September 2003
This document specifies SPANSION memory products that are now off ered b y both Adv anced Micro De vices and
Fujitsu. Although the document is marked with the name of the company that originally de v eloped the specification,
these products will be offered to customers of both AMD and Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a SPANSION product. Future routine
revisions will occur when appropriate, and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To order these
products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about SPANSION memory
solutions.
TM
TM
TM
SPANSION Flash Memory
Data Sheet
TM
DS05-20911-1E
FUJITSU SEMICONDUCTOR
DATA SHEET
FLASH MEMORY
CMOS
8 M (1 M ×
××
× 8/512 K ×
××
× 16) BIT
MBM29SL800TE/BE-90/10
DESCRIPTION
The MBM29SL800TE/BE are a 8 M-bit, 1.8 V-only Flash memor y organized as 1 Mbytes of 8 bits each or 512
Kwords of 16 bits each. The MBM29SL800TE/BE are offered in a 48-ball FBGA and 45-ball SCSP packages.
These de vices are designed to be progr ammed in-system with the standard system 1.8 V VCC supply. 12.0 V VPP
and 5.0 V VCC are not required f or write or erase operations . The devices can also be reprogrammed in standard
EPROM pr ogrammers.
(Continued)
PRODUCT LINE UP
PACKAGES
Part No. MBM29SL800TE/BE-90 MBM29SL800TE/BE-10
VCC 1.65 V to 1.95 V
Max Address Access Time 90 ns 100 ns
Max CE Access Time 90 ns 100 ns
Max OE Access Time 30 ns 35 ns
48-ball Plastic FBGA 45-ball Plastic SCSP
(BGA-48P-M20) (WLP-45P-M02)
MBM29SL800TE/BE-90/10
2
(Continued)
The standard MBM29SL800TE/BE offer access times 90 ns and 100 ns, allowing operation of high-speed
microprocessors without wait states. To eliminate bus contention the devices have separate chip enable (CE) ,
write enable (WE) , and output enable (OE) controls.
The de vice supports pin and command set compatible with JEDEC standard E2PROMs . Commands are written
to the command register using standard microprocessor write timings. Register contents ser ve as input to an
internal state-machine which controls the erase and programming circuitry. Write cycles also internally latch
addresses and data needed for the programming and erase operations. Reading data out of the devices is similar
to reading from 5.0 V and 12.0 V Flash or EPROM devices.
The device is programmed by executing the program command sequence. This will invoke the Embedded
Program Algorithm which is an internal algorithm that automatically times the program pulse widths and v erifies
proper cell margin. Typically, each sector can be programmed and verified in about 0.5 seconds. Erase is
accomplished by executing the erase command sequence. This will invoke the Embedded Erase Algorithm which
is an internal algorithm that automatically preprograms the arra y if it is not already programmed bef ore ex ecuting
the erase operation. During erase, the devices automatically time the erase pulse widths and verify proper cell
margin.
Each sector is typically erased and verified in 1.5 second. (If already completely preprogrammed.)
The devices also feature a sector erase architecture. The sector mode allows each sector to be erased and
reprogrammed without affecting other sectors. The MBM29SL800TE/BE are erased when shipped from the
factory.
The de vices feature single 1.8 V power supply oper ation for both read and write functions. Internally generated
and regulated voltages are provided for the program and erase operations. A low VCC detector automatically
inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ7,
by the Toggle Bit feature on DQ6, or the RY/BY output pin. Once the end of a program or erase cycle has been
completed, the device internally returns to the read mode.
Fujitsu’s Flash technology combines years of Flash memory manufacturing experience to produce the highest
levels of quality, reliability, and cost effectiveness. The MBM29SL800TE/BE memories electrically erase the
entire chip or all bits within a sector simultaneously via Fowler-Nordhiem tunneling. The bytes/words are pro-
grammed one byte/word at a time using the EPROM programming mechanism of hot electron injection.
MBM29SL800TE/BE-90/10
3
FEATURES
0.23 µ
µµ
µm Process Technology
Single 1.8 V read, program, and erase
Minimizes system level power requirements
Compatible with JEDEC-standard world-wide pinouts
48-ball FBGA (Package suffix : PBT)
45-ball SCSP (Package suffix : PW)
Minimum 100,000 program/erase cycles
High performance
90 ns maximum access time
Sector erase architecture
One 8 Kword, two 4 Kwords, one 16 Kword, and fifteen 32 Kwords sectors in word mode
One 16 Kbyte, two 8 Kbytes, one 32 Kbyte, and fifteen 64 Kbytes sectors in byte mode
Any combination of sectors can be concurrently erased. Also supports full chip erase
Boot Code Sector Architecture
T = Top sector
B = Bottom sector
Embedded EraseTM Algorithms
Automatically pre-programs and erases the chip or any sector
Embedded ProgramTM Algorithms
Automatically writes and verifies data at specified address
•Data
Polling and Toggle Bit feature for detection of program or erase cycle completion
Ready/Busy output (RY/BY)
Hardware method for detection of program or erase cycle completion
Automatic sleep mode
When addresses remain stable, automatically switch themselves to low power mode
Erase Suspend/Resume
Suspends the erase operation to allow a read in another sector within the same device
Sector protection
Hardware method disables any combination of sectors from program or erase operations
Sector Protection set function by Extended sector Protect command
Fast programming Function by Extended Command
Temporary sector unprotection
Temporary sector unprotection via the RESET pin
Embedded EraseTM and Embedded ProgramTM are trademarks of Advanced Micro Devices, Inc.
MBM29SL800TE/BE-90/10
4
PIN ASSIGNMENTS
A6 B6 C6 D6 E6 F6 G6 H6
A
13
A
12
A
14
A
15
A
16
DQ
15
/A
-1
V
SS
A5 B5 C5 D5 E5 F5 G5 H5
A
9
A
8
A
10
A
11
DQ
7
DQ
14
DQ
13
DQ
6
A4 B4 C4 D4 E4 F4 G4 H4
WE RESET N.C. N.C. DQ
5
DQ
12
V
CC
DQ
4
A3 B3 C3 D3 E3 F3 G3 H3
RY/BY N.C. A
18
N.C. DQ
2
DQ
10
DQ
11
DQ
3
A2 B2 C2 D2 E2 F2 G2 H2
A
7
A
17
A
6
A
5
DQ
0
DQ
8
DQ
9
DQ
1
A1 B1 C1 D1 E1 F1 G1 H1
A
3
A
4
A
2
A
1
A
0
CE OE V
SS
BYTE
A3
A4
A7
A17A6
A5
DQ0
DQ8
DQ9
DQ1
RY/BY
A18
DQ2
DQ10
DQ11
DQ3
WE
RESET
N.C.
DQ5
DQ12VCC
DQ4
A9
A8
A10
A11
DQ7
DQ14
DQ13
DQ6
A13
A12
B5 C5 D5 E5 F5 G5 H5
B4 C4 D4 E4 F4 G4 H4
A0
A3 B3 C3 D3 E3 F3 G3 H3
A1
A2 B2 C2 D2 E2 F2 G2 H2
A2
A1 B1 C1 D1 E1 F1 G1 H1
BYTE
J5
VSS
J4
A16
J3
A15
J2
A14
J1
DQ15/A-1
A5
CE OE
A4
VSS
(WLP-45P-M02)
SCSP
(TOP VIEW)
Marking side
FBGA
(TOP VIEW)
Marking side
(BGA-48P-M20)
MBM29SL800TE/BE-90/10
5
PIN DESCRIPTION
Pin name Function
A18 to A0, A-1Address Inputs
DQ15 to DQ0Data Inputs/Outputs
CE Chip Enable
OE Output Enable
WE Write Enable
RESET Hardware Reset
RY/BY Ready/Busy Output
BYTE Selects 8-bit or 16-bit mode
VCC Device Power Supply
VSS Device Ground
N.C. No Internal Connection
MBM29SL800TE/BE-90/10
6
BLOCK DIAGRAM
LOGIC SYMBOL
A-1
VSS
VCC
WE
CE
A18 to A0
OE
DQ15 to DQ0
Input/Output
Buffers
BYTE
RESET
RY/BY
STB
STB
RY/BY
Buffer
Erase Voltage
Generator
Program Voltage
Generator
Timer for
Program/Erase
Low VCC Detector
Chip Enable
Output Enable
Logic
State
Control
Command
Register
Data Latch
Y-Gating
Cell Matrix
Y-Decoder
X-Decoder
Address Latch
19 A18 to A0
WE
OE
CE
DQ15 to DQ0
16 or 8
BYTE
RESET
A-1
RY/BY
MBM29SL800TE/BE-90/10
7
DEVICE BUS OPERATION
MBM29SL800TE/BE User Bus Operations (BYTE =
==
= VIH)
Legend : L = VIL, H = VIH, X = VIL or VIH, See DC CHARACTERISTICS.
*1: Manufacturer and device codes may also be accessed via a command register write sequence. See
“MBM29SL800TE/BE Standard Command Definitions”.
*2: Refer to the section on Sector Protection.
*3: WE can be VIL if OE is VIL, OE at VIH initiates the write operations.
*4: VCC = 1.8 V ± 0.15V
*5: It is also used for the extended sector protection.
MBM29SL800TE/BE User Bus Operations (BYTE =
==
= VIL)
Legend : L = VIL, H = VIH, X = VIL or VIH, See DC CHARACTERISTICS.
*1: Manufacturer and device codes may also be accessed via a command register write sequence.
See “MBM29SL800TE/BE Standard Command Definitions”.
*2: Refer to the section on Sector Protection.
*3: WE can be VIL if OE is VIL, OE at VIH initiates the write operations.
*4: VCC = 1.8 V ± 0.15 V
*5: It is also used for the extended sector protection.
