2015-2018 Microchip Technology Inc. DS60001372G-Page 1
BM70/71
Features
• Qualified for Bluetooth SIG v4.2 specifications
• Certified to FCC, ISED, MIC, KCC, NCC, and
SRRC radio regulations
• Certified by European RED Assessed Radio
module
• Compliant to RoHS
• Supports UART interface
• Supports transparent UART data service of BLE
• BM70 module supports 3-channel pulse-width
modulation (PWM) and BM71 module supports
1-channel PWM
• Supports Precision Temperature Sensor (PTS) for
ambient temperature detection
• Supports 12-bit ADC (ENOB=10 or 8 bits) for
battery and voltage detection
• Provides 8-channel ADC for BM70 module and 5-
channel ADC for BM71 module
• Features 18 general purpose I/O (GPIO) pins for
the BM70 module and 9 GPIO pins for the BM71
module
• Features integrated 32 MHZ crystal
• Small and compact surface mount module
• Castellated surface mount pads for easy and
reliable host PCB mounting
RF Features
• ISM band 2.402 GHz to 2.480 GHz operation
• Channels: 0 to 39
• Receive Sensitivity: typical -90 dBm (LE)
• Transmit Power: 0 dBm (typical)
• Received Signal Strength Indication (RSSI)
monitor with 1 dB resolution
MAC/Baseband/Higher Layer Features
• Secure AES128 encryption
• Bluetooth 4.2: GAP, GATT, SMP, L2CAP and inte-
grated public profile
• To create custom GATT services, refer to the
“BM70/71 Bluetooth® Low Energy Module User’s
Guide” (DS50002542) for details.
• I/O capability for Bluetooth 4.0/4.2 authentication
• Configurable role as peripheral/central, client/
server
FIGURE 1: BM70 MODULE
FIGURE 2: BM71 MODULE
Antenna
• Integrated chip antenna (BM7xBLES1FC2)
- Refer to 4.0 “Antenna”, Tabl e 4-1, and
Table 4-2 for antenna performance
specifications
• External antenna connection through RF pad
(BM7xBLE01FC2)
Power Management
• Two low-power modes supported, with wake-up
through GPIO or internal timer
• Average current: Tx=3.3 mA and Rx=3.2 mA with
buck at 3.0V VBAT input and 18.75 ms connection
interval, when transmitting full data packets to
achieve a data rate of approximately 8.6 kbps
Bluetooth® Low Energy (BLE) Module
BM70/71
DS60001372G-Page 2 2015-2018 Microchip Technology Inc.
Operating Conditions
• Operating voltage range: 1.9V to 3.6V
• Operating temperature: -40ºC to +85ºC
Applications
• Internet of Things (IoT)
• Secure Payment
• Wearable Devices
• Home and Security
• Health and Fitness
• Beacons
• Industrial and Data Logger
General Description
The BM70/71 module offers BLE solutions for embed-
ded applications. It conforms to the Bluetooth v4.2
specifications to enhance the throughput and security
for the IoT applications. It also supports beacon
technology to enhance the user experience for the IoT
applications and enables users to control the cloud and
receive data without opening the application through a
smartphone.
The BM70/71 module has an integrated Bluetooth
stack and is available in different form factors to
optimize space, cost, and RF performance. The power-
optimized design minimizes the current consumption
and extends battery life for portable and wearable
applications.
2015-2018 Microchip Technology Inc. DS60001372G-Page 3
BM70/71
Table of Contents
1.0 Device Overview .............................................................................................................................................................................. 5
2.0 Application Information .................................................................................................................................................................. 13
3.0 Module Configuration..................................................................................................................................................................... 25
4.0 Antenna.......................................................................................................................................................................................... 27
5.0 Electrical Characteristics................................................................................................................................................................37
6.0 Physical Dimensions...................................................................................................................................................................... 43
7.0 Soldering Recommendations......................................................................................................................................................... 51
8.0 Ordering Guide .............................................................................................................................................................................. 53
Appendix A: Certification Notices......................................................................................................................................................... 55
Appendix B: Revision History............................................................................................................................................................... 61
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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BM70/71
DS60001372G-Page 4 2015-2018 Microchip Technology Inc.
NOTES:
2015-2018 Microchip Technology Inc. DS60001372G-Page 5
BM70/71
1.0 DEVICE OVERVIEW
The BM70/71 module is built around Microchip
Technology IS1870/71 BLE Integrated Circuit (IC). The
IS1870/71 IC includes an on board Bluetooth stack, a
power management subsystem, a 2.4 GHz transceiver,
and an RF power amplifier. The user can embed
Bluetooth functionality into any product using the
BM70/71 module.
The BM70/71 module enables the following features:
• Simple integration and programming
• Reduced development time
• Superior wireless module with a low-cost system
• Interoperability with Apple® iOS and Android™
OS
• A wide range of applications
The BM70/71 module can independently maintain a low
power wireless connection. Low power and flexible
power management features maximize the lifetime of the
BM70/71 module in battery-operated devices. A wide
operating temperature range enables its applications in
indoor and outdoor environments.
The BM70/71 module is a small, compact, and
surface-mounted module with castellated pads for easy
and reliable host PCB mounting. The relatively small
form factor of the module is targeted for applications,
such as wearable sports, fitness devices and so on.
1.1 Interface Description
Figure 1-1 and Figure 1-2 illustrate an example of the
BM70/71 module-based system.
FIGURE 1-1: BM70 MODULE BLOCK DIAGRAM
Note 1: SPI and I2C peripherals of the IS1870/71 IC can be enabled on the BM70/71 module by changing the
default firmware. For more details, contact a local Microchip representative.
BM70/71
DS60001372G-Page 6 2015-2018 Microchip Technology Inc.
FIGURE 1-2: BM71 MODULE BLOCK DIAGRAM
Note 1: SPI and I2C peripherals of the IS1870/71 IC can be enabled on the BM70/71 module by changing the
default firmware. For more details, contact a local Microchip representative.
BM70/71
DS60001372G-Page 8 2015-2018 Microchip Technology Inc.
FIGURE 1-5: BM71BLE01FC2 PIN DIAGRAM
FIGURE 1-6: BM71BLES1FC2 PIN DIAGRAM
2015-2018 Microchip Technology Inc. DS60001372G-Page 9
BM70/71
Table 1 - 1 provides pin descriptions of the
BM70/71
modul e .
TABLE 1-1: BM70/71 PIN DESCRIPTION
BM70BLE0
1FC2
BM70BLE
S1FC2
BM71BLE
01FC2
BM71BLE
S1FC2 Pin Name Type Description
—1——GNDPower Ground reference
—2——GNDPower Ground reference
131213 GND Power Ground reference
241114 VBAT Power Battery input. Voltage range: 1.9V to 3.6V
——10— BK_IN Power Buck input. Voltage range: 1.9V to 3.6V
35——P2_2DIO GPIO, default pull-high input PWM1
46——VDD_IO Power I/O positive supply. Do not connect.
Ensure VDD_IO and MCU I/O voltage are
compatible
57——VDD_IO Power I/O positive supply. Do not connect.
Ensure VDD_IO and MCU I/O voltage are
compatible
68——ULPC_OPower 1.2V programmable ULPC LDO output
for AON-logic and retention memory sup-
ply. Internal use only, do not connect to
other devices
79——P2_3DI GPIO, default pull-high input PWM2
810——BK_OPower 1.55V buck output. Internal use only, do
not connect to other devices
——136P1_6DIOP1_6
——145P1_7DIO P1_7
9111515 P2_7/TX_
IND
DIO
AI
DO
GPIO: P2_7
ADC Input: AD14
TX_IND
10 12 — —P1_1DIO
AI
GPIO: P1_1
ADC Input: AD9
11 13 2 3P1_2DIO
AI
GPIO, default pull-high input
AD10
12 14 3 4P1_3DIO
AI
GPIO, default pull-high input
AD11
13 15 8 11 P0_0 DIO
AI
DI
GPIO, default pull-high input
AD0
UART flow-control CTS
14 16 — —P1_0DIO
AI
GPIO, default pull-high input
AD8
15 17 6 9P3_6DIO
DO
DO
GPIO, default pull-high input
PWM0
UART flow-control RTS
16 18 16 16 P2_0 DI System configuration, default pull-high
input
H: Application mode
L: Test mode
17 19 — —P2_4DIO GPIO, default pull-high input
18 20 — —NC—No connection
Legend: A = Analog D = Digital I = Input O = Output
BM70/71
DS60001372G-Page 10 2015-2018 Microchip Technology Inc.
