MCP1727-1202E/MF - Microchip Technology

MCP1727

Features

• 1.5A Output Current Capability

• Input Operating Voltage Range: 2.3V to 6.0V

• Adjustable Output Voltage Range: 0.8V to 5.0V

• Standard Fixed Output Voltages:

- 0.8V, 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V

• Other Fixed Output Voltage Options Available

Upon Request

• Low Dropout Voltage: 330 mV Typical at 1.5A

• Typical Output Voltage Tolerance: 0.4%

• Stable with 1.0 µF Ceramic Output Capacitor

• Fast response to Load Transients

• Low Supply Current: 140 µA (typ)

• Low Shutdown Supply Current: 0.1 µA (typ)

• Adjustable Delay on Power Good Output

• Short Circuit Current Limiting and

Overtemperature Protection

• 3x3 DFN-8 and SOIC-8 Package Options

Applications

• High-Speed Driver Chipset Power

• Networking Backplane Cards

• Notebook Computers

• Network Interface Cards

• Palmtop Computers

• 2.5V to 1.XV Regulators

Description

The MCP1727 is a 1.5A Low Dropout (LDO) linear

regulator that provides high current and low output

voltages in a very small package. The MCP1727

comes in a fixed (or adjustable) output voltage version,

with an output voltage range of 0.8V to 5.0V. The 1.5A

output current capability, combined with the low output

voltage capability, make the MCP1727 a good choice

for new sub-1.8V output voltage LDO applications that

have high current demands.

The MCP1727 is stable using ceramic output

capacitors that inherently provide lower output noise

and reduce the size and cost of the entire regulator

solution. Only 1 µF of output capacitance is needed to

stabilize the LDO.

Using CMOS construction, the quiescent current

consumed by the MCP1727 is typically less than

140 µA over the entire input voltage range, making it

attractive for portable computing applications that

demand high output current. When shut down, the

quiescent current is reduced to less than 0.1 µA.

The scaled-down output voltage is internally monitored

and a power good (PWRGD) output is provided when

the output is within 92% of regulation (typical). An

external capacitor can be used on the CDELAY pin to

adjust the delay from 1 ms to 300 ms.

The overtemperature and short circuit current-limiting

provide additional protection for the LDO during system

fault conditions.

Package Types

VIN

SHDN

GND PWRGD

CDELAY

Sense

VOUT

VIN

SHDN

GND PWRGD

CDELAY

ADJ

VOUT

Adjustable (SOIC-8) Fixed (SOIC-8)

VIN

SHDN

GND PWRGD

CDELAY

Sense

VOUT

Fixed (3x3 DFN)

VIN

SHDN

GND PWRGD

CDELAY

VOUT

Adjustable (3x3 DFN)

ADJ

1.5A, Low Voltage, Low Quiescent Current

LDO Regulator Product Brief

MCP1727

Typical Application

MCP1727 Adjustable Output Voltage

VIN

SHDN

GND PWRGD

CDELAY

ADJ

VOUT

1µF

PWRGD

VOUT = 1.2V @ 1A

100 kΩ

4.7 µF

VIN = 2.3V to 2.8V

Off

VIN

20 kΩ

40 kΩ

C1C2

1000 pF

MCP1727 Fixed Output Voltage

VIN

SHDN

GND PWRGD

CDELAY

Sense

VOUT

PWRGD

VOUT = 1.8V @ 1A

VIN = 2.3V to 2.8V

Off

VIN

1µF

100 kΩ

4.7 µF

C1C2

1000 pF

MCP1727

Functional Block Diagram - Adjustable Output

–

VOUT

PMOS

ISNS

Overtemperature

VREF

Comp

92% of VREF

TDELAY

PWRGD

CDELAY

VIN

Driver w/limit

and SHDN

GND

Soft-Start

ADJ

Undervoltage

Lock Out

VIN

Reference

SHDN

Sensing

(UVLO)

MCP1727

Functional Block Diagram - Fixed Output

–

VOUT

PMOS

ISNS

Overtemperature

VREF

Comp

92% of VREF

TDELAY

PWRGD

CDELAY

VIN

Driver w/limit

and SHDN

GND

Soft-Start

Sense

Undervoltage

Lock Out

VIN

Reference

SHDN

Sensing

(UVLO)

© 2006 Microchip Technology Inc. Preliminary DS21997A-page 5
MCP1727
1.0 ELECTRICAL 
CHARACTERISTICS
Absolute Maximum Ratings †
VIN....................................................................................6.5V
Maximum Voltage on Any Pin .. (GND – 0.3V) to (VDD + 0.3)V
Maximum Power Dissipation......... Internally-Limited (Note 6)
Output Short Circuit Duration ................................ Continuous
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature, TJ........................... +150°C
ESD protection on all pins (HBM/MM) ...........  ≥ 2kV; ≥ 200V
† Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
AC-DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = VR ( Note 2) + 0.6V, VR = 1.8V for Adjustable Output, 
IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C. 
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C 
Parameters Sym Min Typ Max Units Conditions
Input Operating Voltage VIN 2.3 6.0 VNote 1
Input Quiescent Current Iq— 140 220 µA IL = 0 mA, VIN = Note 1,
VOUT = 0.8V to 5.0V
Input Quiescent Current for SHDN 
Mode
ISHDN —0.13µA SHDN = GND
Maximum Output Current IOUT 1.5 —— AV
IN = 2.3V to 6.0V
VR = 0.8V to 5.0V, Note 1
Line Regulation ΔVOUT/
(VOUT x ΔVIN)
—0.050.15 %/V (Note 1) ≤ VIN ≤ 6V
Load Regulation ΔVOUT/VOUT -1.0 ±0.5 1.0 %I
OUT = 1 mA to 1.5A,
VIN = Note 1, (Note 4)
Output Short Circuit Current IOUT_SC —2.2—AV
IN = Note 1, 
RLOAD <0.1Ω, Peak 
Current
Adjust Pin Characteristics (Adjustable Output Only)
Adjust Pin Reference Voltage VADJ 0.402 0.410 0.418 VV
IN = 2.3V to VIN =6.0V,
IOUT = 1 mA
Adjust Pin Leakage Current IADJ -10 ±0.01 +10 nA VIN = 6.0V, 
VADJ =0Vto6V
Adjust Temperature Coefficient TCVOUT — 40 — ppm/°C Note 3
Fixed-Output Characteristics (Fixed Output Only)
Note 1: The minimum VIN must meet two conditions: VIN ≥ 2.3V and VIN  ≥ (VR + 2.5%) + VDROPOUT(MAX).
2: VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output 
voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.
3: TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the 
temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is 
tested over a load range from 1 mA to the maximum specified output current.
5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its 
nominal value that was measured with an input voltage of  VIN = VR + VDROPOUT(MAX).
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction 
temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power 
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained 
junction temperatures above 150°C can impact device reliability.
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the 
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the 
ambient temperature is not significant.