Operation CE OE WE A0A1A6A9DQ15 to DQ0RESET
Standby H X X X X X X High-Z H
Autoselect Manufacturer Code *1LLHLLLVID Code H
Autoselect Device Code *1LLHHLLVID Code H
Read *3LLHA0A1A6A9DOUT H
Output Disable L H H X X X X High-Z H
Write L H L A0A1A6A9DIN H
Enable Sector Protection *2, *4LHLLHLX X VID
Verify Sector Protection *2, *4LLHLHLVID Code H
Temporary Sector Unprotection *5XXXXXXX X VID
Reset (Hardware) /Standby XXXXXXX High-Z L
Operation CE OE WE DQ15/
A-1 A0A1A6A9DQ7 to
DQ0RESET
Standby H X X X XXXXHigh-Z H
Autoselect Manufacturer Code *1LLHLLLLVID Code H
Autoselect Device Code *1LLHLHLLVID Code H
Read *3LLHA-1A0A1A6A9DOUT H
Output Disable LHHXXXXXHigh-Z H
Write L H L A-1A0A1A6A9DIN H
Enable Sector Protection *2, *4LHLLLHLVID XVID
Verify Sector Protection *2, *4LLHLLHLVID Code H
Temporary Sector Unprotection *5XXXXXXXX X VID
Reset (Hardware) /Standby X X X X XXXXHigh-Z L
MBM29SL800TE/BE-90/10
8
MBM29SL800TE/BE Standard Command Definitions *1
(Continued)
Command
Sequence
Bus
Write
Cycles
Req’d
First Bus
Write Cycle Second Bus
Write Cyc le Third Bus
Write Cyc le
Four th Bus
Read/Write
Cycle
Fifth Bus
Write Cycle Sixth Bus
Write Cycle
Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data
Reset *2Word 1 XXXh F0h 
Byte
Reset *2Word 3555h AAh 2AAh 55h 555h F0h RA RD 
Byte AAAh 555h AAAh
Autoselect Word 3555h AAh 2AAh 55h 555h 90h 00h 04h 
Byte AAAh 555h AAAh
Program Word 4555h AAh 2AAh 55h 555h A0h PA PD 
Byte AAAh 555h AAAh
Chip
Erase Word 6555h AAh 2AAh 55h 555h 80h 555h AAh 2AAh 55h 555h 10h
Byte AAAh 555h AAAh AAAh 555h AAAh
Sector
Erase Word 6555h AAh 2AAh 55h 555h 80h 555h AAh 2AAh 55h SA 30h
Byte AAAh 555h AAAh AAAh 555h
Sector Erase Suspend *3Erase can be suspended during sector erase with ADDr. (“H” or “L”) . Data (B0h)
Sector Erase Resume *3Erase can be resumed after sector erase suspend with ADDr. (“H” or “L”) . Data (30h)
Set to Fast
Mode *4
Word 3555h AAh 2AAh 55h 555h 20h 
Byte AAAh 555h AAAh
Fast
program *4
Word 2XXXh A0h PA PD 
Byte XXXh
Rest from
Fast Mode
*5
Word 2XXXh 90h XXXh 00h
*8
Byte XXXh XXXh
Extended
Sector
Protect
*6,*7
Word
4 XXXh 60h SPA 60h SPA 40h SPA SD 
Byte
MBM29SL800TE/BE-90/10
9
(Continued)
*1 : The command combinations not described in “MBM29SL800TE/BE Standard Command Definitions” are illegal.
*2 : Both Reset commands are functionally equivalent, resetting the device to the read mode.
*3 : The Erase Suspend and Erase Resume command are valid only during a sector erase operation.
*4 : The Set to Fast Mode command is required prior to the Fast Programming command.
*5 : The Reset from Fast Mode command is required to return to the read mode when the device is in Fast mode.
*6 : Set sector address (SA) with (A6, A1, A0) = (0, 1, 0).
*7: This command is valid while RESET =VID.
*8 : The data “F0h” is also acceptable.
Notes : Address bits A18 to A11 = X = “H” or “L” for all address commands except f or Program Address (PA) and
Sector Address (SA)
Bus operations are defined in “MBM29SL800TE/BE User Bus Operations (BYTE = VIH) ” and
“MBM29SL800TE/BE User Bus Operations (BYTE = VIL) ” in DEVICE BUS OPERATION.
RA = Address of the memory location to be read
PA = Address of the memory location to be programmed
Addresses are latched on the falling edge of the WE pulse.
SA = Address of the sector to be erased. The combination of A18, A17, A16, A15, A14, A13, and A12 will
uniquely select any sector.
SPA = Sector address to be protected. Set sector address (SA) and (A6, A1, A0) = (0, 1, 0)
RD = Data read from location RA during read operation.
PD = Data to be programmed at location PA. Data is latched on the rising edge of WE.
The system should generate the following address patterns :
Word Mode : 555h or 2AAh to addresses A10 to A0
Byte Mode : AAAh or 555h to addresses A10 to A0 and A-1
SD = Sector protection verify data. Output 01h at protected sector address and output 00h at
unprotected sector address.
MBM29SL800TE/BE-90/10
10
MBM29SL800TE/BE Sector Protection Verify Autoselect Codes
*1 : A-1 is for Byte mode. At Byte mode, DQ14 to DQ8 are High-Z and DQ15 A-1, the lowest address.
*2 : Outputs 01h at protected sector address and outputs 00h at unprotected sector address.
Extended Autoselect Code
(B) : Byte mode
(W) : Word mode
Hi-Z : High-Z
* : At Byte mode, DQ14 to DQ8 are High-Z and DQ15 is A-1, the lowest address.
Type A18 to A12 A6A1A0A-1*1Code (HEX)
Manufacture’s Code X VIL VIL VIL VIL 04h
Device Code
MBM29SL800TE Byte XV
IL VIL VIH VIL EAh
Word X 22EAh
MBM29SL800BE Byte XV
IL VIL VIH VIL 6Bh
Word X 226Bh
Sector Protection Sector
Address VIL VIH VIL VIL 01h*2
Type Code DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 DQ9DQ8DQ7DQ6DQ5DQ4DQ3DQ2DQ1DQ0
Manufacture’s Code 04h A-1/0 0 00000000000100
Device
Code
MBM29S
L800TE (B) * EAh A-1HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 11101010
(W) 22EAh 0 01 00 01011101010
MBM29S
L800BE (B) * 6Bh A-1HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z HI-Z 01101011
(W) 226Bh 00 10 001001101011
Sector Protection 01h A-1/0 0 00 000000000001
MBM29SL800TE/BE-90/10
11
FLEXIBLE SECTOR-ERASE ARCHITECTURE
One 16 Kbyte, two 8 Kbytes, one 32 Kbyte, and fifteen 64 Kbytes
Individual-sector, multiple-sector, or bulk-erase capability
Individual or multiple-sector protection is user definable.
FFFFFh
FBFFFh
F9FFFh
F7FFFh
EFFFFh
DFFFFh
CFFFFh
BFFFFh
AFFFFh
9FFFFh
8FFFFh
7FFFFh
6FFFFh
5FFFFh
4FFFFh
3FFFFh
2FFFFh
1FFFFh
0FFFFh
00000h
FFFFFh
EFFFFh
DFFFFh
CFFFFh
BFFFFh
AFFFFh
9FFFFh
8FFFFh
7FFFFh
6FFFFh
5FFFFh
4FFFFh
3FFFFh
2FFFFh
1FFFFh
0FFFFh
07FFFh
05FFFh
03FFFh
00000h
7FFFFh
7DFFFh
7CFFFh
7BFFFh
77FFFh
6FFFFh
67FFFh
5FFFFh
57FFFh
4FFFFh
47FFFh
3FFFFh
37FFFh
2FFFFh
27FFFh
1FFFFh
17FFFh
0FFFFh
07FFFh
00000h
7FFFFh
77FFFh
6FFFFh
67FFFh
5FFFFh
57FFFh
4FFFFh
47FFFh
3FFFFh
37FFFh
2FFFFh
27FFFh
1FFFFh
17FFFh
0FFFFh
07FFFh
03FFFh
02FFFh
01FFFh
00000h
16 Kbyte
8 Kbyte
8 Kbyte
32 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
32 Kbyte
8 Kbyte
8 Kbyte
16 Kbyte
(×8) (×16) (×8) (×16)
MBM29SL800TE Sector Architecture MBM29SL800BE Sector Architecture
MBM29SL800TE/BE-90/10
12
Sector Address Tables (MBM29SL800TE)
Sector
Address A18 A17 A16 A15 A14 A13 A12 Address Range (×
××
×8) Address Range (×
××
×16)
SA0 0000XXX00000h to 0FFFFh 00000h to 07FFFh
SA1 0001XXX10000h to 1FFFFh 08000h to 0FFFFh
SA2 0010XXX20000h to 2FFFFh 10000h to 17FFFh
SA3 0011XXX30000h to 3FFFFh 18000h to 1FFFFh
SA4 0100XXX40000h to 4FFFFh 20000h to 27FFFh
SA5 0101XXX50000h to 5FFFFh 28000h to 2FFFFh
SA6 0110XXX60000h to 6FFFFh 30000h to 37FFFh
SA7 0111XXX70000h to 7FFFFh 38000h to 3FFFFh
SA8 1000XXX80000h to 8FFFFh 40000h to 47FFFh
SA9 1001XXX90000h to 9FFFFh 48000h to 4FFFFh
SA10 1010XXXA0000h to AFFFFh50000h to 57FFFh
SA11 1011XXXB0000h to BFFFFh58000h to 5FFFFh
SA12 1100XXXC0000h to CFFFFh60000h to 67FFFh
SA13 1101XXXD0000h to DFFFFh68000h to 6FFFFh
SA14 1110XXXE0000h to EFFFFh70000h to 77FFFh
SA15 11110XXF0000h to F7FFFh78000h to 7BFFFh
SA16 1111100F8000h to F9FFFh7C000h to 7CFFFh
SA17 1111101FA000h to FBFFFh7D000h to 7DFFFh
SA18 111111XFC000h to FFFFFh 7E000h to 7FFFFh
MBM29SL800TE/BE-90/10
13
Sector Address Tables (MBM29SL800BE)
Sector
Address A18 A17 A16 A15 A14 A13 A12 Address Range (×
××
×8) Address Range (×
××
×16)
SA0 000000X00000h to 03FFFh 00000h to 01FFFh
SA1 000001004000h to 05FFFh 02000h to 02FFFh
SA2 000001106000h to 07FFFh 03000h to 03FFFh
SA3 00001XX08000h to 0FFFFh 04000h to 07FFFh
SA4 0001XXX10000h to 1FFFFh 08000h to 0FFFFh
SA5 0010XXX20000h to 2FFFFh 10000h to 17FFFh
SA6 0011XXX30000h to 3FFFFh 18000h to 1FFFFh
SA7 0100XXX40000h to 4FFFFh 20000h to 27FFFh
SA8 0101XXX50000h to 5FFFFh 28000h to 2FFFFh
SA9 0110XXX60000h to 6FFFFh 30000h to 37FFFh
SA10 0111XXX70000h to 7FFFFh 38000h to 3FFFFh
SA11 1000XXX80000h to 8FFFFh 40000h to 47FFFh
SA12 1001XXX90000h to 9FFFFh 48000h to 4FFFFh
SA13 1010XXXA0000h to AFFFFh50000h to 57FFFh
SA14 1011XXXB0000h to BFFFFh58000h to 5FFFFh
SA15 1100XXXC0000h to CFFFFh60000h to 67FFFh
SA16 1101XXXD0000h to DFFFFh68000h to 6FFFFh
SA17 1110XXXE0000h to EFFFFh70000h to 77FFFh
SA18 1111XXXF0000h to FFFFFh78000h to 7FFFFh
MBM29SL800TE/BE-90/10
14
FUNCTIONAL DESCRIPTION
Standby Mode
There are two ways to implement the standby mode on the MBM29SL800TD/BD devices, one using both the
CE and RESET pins; the other via the RESET pin only.