19 21 7 10 RST_N DI Module Reset (active-low) (internal pull
up)
20 22 5 7 HCI_RXD DI HCI UART data input
21 23 4 8 HCI_TXD DO HCI UART data output
22 24 — —P3_1DIO GPIO: P3_1
23 25 — —P3_2DIO GPIO: P3_2
24 26 — —P3_3DIO GPIO: P3_3
25 27 — —P3_4DIO GPIO: P3_4
26 28 — —P3_5DIO
DO
GPIO, default pull-high input
LED1
27 29 — —P0_7DIO
AI
GPIO, default pull-high input
AD7
28 30 9 12 P0_2/LED DIO
AI
P02
AD2
29 31 17 2 GND Power Ground reference
— 32 — — GND Power Ground reference
30 — 1 — BT_RF AI External antenna connection (50 Ohm)
Only for BM70BLE01FC2 and
BM71BLE01FC2
No connection for BM71BLES1FC2
— 33 — — GND Power Ground reference
Legend: A = Analog D = Digital I = Input O = Output
TABLE 1-1: BM70/71 PIN DESCRIPTION (CONTINUED)
BM70BLE0
1FC2
(Continued)
BM70BLE
S1FC2
BM71BLE
01FC2
BM71BLE
S1FC2 Pin Name Type Description
2015-2018 Microchip Technology Inc. DS60001372G-Page 11
BM70/71
Table 1-2 provides the hardware features of the
BM70/71 module.
Note 1: The GPIO, ADC and PWM numbers used are based on disabling the LED indication and UART Hardware
flow-control (RTS/CTS) functionality, see Tab le 1 - 1.
2: For a detailed explanation of GPIO, refer to the “BM70/7 1 Bluetooth® Low Energy Module User’s Guide”
(DS50002542).
Note: I2C and SPI are accessible using specific
firmware versions that support these
peripheral interfaces. Please refer to the
BM70/71 product page on the Microchip
web site for the latest firmware.
TABLE 1-2: BM70/71 MODULE HARDWARE FEATURES
Feature/ Modules BM70BLES1FC2 BM70BLE01FC2 BM71BLES1FC2 BM71BLE01FC2
Configuration Module
H/W
Default
IS1870
Firmware
Module
H/W
Default
IS1870
Firmware
Module
H/W
Default
IS1871
Firmware
Module
H/W
Default
IS1871
Firmware
UART 1 1 1 1 1 1 1 1
GPIO (see Note 2)181318139494
12-bit ADC channels 8 6 8 6 5 3 5 3
PWM 3 2 3 2 1 0 1 0
Total pins 33 — 30 — 16 — 17 —
On board antenna with
CAN
Yes — — — Yes — — —
No Antenna — — Yes — — — Yes —
Government regulatory
RF certified
Yes — — — Yes — — —
Size (mm) 12x22x2.4 — 12x15x1.6 — 9x11.5x2.1 — 6x8x1.6 —
BM70/71
DS60001372G-Page 12 2015-2018 Microchip Technology Inc.
Table 1-3 provides the details of the test pads used for
the production test on the bottom of the BM70/71
module. See
Figure 1-3 through Figure 1-6 for more
details.
TABLE 1-3: TEST PADS DETAILS
BM70BLE
01FC2
BM70BLE
S1FC2
BM71BLE
01FC2
BM71BLE
S1FC2
Pin Name Type Description
TP-1 TP-1 TP-3 TP-3 VCC_PA Power 1.55V RF PA LDO
TP-2 TP-2 TP-1 TP-1 CLDO_O Power 1.2V CLDO output
TP-3 TP-3 TP-2 TP-2 VCC_RF Power 1.28V RF LDO output
— — TP-4 TP-4 ULPC_O Power 1.2V ULPC LDO output
— — TP-5 TP-5 BK_O Power 1.55V buck output
2015-2018 Microchip Technology Inc. DS60001372G-Page 13
BM70/71
2.0 APPLICATION INFORMATION
2.1 Reference Schematics
Figure 2-1 through Figure 2-8 illustrate the BM70/71
module reference schematics for the various Stock
Keeping Units (SKUs). The GPIOs are configurable,
and the connection depends on the user’s application
circuit.
It is recommended to use an external Reset IC in all
applications. An example of using this circuit with the
MCP111-195 is illustrated in Figure 2-1, Figure 2-3,
Figure 2-5, and Figure 2-7. This Reset IC prevents the
Flash data corruption, when VBAT drops below 1.9V
(this includes brown-out, power-down, and power-up
conditions).
The RF antenna impedance matching circuit in
Figure 2-3 and Figure 2-5 require users to implement
by the selected antenna specification.
For battery-powered applications, it is recommended to
use the following external circuits as illustrated in
Figure 2-2, Figure 2-4, Figure 2-6, and Figure 2-8. The
first circuit (left side) ensures that the LED indicator is
bright enough in applications with VBAT > 3.0V. The
second circuit (right side) provides protection from bat-
tery voltage reverse connection.
If a fixed voltage source is applied to VBAT (e.g. 3.3V),
the soft start output is necessary to prevent the inrush
voltage over 3.6V to damage the Flash.
FIGURE 2-1: BM70BLES1FC2 REFERENCE CIRCUIT
BM70/71
DS60001372G-Page 14 2015-2018 Microchip Technology Inc.
FIGURE 2-2: BM70BLES1FC2 REFERENCE CIRCUIT
FIGURE 2-3: BM70BLE01FC2 REFERENCE CIRCUIT
2015-2018 Microchip Technology Inc. DS60001372G-Page 15
BM70/71
FIGURE 2-4: BM70BLE01FC2 REFERENCE CIRCUIT
FIGURE 2-5: BM71BLE01FC2 REFERENCE CIRCUIT
Note 1: Place the capacitor C3 as close as possible to the module. Connect the BK_IN and VBAT trace at C3.
2: The antenna matching component value depends on the user’s antenna and PCB layout.
BM70/71
DS60001372G-Page 16 2015-2018 Microchip Technology Inc.
FIGURE 2-6: BM71BLE01FC2 REFERENCE CIRCUIT
FIGURE 2-7: BM71BLES1FC2 REFERENCE CIRCUIT
Note 1: Place the capacitor C3 as close as possible to the module.
2015-2018 Microchip Technology Inc. DS60001372G-Page 17
BM70/71
FIGURE 2-8: BM71BLES1FC2 REFERENCE CIRCUIT - OPTIONAL
BM70/71
DS60001372G-Page 18 2015-2018 Microchip Technology Inc.
2.2 External Configuration and
Programming
The BM70/71 module can be configured and
programmed using an external configuration and
programming tool. Figure 2-9 illustrates the minimum
signals required for configuring and programming the
module using host PCB.
Configuration and programming modes can be config-
ured using the P2_0 pin. Refer to 3.4 “System Config-
uration” for details.
FIGURE 2-9: EXTERNAL CONFIGURATION AND PROGRAMMING
2015-2018 Microchip Technology Inc. DS60001372G-Page 19
BM70/71
2.3 Host MCU Interface
2.3.1 HOST MCU INTERFACE OVER
UART
Figure 2-10 and Figure 2-11 illustrate the interfacing
between the BM70/71 and host MCU using UART.
UART uses Host Control Interface (HCI) to share the
communication among the Host MCU and BM70/71
module. The interface also illustrates the power
scheme using a 3.3V Low Drop Out (LDO) regulator
that supply 3.3V to the BM70/71 (BAT_IN) and MCU
VDD. This power scheme ensures that the BM70/71
module and MCU I/O voltages are compatible.
FIGURE 2-10: BM70 MODULE TO MCU INTERFACE
Note 1: Ensure that VBAT(=I/O Voltage) and MCU VDD voltages are compatible.
