Datashee
t
Product structureSilicon monolithic integrated circuitThis product is not designed protec tion against radioactive rays
. 1/33 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211114001
Serial EEPROM series Standard EEPROM
I2C BUS EEPROM (2-Wire)
BR24G02-3A
General Description
BR24G02-3A is a serial EEPROM of I2C BUS interface method
Features
All controls available by 2 ports of serial cloc k(SCL) and
serial data(SDA)
Other devices than EEPROM can be connected to the
same port, saving microcontroller port
1.6V to 5.5V single power source action most suitable
for battery use
1MHz action is possible (1.7V to 5.5V)
Up to 8 bytes in page write mode
Self-timed programming cycle
Low current consumption
Prevention of write mistake
Write (write protect) function added
Prevention of write mistake at low voltage
More than 1 million write cycles
More than 40 years data retent ion
Noise filter built in SCL / SDA terminal
Initial delivery state FFh
BR24G02-3A
Capacity Bit Format Type Power Source
Voltage Package
2Kbit 256×8
BR24G02-3A
1.6V to 5.5V
DIP-T8
BR24G02F-3A SOP8
BR24G02FJ-3A SOP-J8
BR24G02FVT-3A TSSOP-B8
BR24G02FVJ-3A TSSOP-B8J
BR24G02FVM-3A MSOP8
BR24G02NUX-3A VSON008X2030
Packages W(Typ.) x D(Typ.)x H(Max.)
Figure 1.
TSSOP-B8
3.00mm x 6.40mm x 1.20mm
MSOP8
2.90mm x 4.00mm x 0.90mm
SOP-J8
4.90mm x 6.00mm x 1.65mm
SOP8
5.00mm x 6.20mm x 1.71mm
DIP-T8
9.30mm x 6.50mm x 7.10mm TSSOP-B8J
3.00mm x 4.90mm x 1.10mm
V
SON008X2030
2.00mm x 3.00mm x 0.60mm
2/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Absolute Maximum Ratings (Ta=25)
Parameter Symbol Ratings Unit Remarks
Supply voltage VCC -0.3 to +6.5 V
Power Dissipation Pd
450 (SOP8)
mW
When using at Ta=25 or higher 4.5mW to be reduced per 1.
450 (SOP-J8) When using at Ta=25 or higher 4.5mW to be reduced per 1.
330 (TSSOP-B8) When using at Ta=25 or higher 3.3mW to be reduced per 1.
310 (TSSOP-B8J) When using at Ta=25 or higher 3.1mW to be reduced per 1.
310 (MSOP8) When using at Ta=25 or higher 3.1mW to be reduced per 1.
300 (VSON008X2030) When using at Ta=25 or higher 3.0mW to be reduced per 1.
800 (DIP-T8) When using at Ta=25 or higher 8.0mW to be reduced per 1.
Storage Temperature Tstg 65 to +150
Operation Temperature Topr 40 to +85
Input Voltage /
Output Voltage -0.3 to Vcc+1.0 V The Max value of input voltage / output voltage is not over 6.5V.
When the pulse width is 50ns or less, the Min value of input voltage
/ output voltage is not under -0.8V.
Junction Temperature Tjmax 150 Junction temperature at the storag e condition
Electrostatic discharge
voltage
(human body model) VESD -4000 to +4000 V
Memory Cell Characteristics (Ta=25, Vcc=1.6V to 5.5V)
Parameter Limits Unit
Min. Typ. Max
Write cycles *1 1,000,000 Times
Data retention *1 40 Years
*1Not 100% TESTED
Recommended Operating Ratings
Parameter Symbol Ratings Unit
Supply voltage Vcc 1.6 to 5.5 V
Input voltage VIN 0 to Vcc
DC Characteristics (Unless otherw ise specified, Ta=-40 to +85, Vcc =1.6 to 5.5V)
Parameter Symbol Limits Unit Conditions
Min. Typ. Max.