When using both pins, a CMOS standby mode is achieved with CE and RESET inputs both held at VCC ± 0.3 V.
Under this condition the current consumed is less than 5 µA. The de vice can be read with standard access time
(tCE) from either of these standby modes. During Embedded Algorithm operation, VCC active current (ICC2) is
required even CE = “H”.
When using the RESET pin only, a CMOS standby mode is achieved with RESET input held at VSS ± 0.3 V
(CE = “H” or “L”) . Under this condition the current is consumed is less than 5 µA. Once the RESET pin is taken
high, the device requires tRH of wake up time before outputs are valid for read access.
In the standby mode the outputs are in the high impedance state, independent of the OE input.
Automatic Sleep Mode
There is a function called automatic sleep mode to restrain power consumption during read-out of
MBM29SL800TE/BE data. This mode can be used effectively with an application requested low power consump-
tion such as handy terminals.
To activate this mode, MBM29SL800TE/BE automatically switch themselves to low power mode when
MBM29SL800TE/BE addresses remain stably during access fine of 150 ns. It is not necessary to control CE,
WE, and OE on the mode. Under the mode, the current consumed is typically 1 µA (CMOS Level) .
Since the data are latched during this mode, the data are read-out continuously. If the addresses are changed,
the mode is canceled automatically and MBM29SL800TE/BE read-out the data for changed addresses.
Autoselect
The autoselect mode allows the reading out of a binary code from the devices and will identify its manufacturer
and type. This mode is intended for use by programming equipment fo r the purpose of automatically matching
the devices to be progr ammed with its corresponding prog ramming algorithm. This mode is functional ov er the
entire temperature range of the devices.
To activate this mode, the programming equipment must force VID (10 V to 11 V) on address pin A9. Two identifier
bytes ma y then be sequenced from the de vices outputs b y toggling address A0 from VIL to VIH. All addresses are
DON’T CARES except A0, A1, A6, and A-1. (See “MBM29SL800TE/BE Sector Protection V erify Autoselect Codes”
in DEVICE BUS OPERATION.)
The manufacturer and device codes may also be read via the command register, for instances when the
MBM29SL800TE/BE are erased or programmed in a system without access to high voltage on the A9 pin. The
command sequence is illustrated in “MBM29SL800TE/BE Standard Command Definitions” in DEVICE BUS
OPERATION. (Refer to Autoselect Command section.)
Byte 0 (A0 = VIL) represents the manuf acturer’ s code (Fujitsu = 04h) and (A0 = VIH) represents the device identifier
code (MBM29SL800TE = EAh and MBM29SL800BE = 6Bh for ×8 mode; MBM29SL800TE = 22EAh and
MBM29SL800BE = 226Bh for ×16 mode) . These two bytes/words are given in “MBM29LV800TE/BE Sector
Protection Verify Autoselect Codes T able” and “Extended Autoselect Code T able” in DEVICE BUS OPERATION.
All identifiers for manufactures and device will exhibit odd par ity with DQ7 defined as the parity bit. In order to
read the proper de vice codes when e xecuting the autoselect, A1 m ust be VIL. (See “MBM29SL800TE/BE Sector
Protection Verify Autoselect Codes” and “Extended Autoselect Code” in DEVICE BUS OPERATION.)
Read Mode
The MBM29SL800TE/BE have two control functions which must be satisfied in order to obtain data at the outputs.
CE is the pow er control and should be used f or a device selection. OE is the output control and should be used
to gate data to the output pins if a device is selected.
Address access time (tACC) is equal to the delay from stable addresses to valid output data. The chip enable
access time (tCE) is the delay from stable addresses and stable CE to valid data at the output pins. The output
enable access time is the delay from the falling edge of OE to valid data at the output pins. (Assuming the
addresses hav e been stable f or at least tACC-tOE time.) When reading out a data without changing addresses after
power-up, it is necessary to input hardware reset or change CE pin from “H” to “L”
MBM29SL800TE/BE-90/10
15
Output Disable
With the OE input at a logic high level (VIH) , output from the devices are disabled. This will cause the output
pins to be in a high impedance state.
Write
Device erasure and programming are accomplished via the command register. The contents of the register serve
as inputs to the internal state machine. The state machine outputs dictate the function of the device.
The command register itself does not occup y an y addressab le memory location. The register is a latch used to
store the commands, along with the address and data information needed to execute the command. The com-
mand register is written by bringing WE to VIL, while CE is at VIL and OE is at VIH. Addresses are latched on the
falling edge of WE or CE, whichever happens later; while data is latched on the rising edge of WE or CE,
whichever happens first. Standard microprocessor write timings are used.
Refer to AC Write Characteristics and the Erase/Programming Waveforms for specific timing parameters.
Sector Protection
The MBM29SL800TE/BE feature hardware sector protection. This feature will disable both progr a m and erase
operations in any number of sectors (0 through 18) . The sector protection feature is enabled using programming
equipment at the user’s site. The devices are shipped with all sectors unprotected.
To activate this mode, the programming equipment must force VID on address pin A9 and control pin OE,
CE = VIL, and A6 = VIL. The sector addresses (A18, A17, A16, A15, A14, A13, and A12) should be set to the sector to
be protected. “Sector Address Tables (MBM29SL800TE) ” and “Sector Address Tables (MBM29SL800TE) ” in
FLEXIBLE SECTOR-ERASE ARCHITECTURE define the sector address for each of the nineteen (19) indi-
vidual sectors.
Programming of the protection circuitry begins on the falling edge of the WE pulse and is terminated with the
rising edge of the same. Sector addresses must be held constant during the WE pulse. See “Sector Protection
Timing Diagram” in TIMING DIAGRAM and “Sector Protection Algor ithm” in FLOW CHART for sector pro-
tection waveforms and algorithm.
To v erify programming of the protection circuitry, the programming equipment must force VID on address pin A9
with CE and OE at VIL and WE at VIH. Scanning the sector addresses (A18, A17, A16, A15, A14, A13, and A12) while
(A6, A1, A0) = (0, 1, 0) will produce a logical “1” code at de vice output DQ0 f or a protected sector. Otherwise the
devices will read 00h for unprotected sector. In this mode, the lower order addresses, except for A0, A1, and A6
are DON’T CARES. Address locations with A1 = VIL are reserved f or A utoselect manuf acturer and de vice codes.
A-1 requires to apply to VIL on b yte mode.
Temporary Sector Unprotection
This feature allows tempor ary unprotection of pre viously protected sectors of the MBM29SL800TE/BE devices
in order to change data. The Sector Unprotection mode is activated by setting the RESET pin to high voltage
(VID) . During this mode, formerly protected sectors can be programmed or erased by selecting the sector
addresses. Once the VID is taken aw ay from the RESET pin, all the pre viously protected sectors will be protected
again. See “Temporary Sector Unprotection Timing Diagram” in TIMING DIAGRAM and “Temporar y Sector
Unprotection Algorithm” in FLOW CHART.
RESET
Hardware Reset
The MBM29SL800TE/BE devices may be reset by driving the RESET pin to VIL. The RESET pin has a pulse
requirement and has to be kept lo w (VIL) f or at least 500 ns in order to properly reset the internal state machine.
Any operation in the process of being executed will be ter minated and the internal state machine will be reset
to the read mode 20 µs after the RESET pin is driven low. Fur ther more, once the RESET pin goes high, the
devices require an additional tRH before it will allow read access. When the RESET pin is low, the devices will
be in the standby mode for the duration of the pulse and all the data output pins will be tri-stated. If a hardware
reset occurs during a program or erase operation, the data at that particular location will be corr upted. Please
note that the RY/BY output signal should be ignored during the RESET pulse. See “RESET, RY/BY Timing
Diagr am” in TIMING DIAGRAM for the timing diag r am. Refer to Temporary Sector Unprotection f or additional
functionality.