2: Control and indication ports are configurable.
BM70/71
DS60001372G-Page 20 2015-2018 Microchip Technology Inc.
FIGURE 2-11: BM71 MODULE TO MCU INTERFACE
Note 1: Ensure that VBAT(=I/O Voltage) and MCU VDD voltages are compatible.
2: Control and indication ports are configurable.
3: 10 μF (X5R) and 330 Ohm resistor are required for the BM71 module.
4: BK_IN connect to VBAT for BM71BLE01FC2.
2015-2018 Microchip Technology Inc. DS60001372G-Page 21
BM70/71
2.3.2 UART READY AFTER EXTERNAL
RESET
In MCU applications, the time between Reset and the
BM70/71 module UART port ready for Test mode and
Application mode, after an external Reset (RST_N)
must be notified. Figure 2-12 illustrates the timing
diagram of the BM70/71 module UART port ready for
Test mode and Application mode after Reset.
FIGURE 2-12: TIMING DIAGRAM OF BM70/71 MODULE UART READY FOR TEST MODE AFTER
RESET
BM70/71
DS60001372G-Page 22 2015-2018 Microchip Technology Inc.
2.3.3 UART READY AFTER POWER-ON
RESET
Figure 2-13 illustrates the timing diagram of the BM70
module UART port ready for Test mode and Applica-
tion mode after Power-on Reset (POR).
In Application mode, when the BM70/71 module is
ready to communicate with the host MCU after reset,
the BM70/71 module may have internal status indi-
cated by the status pins, or by a status report UART
command. This status pin or status report UART
command is sent to inform the MCU that the BM70/71
module is ready for communication.
FIGURE 2-13: TIMING DIAGRAM OF BM70 MODULE UART READY FOR TEST MODE AFTER
POWER-ON
2015-2018 Microchip Technology Inc. DS60001372G-Page 23
BM70/71
2.4 Typical Hosted Configuration
Figure 2-14 illustrates the typical hosted configuration
for the BM71 module. It also illustrates an application
using a coin cell battery at VBAT input. For the BM71
module, a 10 μF capacitor (X5R/X7R) is applied to the
BAT_IN pin. Only on the BM71 module, the BK_IN pin
of the module must be connected to the BAT_IN pin.
FIGURE 2-14: BM71 MODULE TYPICAL HOSTED CONFIGURATION
Note 1: Hardware functions can include ADC and PWM. Refer to “BM70/71 Bluetooth® Low Energy Module
User’s Guide” (DS50002542) for a full description of all possible configurable behavior and hardware.
BM70/71
DS60001372G-Page 24 2015-2018 Microchip Technology Inc.
2.5 Power-Drop Protection
To prevent the BM70/71 module from disruptions,
when the voltage drops to less than 1.9V, an “Open
Drain” Reset chip with a delay time of ≤ 10 ms that trig-
gers Reset at 1.8V output voltage is recommended.
Figure 2-15 illustrates the Reset circuit block diagram.
FIGURE 2-15: RESET CIRCUIT BLOCK DIAGRAM
2015-2018 Microchip Technology Inc. DS60001372G-Page 25
BM70/71
3.0 MODULE CONFIGURATION
The BM70/71 module features and services can be
configured to fit a wide range of application require-
ments. Refer to the “B M70/ 71 Bl uetoot h® Low Energy
Module User’s Guide” (DS50002542) for details of all
device behavior along with information on how to
configure the IS8170/71 IC on the BM70/71 module.
Refer to 3.1“UART Interface” through 3.4“System
Configuration” that describe default behavior of the
BM70/71 module, which can be easily changed.
3.1 UART Interface
The BM70/71 module UART pins, TXD and RXD, are
connected to the UART pins of the host MCU. By
default, the UART characteristics are set to a baud rate
of 115200, with 8-bit data, 1 stop bit, no parity, and no
hardware flow control. These characteristics are config-
urable, refer to the “BM70/71 Bluetooth® Low Energy
Module User’s Guide” (DS50002542) for the full
description.
3.2 Control and Indication I/O Pins
The BM70/71 module I/O pins are configurable as either
control or indication signal. The control
signals are
input to the BM70/71 module and the indication signals
are output from the BM70/71 module. Table 3-1 and
Table 3-2 provide
default pin functions of the default
firmware logic in the IS1870/71 IC on the BM70/71
module. For different BM70/71 module application
requirements, the I/O pin assignment is configurable
and can fit a wide range of application requirements.
For additional information related to I/O pin assign-
ment, refer to the “BM70/71 Bluetooth® Low Energy
Module User’s Guide” (DS50002542).
TABLE 3-1: CONFIGURATION AND INDICATION I/O ASSIGNMENTS FOR BM70 MODULE
Note 1: These signals are part of the remappable hardware functionality and can be input/output on different GPIO
pins of the module. Refer to the “BM70/71 Bluetooth® Low Energy Modu le User’s Gu ide” (DS50002542) for
details.
PINS
N/C(1)
LOW_BATTERY_IND(1)
RSSI_IND(1)
LINK_DROP(1)
UART_RX_IND(1)
PAIRING_KEY(1)
RF_ACTIVE_IND(1)
STATUS1_IND(1)
If hardware function is enabled,
UART_RTS is fixed to this pin
If hardware function is enabled,
UART_CTS is fixed to this pin
If hardware function is enabled,
TX_IND is fixed to this pin
If hardware function is enabled,
LED0 is fixed to this pin
P1_0
P3_1 Default
P3_2 Default
P3_3 Default
P3_4 Default
P0_7 Default
P1_1 Default
P2_2 Default
P2_4 Default
P3_5 Default
P3_6 Default
P0_0 Default
P2_7 Default
P0_2 Default
BM70/71
DS60001372G-Page 26 2015-2018 Microchip Technology Inc.
3.3 Reset (RST_N)
The Reset input pin (RST_N) is used to reset the
BM70/71 module with an active-low pulse with a mini-
mum pulse width of 63 ns.
3.4 System Configuration
Table 3-3 provides the system configuration settings of
the P2_0 pin that places the BM70/71 module into vari-
ous operational modes. The P2_0 pin has an internal
pull up.
TABLE 3-3: SYSTEM CONFIGURATION SETTINGS
Note: For more details and information on the use of these different modes, refer to the “BM70/71 Bluetooth® Low
Energy Module User’s Guide” (DS50002542).
TABLE 3-2: CONFIGURATION AND INDICATION I/O ASSIGNMENTS FOR BM71 MODULE
PINS
LOW_BATTERY_IND
RSSI_IND
LINK_DROP
UART_RX_IND
PAIRING_KEY
RF_ACTIVE_IND
STATUS1_IND
STATUS2_IND
If hardware function is enabled,
UART_RTS is fixed to this pin
If hardware function is enabled,
UART_CTS is fixed to this pin
If hardware function is enabled,
TX_IND is fixed to this pin
If hardware function is enabled,
LED0 is fixed to this pin
P1_6 Default
P1_7 Default
P1_2 Default
P1_3 Default
P3_6 Default
P0_0 Default
P2_7 Default
P0_2 Default
P2_0 Operational Mode
High Application mode
Low Test mode (calibration of the IS1870/71 IC), Configuration mode (programming of configuration
parameters for default firmware), Firmware Update mode (programming of internal flash mem-
ory of IS1870/71 IC).
2015-2018 Microchip Technology Inc. DS60001372G-Page 27
BM70/71
4.0 ANTENNA
4.1 Antenna Characteristics
4.1.1 BM70BLES1FC2 CERAMIC CHIP
ANTENNA
The BM70BLES1FC2 module contains an inbuilt
ceramic chip antenna. Figure 4-1 illustrates the
antenna radiation pattern of the ceramic chip antenna
on the BM70BLES1FC2 module.
FIGURE 4-1: BM70BLES1FC2 ANTENNA RADIATION PATTERN
Table 4-1 provides the antenna radiation pattern details
of the BM70BLES1FC2 module.
