MCP1727 1.5A, Low Voltage, Low Quiescent Current LDO Regulator Product Brief Features Description * * * * The MCP1727 is a 1.5A Low Dropout (LDO) linear regulator that provides high current and low output voltages in a very small package. The MCP1727 comes in a fixed (or adjustable) output voltage version, with an output voltage range of 0.8V to 5.0V. The 1.5A output current capability, combined with the low output voltage capability, make the MCP1727 a good choice for new sub-1.8V output voltage LDO applications that have high current demands. * * * * * * * * * * 1.5A Output Current Capability Input Operating Voltage Range: 2.3V to 6.0V Adjustable Output Voltage Range: 0.8V to 5.0V Standard Fixed Output Voltages: - 0.8V, 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V Other Fixed Output Voltage Options Available Upon Request Low Dropout Voltage: 330 mV Typical at 1.5A Typical Output Voltage Tolerance: 0.4% Stable with 1.0 F Ceramic Output Capacitor Fast response to Load Transients Low Supply Current: 140 A (typ) Low Shutdown Supply Current: 0.1 A (typ) Adjustable Delay on Power Good Output Short Circuit Current Limiting and Overtemperature Protection 3x3 DFN-8 and SOIC-8 Package Options The MCP1727 is stable using ceramic output capacitors that inherently provide lower output noise and reduce the size and cost of the entire regulator solution. Only 1 F of output capacitance is needed to stabilize the LDO. Using CMOS construction, the quiescent current consumed by the MCP1727 is typically less than 140 A over the entire input voltage range, making it attractive for portable computing applications that demand high output current. When shut down, the quiescent current is reduced to less than 0.1 A. Applications * * * * * * The scaled-down output voltage is internally monitored and a power good (PWRGD) output is provided when the output is within 92% of regulation (typical). An external capacitor can be used on the CDELAY pin to adjust the delay from 1 ms to 300 ms. High-Speed Driver Chipset Power Networking Backplane Cards Notebook Computers Network Interface Cards Palmtop Computers 2.5V to 1.XV Regulators The overtemperature and short circuit current-limiting provide additional protection for the LDO during system fault conditions. Package Types Adjustable (SOIC-8) VIN 1 VIN 2 SHDN 3 GND 4 Fixed (SOIC-8) 8 VOUT VIN 1 VIN 2 7 ADJ 6 CDELAY SHDN 3 5 PWRGD (c) 2006 Microchip Technology Inc. GND 4 8 VOUT 7 Sense 6 CDELAY 5 PWRGD Adjustable (3x3 DFN) VIN 1 8 VOUT VIN 2 7 ADJ SHDN 3 6 CDELAY GND 4 5 PWRGD Preliminary Fixed (3x3 DFN) VIN 1 8 VOUT VIN 2 7 Sense SHDN 3 6 CDELAY GND 4 5 PWRGD DS21997A-page 1 MCP1727 Typical Application MCP1727 Fixed Output Voltage VIN = 2.3V to 2.8V C1 4.7 F 1 VIN VOUT 8 2 VIN Sense 7 3 SHDN CDELAY 6 4 GND VOUT = 1.8V @ 1A C2 1 F PWRGD 5 C3 1000 pF On R1 100 k Off PWRGD MCP1727 Adjustable Output Voltage VIN = 2.3V to 2.8V C1 4.7 F 1 VIN VOUT 8 2 VIN ADJ 7 3 SHDN CDELAY 6 4 GND VOUT = 1.2V @ 1A R1 40 k R3 100 k PWRGD 5 On C3 1000 pF Off C2 1 F R2 20 k PWRGD DS21997A-page 2 Preliminary (c) 2006 Microchip Technology Inc. MCP1727 Functional Block Diagram - Adjustable Output PMOS VIN VOUT Undervoltage Lock Out (UVLO) ISNS Cf Rf SHDN ADJ Overtemperature Sensing + Driver w/limit and SHDN EA - SHDN VREF V IN SHDN Reference Soft-Start Comp TDELAY PWRGD GND 92% of VREF (c) 2006 Microchip Technology Inc. Preliminary CDELAY DS21997A-page 3 MCP1727 Functional Block Diagram - Fixed Output PMOS VIN VOUT Undervoltage Lock Out (UVLO) ISNS Cf Rf SHDN Sense Overtemperature Sensing + Driver w/limit and SHDN EA - SHDN VREF V IN SHDN Reference Soft-Start Comp TDELAY PWRGD GND 92% of VREF DS21997A-page 4 Preliminary CDELAY (c) 2006 Microchip Technology Inc. MCP1727 1.0 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings VIN ....................................................................................6.5V Maximum Voltage on Any Pin .. (GND - 0.3V) to (VDD + 0.3)V Maximum Power Dissipation......... Internally-Limited (Note 6) Output Short Circuit Duration ................................ Continuous Storage temperature .....................................-65C to +150C Maximum Junction Temperature, TJ ........................... +150C ESD protection on all pins (HBM/MM) ........... 2 kV; 200V AC-DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VIN = VR ( Note 2) + 0.6V, VR = 1.8V for Adjustable Output, IOUT = 1 mA, CIN = COUT = 4.7 F (X7R Ceramic), TA = +25C. Boldface type applies for junction temperatures, TJ (Note 7) of -40C to +125C Parameters Sym Min Typ Max Input Operating Voltage VIN 2.3 Input Quiescent Current Iq Input Quiescent Current for SHDN Mode Maximum Output Current 6.0 V Note 1 -- 140 220 A IL = 0 mA, VIN = Note 1, VOUT = 0.8V to 5.0V ISHDN -- 0.1 3 A SHDN = GND IOUT 1.5 -- -- A VIN = 2.3V to 6.0V VR = 0.8V to 5.0V, Note 1 Line Regulation VOUT/ (VOUT x VIN) -- 0.05 0.15 %/V Load Regulation VOUT/VOUT -1.0 0.5 1.0 % IOUT = 1 mA to 1.5A, VIN = Note 1, (Note 4) IOUT_SC -- 2.2 -- A VIN = Note 1, RLOAD < 0.1, Peak Current Output Short Circuit Current Units Conditions (Note 1) VIN 6V Adjust Pin Characteristics (Adjustable Output Only) Adjust Pin Reference Voltage VADJ 0.402 0.410 0.418 V VIN = 2.3V to VIN = 6.0V, IOUT = 1 mA Adjust Pin Leakage Current IADJ -10 0.01 +10 nA VIN = 6.0V, VADJ = 0V to 6V TCVOUT -- 40 -- ppm/C Adjust Temperature Coefficient Note 3 Fixed-Output Characteristics (Fixed Output Only) Note 1: 2: 3: 4: 5: 6: 7: The minimum VIN must meet two conditions: VIN 2.3V and VIN (VR + 2.5%) + VDROPOUT(MAX). VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1. TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * Temperature). VOUT-HIGH is the highest voltage measured over the temperature range. VOUT-LOW is the lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested over a load range from 1 mA to the maximum specified output current. Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value that was measured with an input voltage of VIN = VR + VDROPOUT(MAX). The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air. (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150C rating. Sustained junction temperatures above 150C can impact device reliability. The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambient temperature is not significant. (c) 2006 Microchip Technology Inc. Preliminary DS21997A-page 5 MCP1727 AC-DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = VR ( Note 2) + 0.6V, VR = 1.8V for Adjustable Output, IOUT = 1 mA, CIN = COUT = 4.7 F (X7R Ceramic), TA = +25C. Boldface type applies for junction temperatures, TJ (Note 7) of -40C to +125C Parameters Voltage Regulation Sym Min Typ Max Units VOUT VR - 2.5% VR 0.5% VR + 2.5% V VIN-VOUT -- 330 525 mV VPWRGD_VIN 1.0 -- 6.0 V 1.2 -- 6.0 Conditions Note 2 Dropout Characteristics Dropout Voltage Note 5, IOUT = 1.5A, VIN(MIN) = 2.3V Power Good Characteristics PWRGD Input Voltage Operating Range TA = +25C TA = -40C to +125C For VIN < 2.3V, ISINK = 100 A PWRGD Threshold Voltage (Referenced to VOUT) VPWRGD_TH 89 92 95 %VOUT PWRGD Threshold Hysteresis VPWRGD_HYS 1.0 2.0 3.0 %VOUT PWRGD Output Voltage Low VPWRGD_L -- 0.2 0.4 V IPWRGD SINK = 1.2 mA, VFB = 0V, CDELAY = GND PWRGD Leakage PWRGD_LK -- 1 -- nA VPWRGD = VIN = 6.0V PWRGD Time Delay Falling Edge Rising Edge RPULLUP = 10 k TPG -- -- 10 30 55 ms CDELAY = 0.01 F -- 300 -- ms CDELAY = 0.1 F TVDET-PWRGD -- 200 -- s VADJ or VSENSE = VPWRGD_TH + 20 mV to VPWRGD_TH - 20 mV Logic High Input VSHDN-HIGH 