MBM29SL800TE/BE-90/10
16
COMMAND DEFINITIONS
Device operations are selected by writing specific address and data sequences into the command register.
“MBM29SL800TE/BE Standard Command Definitions” in DEVICE BUS OPERATION defines the valid register
command sequences. Note that the Erase Suspend (B0h) and Erase Resume (30h) commands are valid only
while the Sector Erase operation is in progress. Moreover both Reset commands are functionally equivalent,
resetting the device to the read mode. Please note that commands are always written at DQ7 to DQ0 and DQ15
to DQ8 bits are ignored.
Reset Command
In order to return from Autoselect mode or Exceeded Timing Limits (DQ5 = 1) to Read mode, the Reset operation
is initiated by writing the Reset command sequence into the command register. The de vice remains enabled f or
reads until the command register contents are altered.
The device will automatically power-up in the reset state. In this case, a command sequence is not required to
read data.
Autoselect Command
Flash memories are intended for use in applications where the local CPU alters memory contents. As such,
manufacture and device codes must be accessible while the devices reside in the target system. PROM pro-
grammers typically access the signature codes by raising A9 to a high voltage. However, multiplexing high voltage
onto the address lines is not generally desired system design practice.
The de vice contains an A utoselect command oper ation to supplement traditional PR OM prog ramming method-
ology. The operation is initiated by writing the Autoselect command sequence into the command register.
F ollo wing the command write, a read cycle from address XX00h retrieves the manuf acture code of 04h. A read
cycle from address XX01h for ×16 (XX02h for ×8) returns the device code (MBM29SL800TE = EAh and
MBM29SL800BE = 6Bh for ×8 mode; MBM29SL800TE = 22EAh and MBM29SL800BE = 226Bh fo r ×16
mode) . (See “MBM29SL800TE/BE Sector Protection V erify Autoselect Codes” and “Extended Autoselect Code”
in DEVICE BUS OPERATION.) All manufacturer and device codes will exhibit odd parity with DQ7 defined as
the parity bit. Sector state (protection or unprotection) will be informed by address XX02h for ×16 (XX04h for ×8) .
Scanning the sector addresses (A18, A17, A16, A15, A14, A13, and A12) while (A6, A1, A0) = (0, 1, 0) will produce a
logical “1” at device output DQ0 for a protected sector. The programming verification should be perform margin
mode on the protected sector. (See “MBM29SL800TE/BE User Bus Operations (BYTE = VIH) ” and
“MBM29SL800TE/BE User Bus Operations (BYTE = VIL) ” in DEVICE BUS OPERATION.)
To terminate the operation, it is necessary to write the Reset command sequence into the register, and also to
write the Autoselect command during the operation, execute it after writing Reset command
sequence.
Byte/Word Programming
The devices are programmed on a byte-by-byte (or word-by-word) basis. Programming is a four bus cycle
operation. There are two “unlock” wr ite cycles. These are followed by the program set-up command and data
write cycles. Addresses are latched on the falling edge of CE or WE, whichever happens later and the data is
latched on the rising edge of CE or WE, whichever happens first. The rising edge of CE or WE (whichever
happens first) begins programming. Upon executing the Embedded Program Algorithm command sequence,
the system is not required to provide further controls or timings. The device will automatically provide adequate
internally generated program pulses and verify the programmed cell margin.
The automatic programming operation is completed when the data on DQ7 is equivalent to data written to this
bit at which time the devices return to the read mode and addresses are no longer latched. (See “Hardware
Sequence Flags”.) Theref ore, the de vices require that a valid address to the devices be supplied b y the system
at this particular instance of time. Hence, Data P olling m ust be performed at the memory location which is being
programmed.
If hardware reset occurs during the programming operation, it is impossible to guarantee the data are being
written.
MBM29SL800TE/BE-90/10
17
Programming is allowed in any sequence and across sector boundaries. Beware that a data “0” cannot be
programmed back to a “1”. Attempting to do so may either hang up the device or result in an apparent success
according to the data polling algorithm but a read from read/reset mode will show that the data is still “0”. Only
erase operations can convert “0”s to “1”s.
“Embedded ProgramTM Algorithm” in FLOW CHART illustrates the Embedded ProgramTM Algorithm using
typical command strings and bus operations.
Chip Erase
Chip erase is a six bus cycle operation. There are two “unlock” write cycles. These are followed by writing the
“set-up” command. Two more “unlock” write cycles are then followed by the chip erase command.
Chip erase does not require the user to progr am the device prior to erase . Upon ex ecuting the Embedded Erase
Algorithm command sequence the devices will automatically program and verify the entire memor y for an all
zero data pattern prior to electrical erase (Preprogram function) . The system is not required to provide any
controls or timings during these operations.
The automatic erase begins on the rising edge of the last WE pulse in the command sequence and terminates
when the data on DQ7 is “1” (See Write Operation Status section.) at which time the de vice returns to read the
mode.
Chip Erase Time; Sector Erase Time × All sectors + Chip Program Time (Preprogramming)
“Embedded EraseTM Algorithm” in FLOW CHART illustrates the Embedded EraseTM Algorithm using typical
command strings and bus operations.
Sector Erase
Sector erase is a six b us cycle oper ation. There are two “unloc k” write cycles. These are f ollo wed b y writing the
“set-up” command. Two more “unloc k” write cycles are then follo wed b y the Sector Erase command. The sector
address (any address location within the desired sector) is latched on the f alling edge of WE, while the command
(Data = 30h) is latched on the r i sing edge of WE. After time-out of 50 µs from the rising edge of the last sector
erase command, the sector erase operation will begin.
Multiple sectors may be erased concurrently by writing the six bus cycle operations on “MBM29SL800TE/BE
Standard Command Definitions” in DEVICE BUS OPERATION. This sequence is followed with writes of the
Sector Erase command to addresses in other sectors desired to be concurrently erased. The time between
writes must be less than 50 µs otherwise that command will not be accepted and erasure will start. It is recom-
mended that processor interrupts be disabled during this time to guarantee this condition. The interrupts can be
re-enabled after the last Sector Erase command is written. A time-out of 50 µs from the r ising edge of the last
WE will initiate the execution of the Sector Erase command (s) . If another falling edge of the WE occurs within
the 50 µs time-out window the timer is reset. (Monitor DQ3 to determine if the sector erase timer window is still
open, see section DQ3, Sector Erase Timer.) Resetting the devices once execution has begun will corr upt the
data in the sector. In that case, restar t the erase on those sectors and allow them to complete. (Refer to the
Write Operation Status section f or Sector Erase Timer operation.) Loading the sector er ase b uff er ma y be done
in any sequence and with any number of sectors (0 to 18) .
Sector erase does not require the user to program the devices prior to erase. The de vices automatically program
all memory locations in the sector (s) to be erased prior to electrical erase (Preprogram function) . When erasing
a sector or sectors the remaining unselected sectors are not aff ected. The system is not required to provide an y
controls or timings during these operations.
The automatic sector erase begins after the 50 µs time out from the rising edge of the WE pulse for the last
sector erase command pulse and terminates when the data on DQ7 is “1” (See Write Operation Status section.)
at which time the de vices return to the read mode. Data polling must be performed at an address within any of
the sectors being erased. Multiple Sector Erase Time; [Sector Er ase Time + Sector Program Time (Preprogram-
ming) ] × Number of Sector Erase
“Embedded EraseTM Algorithm” in FLOW CHART illustrates the Embedded EraseTM Algorithm using typical
command strings and bus operations.
MBM29SL800TE/BE-90/10
18
Erase Suspend/Resume
The Erase Suspend command allows the user to interrupt a Sector Erase operation and then perform data reads
from or programs to a sector not being erased. This command is applicable ONLY during the Sector Erase
operation which includes the time-out period f or sector erase . Writting the Erase Suspend command during the
Sector Erase time-out results in immediate termination of the time-out period and suspension of the erase
operation.
Writing the Erase Resume command resumes the erase operation. The addresses are DON’T CARES when
writing the Erase Suspend or Erase Resume command.
When the Erase Suspend command is written during the Sector Erase operation, the device will take a maximum
of 20 µs to suspend the erase operation. When the devices have entered the erase-suspended mode, the
RY/BY output pin and the DQ7 bit will be at logic “1”, and DQ6 will stop toggling. The user must use the address
of the erasing sector f or reading DQ6 and DQ7 to determine if the erase operation has been suspended. Further
writes of the Erase Suspend command are ignored.
When the erase operation has been suspended, the devices def ault to the erase-suspend-read mode . Reading
data in this mode is the same as reading from the standard read mode except that the data must be read from
sectors that have not been erase-suspended. Successiv ely reading from the erase-suspended sector while the
device is in the erase-suspend-read mode will cause DQ2 to toggle. (See the section on DQ2.)
After entering the erase-suspend-read mode, the user can program the device by writing the appropriate com-
mand sequence for Program. This program mode is known as the erase-suspend-program mode. Again, pro-
gramming in this mode is the same as prog r amming in the regular Prog ram mode except that the data must be
programmed to sectors that are not erase-suspended. Successively reading from the erase-suspended sector
while the devices are in the erase-suspend-program mode will cause DQ2 to toggle. The end of the erase-
suspended Program operation is detected by the RY/BY output pin, Data polling of DQ7, or by the Toggle Bit I
(DQ6) which is the same as the regular Program operation. Note that DQ7 must be read from the Program address
while DQ6 can be read from any address.
