLH Propagation delay
nA to nY CL = 50 pF;
VCC = 3.3 V 2.5 ns
CIInput capacitance 5.0 pF
CPD Power dissipation capacitance per gate Note s 1 and 2 25 pF
NOTES:
1. CPD is used to determine the dynamic power dissipation (PD in µW)
PD = CPD VCC2 x fi  (CL VCC2 fo) where:
fi = input frequency in MHz; CL = output load capacity in pF;
fo = output frequency in MHz; VCC = supply voltage in V ;
(CL VCC2 fo) = sum of the outputs.
2. The condition is VI = GND to VCC.
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER
14-Pin Plastic SO –40°C to +85°C74LVC04A D 74LVC04A D SOT108-1
14-Pin Plastic SSOP Type II –40°C to +85°C74LVC04A DB 74LVC04A DB SOT337-1
14-Pin Plastic TSSOP Type I –40°C to +85°C74LVC04A PW 74LVC04APW DH SOT402-1
PIN CONFIGURATION
1
2
3
4
5
6
7
1A
1Y
2A
2Y
3A
3Y
GND
VCC
6A
6Y
5A
5Y
4A
4Y
14
13
12
11
10
9
8
SV00396
PIN DESCRIPTION
PIN NUMBER SYMBOL NAME AND FUNCTION
1, 3, 5, 9, 11, 13 1A to 6A Data inputs
2, 4, 6, 8, 10, 12 1Y to 6Y Data outputs
7 GND Ground (0 V)
14 VCC Positive supply voltage
Philips Semiconductors Product specification
74LVC04A
Hex inverter
1997 Jun 30 3
LOGIC SYMBOL
1A 1Y
2A 2Y
3A 3Y
4A 4Y
5A 5Y
6A 6Y
1
3
5
9
11
13
2
4
6
8
10
12
SV00397
LOGIC SYMBOL (IEEE/IEC)
12
34
56
98
11 10
13 12
1
1
1
1
1
1
SV00398
LOGIC DIAGRAM (ONE GATE)
AY
SV00399
FUNCTION TABLE
INPUTS OUTPUTS
nA nY
L H
H L
NOTES:
H = HIGH voltage level
L = LOW voltage level
Philips Semiconductors Product specification
74LVC04A
Hex inverter
1997 Jun 30 4
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
LIMITS
UNIT
SYMBOL
PARAMETER
CONDITIONS
MIN MAX
UNIT
VCC DC supply voltage (for max. speed performance) 2.7 3.6 V
VCC DC supply voltage (for low-voltage applications) 1.2 3.6 V
VIDC Input voltage range 0 5.5 V
VODC output voltage range 0 VCC V
Tamb Operating ambient temperature range in free-air –40 +85 °C
tr, tfInput rise and fall times VCC = 1.2 to 2.7V
VCC = 2.7 to 3.6V 0
020
10 ns/V
ABSOLUTE MAXIMUM RATINGS1
Absolute Maximum Rating System (IEC 134)
Voltages are referenced to GND (ground = 0V)
SYMBOL PARAMETER CONDITIONS RATING UNIT
VCC DC supply voltage –0.5 to +6.5 V
IIK DC input diode current VI 0 –50 mA
VIDC input voltage Note 2 –0.5 to +5.5 V
IOK DC output diode current VO VCC or VO 0 50 mA
VODC output voltage Note 2 VCC + 0.5 V
IODC output source or sink current VO = 0 to VCC 50 mA
IGND, ICC DC VCC or GND current 100 mA
Tstg Storage temperature range –65 to +150 °C
Power dissipation per package
PTOT – plastic mini-pack (SO) above +70°C derate linearly with 8 mW/K 500
mW
– plastic shrink mini-pack (SSOP and TSSOP) above +60°C derate linearly with 5.5 mW/K 500
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
Philips Semiconductors Product specification
74LVC04A
Hex inverter
1997 Jun 30 5
DC CHARACTERISTICS
Over recommended operating conditions voltages are referenced to GND (ground = 0V)
LIMITS