TABLE 4-1: BM70BLES1FC2 ANTENNA
RADIATION PATTERN
DETAILS
Parameter Values
Frequency 2450 MHz
Peak Gain 1.63 dBi
Efficiency 71.55%
BM70/71
DS60001372G-Page 28 2015-2018 Microchip Technology Inc.
4.1.2 BM71BLES1FC2 CERAMIC CHIP
ANTENNA
The BM71BLES1FC2 module contains an inbuilt
ceramic chip antenna. Figure 4-2 illustrates the
antenna radiation pattern of the ceramic chip antenna
on the BM71BLES1FC2 module.
FIGURE 4-2: BM71BLES1FC2 ANTENNA RADIATION PATTERN
Table 4-2 provides the antenna radiation pattern details
of the BM71BLES1FC2 module.
TABLE 4-2: BM71BLES1FC2 ANTENNA
RADIATION PATTERN
DETAILS
Parameter Values
Frequency 2442 MHz
Peak Gain 0.1 dBi
Efficiency 42.7%
2015-2018 Microchip Technology Inc. DS60001372G-Page 29
BM70/71
4.2 Antenna Placement
For a Bluetooth wireless product, the antenna
placement affects the whole system performance. The
antenna requires free space to radiate the RF signals
and it cannot be surrounded by the ground plane.
Figure 4-3 illustrates a typical example of the good and
poor antenna placement of the BM70BLES1FC2
module on the main application board with the ground
plane.
FIGURE 4-3: BM70BLES1FC2 ANTENNA PLACEMENT EXAMPLES
2015-2018 Microchip Technology Inc. DS60001372G-Page 31
BM70/71
4.3 Antenna Considerations
Table 4-3 provides the part number and manufacturer
details of the antenna used on the BM70BLES1FC2
module.
Table 4-4 provides the part number and manufacturer
details of the antenna used on the BM71BLES1FC2
module.
TABLE 4-3: BM70BLES1FC2 ANTENNA DETAILS
Description Part Number Manufacturer
ANT ANT3216A063R2400A PIFA 2.4 GHZ L3.2W1.6 ANT3216A063R2400A YAGEO
TABLE 4-4: BM71BLES1FC2 ANTENNA DETAILS
Description Part Number Manufacturer
ANT ANT3216LL00R2400A 2.4 GHZ L3.2W1.6 ANT3216LL00R2400A YAGEO
BM70/71
DS60001372G-Page 32 2015-2018 Microchip Technology Inc.
4.4 Host PCB Mounting Suggestion
4.4.1 BM70BLES1FC2 HOST PCB
MOUNTING
Figure 4-5 illustrates the host PCB mounting sugges-
tions for the BM70BLES1FC2 module, showing the
minimum ground plane area to the left and right of the
module for best antenna performance.
The area under the antenna must not contain any top,
inner or bottom copper layer, while designing the host
PCB. A low-impedance ground plane ensures the best
radio performance (best range, low noise). The ground
plane can be extended beyond the minimum recom-
mended as required for the host PCB EMC noise
reduction. For best range performance, keep all
external metal away from the ceramic chip antenna by
a minimum of 30 mm.
FIGURE 4-5: BM70BLES1FC2 HOST PCB MOUNTING SUGGESTION
2015-2018 Microchip Technology Inc. DS60001372G-Page 33
BM70/71
4.4.2 BM70BLE01FC2 HOST PCB
MOUNTING
Figure 4-6 illustrates the mounting suggestions for the
BM70BLE01FC2 module and it also shows a connec-
tion to UFL connector. A low-impedance ground plane
will ensure the best radio performance (best range, low
noise).
The pin 30 (BT_RF) is connected to an external
antenna connector, a PCB trace antenna, or a compo-
nent (ceramic chip) antenna through a host PCB
50 Ohm micro-strip trace. The micro-strip trace can be
extended to include passive parts for antenna attenua-
tion padding, impedance matching, or to provide test
points. It is recommended that the micro-strip trace be
as short as possible for minimum loss and best imped-
ance matching. If the micro-strip trace is longer, it must
be a 50 Ohm controlled impedance.
FIGURE 4-6: BM70BLE01FC2 HOST PCB MOUNTING SUGGESTIONS
BM70/71
DS60001372G-Page 34 2015-2018 Microchip Technology Inc.
4.4.3 BM71BLES1FC2 HOST PCB
MOUNTING
Figure 4-7 illustrates the mounting suggestions for the
BM71BLES1FC2 module. It also shows the area
around the antenna, required for the best antenna per-
formance.
The area under the antenna must not contain any top,
inner, or bottom copper layer while designing the host
PCB. A low-impedance ground plane ensures the best
radio performance (best range, low noise). The ground
plane can be extended beyond the minimum recom-
mended as required for the host PCB EMC noise
reduction. For best range performance, keep all exter-
nal metal away from the ceramic chip antenna by a
minimum of 30 mm.
FIGURE 4-7: BM71BLES1FC2 HOST MOUNTING SUGGESTION
2015-2018 Microchip Technology Inc. DS60001372G-Page 35
BM70/71
4.4.4 BM71BLE01FC2 HOST PCB
MOUNTING
Figure 4-8 illustrates the mounting suggestions for the
BM71BLE01FC2 module. It also shows a connection to
the UFL connector. A low-impedance ground plane
ensures the best radio performance (best range, low
noise).
The pin 1 (BT_RF) is connected to an external antenna
connector, a PCB trace antenna, or a component
(ceramic chip) antenna through a host PCB 50 Ohm
micro-strip trace. The micro-strip trace can be
extended to include passive parts for antenna attenua-
tion padding, impedance matching, or to provide test
points. It is recommended that the micro-strip trace be
as short as possible for minimum loss and best imped-
ance matching. If the micro-strip trace is longer, it must
be a 50 Ohm controlled impedance.
FIGURE 4-8: BM71BLE01FC2 HOST PCB MOUNTING SUGGESTION
BM70/71
DS60001372G-Page 36 2015-2018 Microchip Technology Inc.
NOTES:
2015-2018 Microchip Technology Inc. DS60001372G-Page 37
BM70/71
5.0 ELECTRICAL CHARACTERISTICS
This section provides an overview of the BM70/71 module electrical characteristics. Additional information will be
provided in future revisions of this document as it becomes available.
Absolute Maximum Ratings
Ambient temperature under bias for modules parts ending with 0002......................................................-20°C to +70°C
Ambient temperature under bias for modules parts ending with 0B0x......................................................-40°C to +85°C
Storage temperature .............................................................................................................................. -40°C to +125°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V
Voltage of any digital pin ............................................................................................................-0.3V to VDD + 0.3 ≤ 3.9
Maximum output current sink by any I/O pin..........................................................................................................12 mA
Maximum output current sourced by any I/O pin....................................................................................................12 mA
Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions,
above those indicated in the operation listings of this specification, is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
BM70/71
DS60001372G-Page 38 2015-2018 Microchip Technology Inc.
Table 5-1 provides the recommended operating condi-
tions of the BM70/71 module.
Note 1: The current measurements are characterized across a sample of BM70/71 modules at room temperature
(+25°C), unless otherwise noted.
2: For more details on “Reduced current consumption” or “Shutdown” low power modes, refer to the “BM70/71
Bluetooth® Low Energy Module User’s Guide” (DS50002542).
TABLE 5-1: RECOMMENDED OPERATING CONDITIONS
Symbol Min. Typ. Max.
PMU
VDD (VBAT, BK_IN, AVDD) 1.9V 3.0V 3.6V
RST_N 1.9V 3.0V 3.6V
Other I/O 1.9V — 3.6V
GPIO
VIH (Input High Voltage) 0.7 VDD —VDD
VIL (Input Low Voltage) VSS — 0.3 VDD
VOH (Output High Voltage) (High drive, 12 mA) 0.8 VDD —VDD
VOL (Output Low Voltage) (High drive, 12 mA) VSS — 0.2 VDD
Pull up resistance 34 kOhm 48 kOhm 74 kOhm
Pull down resistance 29 kOhm 47 kOhm 86 kOhm
Supply Current (see Note 1)
Peak Tx mode current at VDD=3V,
Tx=0 dBm, Buck mode
— 10 mA at +25°C 13 mA at
+70°C/+85°C
Peak Rx mode current at VDD=3V,
Buck mode
— 10 mA at +25°C 13 mA at
+70°C/+85°C
“Reduced current consumption” low power mode
current (see Note 2)
— 60 μA at +25°C
“Shutdown” low power mode current (see Note 2)1.0 μA — 2.9 μA
Note: For more details on “Analog to Digital Converter (ADC) and Precision Temperature Sensor (PTS)
specifications, refer to “IS1870/71 Bluetooth® Low Energy SoC data sheet” (DS60001371).
