P2814BG-08SR - ON Semiconductor

P2811A/B and P2812A/B and P

2814A/B

Low Power EMI Reduction IC

JUNE 2011 – Rev. 2 P2811/D

Features

• FCC approved method of EMI attenuation

• Provides up to 15dB EMI reduction

• Generates a 1x, 2x and 4x low EMI spread spectrum

clock of the input frequency

o 1x: P2811A/B

o 2x: P2812A/B

o 4x: P2814A/B

• Optimized for input frequency range from 10MHz to

40MHz

• Internal loop filter minimizes external components

and board space

• Selectable spread options:

o Down Spread and Center Spread

• 8 frequency deviation selections:

o ±0.625% to -3.5%

• Low inherent Cycle-to-Cycle Jitter

• 3.3V Operating Voltage

• CMOS/TTL compatible inputs and outputs.

• Pin-out compatible with Cypress CY25811, CY25812

and CY25814

•

Available in 8-pin SOIC Package

Product Description

The P28XX devices are versatile spread spectrum

frequency modulators designed specifically for a wide

range of input clock frequencies from 10MHz to 40MHz.

Refer to Input/output Frequency Range Selection Table.

The P28XX can generate an EMI reduced clock from

crystal, ceramic resonator, or system clock. The P28XX-A

and the P28XX-B offer various

combinations of spread options and percentage

deviations. Refer to Frequency Deviation and Spread

Selection Table. These combinations include Down and

Center Spread, and percentage deviation range from

±0.625% to -3.5%.

The P28XX reduces electromagnetic interference (EMI)

at the clock source, allowing system wide reduction of

EMI of downstream clock and data dependent signals.

The P28XX allows significant system cost savings by

reducing the number of circuit board layers, ferrite beads,

shielding, and other passive components that are

traditionally required to pass EMI regulations.

The P28XX modulates the output of a single PLL in order

to “spread” the bandwidth of a synthesized clock, and

more importantly, decreases the peak amplitudes of its

harmonics. This results in significantly lower system EMI

compared to the typical narrow band signal produced by

oscillators and most frequency generators. Lowering EMI

by increasing a signal’s bandwidth is called ‘spread

spectrum clock generation’.

The P28XX uses the most efficient and optimized

modulation profile approved by the FCC and is

implemented in a proprietary all-digital method.

Applications

The P28XX is targeted towards EMI management for

memory and LVDS interfaces in mobile graphic chipsets

and high-speed digital applications such as PC peripheral

devices, consumer electronics, and embedded controller

systems.

P2811A/B and P2812A/B and P2814A/B

.

Rev. 2 | Page 2 of 6 | www.onsemi.com

Block Diagram

Pin Configuration

Pin Description

Pin#

Pin Name Type Description

1 XIN / CLKIN I Crystal connection or external Clock input.

2 VSS P Ground to entire chip.

3 D_C I Digital logic input used to select Down (LOW) or Center (HIGH) spread options.

(Refer to Frequency Deviation and Spread Selection Table).

This pin has an internal pull-up resistor.

4 SRS I Spread range select. Digital logic input used to select frequency deviation

(Refer to Frequency Deviation and Spread Selection Table).

This pin has an internal pull-up resistor.

5 ModOUT O Spread spectrum clock output.

6 FRS I Frequency range select. Digital logic input used to select Input frequency range

(Refer to Input/Output Frequency Range Selection Table).

This pin has an internal pull-up resistor.

7 VDD P Power supply for the entire chip.

8 XOUT O Crystal connection. If using an external reference, this pin must be left

unconnected.

ModOUT

1

2

3

4 5

6

7

8

FRS

XOUT

XIN / CLKIN

VSS

D_C

SRS

VDD

P2811A/B

P2812A/B

P2814A/B

XIN / CLKIN Crystal

Oscillator

Frequency

Divider

Feedback

Divider

r

Modulation

Phase

Detector Loop

Filter VCO Output

Divider

ModOUT

PLL

VDD

D_C SRS FRS

XOUT

VSS

P2811A/B and P2812A/B and P2814A/B

.

Rev. 2 | Page 3 of 6 | www.onsemi.com

Input/Output Frequency Range Selection Table

FRS (pin 6)

Part Number

Modulation Rate P2811 (1x) P2812 (2x) P2814 (4x)

Input

(MHz) Output

(MHz) Input

(MHz) Output

(MHz) Input

(MHz) Output

(MHz)

0 10-20 10-20 10-20 20-40 10-20 40-80 Input Frequency / 448

1 20-40 20-40 20-40 40-80 20-40 80-160 Input Frequency / 896

Output Frequency Deviation and Spread Selection Table

Part Number D_C

(pin 3) SRS

(pin 4)

Frequency Deviation

1

(%)

FS=0 FS=1

10/20/40 (MHz) 20/40/80 (MHz) 20/40/80 (MHz) 40/80/160 (MHz)

P28XXA

0 0 -3 -2.5 -2.7 -2.6

0 1 -3.7 -3.4 -3.8 -3.6

1 0 ±1.5 ±1.2 ±1.5 ±1.3

1 1 ±1.8 ±1.6 ±1.9 ±1.8

P28XXB

0 0 -1.7 -1.0 -1.5 -1.4

0 1 -2.0 -1.5 -2.0 -1.9

1 0 ±0.75 ±0.6 ±0.8 ±0.7

1 1 ±1.0 ±0.75 ±1.0 ±0.9

Note: 1. Frequency Deviation given in the table is for the Output Frequency Range covering P2811x / 12x / 14x.

