MURHB840CTG, MURHB840CTT4G, SURHB8840CTT4G Power Rectifier D2PAK Power Surface Mount Package These state-of-the-art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features * * * * * * * * * * * * Package Designed for Power Surface Mount Applications Ultrafast 28 Nanosecond Recovery Times 175C Operating Junction Temperature Epoxy Meets UL 94 V-0 @ 0.125 in High Temperature Glass Passivated Junction High Voltage Capability Low Leakage Specified @ 150C Case Temperature Short Heat Sink Tab Manufactured - Not Sheared! Similar in Size to Industrial Standard TO-220 Package SURHB8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable SURHB8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements These Packages are Pb-Free* http://onsemi.com ULTRAFAST RECTIFIER 8.0 AMPERES, 400 VOLTS D2PAK CASE 418B STYLE 3 1 4 3 MARKING DIAGRAM AY WW UH840G AKA Mechanical Characteristics: * Case: Epoxy, Molded, Epoxy Meets UL 94, V-0 * Weight: 1.7 Grams (Approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * * * Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Ratings: Machine Model, C (> 400 V) Human Body Model, 3B (> 8000 V) A Y WW UH840 G AKA = Assembly Location = Year = Work Week = Device Code = Pb-Free Package = Diode Polarity ORDERING INFORMATION Device MURHB840CTG Package Shipping D2PAK 50 Units/Rail (Pb-Free) *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (c) Semiconductor Components Industries, LLC, 2013 May, 2013 - Rev. 7 1 MURHB840CTT4G D2PAK (Pb-Free) 800 / Tape & Reel SURHB8840CTT4G D2PAK (Pb-Free) 800 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: MURHB840CT/D MURHB840CTG, MURHB840CTT4G, SURHB8840CTT4G MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 400 V Average Rectified Forward Current (Rated VR, TC = 120C) Total Device IF(AV) 4.0 8.0 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 120C) IFM Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 8.0 100 A A Controlled Avalanche Energy WAVAL 20 mJ Operating Junction and Storage Temperature Range TJ, Tstg -65 to +175 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS (Per Leg) Rating Symbol Value Unit Maximum Thermal Resistance, Junction-to-Case RqJC 3.0 C/W Maximum Thermal Resistance, Junction-to-Ambient RqJA 50 C/W Symbol Value Unit ELECTRICAL CHARACTERISTICS (Per Leg) Characteristic Maximum Instantaneous Forward Voltage (Note 1) (iF = 4.0 A, TC = 150C) (iF = 4.0 A, TC = 25C) vF Maximum Instantaneous Reverse Current (Note 1) (Rated DC Voltage, TC = 150C) (Rated DC Voltage, TC = 25C) iR Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/ms) trr Typical Peak Reverse Recovery Current (IF = 1.0 A, di/dt = 50 A/ms) IRM 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0% http://onsemi.com 2 1.9 2.2 500 10 28 0.7 V mA ns A 1000 500 100 IR, REVERSE CURRENT (A) 50 TJ = 150C 20 10 100C 5 25C 2 1 0.5 0.2 0.1 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 50 20 10 100C 5 25C 2 1 0.5 0.2 0.1 2.4 TJ = 150C 200 100 0 50 100 150 200 250 300 350 400 vF, INSTANTANEOUS VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current, Per Leg 10 1000 RATED VR APPLIED RqJC = 3C/W 6 C, CAPACITANCE (pF) 8 DC 4 SQUARE WAVE 100 10 2 0 110 120 130 140 150 160 TC, CASE TEMPERATURE (C) 170 180 1 0.01 Figure 3. Current Derating, Case PF(AV) , AVERAGE POWER DISSIPATION (WATTS) I F, AVERAGE POWER DISSIPATION (WATTS) i F, INSTANTANEOUS FORWARD CURRENT (AMP) MURHB840CTG, MURHB840CTT4G, SURHB8840CTT4G 0.1 1 10 VR, REVERSE VOLTAGE (VOLTS) Figure 4. Typical Capacitance, Per Leg 20 18 TJ = 175C SQUARE WAVE 16 DC 14 12 10 8 6 4 2 0 1 2 3 4 5 6 7 8 IF(AV), AVERAGE FORWARD CURRENT (AMPS) 9 Figure 5. Forward Power Dissipation, Per Leg http://onsemi.com 3 10 100 MURHB840CTG, MURHB840CTT4G, SURHB8840CTT4G PACKAGE DIMENSIONS D2PAK 3 CASE 418B-04 ISSUE K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B-01 THRU 418B-03 OBSOLETE, NEW STANDARD 418B-04. C E -B- V W 4 1 2 A S 3 -T- SEATING PLANE K J G D M T B M N R P L M L M F F F VIEW W-W 1 VIEW W-W 2 VIEW W-W 3 SOLDERING FOOTPRINT* 10.49 8.38 16.155 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4 INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.310 0.350 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.052 0.072 0.280 0.320 0.197 REF 0.079 REF 0.039 REF 0.575 0.625 0.045 0.055 STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE U L M W H 3 PL 0.13 (0.005) VARIABLE CONFIGURATION ZONE DIM A B C D E F G H J K L M N P R S V MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40 MURHB840CTG, MURHB840CTT4G, SURHB8840CTT4G ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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