2015-2018 Microchip Technology Inc. DS60001372G-Page 39
BM70/71
Table 5-2 provides the RF specifications of the
BM70/71 module.
Note 1: Tested by transmitting known ‘00001111’b patterns.
TABLE 5-2: RF SPECIFICATIONS
Parameter Min. Typ. Max.
Transmitter
Frequency 2402 MHz — 2480 MHz
Output Power — 0 dBm —
RF Power Control Range -25 dBm — 3 dBm
In-band Spurious (N±2) — -38.5 dBm —
In-band Spurious (N±3) — -43.25 dBm —
Modulation Characteristic - Frequency
Deviation (see Note 1)
—247 kHz—
Receiver
Frequency 2402 MHz — 2480 MHz
Sensitivity Level (interference active) — -90 dBm —
Interference
Performance
Co-channel — 17 dB —
Adjacent
± 1 MHz
—0 dB—
Adjacent
± 2 MHz
—-25 dB—
Adjacent >=
± 3 MHz
—-32 dB—
Inter-modulation Characteristic (n=3,4,5) — -37.5 dBm —
Maximum Usable Level 0 dBm
BM70/71
DS60001372G-Page 40 2015-2018 Microchip Technology Inc.
5.1 Current Consumption Details
5.1.1 Tx/Rx CURRENT CONSUMPTION
DETAILS
Figure 5-1 illustrates the Tx/Rx peak current
consumption of 12 mA during an advertising event.
However, the average current consumption is only
around 230 μA while advertising at an interval of
approximately 100 ms, see Figure 5-2. This is due to
the “Reduced Current Consumption” Low Power mode
being enabled (configuration parameter -
UART_RX_IND). Reducing the current draw to
approximately 60 μA, while not actively transmitting the
advertisings packets, refer to the “BM70/71 Blue tooth®
Low Energy Module User’s Guide” (DS50002542) for
more details.
The overall average current consumption is measured
with a 3.3V VBAT input, and is affected by the way the
IS1870/71 IC on the BM70/71 module has been config-
ured to operate. A low average current value can be
achieved by choosing the minimum settings for the
advertising interval and connection interval, which
meet the data throughput requirements of the intended
application. The lower or less frequent the interval time
periods, the lower the overall average current to be
drawn.
FIGURE 5-1: TX/RX PEAK CURRENT CONSUMPTION OF AN ADVERTISING EVENT
2015-2018 Microchip Technology Inc. DS60001372G-Page 41
BM70/71
Figure 5-2 illustrates the oscilloscope screen, captured
when the auto operation and Low Power mode is active
on the BM70/71 module. Refer to the “BM70/71 Blue-
tooth® Low Energy Module User’s Guide”
(DS50002542) for more details on the auto operation.
FIGURE 5-2: TX/RX AVERAGE CURRENT CONSUMPTION WHILE BM70/71 MODULE IS
ADVERTISING
For additional information on the current consumption
measurements, test conditions and test environment
setup, refer to the “BM70/71 Bluetooth® Low Energy
Module User’s Guide” (DS50002542).This user guide
provides detailed information about the behavior of the
default internal logic of the IS1870/71 IC on the
BM70/71 module.
BM70/71
DS60001372G-Page 42 2015-2018 Microchip Technology Inc.
Table 5-3 provides the average current consumption
measurements for the BM70/71 module in Application
mode.
Note 1: These measurements are done at an operating temperature of +25°C at 3.3V and are characterized across
a sample of BM70/71 modules.
2: These measurements are taken with version 1.06 firmware, loaded into the module with “Reduced Current
Consumption” Low Power mode enabled. For more details on Low Power modes and current consumption
configuration, refer to “BM70/71 Bluetooth® Low Energy Module User's Guide” (DS50002542).
3: The advertising packet data payload is approximately 15 bytes in length.
4: The amount of data being transmitted between two peer devices can affect the average current measured.
The average current measurements are done with only the necessary Bluetooth packets being exchanged
to keep the connection active at the stated interval.
TABLE 5-3: BM70/71 APPLICATION MODE CURRENT CONSUMPTION MEASUREMENTS
Test Mode Interval [ms] Average Current Consumption
Advertising (see Note 1,2,3) 20 1.061 mA
50 505 μA
100 298 μA
500 113 μA
1000 89 μA
Connected (see Note 1,2,4) 18.75 2.23 mA
50 2.13 mA
100 2.10 mA
500 83 μA
1000 80 μA
2015-2018 Microchip Technology Inc. DS60001372G-Page 51
BM70/71
7.0 SOLDERING
RECOMMENDATIONS
The BM70/71 module is assembled using a standard
lead-free, reflow profile, IPC/JEDEC J-STD-020. The
BM70/71 module can be soldered to the host PCB by
using the standard lead or lead-free solder reflow
profiles.
To avoid any damage to the BM70/71 module, follow
these recommendations:
• Refer to the “AN233 Solder Reflow Recommen-
dation” (DS00233) document for the soldering
reflow recommendations
• Do not exceed the peak temperature (TP) of
+260˚C
• Use no-clean flux solder paste
• Do not wash the BM70/71 module as moisture
can be trapped under the shield
• Use only one flow. If the PCB requires multiple
flows, apply the BM70/71 module on the final flow
Figure 7-1 illustrates the reflow profile of the BM70/71
module.
FIGURE 7-1: REFLOW PROFILE
BM70/71
DS60001372G-Page 52 2015-2018 Microchip Technology Inc.
NOTES:
2015-2018 Microchip Technology Inc. DS60001372G-page 53
BM70/71
8.0 ORDERING GUIDE
Table 8-1 provides the ordering information of the BM70/71 module.
TABLE 8-1: BM70/71 MODULE ORDERING INFORMATION
Note 1: With the introduction of the IS187xSF-202 IC, the PC tools provided by Microchip which change/control Bluetooth operation have been revised.
The correct tool version must be paired with the applicable module/IC part number.
All module parts ending with BM7xBLEX1FC2-0BxxAA must use the PC tools ending with 0BxxAA.
All module parts ending with BM7xBLEX1FC2-0002AA must use the PC tools ending with 0002AA.
2: The numbers listed under “Orderable Part Number” must be used, when purchasing a specific module from Microchip.
3: “Regulatory Model No.” column represents the Model No. listed in Microchip's regulatory notices. The extensions used to order/buy a specific version of the
module are listed in the “Orderable Part Number”.
Module Description
Operating
Temperature
Range
Firmware
Version Antenna Shield Pin # Regulatory
Certification
Regulatory Model
No. (see Note 3)
Orderable Part
Number
(see Note 1 and 2)
BM70 Bluetooth 4.2 BLE
module,
(12x15x1.6 mm)
-20°C to +70°C V1.03 External No 30 No N/A BM70BLE01FC2-00
02AA
BM70 Bluetooth 4.2 BLE
module,
(12x15x2.4 mm)
-20°C to +70°C V1.03 On board Yes 33 FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM70BLES1FC2 BM70BLES1FC2-00
02AA
BM71 Bluetooth 4.2 BLE
module,
(6x8x1.6 mm)
-20°C to +70°C V1.06 External No 17 No N/A BM71BLE01FC2-00
02AA
BM71 Bluetooth 4.2 BLE
module,
(9x11.5x2.1 mm)
-20°C to +70°C V1.06 On board Yes 16 FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM71BLES1FC2 BM71BLES1FC2-00
02AA
BM70 Bluetooth 4.2 BLE
module,
(12x15x1.6 mm)
-40°C to +85°C V1.06 External No 30 No N/A BM70BLE01FC2-0B
03AA
BM70 Bluetooth 4.2 BLE
module,
(12x15x2.4 mm)
-40°C to +85°C V1.06 On board Yes 33 FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM70BLES1FC2 BM70BLES1FC2-0B
03AA
BM71 Bluetooth 4.2 BLE
module,
(6x8x1.6 mm)
-40°C to +85°C V1.06 External No 17 No N/A BM71BLE01FC2-0B
02AA
BM71 Bluetooth 4.2 BLE
module,
(9x11.5x2.1 mm)
-40°C to +85°C V1.06 On board Yes 16 FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM71BLES1FC2 BM71BLES1FC2-0B
02AA
BM70/71
DS60001372G-Page 54 2015-2018 Microchip Technology Inc.