Absolute Maximum Ratings

Symbol Parameter Rating Unit

V

DD

, V

IN

Voltage on any pin with respect to Ground -0.5 to +4.6 V

T

STG

Storage temperature -65 to +125 °C

T

s

Max. Soldering Temperature (10 sec) 260 °C

T

J

Junction Temperature 150 °C

T

DV

Static Discharge Voltage(As per JEDEC STD 22- A114-B) 2 KV

Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect

device reliability.

P2811A/B and P2812A/B and P2814A/B

.

Rev. 2 | Page 4 of 6 | www.onsemi.com

Operating Conditions

Symbol

Parameter Min Max Unit

VDD Supply Voltage 3.0 3.6 V

T

A

Operating temperature -40 +85 °C

C

L

Load Capacitance 15 pF

C

IN

Input Capacitance 7 pF

DC Electrical Characteristics

Symbol

Parameter Min Typ Max Unit

V

IL

Input low voltage VSS – 0.3 0.8 V

V

IH

Input high voltage 2 V

DD

+ 0.3 V

I

IL

Input low current

(Inputs D_C, SRS and FRS are pulled high internally) -50 µA

I

IH

Input high current 50 µA

I

XOL

XOUT Output low current

(V

XOL

@ 0.4V, V

DD

= 3.3V) 3 mA

I

XOH

XOUT Output high current

(V

XOH

@ 2.5V, V

DD

= 3.3V) 3 mA

V

OL

Output low voltage (V

DD

= 3.3V, I

OL

= 15mA) 0.4 V

V

OH

Output high voltage (V

DD

= 3.3V, I

OH

= -15mA) 2.5 V

I

CC

Dynamic supply current (Unloaded Output) 8 24 mA

I

DD

Static supply current , Standby mode

(CLKIN pulled to GND) 4.5 mA

VDD Operating voltage 3.0 3.3 3.6 V

t

ON

Power up time (first locked clock cycle after power up) 500 µS

Z

OUT

Clock out impedance 26 Ω

AC Electrical Characteristics

Symbol

Parameter Min Typ Max Unit

f

IN

Input frequency for P2811/12/13/14 A/B 10 40 MHz

f

OUT

Output frequency for P2811A/B 10 40 MHz

Output frequency for P2812A/B 20 80 MHz

Output frequency for P2814A/B 40 160 MHz

t

LH1

Output rise time (measured at 0.8V to 2.0V) 0.4 0.5 0.7 nS

t

HL1

Output fall time (measured at 2.0V to 0.8V) 0.5 0.6 0.8 nS

t

JC

Cycle-to-Cycle Jitter (Unloaded Output) ±250 pS

t

D

Output duty cycle 45 50 55 %

Note: 1. tLH and tHL are measured into a capacitive load of 15pF

P2811A/B and P2812A/B and P2814A/B

.

Rev. 2 | Page 5 of 6 | www.onsemi.com

Package Information

8-Pin SOIC Package

D

EH

D

A1

A2

A

θ

L

C

B

e

Symbol

Dimensions

Inches Millimeters

Min Max Min Max

A1 0.004 0.010 0.10 0.25

A 0.053 0.069 1.35 1.75

A2 0.049 0.059 1.25 1.50

B 0.012 0.020 0.31 0.51

C 0.007 0.010 0.18 0.25

D 0.193 BSC 4.90 BSC

E 0.154 BSC 3.91 BSC

e 0.050 BSC 1.27 BSC

H 0.236 BSC 6.00 BSC

L 0.016 0.050 0.41 1.27

θ 0° 8° 0° 8°

Note: Controlling dimensions are millimeters.

SOIC: 0.074 grams unit weight.

P2811A/B and P2812A/B and P2814A/B

.

Rev. 2 | Page 6 of 6 | www.onsemi.com

Ordering Code

Part Number Marking Package Type Temperature

P2811BF-08SR ABU 8-Pin SOIC, Tape & Reel, Pb free 0°C to +70°C

I2811BF-08SR ABV 8-Pin SOIC, Tape & Reel, Pb free -40°C to +85°C

P2814BG-08SR ACD 8-Pin SOIC, Tape & Reel, Pb free 0°C to +70°C

A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb-free

Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.

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