MCP1727

Voltage Regulation VOUT VR - 2.5% VR

±0.5%

VR + 2.5% VNote 2

Dropout Characteristics

Dropout Voltage VIN-VOUT — 330 525 mV Note 5, IOUT = 1.5A,

VIN(MIN) =2.3V

Power Good Characteristics

PWRGD Input Voltage Operating

Range

VPWRGD_VIN 1.0 — 6.0 V TA = +25°C

1.2 —6.0 TA = -40°C to +125°C

For VIN < 2.3V,

ISINK = 100 µA

PWRGD Threshold Voltage

(Referenced to VOUT)

VPWRGD_TH 89 92 95 %VOUT Falling Edge

PWRGD Threshold Hysteresis VPWRGD_HYS 1.0 2.0 3.0 %VOUT

PWRGD Output Voltage Low VPWRGD_L —0.20.4 VI

PWRGD SINK = 1.2 mA,

VFB = 0V, CDELAY = GND

PWRGD Leakage PWRGD_LK —1—nAV

PWRGD = VIN = 6.0V

PWRGD Time Delay TPG Rising Edge

RPULLUP = 10 kΩ

— 200 — µs CDELAY = OPEN

10 30 55 ms CDELAY =0.01µF

— 300 — ms CDELAY =0.1µF

Detect Threshold to PWRGD Active

Time Delay

TVDET-PWRGD — 200 — µs VADJ or VSENSE =

VPWRGD_TH + 20 mV to

VPWRGD_TH - 20 mV

Shutdown Input

Logic High Input VSHDN-HIGH 45 %VIN VIN = 2.3V to 6.0V

Logic Low Input VSHDN-LOW 15 %VIN VIN = 2.3V to 6.0V

SHDN Input Leakage Current SHDNILK -0.1 ±0.001 +0.1 µA VIN = 6V, SHDN =VIN,

SHDN = GND

AC Performance

Output Delay From SHDN TOR 100 µs SHDN = GND to VIN

VOUT = GND to 95% VR

AC-DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, VIN = VR ( Note 2) + 0.6V, VR = 1.8V for Adjustable Output,

IOUT = 1 mA, CIN = COUT = 4.7 µF (X7R Ceramic), TA = +25°C.

Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C

Parameters Sym Min Typ Max Units Conditions

Note 1: The minimum VIN must meet two conditions: VIN ≥ 2.3V and VIN ≥ (VR + 2.5%) + VDROPOUT(MAX).

2: VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output

voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1.

3: TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature). VOUT-HIGH is the highest voltage measured over the

temperature range. VOUT-LOW is the lowest voltage measured over the temperature range.

4: Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is

tested over a load range from 1 mA to the maximum specified output current.

5: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its

nominal value that was measured with an input voltage of VIN = VR + VDROPOUT(MAX).

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air. (i.e., TA, TJ, θJA). Exceeding the maximum allowable power

dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained

junction temperatures above 150°C can impact device reliability.

7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the

desired junction temperature. The test time is small enough such that the rise in the junction temperature over the

ambient temperature is not significant.

MCP1727

TEMPERATURE SPECIFICATIONS

Output Noise eN—2.0—µV/√Hz IOUT = 500 mA, f = 1 kHz,

COUT = 10 µF (X7R

Ceramic), VOUT = 2.5V

Power Supply Ripple Rejection

Ratio

PSRR — 60 — dB f = 100 Hz, COUT = 10 µF,

IOUT = 100 mA,

VINAC = 30 mV pk-pk,

CIN = 0 µF

Thermal Shutdown Temperature TSD — 150 — °C IOUT = 100 µA, VOUT =

1.8V, VIN = 2.8V

Thermal Shutdown Hysteresis ΔTSD —10—°CI

OUT = 100 µA, VOUT =

1.8V, VIN = 2.8V

Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 2.3V to 6.0V.

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Operating Junction Temperature Range TJ-40 — +125 °C Steady State

Maximum Junction Temperature TJ— — +150 °C Transient

Storage Temperature Range TA-65 — +150 °C

Thermal Package Resistances

Thermal Resistance, 8LD 3x3 DFN θJA — 41 — °C/W 4-Layer JC51-7

Standard Board with

vias

Thermal Resistance, 8LD SOIC θJA — 150 — °C/W 4-Layer JC51-7

Standard Board