
KK74LV14
MAXIMUM RATINGS*
Symbol Parameter Value Unit
VCC DC supply voltage (Referenced to GND) -0.5 ÷ +7.0 V
IIK*1DC input diode current ±20 mA
IOK*2DC output diode current ±50 mA
Io*3DC output source or sink current
-bus driver outputs
±25 mA
IGND DC GND current for types with
- bus driver outputs
±50 mA
ICC DC VCC current for types with
- bus driver outputs
±50 mA
PDPower dissipation per paskade, plastic DIP+
SOIC package+
750
500
mW
Tstg Storage temperature -65 ÷ +150 °C
TLLead temperature, 1.5 mm from Case for 10 seconds
(Plastic DIP ), 0.3 mm (SOIC Package)
260 °C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 12 mW/°C from 70° to 125°C
SOIC Package: : - 8 mW/°C from 70° to 125°C
*1: VI < -0.5V or VI > VCC+0.5V
*2: Vo < -0.5V or Vo > VCC+0.5V
*3: -0.5V < Vo < VCC+0.5V
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC DC Supply Voltage (Referenced to GND) 1.0 5.5 V
VIN, VOUT DC Input Voltage, Output Voltage (Referenced to GND) 0 VCC V
TAOperating Temperature, All Package Types -40 +125 °C
tr, tfInput Rise and Fall Time 1.0 V≤VCC <2.0 V
2.0 V≤VCC <2.7 V
2.7 V≤VCC <3.6 V
3.6 V≤VCC ≤5.5 V
0
0
0
0
500
200
100
50
ns
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this
high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or
VOUT)≤VCC.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused
outputs must be left open.
2