Input High Voltage1 VIH1 0.7Vcc Vcc+1.0 V 1.7VVcc5.5V
Input Low Voltage1 VIL1 0.3*1 0.3Vcc V 1.7VVcc5.5V
Input High Voltage2 VIH2 0.8Vcc Vcc+1.0 V 1.6VVcc1.7V
Input Low Voltage2 VIL2 0.3*1 0.2Vcc V 1.6VVcc1.7V
Output Low Voltage1 VOL1 0.4 V
IOL=3.0mA, 2.5VVcc5.5V (SDA)
Output Low Voltage2 VOL2 0.2 V IOL=0.7mA, 1.6VVcc2.5V (SDA)
Input Leakage Current ILI 1 1 μA VIN=0 to Vcc
Output Leakage Current ILO 1 1 μA VOUT=0 to Vcc (SDA)
Supply Current (Write) ICC1 2.0
mA
Vcc=5.5V, fSCL=1MHz, tWR=5ms,
Byte write, Page write
Supply Current (Read) ICC2 - - 2.0 Vcc=5.5V, fSCL=1MHz
Random read, current read,
sequential read
Standby Curr ent ISB 2.0 μA Vcc=5.5V, SDA, SCL=Vcc
A0, A1, A2=GND, WP=GND
*1 When the pulse width is 50ns or less, it is -0.8V.
3/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
AC Characteristics
(Unless oth erwise specified, Ta=40 to +85)
Parameter Symbol
Limits
(1.6VVcc1.7V) Limits
(1.7VVcc5.5V) Unit
Min. Typ. Max. Min. Typ. Max.
Clock Frequency fSCL - - 400 1000 kHz
Data Clock “HIGH“ Period tHIGH 0.6 - - 0.3 µs
Data Clock “LOW“ Period tLOW 1.2 - - 0.5 µs
SDA, SCL (INPUT) Rise Time *1 tR
- - 1
0.12 µs
SDA, SCL (INPUT) Fall Time *1 tF1
- - 1
0.12 µs
SDA (OUTPUT) Fall Time *1 tF2
- - 0.12 0.12 µs
Start Condition Hold Time tHD:STA 0.6 - -
0.25 µs
Start Condition Setup Time tSU:STA 0.6 - -
0.20 µs
Input Data Hold Time tHD:DAT 0 - - 0 ns
Input Data Setup Time tSU:DAT 100 - -
50 ns
Output Data Delay Time tPD 0.1 - 0.9
0.05 0.45 µs
Output Data Hold Time tDH 0.1 - -
0.05 µs
Stop Condition Setup Time tSU:STO 0.6 - -
0.25 µs
Bus Free Time tBUF 1.2 - - 0.5 µs
Write Cycle Time tWR - - 5
5 ms
Noise Spike Width (SDA, SCL) tI - - 0.05 0.05 µs
WP Hold Time tHD:WP 1.0 - - 1.0 µs
WP Setup Time tSU:WP 0.1 - - 0.1 µs
WP High Period tHIGH:WP 1.0 - - 1.0 µs
*1 Not 100% tested
AC Characteristics Condition
Parameter Symbol Condition Unit
Load Capacitance CL 100 pF
SDA, SCL (INPUT) Rise Time tR 20 ns
SDA, SCL (INPUT) Fall Time tF1 20 ns
Input Data Level VIL1/VIH1 0.2Vcc/0.8Vcc V
Input/Output Data Timing Reference Level - 0.3Vcc/0.7Vcc V
4/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Serial Input / Output timing
Figure 2-(e). WP timing at write cancel
Figure 2-(d). WP timing at write execution
Figure 2-(c). Write cycle timing
Figure 2-(a). Serial input / output timing
Input read at the rise edge of SCL
Data ou tput in sync with the fall of S C L
SCL
SDA
(入力)
SDA
(出力)
tR tF1 tHIGH
tSU:DAT tLOW tHD:DAT
tDH
tPD
tBUF
tHD:STA
70%
30%
70%
70%
30%
70% 70%
30% 30%
70% 70%
30%
70% 70%
70%
70%
30%
30%
30% 30%
tF2
70% 70%
tSU:STA tHD:STA
START CONDITION
tSU:STO
STOP CONDITION
30%
30%
70%
70%
D0 ACK
tWRwrite data
(n-th address) START CONDITIONSTOP CONDITION
70%
70%
DATA(1)
D0 ACK
D1
DATA(n)
ACK tWR
30%
70%
STOP CONDITION
tHD:WP
tSU:WP
30%
70%
DATA(1)
D0
D1 ACK
DATA(n)
ACK
tHIGH:WP
70% 70%
tWR
70%
(INPUT)
(OUTPUT)
Figure 2-(b). Start-stop bit timing
5/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Block Diagram
Figure 3. Block diagram
Pin Configuration
Pin Descriptions
Terminal
Name Input/
Output Function
A0 Input Slave address setting*
A1 Input Slave address setting*
A2 Input Slave address setting*
GND Reference voltage of all input / output, 0V
SDA Input/
output Serial data input serial data output
SCL Input Serial clock input
WP Input Write protect terminal
Vcc Connect the power source.
