© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 7
1Publication Order Number:
MURHB840CT/D
MURHB840CTG,
MURHB840CTT4G,
SURHB8840CTT4G
Power Rectifier
D2PAK Power Surface Mount Package
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
Features
•Package Designed for Power Surface Mount Applications
•Ultrafast 28 Nanosecond Recovery Times
•175°C Operating Junction Temperature
•Epoxy Meets UL 94 V−0 @ 0.125 in
•High Temperature Glass Passivated Junction
•High Voltage Capability
•Low Leakage Specified @ 150°C Case Temperature
•Short Heat Sink Tab Manufactured − Not Sheared!
•Similar in Size to Industrial Standard TO−220 Package
•SURHB8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
•SURHB8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
•These Packages are Pb-Free*
Mechanical Characteristics:
•Case: Epoxy, Molded, Epoxy Meets UL 94, V−0
•Weight: 1.7 Grams (Approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•Device Meets MSL1 Requirements
•ESD Ratings:
♦Machine Model, C (> 400 V)
♦Human Body Model, 3B (> 8000 V)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package Shipping†
ORDERING INFORMATION
D2PAK
CASE 418B
STYLE 3
ULTRAFAST RECTIFIER
8.0 AMPERES, 400 VOLTS
1
3
4
MARKING DIAGRAM
http://onsemi.com
A = Assembly Location
Y = Year
WW = Work Week
UH840 = Device Code
G = Pb−Free Package
AKA = Diode Polarity
AY WW
UH840G
AKA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MURHB840CTT4G D2PAK
(Pb−Free)
800 /
Tape & Reel
MURHB840CTG D2PAK
(Pb−Free)
50 Units/Rail
SURHB8840CTT4G D2PAK
(Pb−Free)
800 /
Tape & Reel
MURHB840CTG, MURHB840CTT4G, SURHB8840CTT4G
http://onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
400 V
Average Rectified Forward Current
(Rated VR, TC = 120°C) Total Device
IF(AV) 4.0
8.0
A
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz, TC = 120°C)
IFM 8.0
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM 100
A
Controlled Avalanche Energy WAVAL 20 mJ
Operating Junction and Storage Temperature Range TJ, Tstg −65 to +175 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS (Per Leg)
Rating Symbol Value Unit
Maximum Thermal Resistance, Junction−to−Case RqJC 3.0 °C/W
Maximum Thermal Resistance, Junction−to−Ambient RqJA 50 °C/W
ELECTRICAL CHARACTERISTICS (Per Leg)
Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage (Note 1)
(iF = 4.0 A, TC = 150°C)
(iF = 4.0 A, TC = 25°C)
vF1.9
2.2
V
Maximum Instantaneous Reverse Current (Note 1)
(Rated DC Voltage, TC = 150°C)
(Rated DC Voltage, TC = 25°C)
iR500
10
mA
Maximum Reverse Recovery Time
(IF = 1.0 A, di/dt = 50 A/ms)
trr 28
ns
Typical Peak Reverse Recovery Current
(IF = 1.0 A, di/dt = 50 A/ms)
IRM 0.7 A
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤2.0%
MURHB840CTG, MURHB840CTT4G, SURHB8840CTT4G
http://onsemi.com
3
Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current, Per Leg
Figure 3. Current Derating, Case Figure 4. Typical Capacitance, Per Leg
50
20
10
0.1
0.2
0.5
1
2
5
2.42.221.81.61.41.210.80.60.4
vF, INSTANTANEOUS VOLTAGE (VOLTS)
iF, INSTANTANEOUS FORWARD CURRENT (AMP)
TJ = 150°C
100°C
25°C
VR, REVERSE VOLTAGE (VOLTS)
IR, REVERSE CURRENT (A)μ
0.1 0
1000
0.2
0.5
1
5
10
20
50
100
200
500
50 100 150 200 250 300 350 400
IF, AVERAGE POWER DISSIPATION (WATTS)
TC, CASE TEMPERATURE (°C)
0110
2
4
6
8
10
120 130 140 150 160 170 180
TJ = 150°C
100°C
25°C
RATED VR APPLIED
RqJC = 3°C/W
DC
SQUARE
WAVE
C, CAPACITANCE (pF)
VR, REVERSE VOLTAGE (VOLTS)
0.01
1000
100
10
10.1 1 10 100
2
100
Figure 5. Forward Power Dissipation, Per Leg
PF(AV), AVERAGE POWER DISSIPATION (WATTS)
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
1
20
18
16
14
12
10
8
6
4
2
02345678910
TJ = 175°C
SQUARE WAVE
DC
MURHB840CTG, MURHB840CTT4G, SURHB8840CTT4G
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4
PACKAGE DIMENSIONS
SEATING
PLANE
S
G
D
−T−
M
0.13 (0.005) T
231
4
3 PL
K
J
H
V
E
C
A
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.340 0.380 8.64 9.65
B0.380 0.405 9.65 10.29
C0.160 0.190 4.06 4.83
D0.020 0.035 0.51 0.89
E0.045 0.055 1.14 1.40
G0.100 BSC 2.54 BSC
H0.080 0.110 2.03 2.79
J0.018 0.025 0.46 0.64
K0.090 0.110 2.29 2.79
S0.575 0.625 14.60 15.88
V0.045 0.055 1.14 1.40
−B−
M
B
W
W
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
F0.310 0.350 7.87 8.89
L0.052 0.072 1.32 1.83
M0.280 0.320 7.11 8.13
N0.197 REF 5.00 REF
P0.079 REF 2.00 REF
R0.039 REF 0.99 REF
M
L
F
M
L
F
M
L
F
VARIABLE
CONFIGURATION
ZONE RN P
U
VIEW W−W VIEW W−W VIEW W−W
123
D2PAK 3
CASE 418B−04
ISSUE K
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8.38
5.080
DIMENSIONS: MILLIMETERS
PITCH
2X
16.155
1.016
2X
10.49
3.504
MURHB840CTG, MURHB840CTT4G, SURHB8840CTT4G
http://onsemi.com
5
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
MURHB840CT/D
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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