NOTES:
2015-2018 Microchip Technology Inc. DS60001372G-Page 55
BM70/71
APPENDIX A: CERTIFICATION
NOTICES
The BM70 module (BM70BLES1FC2) has received the
regulatory approval for the following countries:
• BT SIG/QDID:74246
• United States/FCC ID: A8TBM70ABCDEFGH
• Canada/ISED
- IC ID: 12246A-BM70BLES1F2
- HVIN: BM70BLES1F2
• Europe/CE
• Japan/MIC: 202-SMD069
• Korea/KCC: MSIP-CRM-mcp-BM70BLES1FC2
• Taiwan/NCC No: CCAN15LP0500T1
• China/SRRC: CMIIT ID: 2015DJ7135
The BM71 module (BM71BLES1FC2) has received the
regulatory approval for the following countries:
• BT SIG/QDID:74246
• United States/FCC ID: A8TBM71S2
• Canada/ISED
- IC ID: 12246A-BM71S2
- HVIN: BM71BLES1FC2
• Europe/CE
• Japan/MIC: 005-101150
• Korea/KCC: MSIP-CRM-mcp-BM71BLES1FC2
• Taiwan/NCC No: CCAN16LP0010T5
• China/SRRC: CMIIT ID: 2016DJ2787
A.0.1 UNITED STATES
The BM70/71 module has received Federal Communi-
cations Commission (FCC) CFR47 Telecommunica-
tions, Part 15 Subpart C “Intentional Radiators”
modular approval in accordance with Part 15.212 Mod-
ular Transmitter approval. Modular Transmitter
approval allows the end user to integrate the BM70/71
module into a finished product without obtaining subse-
quent and separate FCC approvals for intentional radi-
ation, provided no changes or modifications are made
to the module circuitry. Changes or modifications could
void the user's authority to operate the equipment. The
end user must comply with all of the instructions pro-
vided by the Grantee, which indicate installation and/or
operating conditions necessary for compliance.
The finished product is required to comply with all other
applicable FCC equipment authorizations regulations,
requirements and equipment functions that are not
associated with the transmitter module portion. For
example, compliance must be demonstrated: to regula-
tions for other transmitter components within the host
product; to requirements for unintentional radiators
(Part 15 Subpart B), such as digital devices, computer
peripherals, radio receivers, etc.; and to additional
authorization requirements for the non-transmitter
functions on the transmitter module (i.e., Verification, or
Declaration of Conformity) as appropriate (e.g., trans-
mitter modules may also contain digital logic functions)
A.0.2 LABELING AND USER
INFORMATION REQUIREMENTS
The BM70/71 module has been labeled with its own
FCC ID number, and if the FCC ID is not visible when
the module is installed inside another device, then the
outside of the finished product into which the module is
installed must also display a label referring to the
enclosed module. This exterior label should use the fol-
lowing wording:
For the BM70 module:
For the BM71 module:
Contains Transmitter Module FCC ID: A8TBM70AB-
CDEFGH
or
Contains FCC ID: A8TBM70ABCDEFGH
This device complies with Part 15 of the FCC
Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any
interference received, including interference that
may cause undesired operation
Co ntains Tra nsmitter M odule FCC ID: A8TBM 71S2
or
Contains FCC ID: A8TBM71S2
This device complies with Part 15 of the FCC
Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any
interference received, including interference that
may cause undesired operation
BM70/71
DS60001372G-Page 56 2015-2018 Microchip Technology Inc.
The user's manual for the finished product should
include the following statement:
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748, which is available at the FCC
Office of Engineering and Technology (OET) Labora-
tory Division Knowledge Database (KDB)
http://apps.fcc.gov/oetcf/kdb/index.cfm.
A.0.3 RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. KDB 447498 General RF
Exposure Guidance provides guidance in determining
whether proposed or existing transmitting facilities,
operations or devices comply with limits for human
exposure to Radio Frequency (RF) fields adopted by
the Federal Communications Commission (FCC).
From the FCC Grant: Output power listed is conducted.
This grant is valid only when the module is sold to OEM
integrators and must be installed by the OEM or OEM
integrators. This transmitter is restricted for use with
the specific antenna(s) tested in this application for
Certification and must not be co-located or operating in
conjunction with any other antenna or transmitters
within a host device, except in accordance with FCC
multi-transmitter product procedures. This module is
approved for installation into mobile or/and portable
host platforms
A.0.4 HELPFUL WEB SITES
Federal Communications Commission (FCC):
http://www.fcc.gov
FCC Office of Engineering and Technology (OET) Lab-
oratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm.
A.1 Canada
The BM70/71 module has been certified for use in Can-
ada under Innovation, Science and Economic Develop-
ment Canada (ISED, formerly Industry Canada) Radio
Standards Procedure (RSP) RSP-100, Radio Stan-
dards Specification (RSS) RSS-247 and RSS-Gen.
Modular approval permits the installation of a module in
a host device without the need to recertify the device.
A.1.1 LABELING AND USER
INFORMATION REQUIREMENTS
Labeling Requirements for the Host Device (from Sec-
tion 3.1, RSS-Gen, Issue 4, November 2014): The host
device shall be properly labeled to identify the module
within the host device.
The Innovation, Science and Economic Development
Canada certification label of a module shall be clearly
visible at all times when installed in the host device;
otherwise, the host device must be labeled to display
the Innovation, Science and Economic Development
Canada certification number of the module, preceded
by the word “Contains transmitter module”, or the word
“Contains”, or similar wording expressing the same
meaning, as follows:
For the BM70 module:
For the BM71 module:
User Manual Notice for License-Exempt Radio Appara-
tus (from Section 8.4, RSS-Gen, Issue 4, November
2014): User manuals for license-exempt radio appara-
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equip-
ment generates, uses and can radiate radio fre-
quency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the follow-
ing measures:
• Reorient or relocate the receiving antenna
• Increase the separation between the equipment
and receiver
• Connect the equipment into an outlet on a circuit
different from that to which the receiver is con-
nected
• Consult the dealer or an experienced radio/TV
technician for help
Contains IC: 12246A-BM70BLES1F2
Contains IC: 12246A-BM71S2
2015-2018 Microchip Technology Inc. DS60001372G-Page 57
BM70/71
tus shall contain the following or equivalent notice in a
conspicuous location in the user manual or alterna-
tively on the device or both:
Guidelines on Transmitter Antenna for License Exempt
Radio Apparatus:
Immediately following the above notice, the manufac-
turer shall provide a list of all antenna types approved
for use with the transmitter, indicating the maximum
permissible antenna gain (in dBi) and required imped-
ance for each.
A.1.2 RF EXPOSURE
All transmitters regulated by the Innovation, Science
and Economic Development Canada (ISED) must
comply with RF exposure requirements listed in
RSS-102 - Radio Frequency (RF) Exposure Compli-
ance of Radio communication Apparatus (All Fre-
quency Bands).
This transmitter is restricted for use with a specific
antenna tested in this application for certification, and
must not be co-located or operating in conjunction with
any other antenna or transmitters within a host device,
except in accordance with Innovation, Science and
Economic Development Canada multi-transmitter
guidelines.
The installation of the transmitter must ensure that the
antenna has a separation distance of at least 6.5 cm
from all persons or compliance must be demonstrated
according to the ISED SAR procedures.