*A0, A1 and A2 are not allowed to use as open.
2Kbit EEPROM array
8bit
1
BR24G02-3A
A0
A1
A2
GND
Vcc
WP
SCL
SDA
2
3
4
8
7
6
5
8
7
6
5 4
3
2
1
SDA
SCL
WP
V cc
GND
A
2
A1
A0
A
ddress
decoder
Word
address register Data
register
Control circuit
High voltage
generating circuit
Power source
voltage detection
8bit
A
CK
START STOP
6/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Typical Performance Curves
(The following values are Typ. ones)
Figure 4. Input High Voltage1,2 VIH1,2
(A0, A1, A2, SCL, SDA, WP) Figure 5. Input Low Voltage1,2 VIL1,2
(A0, A1, A2, SCL, SDA, WP)
Figure 6. Output Low Voltage1 VOL1
(Vcc=2.5V) Figure 7. Output Low Voltage2 VOL2
(Vcc=1.6V)
0
1
2
3
4
5
6
0123456
SUPPLY VO LT AG E: Vcc(v)
INPUT LOW VO LTAG E: V
IL1
(V)
Ta=-40℃
Ta= 25℃
Ta= 85℃
SPEC
0
1
2
3
4
5
6
0123456
SUPPLY VOLTAGE: Vcc(v)
I NPUT HIG H VOLTAG E: V
IH1
(V)
Ta=-40℃
Ta= 25℃
Ta= 85℃
SPEC
0
0.2
0.4
0.6
0.8
1
0123456
L O UTP UT CURRE NT : I
OL
(mA)
OUTPUT LOW VO LT AGE: V
OL1
(V)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.2
0.4
0.6
0.8
1
0123456
L O UTP UT CURRE NT: I
OL
(mA)
O UTPUT LOW VO LTAG E: V
OL2
(V)
Ta=-40℃
Ta= 25℃
Ta= 85℃
SPEC
7/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Typical Performance Cur vesContinued
Figure 8. Input Leakage Current ILI
(A0, A1, A2, SCL, WP) Figure 9. Output Leakage Current ILO (SDA)
Figure 10. Supply Current (WRIT E ) ICC1
(fscl=1MHz) Figure 11. Supply Current (READ) ICC2
(fscl=1MHz)
0
0.2
0.4
0.6
0.8
1
1.2
0123456
SUPPLY VO LT AG E: Vcc(v)
INPUT LEAKAGE CURRENT : I
LI
(µA)
Ta=-40℃
Ta= 25℃
Ta= 85℃
SPEC
0
0.2
0.4
0.6
0.8
1
1.2
0123456
SUPPLY VOLTAGE: Vcc(v )
OUTPUT LEAKAGE CURRENT: I
LO
(µA)
Ta=-40℃
Ta= 25℃
Ta= 85℃
SPEC
0
0.5
1
1.5
2
2.5
0123456
S UPP LY VOLT AG E: Vcc ( v)
S UP P LY CURRENT ( WRITE) : Ic c 1(mA )
Ta=-40℃
Ta= 25℃
Ta= 85℃
SPEC
0
0.5
1
1.5
2
2.5
0123456
SUPPLY VOLTAGE: Vcc(v)
SUPPLY CURRENT (READ) : I cc2(mA)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
8/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Typical Performance Cur vesContinued
Figure 12. Standby Current ISB Figure 13. Clock Frequenc y fSCL
Figure 14. Data Clock High Period tHIGH Figure 15. Data Clock Low Period tLOW
0.1
1
10
100
1000
10000
0123456
SUPPLY VO LTAGE: Vcc ( v)
SCL FREQUENCY: fscl( k Hz)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.5
1
1.5
2
2.5
0123456
SUPPLY VO LTAGE: Vc c(v)
S TANDB Y CURRE NT: I
SB
(µA)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.1
0.2
0.3
0.4
0123456
SUPPLY VOLTAGE: Vcc(v)
DATA CLK H TIME : t
HIGH
(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.1
0.2
0.3
0.4
0.5
0.6
0123456
SUPPLY VOLTAGE: Vcc(v)
DATA CLK L TIME : t
LOW
(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
9/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Typical Performance Cur vesContinued
Figure 17. Start Condition Hold Time tHD:STA
Figure 16. SDA (OUTPUT) Fall Time tF2
Figure 18. Start Condition Setup Time tSU:STA Figure 19. Input Data Hold Time tHD:DAT ( HIGH)
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
SUPPLY VO LTAGE: Vcc ( v)
START CONDITION HOLD TIME: t
HD:STA