To resume the operation of Sector Erase, the Resume command (30h) should be written. Any further writes of
the Resume command at this point will be ignored. Another Erase Suspend command can be written after the
chip has resumed erasing.
Fast Mode Set/Reset
MBM29SL800TE/BE has Fast Mode function. This mode dispenses with the initial two unclock cycles required
in the standard progra m command sequence by writing Fast Mode command into the command register . In this
mode, the required bus cycle for programming is two cycles instead of four bus cycles in standard program
command. The read operation is also executed after exiting this mode. During Fast mode, do not write any
commands other than the Fast program/Fast mode reset command. To exit this mode, it is necessary to wr ite
Fast Mode Reset command into the command register.
(Refer to the “Embedded ProgramTM Algorithm for Fast Mode” in FLOW CHART Extended algorithm.) The
VCC active current is required even CE = VIH during Fast Mode.
F ast Programming
During Fast Mode, the programming can be executed with two bus cycles operation. The Embedded Program
Algorithm is executed by writing program set-up command (A0h) and data write cycles (PA/PD) . (Refer to the
“Embedded ProgramTM Algorithm for Fast Mode” in FLOW CHART Extended algorithm.)
Extended Sector Protection
In addition to nor mal sector protection, the MBM29SL800TE/BE has Extended Sector Protection as extended
function. This function enable to protect sector by forcing VID on RESET pin and write a commnad sequence.
Unlike conventional procedure, it is not necessary to force VID and control timing for control pins. The only RESET
pin requires VID f or sector protection in this mode. The e xtended sector protect requires VID on RESET pin. With
this condition, the operation is initiated by writing the set-up command (60h) into the command register. Then,
the sector addresses pins (A18, A17, A16, A15, A14, A13 and A12) and (A6, A1, A0) = (0, 1, 0) should be set to the
sector to be protected (recommend to set VIL for the other addresses pins) , and write extended sector protect
MBM29SL800TE/BE-90/10
19
command (60h) . A sector is typically protected in 250 µs. To verify programming of the protection circuitry, the
sector addresses pins (A18, A17, A16, A15, A14, A13 and A12) and (A6, A1, A0) = (0, 1, 0) should be set and write a
command (40h) . Following the command write, a logical “1” at device output DQ0 will produce for protected
sector in the read operation. If the output data is logical “0”, please repeat to write extended sector protect
command (60h) again. To terminate the operation, it is necessary to set RESET pin to VIH.
Write Operation Status
Hardware Sequence Flags
*1:Successive reads from the er asing or erase-suspend sector causes DQ2 to toggle.
*2:Reading from non-erase suspend sector address will indicate logic “1” at the DQ2 bit.
DQ7
Data Polling
The MBM29SL800TE/BE devices feature Data Polling as a method to indicate to the host that the Embedded
Algorithms are in progress or completed. During the Embedded Program Algorithm an attempt to read the
devices will produce the complement of the data last written to DQ7. Upon completion of the Embedded Program
Algorithm, an attempt to read the device will produce the true data last written to DQ7. During the Embedded
Erase Algorithm, an attempt to read the device will produce a “0” at the DQ7 output. Upon completion of the
Embedded Erase Algorithm an attempt to read the device will produce a “1” at the DQ7 output. The flowchar t
for Data Polling (DQ7) is shown in “Data Polling Algorithm” in FLOW CHART.
For chip erase and sector erase, the Data Polling is valid after the rising edge of the sixth WE pulse in the six
write pulse sequence. Data Polling must be perf ormed at sector address within any of the sectors being erased
and not a protected sector. Otherwise, the status ma y not be valid. Once the Embedded Algorithm operation is
close to being completed, the MBM29SL800TE/BE data pins (DQ7) may change asynchronously while the output
enable (OE) is asserted low. This means that the devices are driving status information on DQ7 at one instant
of time and then that byte’s valid data at the next instant of time. Depending on when the system samples the
DQ7 output, it may read the status or valid data. Even if the device has completed the Embedded Algorithm
operation and DQ7 has a valid data, the data outputs on DQ6 to DQ0 may be still invalid. The valid data on DQ7
to DQ0 will be read on the successive read attempts.
The Data Polling feature is only active during the Embedded Programming Algorithm, Embedded Erase Algorithm
or sector erase time-out. (See “Hardware Sequence Flags”.)
Status DQ7DQ6DQ5DQ3DQ2
In Progress
Embedded Program Algorithm DQ7Toggle 0 0 1
Embedded Erase Algorithm 0 Toggle 0 1 Toggle
*1
Erase
Suspended
Mode
Erase Suspend Read
(Erase Suspended Sector) 1 1 0 0 Toggle
Erase Suspend Read
(Non-Erase Suspended Sector) Data Data Data Data Data
Erase Suspend Program
(Non-Erase Suspended Sector) DQ7*1Toggle *1001 *
2
Exceeded
Time Limits
Embedded Program Algorithm DQ7Toggle 1 0 1
Embedded Erase Algorithm 0 Toggle 1 1 N/A
Erase
Suspended
Mode
Erase Suspend Program
(Non-Erase Suspended Sector) DQ7Toggle 1 0 N/A
MBM29SL800TE/BE-90/10
20
See “Data Polling during Embedded Algorithm Operation Timing Diag ram” in TIMING DIAGRAM f or the Data
Polling timing specifications and diagrams.
DQ6
Toggle Bit I
The MBM29SL800TE/BE also feature the “Toggle Bit I” as a method to indicate to the host system that the
Embedded Algorithms are in progress or completed.
During an Embedded Program or Erase Algorithm cycle, successive attempts to read (OE toggling) data from
the de vices will result in DQ6 toggling betw een one and zero. Once the Embedded Program or Er ase Algorithm
cycle is completed, DQ6 will stop toggling and valid data will be read on the next successive attempts. During
programming, the Toggle Bit I is valid after the rising edge of the fourth WE pulse in the four write pulse sequence.
For chip erase and sector erase, the Toggle Bit I is valid after the rising edge of the sixth WE pulse in the six
write pulse sequence. The Toggle Bit I is active during the sector time out.
In progra mming, if the sector being written to is protected, the toggle bit will toggle for about 2 µs and then stop
toggling without the data having changed. In er ase, the de vices will erase all the selected sectors e xcept f or the
ones that are protected. If all selected sectors are protected, the chip will toggle the toggle bit for about 100 µs
and then drop back into read mode, having changed none of the data.
Either CE or OE toggling will cause the DQ6 to toggle. In addition, an Erase Suspend/Resume command will
cause the DQ6 to toggle.
See “AC Waveforms for Toggle Bit I during Embedded Algorithm Operations” in TIMING DIAGRAM for the
Toggle Bit I timing specifications and diagrams.
DQ5
Exceeded Timing Limits
DQ5 will indicate if the program or erase time has exceeded the specified limits (inter nal pulse count) . Under
these conditions DQ5 will produce a “1”. This is a failure condition which indicates that the program or erase
cycle was not successfully completed. Data Polling is the only operating function of the devices under this
condition. The CE circuit will partially power down the device under these conditions (to approximately 2 mA) .
The OE and WE pins will control the output disable functions as described in “MBM29SL800TE/BE User Bus
Operations (BYTE = VIH) ” and “MBM29SL800TE/BE User Bus Operations (BYTE = VIL) ” in DEVICE BUS
OPERATION.
The DQ5 f ailure condition ma y also appear if a user tries to program a non b lank location without erasing. In this
case the devices lock out and never complete the Embedded Algorithm operation. Hence, the system never
reads a v alid data on DQ7 bit and DQ6 never stops toggling. Once the devices have e x ceeded timing limits, the
DQ5 bit will indicate a “1.” Please note that this is not a device failure condition since the devices were incorrectly
used. If this occurs, reset the device with command sequence.
DQ3
Sector Erase Timer
After the completion of the initial sector erase command sequence the sector erase time-out will begin. DQ3 will
remain low until the time-out is complete. Data Polling and Toggle Bit are valid after the initial sector erase
command sequence.
If Data Polling or the Toggle Bit I indicates the device has been wr itten with a valid erase command, DQ3 may
be used to deter mine if the sector erase timer window is still open. If DQ3 is high (“1”) the internally controlled
erase cycle has begun. If DQ3 is low (“0”) the device will accept additional sector erase commands. To insure
the command has been accepted, the system software should check the status of DQ3 prior to and following
each subsequent Sector Erase command. If DQ3 were high on the second status chec k, the command ma y not
have been accepted.
See “Hardware Sequence Flags”.
MBM29SL800TE/BE-90/10
21
DQ2
Toggle Bit II
This toggle bit II, along with DQ6, can be used to deter mine whether the devices are in the Embedded Erase
Algorithm or in Erase Suspend.
Successiv e reads from the erasing sector will cause DQ2 to toggle during the Embedded Erase Algorithm. If the
de vices are in the er ase-suspended-read mode, successive reads from the erase-suspended sector will cause
DQ2 to toggle. When the devices are in the erase-suspended-program mode, successive reads from the byte
address of the non-erase suspended sector will indicate a logic “1” at the DQ2 bit.
DQ6 is different from DQ2 in that DQ6 toggles only when the standard program or Erase, or Erase Suspend
Program operation is in progress. The behavior of these two status bits, along with that of DQ7, is summarized
as follows :
For example, DQ2 and DQ6 can be used together to deter mine if the erase-suspend-read mode is in progress.
(DQ2 toggles while DQ6 does not.) See also “Hardware Sequence Flags” and “DQ2 vs. DQ6” in TIMING DIA-
GRAM.
Furthermore, DQ2 can also be used to determine which sector is being erased. When the de vice is in the er ase
mode, DQ2 toggles if this bit is read from an erasing sector.