45 Logic Low Input VSHDN-LOW Detect Threshold to PWRGD Active Time Delay s CDELAY = OPEN 200 Shutdown Input SHDN Input Leakage Current SHDNILK -0.1 0.001 %VIN VIN = 2.3V to 6.0V 15 %VIN VIN = 2.3V to 6.0V +0.1 A VIN = 6V, SHDN =VIN, SHDN = GND s SHDN = GND to VIN VOUT = GND to 95% VR AC Performance Output Delay From SHDN Note 1: 2: 3: 4: 5: 6: 7: TOR 100 The minimum VIN must meet two conditions: VIN 2.3V and VIN (VR + 2.5%) + VDROPOUT(MAX). VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1. TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * Temperature). VOUT-HIGH is the highest voltage measured over the temperature range. VOUT-LOW is the lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested over a load range from 1 mA to the maximum specified output current. Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value that was measured with an input voltage of VIN = VR + VDROPOUT(MAX). The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air. (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150C rating. Sustained junction temperatures above 150C can impact device reliability. The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambient temperature is not significant. DS21997A-page 6 Preliminary (c) 2006 Microchip Technology Inc. MCP1727 AC-DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = VR ( Note 2) + 0.6V, VR = 1.8V for Adjustable Output, IOUT = 1 mA, CIN = COUT = 4.7 F (X7R Ceramic), TA = +25C. Boldface type applies for junction temperatures, TJ (Note 7) of -40C to +125C Parameters Sym Min Typ Max Units eN -- 2.0 -- V/Hz IOUT = 500 mA, f = 1 kHz, COUT = 10 F (X7R Ceramic), VOUT = 2.5V Power Supply Ripple Rejection Ratio PSRR -- 60 -- dB f = 100 Hz, COUT = 10 F, IOUT = 100 mA, VINAC = 30 mV pk-pk, CIN = 0 F Thermal Shutdown Temperature TSD -- 150 -- C IOUT = 100 A, VOUT = 1.8V, VIN = 2.8V TSD -- 10 -- C IOUT = 100 A, VOUT = 1.8V, VIN = 2.8V Output Noise Thermal Shutdown Hysteresis Note 1: 2: 3: 4: 5: 6: 7: Conditions The minimum VIN must meet two conditions: VIN 2.3V and VIN (VR + 2.5%) + VDROPOUT(MAX). VR is the nominal regulator output voltage for the fixed cases. VR = 1.2V, 1.8V, etc. VR is the desired set point output voltage for the adjustable cases. VR = VADJ * ((R1/R2)+1). Figure 4-1. TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * Temperature). VOUT-HIGH is the highest voltage measured over the temperature range. VOUT-LOW is the lowest voltage measured over the temperature range. Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested over a load range from 1 mA to the maximum specified output current. Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its nominal value that was measured with an input voltage of VIN = VR + VDROPOUT(MAX). The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air. (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150C rating. Sustained junction temperatures above 150C can impact device reliability. The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambient temperature is not significant. TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 2.3V to 6.0V. Parameters Sym Min Typ Max Units Conditions TJ -40 -- +125 C Steady State Transient Temperature Ranges Operating Junction Temperature Range Maximum Junction Temperature TJ -- -- +150 C Storage Temperature Range TA -65 -- +150 C Thermal Resistance, 8LD 3x3 DFN JA -- 41 -- C/W 4-Layer JC51-7 Standard Board with vias Thermal Resistance, 8LD SOIC JA -- 150 -- C/W 4-Layer JC51-7 Standard Board Thermal Package Resistances (c) 2006 Microchip Technology Inc. Preliminary DS21997A-page 7 MCP1727 NOTES: DS21997A-page 8 Preliminary (c) 2006 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." 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