(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0123456
SUPPLY VO LTAGE: Vcc ( v)
SDA (O UTPUT) FALL T IME: t
F2
(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
-0.05
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
SUPPLY VOLTAGE: Vcc(v)
ST ART CONDI TION SETUP TIME: t
SU:STA
(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
-150
-100
-50
0
50
0123456
SUPPLY VOLTAGE: Vc c (v)
INPUT DATA HOLD TIME: t
HD:DAT
(ns)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
10/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Typical Performance Cur vesContinued
Figure 20. Input Data Hold Time tHD:DAT(LOW) Figure 21. Input Data Setup Time tSU:DAT(HIGH)
Figure 22. Input Data Setup Time tSU:DAT(LOW) Figure 23. ‘L’ Output Data Delay Time tPD0
-150
-100
-50
0
50
0123456
SUPPLY VO LTAGE: Vcc(v)
INPUT DAT A HO L D TIME : t
HD:DAT
(ns)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
10
20
30
40
50
60
0123456
SUPPLY VO LTAGE: Vcc(v)
INPUT DATA SET UP TIME: t
SU:DAT
(ns)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
10
20
30
40
50
60
0123456
SUPPLY VOLTAGE: Vcc(v)
INPUT DATA SET UP TIME: t
SU:DAT
(ns)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.1
0.2
0.3
0.4
0.5
0123456
SUPPLY VOLTAGE: Vcc(v)
OUT PUT DA TA DE LAY TIME: t
PD
(µs)
SPEC
SPEC
Ta=-40
Ta= 25℃
Ta= 85℃
11/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Typical Performance Cur vesContinued
Figure 26. BUS Free Time tBUF
Figure 24. ‘H’ Output Data Delay Time tPD1 Figure 25. Stop Condition Setup Time tSU:STO
Figure 27. Write Cycle Time tWR
0
0.1
0.2
0.3
0.4
0.5
0123456
SUPPLY VO LT AGE: Vcc (v)
OUTPUT DATA DELAY TIME: t
PD
(µs)
SPEC
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
SUPPLY VOLTAGE: Vcc ( v)
S TOP CONDITION SET UP TIME: t
SU:STO
s)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.1
0.2
0.3
0.4
0.5
0.6
0123456
SUPPLY VOLT AGE: Vcc( v)
BUS OPEN TIME
BEF ORE TRANSMI SS ION: t
BUF
(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
1
2
3
4
5
6
0123456
SUPPLY VOLTAGE: Vcc(v)
INTERNAL WRITING
CY CL E T IME: tWR(ms)
Ta=-40℃
Ta= 25℃
Ta= 85℃
SPEC
12/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Figure 31. Noise Spike Width tI (SDA L)
Figure 30. Noise Spike Width tI (SDA H)
Figure 29. Noise Spike Width tI (SC
L
L)
Figure 28. Noise Spike Width tI (SC
L
H)
Typical Performance Cur vesContinued
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
SUPPLY VOLTAGE: Vcc(v)
NOIS E RE DUCTION
EFECTIVE TIME: t
I
(SCL L)(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
SUPPLY VOLTAGE: Vcc(v)
NOISE REDUCTION
EFECT IVE TIME: t
I
(SCL H)(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
SUPPLY VO LT AGE: Vcc ( v)
NOISE RE DUCTION
EFECTIVE TI ME: t
I
(SDA L)(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.05
0.1
0.15
0.2
0.25
0.3
0123456
SUPPLY VOLTAGE: Vcc(v)
NOISE REDUCTION
EFECTIVE TIME: t
I
(SDA H)(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
13/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Figure 34. WP High Time tHIGH:WP
Figure 33. WP Setup Time tSU:WP
Figure 32. WP Hold Time tHD:WP
Typical Performance Cur vesContinued