A.1.3 HELPFUL WEB SITES
Innovation, Science and Economic Development Can-
ada (ISED): http://www.ic.gc.ca/
A.2 Europe
The BM70/71 module is an Radio Equipment Directive
(RED) assessed radio module that is CE marked and
has been manufactured and tested with the intention of
being integrated into a final product.
The BM70/71 module has been tested to RED
2004/53/EC Essential Requirements for Health and
Safety (Article (3.1(a)), Electromagnetic Compatibility
(EMC) (Article 3.1(b)), and Radio (Article 3.2), which is
summarized in the following European Compliance
Testing table.
The ETSI provides guidance on modular devices in the
“Guide to the applic ation of ha rmonised standards cov-
ering Article 3.1(b) and Article 3.2 of the Directive
2014/53/EU RED to multi-radio and combined radio
and non-radio equipment” document available at
http://www.etsi.org/deliver/etsi_eg/203300_203399/20
3367/01.01.01_60/eg_203367v010101p.pdf.
A.2.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM70/71 module must follow CE marking require-
ments. The RED Compliance Association Technical
Guidance Note 01 provides guidance on final product
CE marking.
This device complies with Industry Canada’s
license-exempt RSS standard(s). Operation is
subject to the following two conditions:
(1) This device may not cause interference, and
(2) This device must accept any interference,
including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR
d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouil-
lage est susceptible d'en compromettre le
fonctionnement.
Under Industry Canada regulations, this radio
transmitter may only operate using an antenna of
a type and maximum (or lesser) gain approved for
the transmitter by Industry Canada. To reduce
potential radio interference to other users, the
antenna type and its gain should be so chosen
that the equivalent isotropically radiated power
(e.i.r.p.) is not more than that necessary for suc-
cessful communication.
Conformément à la réglementation d'Industrie
Canada, le présent émetteur radio peut fonction-
ner avec une antenne d'un type et d'un gain max-
imal (ou inférieur) approuvé pour l'émetteur par
Industrie Canada. Dans le but de réduire les ris-
ques de brouillage radioélectrique à l'intention
des autres utilisateurs, il faut choisir le type
d'antenne et son gain de sorte que la puissance
isotrope rayonnée équivalente (p.i.r.e.) ne
dépasse pas l'intensité nécessaire à l'établisse-
ment d'une communication satisfaisante.
Note: To maintain conformance to the testing
listed in Ta b l e A - 1 /Table A-2, the module
shall be installed in accordance with the
installation instructions in this data sheet
and shall not be modified.
When integrating a radio module into a
completed product, the integrator
becomes the manufacturer of the final
product and is therefore responsible for
demonstrating compliance of the final
product with the essential requirements
against the RED.
BM70/71
DS60001372G-Page 58 2015-2018 Microchip Technology Inc.
Note 1: RF reports apply only to modules using the part IS1870SF-202.
Note 1: RF reports apply only to modules using the part IS1871SF-202.
A.2.2 CONFORMITY ASSESSMENT
From ETSI Guidance Note EG 203367, section 6.1
Non-radio products are combined with a radio product:
If the manufacturer of the combined equipment installs
the radio product in a host non-radio product in equiva-
lent assessment conditions (i.e. host equivalent to the
one used for the assessment of the radio product) and
according to the installation instructions for the radio
product, then no additional assessment of the com-
bined equipment against article 3.2 of the RED is
required.
The European Compliance Testing listed in Ta ble A- 1
and Table A-2 were performed using the integral
ceramic chip antenna.
A.2.3 SIMPLIFIED EU DECLARATION OF
CONFORMITY
Hereby, Microchip Technology Inc. declares that the
radio equipment type BM70/71 is in compliance with
Directive 2014/53/EU.
The full text of the EU declaration of conformity, for this
product, is available at: http://www.micro-
chip.com/design-centers/wireless-connectivity
A.2.4 HELPFUL WEB SITES
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications
Committee (ERC) Recommendation 70-03 E, which
can be downloaded from the European Radio Commu-
nications Committee (ECC) at: http://www.ero.dk/.
TABLE A-1: EUROPEAN COMPLIANCE TESTING (BM70 MODULE)
Certification Standards Article Laboratory Report Number Date
Safety EN60950-1:2006/A11:2009/A
1:2010/A12:2011/A2:2013
[3.1(a)]
TUV
Rheinland
Ta i w a n
10051261 003 2016-01-05
Health EN300328 V1.9.1/
EN62479:2010
10053580 001 2015-12-10
EMC EN301489-1 V1.9.2 [3.1(b)]
10051137 002 2016-01-08
EN301489-17 V2.2.1
EN301489-1 V2.1.1
EN301489-17 V2.2.0 10051137 003 2017-05-26
EN301489-17 V3.1.1
EN301489-17 V3.2.0
Radio EN300328 V1.9.1 (3.2) 10053580 001 2015-12-10
50067510 001(1) 2017-10-04
EN300328 V2.1.1 50067510 002 2017-05-26
TABLE A-2: EUROPEAN COMPLIANCE TESTING (BM71 MODULE)
Certification Standards Article Laboratory Report Number Date
Safety EN60950-1:2006/A11:2009/A
1:2010/A12:2011/A2:2013
[3.1(a)]
TUV
Rheinland
Ta i w a n
10053210 001 2016-01-07
Health EN62479:2010 10053433 001 2015-12-29
EMC EN301489-1 V1.9.2 [3.1(b)]
10052964 001 2015-10-22
EN301489-17 V2.2.1
EN301489-1 V2.1.1
EN301489-1 V2.2.0 10052964 002 2017-05-26
EN301489-17 V3.1.1
EN301489-17 V3.2.0
Radio EN300328 V1.9.1 (3.2) 10053433 001 2015-12-29
50067509 001(1) 2017-04-10
EN300328 V2.1.1 50067509 002 2017-05-26
2015-2018 Microchip Technology Inc. DS60001372G-Page 59
BM70/71
Additional helpful web sites are:
• Radio Equipment Directive (2014/53/EU):
https://ec.europa.eu/growth/single-market/euro-
pean-standards/harmonised-standards/red_en
• European Conference of Postal and Telecommu-
nications Administrations (CEPT):
http://www.cept.org
• European Telecommunications Standards Insti-
tute (ETSI): http://www.etsi.org
• The Radio Equipment Directive Compliance
Association (REDCA): http://www.redca.eu/
A.3 Japan
The BM70/71 module has received type certification
and is labeled with its own technical conformity mark
and certification number as required to conform to the
technical standards regulated by the Ministry of Internal
Affairs and Communications (MIC) of Japan pursuant
to the Radio Act of Japan.
Integration of this module into a final product does not
require additional radio certification provided installa-
tion instructions are followed and no modifications of
the module are allowed. Additional testing may be
required:
• If the host product is subject to electrical appli-
ance safety (for example, powered from an AC
mains), the host product may require Product
Safety Electrical Appliance and Material (PSE)
testing. The integrator should contact their confor-
mance laboratory to determine if this testing is
required
• There is an voluntary Electromagnetic Compatibil-
ity (EMC) test for the host product administered
by VCCI: http://www.vcci.jp/vcci_e/index.html
A.3.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM70/71 module must follow Japan marking require-
ments. The integrator of the module should refer to the
labeling requirements for Japan available at the Minis-
try of Internal Affairs and Communications (MIC) web-
site.
For the BM70 module, due to a limited module size, the
technical conformity logo and ID is displayed in the
data sheet and/or packaging and cannot be displayed
on the module label. The final product in which this
module is being used must have a label referring to the
type certified module inside:
For the BM71 module, due to the limited module size,
the technical conformity logo and ID displayed in the
data sheet only and cannot be displayed on the module
label. The final product in which this module is being
used must have a label referring to the type certified
module inside:
A.3.2 HELPFUL WEB SITES
Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm
Association of Radio Industries and Businesses
(ARIB): http://www.arib.or.jp/english/
A.4 Korea
The BM70/71 module has received certification of con-
formity in accordance with the Radio Waves Act. Inte-
gration of this module into a final product does not
require additional radio certification provided installa-
tion instructions are followed and no modifications of
the module are allowed.