Reading Toggle Bits DQ6/DQ2
Whenever the system initially begins reading toggle bit status, it must read DQ7 to DQ0 at least twice in a row
to determine whether a toggle bit is toggling. Typically a system would note and store the v alue of the toggle bit
after the first read. After the second read, the system would compare the new value of the toggle bit with the
first. If the toggle bit is not toggling, the device has completed the progr am or er ase oper ation. The system can
read array data on DQ7 to DQ0 on the following read cycle.
How ev er, if, after the initial two read cycles, the system determines that the toggle bit is still toggling, the system
also should note whether the value of DQ5 is high (see the section on DQ5) . If it is, the system should then
deter mine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as DQ5
went high. If the toggle bit is no longer toggling, the device has successfully completed the program or erase
operation. If it is still toggling, the de vice did not complete the operation successfully, and the system m ust write
the reset command to return to reading array data.
The remaining scenario is that the system initially deter mines that the toggle bit is toggling and DQ5 has not
gone high. The system may continue to monitor the toggle bit and DQ5 through successive read cycles, deter-
mining the status as described in the previous par agraph. Alternatively, it may choose to perform other system
tasks. In this case, the system m ust start at the begining of the algorithm when it returns to determine the status
of the operation. (Refer to “Toggle Bit Algorithm” in “ FLOW CHART”.)
Toggle Bit Status
*1 : Successive reads from the erasing or erase-suspend sector will cause DQ2 to toggle.
*2 : Reading from the non-erase suspend sector address will indicate logic “1” at the DQ2 bit.
Mode DQ7DQ6DQ2
Program DQ7Toggle 1
Erase 0 Toggle Toggle*1
Erase-Suspend Read
(Erase-Suspended Sector) 11Toggle
Erase-Suspend Program DQ7Toggle 1*2
MBM29SL800TE/BE-90/10
22
RY/BY
Ready/Busy
The MBM29SL800TE/BE provide a RY /BY open-drain output pin as a way to indicate to the host system that
the Embedded Algorithms are either in progress or has been completed. If the output is low, the devices are
busy with either a program or erase operation. If the output is high, the devices are ready to accept any
read/write or erase operation. If the MBM29SL800TE/BE are placed in an Erase Suspend mode, the RY/BY
output will be high.
During programming, the RY/BY pin is driven lo w after the rising edge of the fourth WE pulse. During an erase
operation, the RY/BY pin is driven lo w after the rising edge of the sixth WE pulse. The RY/BY pin will indicate a
busy condition during the RESET pulse. Refer to “RY/BY Timing Diagram during Program/Erase Operation
Timing Diagram” and “RESET, RY/BY Timing Diagram” in TIMING DIAGRAM for a detailed timing diagram.
The RY/BY pin is pulled high in standby mode.
Since this is an open-drain output, the pull-up resistor needs to be connected to VCC; multiples of devices may
be connected to the host system via more than one RY/BY pin in parallel.
Byte/Word Configuration
The BYTE pin selects the Byte (8-bit) mode or W ord (16-bit) mode for the MBM29SL800TE/BE devices. When
this pin is driven high, the de vices operate in the W ord (16-bit) mode . The data is read and programmed at DQ15
to DQ0. When this pin is driven lo w, the devices operate in byte (8-bit) mode . Under this mode, the DQ15/A-1 pin
becomes the low est address bit and DQ14 to DQ8 bits are tri-stated. Howe v er, the command b us cycle is alwa ys
an 8-bit operation and hence commands are written at DQ7 to DQ0 and the DQ15 to DQ8 bits are ignored.
Data Protection
The MBM29SL800TE/BE are designed to offer protection against accidental erasure or programming caused
by spurious system le v el signals that may e xist during power tr ansitions. During pow er up the de vices automat-
ically reset the internal state machine in the Read mode. Also, with its control register architecture, alter ation of
the memory contents only occurs after successful completion of specific multi-bus cycle command sequences.
The devices also incor porate several features to prevent inadvertent write cycles resulting form VCC power-up
and power-down transitions or system noise.
If Embedded Erase Algorithm is interrupted, there is possibility that the erasing sector (s) cannot be used.
Write Pulse “Glitch” Protection
Noise pulses of less than 3 ns (typical) on OE, CE, or WE will not initiate a write cycle.
Logical Inhibit
Writing is inhibited by holding any one of OE = VIL, CE = VIH, or WE = VIH. To initiate a wr ite cycle CE and WE
must be a logical zero while OE is a logical one.
Power-Up Write Inhibit
Power-up of the devices with WE = CE = VIL and OE = VIH will not accept commands on the rising edge of WE.
The internal state machine is automatically reset to the read mode on power-up.
Sector Protection
Device user is able to protect each sector individually to store and protect data. Protection circuit voids both
program and erase commands that are addressed to protected sectors. Any commands to program or erase
addressed to ptotected sector are ignored. (See “Sector Ptotection” in “ FUNCTIONAL DESCRIPTION”.)
MBM29SL800TE/BE-90/10
23
ABSOLUTE MAXIMUM RATINGS
*1:Voltage is defined on the basis of VSS = GND = 0 V.
*2:Minimum DC vo ltage on input or I/O pins is 0.3 V. During voltage tr ansitions, input or I/O pins ma y undershoot
VSS to 2.0 V f or periods of up to 20 ns. Maximum DC v oltage on input or I/O pins is VCC + 0.5 V. During v oltage
transitions, input or I/O pins may overshoot to V CC + 2.0 V for periods of up to 20 ns.
*3:Minimum DC input voltage on A9, OE and RESET pins is 0.3 V. During v oltage transitions, A9, OE and RESET
pins may undershoot VSS to 2.0 V for periods of up to 20 ns. V oltage difference between input and supply voltage
(VIN - VCC) does not e xceed +9.0 V. Maximum DC input v oltage on A9, OE and RESET pins is +11.5 V which may
overshoot to +12.5 V for periods of up to 20 ns.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
RECOMMENDED OPERATING CONDITIONS
* : Voltage is defined on the basis of VSS = GND = 0V.
Note: Operating ranges define those limits between which the proper device function is guaranteed.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
Parameter Symbol Rating Unit
Min Max
Storage Temperature Tstg 55 +125 °C
Ambient Temperature with Power Applied TA40 +85 °C
Voltage with Respect to Ground All pins except A9,
OE, and RESET *1, *2VIN, VOUT 0.3 VCC + 0.5 V
A9, OE, and RESET *1, *3VIN 0.3 +11.5 V
Power Supply Voltage *1VCC 0.5 +3.0 V
Parameter Symbol Value Unit
Min Max
Ambient Temperature TA40 +85 °C
Power Supply Voltage * VCC +1.65 +1.95 V
MBM29SL800TE/BE-90/10
24
MAXIMUM OVERSHOOT/MAXIMUM UNDERSHOOT
0.2 × VCC
0.3 V
20 ns
2.0 V 20 ns
20 ns
Maximum Undershoot Waveform
VCC + 0.5 V
0.8 × VCC
VCC + 2.0 V 20 ns
20 ns20 ns
Maximum Overshoot Waveform 1
+11.5 V
VCC + 0.5 V
+12.5 V 20 ns
20 ns20 ns
Maximum Overshoot Waveform 2
Note : This waveform is applied for A9, OE, and RESET.
MBM29SL800TE/BE-90/10
25
DC CHARACTERISTICS
*1: The ICC current listed includes both the DC operating current and the frequency dependent component.
*2: ICC active while Embedded Algorithm (program or erase) is in progress.
*3: Automatic sleep mode enables the low power mode when address remain stable for 150 ns.
*4: This timing is only for Sector Protection operation and Autoselect mode.
*5: Applicable for only VCC applying.
Parameter Symbol Conditions Value Unit
Min Typ Max
Input Leakage Current ILI VIN = VSS to VCC, VCC = VCC Max 1.0 +1.0 µA
Output Leakage Current ILO VOUT = VSS to VCC, VCC = VCC Max 1.0 +1.0 µA
A9, OE, RESET Inputs Leakage
Current ILIT VCC = VCC Max,
A9, OE, RESET = 11 V 35 µA
VCC Active Current *1ICC1
CE = VIL, OE = VIH,
f = 10 MHz Byte 20 mA
Word 20
CE = VIL, OE = VIH,
f = 5 MHz Byte 10 mA
Word 10
VCC Active Current *2ICC2 CE = VIL, OE = VIH 25 mA
VCC Current (Standby) ICC3 VCC = VCC Max, CE = VCC ± 0.3 V,
RESET = VCC ± 0.3 V 15µA
VCC Current (Standby, Reset) ICC4 VCC = VCC Max,
RESET = VSS ± 0.3 V 15µA
VCC Current
(Automatic Sleep Mode) *3ICC5 VCC = VCC Max, CE = VSS ± 0.3 V,
RESET = VCC ± 0.3 V,
VIN = VCC ± 0.3 V or VSS ± 0.3 V 15µA
Input Low Voltage VIL −0.3 0.2 × VCC V
Input High Voltage VIH 0.8 × VCC VCC + 0.3 V
Voltage for Autoselect and Sector
Protection (A9, OE, RESET) *4, *5VID 10 10.5 11 V
Output Low Voltage VOL IOL = 0.1 mA, VCC = VCC Min 0.1 V
Output High Voltage VOH IOH = 100 µAVCC 0.1 V
MBM29SL800TE/BE-90/10
26
AC CHARACTERISTICS
Read Only Operations Characteristics
* : Test Conditions :
Output Load : 30 pF
Input rise and fall times : 5 ns
Input pulse levels : 0.0 V or VCC
Timing measurement reference level
Input : VCC / 2
Output : VCC / 2
Parameter Symbol Test Setup
Value*
Unit-90 -10
JEDEC Standard Min Max Min Max
Read Cycle Time tAVAV tRC 90 100 ns
Address to Output Delay tAVQV tACC CE = VIL
OE = VIL 90 100 ns
Chip Enable to Output Delay tELQV tCE OE = VIL 90 100 ns
Output Enable to Output Delay tGLQV tOE 35 35 ns
Chip Enable to Output High-Z tEHQZ tDF 30 30 ns
Output Enable to Output High-Z tGHQZ tDF 30 30 ns
Output Hold Time From Addresses,
CE or OE, Whichever Occurs First tAXQX tOH 00ns
RESET Pin Low to Read Mode tREADY 20 20 µs
C
L
Device
Under
Test
Test Conditions
Note : CL = 30 pF including jig capacitance
MBM29SL800TE/BE-90/10
27
Write/Erase/Program Operations
*1: This does not include the preprogramming time.