SYMBOL PARAMETER TEST CONDITIONS Temp = -40°C to +85°C UNIT
MIN TYP1MAX
V
HIGH level In
p
ut voltage
VCC = 1.2V VCC
V
V
IH
HIGH
le
v
el
Inp
u
t
v
oltage
VCC = 2.7 to 3.6V 2.0
V
V
LOW level In
p
ut voltage
VCC = 1.2V GND
V
V
IL
LOW
le
v
el
Inp
u
t
v
oltage
VCC = 2.7 to 3.6V 0.8
V
VCC = 2.7V ; VI = VIH or VIL;I
O = –12mA VCC*0.5
VO
HIGH level out
p
ut voltage
VCC = 3.0V ; VI = VIH or VIL;I
O = –100µA VCC*0.2 VCC
V
V
OH
HIGH
le
v
el
o
u
tp
u
t
v
oltage
VCC = 3.0V ; VI = VIH or VIL; IO = –18mA VCC*0.6
V
VCC = 3.0V ; VI = VIH or VIL; IO = –24mA VCC*0.8
VCC = 2.7V ; VI = VIH or VIL;I
O = 12mA 0.40
VOL LOW level output voltage VCC = 3.0V ; VI = VIH or VIL;I
O = 100µA 0.20 V
VCC = 3.0V ; VI = VIH or VIL; IO = 24mA 0.55
I
In
p
ut leakage current
V=36V
;
V = 5 5V or GND
µA
I
I
Inp
u
t
leakage
c
u
rrent
V
CC =
3
.
6V
;
V
I =
5
.
5V
or
GND
.
µ
A
ICC Quiescent supply current VCC = 3.6V ; VI = VCC or GND; IO = 0 0.1 10 µA
∆ICC Additional quiescent supply current
per input pin VCC = 2.7V to 3.6V ; VI = VCC –0.6V; IO = 0 5 500 µA
NOTES:
1. All typical values are at VCC = 3.3V and Tamb = 25°C.
AC CHARACTERISTICS
GND = 0 V ; tr = tf v 2.5 ns; CL = 50 pF LIMITS
SYMBOL PARAMETER WAVEFORM VCC = 3.3V ±0.3V VCC = 2.7V VCC = 1.2V UNIT
MIN TYP1MAX MIN TYP MAX TYP
tPHL/
tPLH Propagation delay
nA to nY 1 1.5 2.5 4.5 1.5 3.2 5.5 16.0 ns
NOTE:
1. These typical values are at VCC = 3.3V and Tamb = 25°C.
AC WAVEFORMS
VM = 1.5 V at VCC w 2.7 V
VM = 0.5 VCC at VCC < 2.7 V
VOL and VOH are the typical output voltage drop that occur with the
output load.
VM
nA INPUT
nY OUTPUT VM
tPLH
tPHL
GND
VI
VOL
VOH
SV00395
Waveform 1. Input (nA) to output (nY) propagation delays.
TEST CIRCUIT
PULSE
GENERATOR
VI
RT
D.U.T. VO
CL50pF
S12 < VCC
Open
GND
500Ω
500Ω
VCC VI
t 2.7V VCC
2.7V – 3.6V 2.7V
Test S1
tPLH/tPHL Open
VCC
SY00077
W aveform 2. Load circuitry for switching times.
Hex inverter
Philips Semiconductors Product specification
74LVC04A
1997 Jun 30 6
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
Hex inverter
Philips Semiconductors Product specification
74LVC04A
1997 Jun 30 7
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1
Hex inverter
Philips Semiconductors Product specification
74LVC04A
1997 Jun 30 8
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
Hex inverter
Philips Semiconductors Product specification
74LVC04A
1997 Jun 30 9
NOTES
Hex inverter
Philips Semiconductors Product specification
74LVC04A
1997 Jun 30 10
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICATIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appl iances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
DEFINITIONS
Data Sheet Identification Product Status Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1997
All rights reserved. Printed in U.S.A.
print code Date of release: 05-96
Document order number: 9397-750-04478
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