0
0.2
0.4
0.6
0.8
1
1.2
0123456
SUPPLY VO LTAGE: Vcc ( v)
WP DATA HOLD TIME: t
HD:WP
(µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
-0.3
-0.2
-0.1
0
0.1
0.2
0123456
SUPPLY VOLTAGE: Vc c(v)
WP DATA SET UP TIME: t
SU:WP
s)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0.2
0.4
0.6
0.8
1
1.2
0123456
SUPPLY VOLTAGE: Vcc(v)
WP EFECTIVE TIME: t
HIGH:WP
( µs)
SPEC
Ta=-40℃
Ta= 25℃
Ta= 85℃
14/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Timing Chart
I2C BUS data communication
I2C BUS data communication starts by start condition input, and ends by stop condition input. Data is always 8bit long, and
acknowledge is al ways required after each byte. I2C BUS carries out data transmission with plural devic es connected by 2
communication lines of serial data (SDA) and serial clock (SCL).
Among devices, there are “master” that generates clock and control communication start and end, and “slave” that is
controlled by address peculiar to devices. EEPROM becomes “slave”. And the device that outputs data to bus during data
communication is called “trans mitter”, and the device that receives data is called “receiver”.
Start condition (Start bit recognition)
Before executing each command, start condition (start bit) where SDA goes from 'HIGH' down to 'LOW' when SCL is
'HIGH' is necessary.
This IC always detects whether SDA and SCL are in start condition (start bit) or not, therefore, unless this confdition is
satisfied, any command is executed.
Stop condition (stop bit recongnition)
Each command can be ended b y SDA rising from 'LOW' to 'HIGH' when stop condition (stop bit), namely, SCL is 'HIGH'
Acknowledge (ACK) signal
This acknowledge (ACK) signal is a software rule to show whether data transfer has been made normally or not. In
master and slave, the device (μ-COM at slave address input of write command, read command, and this IC at data
output of read command) at the transmitter (sending) side releas es the bus after output of 8bit data.
The device (this IC at slave address input of write command, read command, and μ-COM at data output of read
command) at the receiver (receiving) side s ets SDA 'LOW' during 9 clock cycles, and outputs acknowledge si gnal (ACK
signal) showing that it has received the 8bit data.
This IC, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ACK signal) 'LOW' .
Each write action outputs acknowledge signal (ACK signal) 'LOW', at receiving 8bit data (word address and write data).
Each read action outputs 8bit data (read d ata), and detec ts ackno wledge sig nal (A CK signa l) 'LOW '. W hen ack no wledge
signal (ACK signal) is detected, and stop condition is not sent from the master (μ-COM) side, this IC continues data
output. When acknowledge s ignal (ACK signal) is not detected, this IC stops data transfer, and recogni zes stop cindition
(stop bit), and ends read action. And this IC gets in status.
Device addressing
Output slave address after start condition from master.
The significant 4 bits of slave address are used for reco gnizing a device type.
The device code of this IC is fixed to '1010' .