*2: This timing is for Sector Protection operation.
Parameter Symbol Value
Unit-90 -10
JEDEC Standard Min Typ Max Min Typ Max
Write Cycle Time tAVAV tWC 90 100 ns
Address Setup Time tAVWL tAS 0 0ns
Address Hold Time tWLAX tAH 45 50 ns
Data Setup Time tDVWH tDS 45 50 ns
Data Hold Time tWHDX tDH 0 0ns
Output Enable Setup Time tOES 0 0ns
Output Enable
Hold Time Read tOEH 0 0ns
Toggle and Data Polling 10 10 ns
Read Recover Time Before Write tGHWL tGHWL 0 0ns
Read Recover Time Before Write tGHEL tGHEL 0 0ns
CE Setup Time tELWL tCS 0 0ns
WE Setup Time tWLEL tWS 0 0ns
CE Hold Time tWHEH tCH 0 0ns
WE Hold Time tEHWH tWH 0 0ns
Write Pulse Width tWLWH tWP 45 50 ns
CE Pulse Width tELEH tCP 45 50 ns
Write Pulse Width High tWHWL tWPH 30 30 ns
CE Pulse Width High tEHEL tCPH 30 30 ns
Programming
Operation Byte tWHWH1 tWHWH1 10.6 10.6 µs
Word 14.6 14.6 µs
Sector Erase Operation *1tWHWH2 tWHWH2 1.5 1.5 s
VCC Setup Time tVCS 50 50 µs
Rise Time to VID *2tVIDR 500 500 ns
Voltage Transition Time *2tVLHT 4 4µs
Write Pulse Width *2tWPP 100 100 µs
OE Setup Time to WE Active *2tOESP 4 4µs
CE Setup Time to WE Active *2tCSP 4 4µs
Recover Time From RY/BY tRB 0 0ns
RESET Pulse Width tRP 500 500 ns
RESET Hold Time Before Read tRH 200 200 ns
Program/Erase Valid to RY/BY Delay tBUSY 90 90 ns
Delay Time from Embedded Output Enable tEOE 90 100 ns
Power On/Off Timing tPS 0 0ns
Erase Time-out Time tTOW 50 50 µs
Erase Suspend Transition Time tSPO 20 20 µs
MBM29SL800TE/BE-90/10
28
ERASE AND PROGRAMMING PERFORMANCE
PIN CAPACITANCE
TSOP, FBGA, CSOP PIN CAPACITANCE
Notes : Test conditions TA = +25 °C, f = 1.0 MHz
DQ15/A-1 pin capacitance is stipulated by output capacitance.
Parameter Value Unit Remarks
Min Typ Max
Sector Erase Time 1.5 15 s Excludes programming time prior to erasure
Word Programming Time 14.6 µsExcludes system-level overhead
Byte Programming Time 10.6 300 µs
Chip Programming Time 7.7 200 s Excludes system-level overhead
Program/Erase Cycle 100,000 cycle
Parameter Symbol Test Setup Value Unit
Typ Max
Input Capacitance CIN VIN = 07.59.5pF
Output Capacitance COUT VOUT = 0810pF
Control Pin Capacitance CIN2 VIN = 01013pF
MBM29SL800TE/BE-90/10
29
TIMING DIAGRAM
Key to Switching Waveforms
WAVEFORM INPUTS OUTPUTS
Must Be
Steady
May
Change
from H to L
May
Change
from L to H
"H" or "L":
Any Change
Permitted
Does Not
Apply
Will Be
Steady
Will
Change
from H to L
Will
Change
from L to H
Changing,
State
Unknown
Center Line is
High-
Impedance
"Off" State
Read Operation Timing Diagram
Address Address Stable
High-Z High-Z
CE
OE
WE
Outputs Outputs Valid
tRC
tACC
tOE tDF
tCE tOH
tOEH
MBM29SL800TE/BE-90/10
30
Hardware Reset/Read Operation Timing Diagram
Address
CE
RESET
Outputs High-Z Outputs Valid
Address Stable
tRC
tACC
tRH
tRP tRH tCE
tOH
MBM29SL800TE/BE-90/10
31
Address
Data
CE
OE
WE
3rd Bus Cycle Data Polling
555h PA
A0h PD DQ7DOUT DOUT
PA
tWC tAS tAH tRC
tCE
tWHWH1
tWPHtWP
tGHWL
tDS tDH tDF tOH
tOE
tCS tCH
Alternate WE Controlled Program Operation Timing Diagram
Notes : PA is address of the memory location to be programmed.
PD is data to be programmed at byte address.
DQ7 is the output of the complement of the data written to the device.
DOUT is the output of the data written to the device.
Figure indicates last two bus cycles out of four bus cycles sequence.
These waveforms are for the ×16 mode. (The addresses differ from ×8 mode.)
MBM29SL800TE/BE-90/10
32
Address
Data
WE
OE
CE
3rd Bus Cycle Data Polling
555h PA
A0h PD DQ7DOUT
PA
tWC tAS tAH
tWHWH1
tCPH
tCP
tGHEL
tDS tDH
tWS tWH
Alternate CE Controlled Program Operation Timing Diagram
Notes : PA is address of the memory location to be programmed.
PD is data to be programmed at byte address.
DQ7 is the output of the complement of the data written to the device.
DOUT is the output of the data written to the device.
Figure indicates last two bus cycles out of four bus cycles sequence.
These waveforms are for the ×16 mode. (The addresses differ from ×8 mode.)
MBM29SL800TE/BE-90/10
33
Address
Data
V
CC
CE
OE
WE
555h 2AAh 555h 555h 2AAh SA*
t
WC
t
AS
t
AH
t
CS
t
GHWL
t
CH
t
WP
t
DS
t
VCS
t
DH
t
WPH
AAh 55h 80h AAh 55h 10h/
30h
10h for Chip Erase
SA*
30h
t
TOW
Chip/Sector Erase Operation Timing Diagram
* : SA is the sector address for Sector Erase. Addresses = 555h (Word) fo r Chip Erase.
Note : These waveforms are for the ×16 mode. The addresses differ for ×8 mode.
MBM29SL800TE/BE-90/10
34
tOEH
tCH tOE
tCE
tDF
tBUSY tEOE
tWHWH1 or 2
CE
DQ7
DQ6 to DQ0
RY/BY
DQ7DQ7 =
Valid Data
DQ6 to DQ0 =
Outputs Flag DQ6 to DQ0
Valid Data
OE
WE
High-Z
High-Z
Data
Data
*
Data Polling during Embedded Algorithm Operation Timing Diagram
* : DQ7 = Valid Data (The device has completed the Embedded operation) .
MBM29SL800TE/BE-90/10
35
tDH tOE tCE
CE
WE
OE
DQ6/DQ2
Address
RY/BY
Data Toggle
Data Toggle
Data Toggle
Data Stop
Toggling Outpu
t
Valid
*
tBUSY
tOEHtOEH tOEPH
tAHT tAHTtASO tAS
tCEPH
AC Waveforms for Toggle Bit I during Embedded Algorithm Operations
* : DQ6 stops toggling (The device has completed the Embedded operation) .
MBM29SL800TE/BE-90/10
36
CE
RY/BY
WE
Rising edge of the last WE signal
tBUSY
Entire programming
or erase operations
RY/BY Timing Diagram during Program/Erase Operation Timing Diag ram
tRP
tRB
tREADY
RY/BY
WE
RESET
RESET, RY/BY Timing Diagram
MBM29SL800TE/BE-90/10
37
tWPP
tVLHT tVLHT
tOE
tCSP
tOESP
tVCS
tVLHT
tVLHT
A18, A17, A16
A15, A14, A13
A12
A6, A0
A1
A9
VCC
OE
VID
VIH
VID
VIH
WE
CE
Data
SPAX
01h
SPAY
Sector Protection Timing Diagram
SPAX : Sector Address to be protected
SPAY : Next Sector Address to be protected
Note : A-1 is VIL on byte mode.
MBM29SL800TE/BE-90/10
38
Unprotection period
tVLHT
tVLHT
tVCS
tVLHT
tVIDR
Program or Erase Command Sequence
VCC
VID
VIH
WE
RY/BY
CE
RESET
Temporary Sector Unprotection Timing Diagram
Enter
Embedded
Erasing Erase
Suspend Erase
Resume
Enter Erase
Suspend Program
Erase
Suspend
Program
Erase
Complete
Erase
Erase Suspend
Read Erase Suspend
Read
Erase
DQ6
DQ2 *
WE
Toggle
DQ2 and DQ6
with OE or CE
DQ2 vs. DQ6
* : DQ2 is read from the erase-suspended sector.
MBM29SL800TE/BE-90/10
39
VCC
WE
OE
CE
RESET tWC tWC
tVLHT
tVIDR
tVCS
TIME-OUT
SAX SAX SAY
tWP
tOE
60h01h40h60h60h
Data
Address
A6, A0
A1
Extended Sector Protection Timing Diagram
SAX : Sector Address to be protected
SAY : Next Sector Address to be protected
TIME-OUT : Time-Out window = 250 µs (Min)
MBM29SL800TE/BE-90/10
40
RESET
Address
Data
VCC
tPS tPS
tRH tACC
1.65 V
0 V
Input Valid
Output Valid
0 V
Power ON/OFF Timing Diagram
MBM29SL800TE/BE-90/10
41
FLOW CHART
Embedded ProgramTM Algorithm
Note : The sequence is applied for × 16 mode.