A.4.1 LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM70/71 module must follow KC marking require-
ments. The integrator of the module should refer to the
labeling requirements for Korea available on the Korea
Communications Commission (KCC) website.
The BM70 module is labeled with its own KC mark. The
final product requires the KC mark and certificate num-
ber of the module:
The BM71 module is labeled with its own KC mark. The
final product requires the KC mark and certificate num-
ber of the module:
BM70/71
DS60001372G-Page 60 2015-2018 Microchip Technology Inc.
A.4.2 HELPFUL WEB SITES
Korea Communications Commission (KCC):
http://www.kcc.go.kr
National Radio Research Agency (RRA):
http://rra.go.kr
A.5 Taiwan
The BM70/71 module has received compliance
approval in accordance with the Telecommunications
Act. Customers seeking to use the compliance
approval in their product should contact Microchip
Technology sales or distribution partners to obtain a
Letter of Authority.
Integration of this module into a final product does not
require additional radio certification provided installa-
tion instructions are followed and no modifications of
the module are allowed.
A.5.1 LABELING AND USER
INFORMATION REQUIREMENTS
For the BM70 module, due to the limited module size,
the NCC mark and ID are displayed in the data sheet
only and cannot be displayed on the module label:
For the BM71 module, due to the limited module size,
the NCC mark and ID are displayed in the data sheet
only and cannot be displayed on the module label.
The user's manual should contain following warning
(for RF device) in traditional Chinese:
注意 !
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機，非經許
可，
公司、商號或使用者均不得擅自變更頻率、加大功率或
變更原設計
之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安全及
干擾合法通信；
經發現有干擾現象時，應立即停用，並改善至無干擾時
方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用
電波輻射性
電機設備之干擾。
A.5.2 HELPFUL WEB SITES
National Communications Commission (NCC):
http://www.ncc.gov.tw
A.6 China
The BM70/71 module has received certification of con-
formity in accordance with the China MIIT Notice
2014-01 of State Radio Regulation Committee (SRRC)
certification scheme. Integration of this module into a
final product does not require additional radio certifica-
tion, provided installation instructions are followed and
no modifications of the module are allowed.
A.6.1 LABELING AND USER
INFORMATION REQUIREMENTS
The BM70 module is labeled with its own CMIIT ID as
follows:
When Host system is using an approved Full Modular
Approval (FMA) radio: The host must bear a label con-
taining the statement “This device contains SRRC
approved Radio module CMIIT ID: 2015DJ7135”.
The BM71 module is labeled with its own CMIIT ID as
follows:
When Host system is using an approved Full Modular
Approval (FMA) radio: The host must bear a label con-
taining the statement “This device contains SRRC
approved Radio module CMIIT ID: 2016DJ2787”.
A.7 Other Regulatory Jurisdictions
• For information about other countries jurisdictions
not covered here, refer to the http://www.micro-
chip.com/design-centers/wireless-connectivity.
• Should other regulatory jurisdiction certification be
required by the customer, or the customer needs
to recertify the module for other reasons, contact
Microchip for the required utilities and documenta-
tion.
2015-2018 Microchip Technology Inc. DS60001372G-Page 61
BM70/71
APPENDIX B: REVISION HISTORY
Revision A (October 2015)
This is the initial released version of the document.
Revision B (October 2015)
This revision includes the following changes as well as
minor updates to text and formatting, which were
incorporated throughout the document.
TABLE B-1: MAJOR SECTION UPDATES
Revision C (November 2015)
Updated Appendix A: “Certification Notices”.
Revision D (March 2016)
This revision includes the following changes as well as
minor updates to text and formatting incorporated
throughout the document.
Section Update Description
“Features” This section is updated with certification informations. The data
from this section has been reformatted and distributed in other sec-
tions.
“MAC/Baseband/Higher Layer Features”,
“Power Management”, “Operating Condi-
tions”,and FIGURE 2: “BM71 MODULE”
These sections are newly added.
“General Description” This section was previously placed in chapter 1 and has been
moved here.
1.0 “Device Overview” Ta b l e 1 - 2 , Table 1-4, and Table 1-5 are added.
2.0 “Application Information” This chapter contains information that was previously located in
Appendix A and Electrical Characteristics.
8.0 “Ordering Guide” Ta b l e 8 - 1 is updated with Y-axis information and certification infor-
mation.
Appendix A: “Certification Notices” This section is updated with images for the Certification Marking
and their numbers. The regulatory information is updated to be the
latest.
5.0 “Electrical Characteristics” Ta bl e 5 - 3 is added
TABLE D-1: MAJOR SECTION UPDATES
Section Update Description
1.1 “Interface Description” This section is updated with a note.
Updated Figure 1-1, Figure 1-2, Figure 1-6
2.1 “Reference Schematics” Figure 2-1 through Figure 2-8, Figure 2-10, Figure 5-1, Figure 5-2,
Figure 2-11, Figure 4-1 and Tabl e 4 -1 , Tabl e 8 -1
“Absolute Maximum Ratings” Updated this section.
5.1.1 “Tx/Rx current consumption details” Updated this section with new content.
8.0 “Ordering Guide” This section is updated with a note.
Appendix A: “Certification Notices” Content has been updated
BM70/71
DS60001372G-Page 62 2015-2018 Microchip Technology Inc.
Revision E (January 2017)
This revision includes the following changes as well as
minor updates to text and formatting, which were
incorporated throughout the document.
Revision F (May 2017)
This revision includes the following changes as well as
minor updates to text and formatting were incorporated
throughout the document.
Revision G (January 2018)
This revision includes the following changes as well as
minor updates to text and formatting were incorporated
throughout the document.
TABLE E-1: MAJOR SECTION UPDATES
Section Update Description
“Features” Updated this section.
“MAC/Baseband/Higher Layer Features” Updated this section.
“Power Management” Updated the average current details.
“Operating Conditions” Updated the operating temperature details.
1.0 “Device Overview” Updated Figure 1-1, Figure 1-2, Ta b l e 1 - 1 and Tab l e 1-2
Deleted Table 1-4
2.0 “Application Information” Updated Figure 2-9 through Figure 2-11 and Figure 2-14
3.0 “Module Configuration” Added Tabl e 3 -2 and updated this section.
4.3 “Antenna Considerations” Added new section.
5.0 “Electrical Characteristics” Updated ambient temperature details for part numbers ending with
0002 and 0B0x.
Deleted Table 5-2. Updated Table 5-1, Ta b l e 5 - 3 . Added Ta b l e 5 - 2
8.0 “Ordering Guide” Updated Table 8-1
Appendix A: “Certification Notices” Updated this section.
TABLE F-1: MAJOR SECTION UPDATES
Section Update Description
1.0 “Device Overview” Updated Table 1-1, Figure 1-6
6.0 “Physical dimensions” Updated Figure 6-5 and Figure 6-6
8.0 “Ordering Guide” Added Regulatory model information in Tab l e 8- 1
Appendix A: “Certification Notices” Added the report number of “Radio” certification and notes in
Table A-1 and Table A-2
TABLE G-1: MAJOR SECTION UPDATES
Section Update Description
“Features” Updated Canada certification information.
1.0 “Device Overview” Updated the NOTE.
2.0 “Application Information” Updated 2.1“Reference Schematics”, Figure 2-1, Figure 2-3,
Figure 2-5 and Figure 2-7.
8.0 “Ordering Guide” Updated Table 8-1 with Canada regulatory certification
information and deleted Microchip IC information.
Appendix A: “Certification Notices” Updated the United States, Canada and Europe certification informa-
tion.
Updated KDB and ECC URL links.
2015-2018 Microchip Technology Inc. DS60001372G-Page 63
BM70/71
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
BM70/71
DS60001372G-Page 64 2015-2018 Microchip Technology Inc.
NOTES:
2015-2018 Microchip Technology Inc. DS60001372G-Page 65
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015-2018, Microchip Technology Incorporated, All Rights
Reserved.
ISBN: 978-1-5224-2621-9
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microch ip rece ived IS O/T S-16 94 9:20 09 certificat ion for it s worldwi d e
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS60001372G-page 66 2018 Microchip Technology Inc.
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