Next slave addresses (A2 A1 A0 --- device address) ar e for selecting devices, and plural ones can be used on a same
bus according to the number of device addresses.
The most insignificant bit (R/W --- READ / WRITE) of slave address is used for designating write or read action, and is as
shown below.
Setting R / W
―― to 0 ------- write (setting 0 to word address setting of random read)
Setting R / W
―― to 1 ------- read
Type Slave address Maximum number of
Connected buses
BR24G02-3A 1 0 1 0 A2 A1 A0 R/W
―― 8
89 89 89
S P
condition condition
ACK STOPACKDATA DATAADDRES
S
START R/W ACK
1-7
SDA
SCL 1-7 1-7
Figure 35. Data transfer timing
15/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Write Command
Write cycl e
Arbitrary data is written to EEPROM. When to write only 1 byte, byte write is normally used, and when to write continuous
data of 2 bytes or more, simultaneous write is possible by page write cycle. Up to 8 arbitrary bytes can be written.
During internal write execution, all input commands are ignored, therefore ACK is not sent back.
Data is written to the address designated by word address (n-th address)
By issuing stop bit after 8bit data input, write to memory cell inside starts.
When internal write is started, command is not accepted for tWR (5ms at maximum).
By page write cycle, data up to 8 bytes can be written in bulk.
And when data of the maximum bytes or higher is sent, data from the first byte is overwritten.
(Refer to "Internal address increment")
As for page write cycle of BR24G02-3A, after the significant 5 bits of word address are designated arbitrarily, by
continuing data input of 2 bytes or more, the address of insignificant 3 bits is incremented internally, and data up to 8
bytes can be written.
Figure 36. Byte write cycle
Figure 37. Page write cycle
A1 A2 WA
7 D7 1 1 0 0
W
R
I
T
E
S
T
A
R
T
R
/
W
S
T
O
P
WORD
ADDRESS DATA
SLAVE
ADDRESS
A0 WA
0 D0
A
C
K
SDA
LINE
A
C
K
A
C
K
A1A2 WA
7 D7 1 1 0 0
W
R
I
T
E
S
T
A
R
T
R
/
W
S
T
O
P
WORD
ADDRESS
n
DATA(n)
SLAVE
ADDRESS
A0 WA
0 D0
A
C
K
SDA
LINE
A
C
K
A
C
K
DATA
(
n+7
)
D0
A
C
K
16/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Notes on write cycle continuous input
The maximum page numbers of BR24G02-3A are 8 bytes. Any bytes below these can be written.
1 page=8bytes, but the page write cycle time is 5ms at maximum for 8byte bulk write.
It does not stand 5ms at maximum × 8byte=40ms(Max.)
Internal address increment
Page write mode
Write protect (WP) terminal
Write protect (WP) function
When WP terminal is set Vcc (H level), data rewrite of all addresses is prohibited. When it is set GND (L level), data
rewrite of all address is ena ble d. Be sure to c onn ect this ter minal t o Vcc or GND, or contr ol it to H lev el or L level. Do not
use it open.
In the case of use it as an ROM, it is recommended to connect it to pull up or Vcc.
At extremely low voltage at power ON / OFF, by setting the WP terminal 'H', mistake write can be prevented.
For example, when it is started from address 06h,
therefore, increment is made as below,
06h07h00h01h・・・ which please not e.
06h・・・06 in hexadecimal, therefore, 00000110 becomes a
binary number.
WA7 WA4 WA3 WA2 WA1 WA0
0 00000
0 00001
0 00010
0 00110
0 00111
0 00000
Incremen
t
06h
Significant bit is fixed.
No digit up
17/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Read Command
Read cycle
Data of EEPROM is read. In read cycle, there are random read cycle and current read cycle.
Random read cycle is a command to read d ata by designat ing address, and is used generally.
Current read cycle is a command to read d ata of internal add ress register without d esign ating addr ess, and is used when
to verify just after write cycle. In both the read cycles, sequential read cycle is available, and the next address data can
be read in succession.
In random read cycle, data of designated word address can be re ad.