The addresses differ from × 8 mode.
Embedded AlgorithmTM
555h/AAh
555h/A0h
2AAh/55h
Program Address/Program Data
Programming Completed
Last Address
?
Increment Address
Verify Data
?
Data Polling
Program Command Sequence (Address/Command):
Write Program
Command Sequence
(See Below)
Start
No
No
Yes
Yes
Embedded
Program
Algorithm
in progress
MBM29SL800TE/BE-90/10
42
Embedded EraseTM Algorithm
Note : The sequence is applied for × 16 mode.
The addresses differ from × 8 mode.
Embedded AlgorithmTM
555h/AAh
555h/80h
2AAh/55h
555h/AAh
555h/10h
2AAh/55h
555h/AAh
555h/80h
2AAh/55h
555h/AAh
Sector Address
/30h
Sector Address
/30h
Sector Address
/30h
2AAh/55h
Erasure Completed
Data = FFh
?
Data Polling
Write Erase
Command Sequence
(See Below)
Start
No
Yes
Embedded
Erase
Algorithm
in progress
Chip Erase Command Sequence
(Address/Command):
Individual Sector/Multiple Sector
Erase Command Sequence
(Address/Command):
Additional sector
erase commands
are optional.
MBM29SL800TE/BE-90/10
43
Data Polling Algorithm
* : DQ7 is rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5.
VA =Valid Address for programming
=Any of the sector addresses
within the sector being erased
during sector erase or multiple
erases operation.
=Any of the sector addresses
within the sector not being
protected during sector erase or
multiple sector erases
operation.
(Data polling on sector group
protected sector may fail.)
DQ7 = Data?
DQ5 = 1?
Fail Pass
DQ7 = Data?
*
Read Byte
(DQ7 to DQ0)
Addr. = VA
Read Byte
(DQ7 to DQ0)
Addr. = VA
Start
No
No
No
Yes
Yes
Yes
MBM29SL800TE/BE-90/10
44
Toggle Bit Algorithm
*1 : Read toggle bit twice to determine whether it is toggling.
*2 : Recheck toggle bit because it may stop toggling as DQ5 changes to “1”.
DQ6
= Toggle?
DQ5 = 1?
DQ6
= Toggle?
Read (DQ7 to DQ0)
Addr. = VIH or VIL
Read (DQ7 to DQ0)
Addr. = VIH or VIL
Read DQ7 to DQ0
Addr. = VIH or VIL
Start
No
No
No
Yes
Yes
Yes *1, *2
Read DQ7 to DQ0
Addr. = VIH or VIL
*1
Fail Pass
MBM29SL800TE/BE-90/10
45
Start
No No
No
Yes
Yes Yes
Data = 01h?
Device Failed
PLSCNT = 25?
PLSCNT = 1
Remove VID from A9
Write Reset Command
Remove VID from A9
Write Reset Command
Sector Protection
Completed
Protect Another
Sector?
Increment PLSCNT
Read from Sector Address
Addr. = SPA, A1 = VIH
A6 = A0 = VIL
Setup Sector Addr.
(A18, A17, A16, A15, A14, A13, A12)
OE = VID, A9 = VID
CE = VIL, RESET = VIH
A6 = A0 = VIL, A1 = VIH
Activate WE Pulse
Time out 100 µs
WE = VIH, CE = OE = VIL
(A9 should remain VID)
()
*
Sector Protection Algorithm
* : A-1 is VIL on byte mode.
MBM29SL800TE/BE-90/10
46
Start
Perform Erase or
Program Operations
RESET = VID
*1
RESET = VIH
Temporary Sector
Unprotection Completed
*2
Temporary Sector Unprotection Algorithm
*1 : All protected sectors are unprotected.
*2 : All previously protected sectors are protected once again.
MBM29SL800TE/BE-90/10
47
Start
No
Yes Yes
Data = 01h?
PLSCNT = 1
No
No
Yes
Device Failed
PLSCNT = 25?
Remove VID from RESET
Write Reset Command
Sector Protection
Completed
Protect Other Sector?
Increment PLSCNT
Read from Sector Address
(Addr. = SPA, A0 = VIL,
A1 = VIH, A6 = VIL)
Remove VID from RESET
Write Reset Command
Time out 150 µs
RESET = VID
Wait to 4 µs
No
Yes
Setup Next Sector Address
Device is Operating in
Temporary Sector
Unprotection Mode
To Protect Sector
Write 60h to Secter Address
(A6 = A0 = VIL, A1 = VIH)
To Verify Sector Protection
Write 40h to Secter Address
(A6 = A0 = VIL, A1 = VIH)
To Setup Sector Protection
Write XXXh/60h
Extended Sector
Protection Entry?
Extended Sector Protection Algorithm
MBM29SL800TE/BE-90/10
48
555h/AAh
555h/20h
XXXh/90h
XXXh/F0h
XXXh/A0h
2AAh/55h
Program Address/Program Data
Programming Completed
Last Address
?
Increment Address
Verify Data?
Data Polling
Start
No
No
Yes
Yes
Set Fast Mode
In Fast Program
Reset Fast Mode
Embedded ProgramTM Algorithm for Fast Mode
Note : The sequence is applied for × 16 mode.
The addresses differ from × 8 mode.
FAST MODE ALGORITHM
MBM29SL800TE/BE-90/10
49
ORDERING INFORMATION
Part No. Package Access Time Sector
Architecture
MBM29SL800TE-90PBT
MBM29SL800TE-10PBT 48-ball plastic FBGA
(BGA-48P-M20) 90
100 Top Sector
MBM29SL800TE-90PW
MBM29SL800TE-10PW 45-ball plastic SCSP
(WLP-45P-M02) 90
100
MBM29SL800BE-90PBT
MBM29SL800BE-10PBT 48-ball plastic FBGA
(BGA-48P-M20) 90
100 Bottom Sector
MBM29SL800BE-90PW
MBM29SL800BE-10PW 45-ball plastic SCSP
(WLP-45P-M02) 90
100
10
ET
MBM29SL800
DEVICE NUMBER/DESCRIPTION
MBM29SL800
8 Mega-bit (1 M × 8-Bit or 512 K × 16-Bit) CMOS Flash Memory
1.8 V-only Read, Progra m, and Erase
PACKAGE TYPE
PBT = 48-Ball Fine Pitch Ball Grid Array
Package (FBGA)
PW = 45-Ball Super Chip Size Package
(SCSP)
SPEED OPTION
See Product Selector Guide
Device Revision
BOOT CODE
T = Top sector
B = Bottom sector
PBT
MBM29SL800TE/BE-90/10
50
PACKAGE DIMENSIONS
(Continued)
48-ball plastic FBGA
(BGA-48P-M20)
Dimensions in mm (inches).
Note : The values in parentheses are reference values.
C
2003 FUJITSU LIMITED B48020S-c-2-2
8.00
±
0.20(.315
±
.008)
0.38
±
0.10(.015
±
.004)
(Stand off)
(Mounting height)
6.00
±
0.20
(.236
±
.008)
0.10(.004)
0.80(.031)TYP
5.60(.220)
4.00(.157)
48-ø0.45
±
0.05
(48-ø.018
±
.002)
M
ø0.08(.003)
HGFEDCBA
6
5
4
3
2
1
.043
.005
+.003
0.13
+0.12
1.08
(INDEX AREA)
MBM29SL800TE/BE-90/10
51
(Continued)
45-ball plastic SCSP
(WLP-45P-M02)
Dimensions in mm (inches).
Note : The values in parentheses are reference values.
C
2004 FUJITSU LIMITED W45002Sc-1-1
4.70±0.10
3.54±0.10
(.139±.004)
(LASER MARKING)
0.08(.003)
Z
(0.50x8=4.00)
0.50(.020)
Typ
0.50(.020)
Typ
45-ø0.23±0.10
(45-ø.009±.004) M
0.08(.003)
Z
4-ø0.13(4-ø.005)
X
Y
INDEX AREA
0.10(.004)
Min
0.80(.032)
((.020x8=.158))
(0.50x4=2.00)
((.020x4=.079))
XYZ
Max
(.185±.004)
(Stand off)
MBM29SL800TE/BE-90/10
FUJITSU LIMITED
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information, such as descriptions of function and application
circuit examples, in this document are presented solely for the
purpose of reference to show examples of operations and uses of
Fujitsu semiconductor device; Fujitsu does not warrant proper
operation of the device with respect to use based on such
information. When you develop equipment incorporating the
device based on such information, you must assume any
responsibility arising out of such use of the information. Fujitsu
assumes no liability for any damages whatsoever arising out of
the use of the information.
Any information in this document, including descriptions of
function and schematic diagrams, shall not be construed as license
of the use or exercise of any intellectual property right, such as
patent right or copyright, or any other right of Fujitsu or any third
party or does Fujitsu warrant non-infringement of any third-party’s
intellectual property right or other right by using such information.
Fujitsu assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result
from the use of information contained herein.
The products described in this document are designed, developed
and manufactured as contemplated for general use, including
without limitation, ordinary industrial use, general office use,
personal use, and household use, but are not designed, developed
and manufactured as contemplated (1) for use accompanying fatal
risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death,
personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for use requiring
extremely high reliability (i.e., submersible repeater and artificial
satellite).
Please note that Fujitsu will not be liable against you and/or any
third party for any claims or damages arising in connection with
above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You
must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for export
of those products from Japan.
F0407
FUJITSU LIMITED Printed in Japan