When the command just before current read cycle is random read cycle, current read cycle (each including sequential
read cycle), data of incremented last read address (n)-th address, i.e., data of the (n+1)-th address is output.
When ACK signal 'LOW' after D0 is detect ed, an d stop c ondition is not sent from master (μ-COM) side, the n ext addres s
data can be read in succession.
Read cycle is end ed by stop condition where 'H' is input to ACK signal after D0 and SDA signal is started at SCL signal
'H' .
When 'H' is not input to ACK signal after D0, sequential read gets in, and the next data is output.
Therefore, read command cycle cann ot be ended. W hen to end read command c ycle, be sure input stop conditi on to input
'H' to ACK signal after D0, and to start SDA at SCL signal 'H'.
Sequential read is ended by stop condition where ' H' is input to ACK signal after arbitrary D0 and SDA is started at SCL
signal 'H'.
Figure 38. Random read cycle
Figure 40. Sequential read cycle (in the cas e of current read cycle)
W
R
I
T
E
S
T
A
R
T
R
/
W
A
C
K
S
T
O
P
WORD
AD DRESS(n)
SDA
LINE
A
C
K
A
C
K
DATA(n)
A
C
K
SLAVE
ADDRESS
10 0 1 A0 A1 A2 WA
7 A0 D0
SLAVE
ADDRESS
10 0 1A1 A2
S
T
A
R
T
D7
R
/
W
R
E
A
D
WA
0
S
T
A
R
T
S
T
O
P
SDA
LINE
A
C
K
DATA(n)
A
C
K
SLAVE
ADD R ES S
10 0 1 A0 A1A2 D0D7
R
/
W
R
E
A
D
Figure 39. Current read cycle
R
E
A
D
S
T
A
R
T
R
/
W
A
C
K
S
T
O
P
DATA(n)
SDA
LINE
A
C
K
A
C
K
DATA(n+x)
A
C
K
SLAVE
ADDRESS
10 0
1A0
A1
A2 D0D7 D0 D7
18/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Software Reset
Software reset is executed when to avoid malfunction after power on, and to reset during command input. Software reset
has several kinds, and 3 kinds of them are sho wn in the figure be low. (Refer to Figure 41-(a), Figure 41- (b), Figure 41-(c))
In dummy clock input area, release the SDA bus ('H' by pull up). In dummy clock area, ACK output and read data '0' (both
'L' level) may be output from EEPROM, therefore, if 'H' is input forcibly, output may conflict and over current may flow,
leading to instantaneous power failure of system power source or influ ence upon devices.
Acknowledge Polling
During internal write e xecution, all i nput commands are ignored, therefore ACK is not sent back. During int ernal automatic
write execution after write cycle input, next command (slave address) is sent, and if the first ACK signal sends back 'L' , then
it means end of write action, while if it sends back 'H', it means now in writing. By use of acknowledge polling, next
command can be executed without waiting for tWR = 5ms.
When to write continuousl y, R/W = 0, when to carry out current read cyc le after write, slave ad dress R/ W = 1 is sent, and if
ACK signal sends back 'L', then execute word address input and data output and so forth.
Figure 41-(a). Dummy clock x 14 + START + START + command input
Start command from START input.
Figure 41-(b). START + dummy clock x 9 + START + command input
1 2 13 14
SCL
Dummy clock x 14 Start x 2
Normal command
Normal command
SDA
SCL 2 1 8 9
Dummy clock x 9 Start
Start
Normal command
Normal command
SDA
Figure 41-(c). START x 9 + command input
St art x 9
SCL 1 2 3 8 9 7 Normal command
Normal command
SDA
Slave
address
Word
address
S
T
A
R
T
First write command
A
C
K
H
A
C
K
L
Slave
address
Slave
address
Slave
address Data
Write command
During internal write,
ACK = HIGH is sent back.
After completion of internal write,
ACK=LOW is sent back, so input
next word address and data in
succession.
tWR
tWR
Second write command
S
T
A
R
T
S
T
A
R
T
S
T
A
R
T
S
T
A
R
T
S
T
O
P
S
T
O
P
A
C
K
H
A
C
K
H
A
C
K
L
A
C
K
L
Figure 42. Case to continuously write by acknowledge polling
19/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
WP Valid Timing (Write Cancel)
WP is usually fixed to 'H' or 'L', but when WP is used to cancel write cycle and so forth, pay attention to the following WP
valid timing. During write cycl e execution, in cancel valid area, by setting WP= 'H', write cycle can be cancelled. In both byte
write cycle and page write cycle, the area from the first start condition of command to the rise of clock to taken in D0 of
data(in page write cycle, the first byte data) is cancel invalid area.
WP input in this area becomes don't care. The area from the rise of SCL to take in D0 to input the stop condition is cancel
valid area. And, after execution of forced end by WP, standby status gets in.
Command Cancel by Start Condition and Stop Condition
During command input, by continuously inputting start condition and stop condition, command ca n be cancelled. (Figure 44)
However, in ACK output area and during data read, SDA bus may output 'L', and in this case, start condition and stop
condition cannot be input, so reset is not available. Therefore, execute software reset. And when command is cancelled b y
start, stop condition, during random read c ycle, sequential read cycle, or current read cycle, internal s etting address is not
determined, therefore, it is not possible to carry out current read cycle in succession. When to carry out read cycle in
succession, carry out random read cycle.
Rise of D0 taken clock
SCL
D0 ACK
Enlarged view
SCL
SDA ACK D0
Rise of SDA
SDA
WP
WP cancel invalid area WP cancel valid area
Data is not written.
Figure 43. WP valid timing
Slave
address D7 D6 D5 D4 D3 D2 D1 D0 Data tWR
SDA D1
S
T
A
R
T
A
C
K
L
A
C
K
L
A
C
K
L
A
C
K
L
S
T
O
P
Word
address
Figure 44. Case of cancel by start, stop condition during slave address input
SCL
SDA 1 1 0 0
Start condition Stop condition
Enlarged view
WP cancel invalid area
20/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
I/O Peripheral Circuit
Pull up resistance of SDA terminal
SDA is NMOS open drai n, so requires pull up resistance. As for this resistance value (RPU), select an appropriate value to
this resistance value from microcontroller VIL, IL, and VOL-IOL characteristics of this IC. If RPU is large, action frequency is
limited. The smaller the RPU, the larger the supply current.
Maximum value of RPU
The maximum value of RPU is determined by the following factors.
SDA rise time to be determined b y the c apacitance (CBUS) of bus line of RPU and SDA should be tR or below.
And AC timing should be satisfied even when SDA rise time is late.
The bus electric potential A to be determined by input leak total (IL) of device connected to bus at output of 'H' to
SDA bus and RPU should sufficiently secure the input 'H' level (VIH) of microcontroller and EEPROM including
recommended noise margin 0.2Vcc.
VCCILRPU0.2 VCC VIH
RPU 0.8VCCVIH
IL
Ex.) VCC =3V IL=10μA VIH=0.7 VCC
from
30 kΩ]
RPU 0.8×30.7×3
10×10-6
Minimum value of RPU
The minimum value of RPU is determined by the following factors.
When IC outputs LOW, it should be satisfied that VOLMAX=0.4V and IOLMAX=3mA.
VOLMAX=0.4V should secure the input 'L' level (VIL) of microcontroller and EEPROM including recommended
noise margin 0.1Vcc.
VOLMAX VIL0.1 VCC
Ex.) VCC =3V, VOL=0.4V, IOL=3mA, microcontroller, EEPROM VIL=0.3Vcc
And VOL=0.4V
VIL=0.3×3
=0.9V
Therefore, the condition is satisfied.
Pull up resistance of SCL terminal
When SCL control is made at CMOS output port, there is no need, but in the case there is timing where SCL becomes
'Hi-Z', add a pull up resistance. As for the pull up resistance, one of several kΩ to several ten kΩ is recommended in
consideration of drive perform ance of output port of microcontroller.
IOL
RPU VCCVOL
IOL
VCCVO
L
RPU
867 [Ω]
RPU 30.4
3×10 -3
from
Microcontroller
RPU
A SDA terminal
IL IL
Bus line
capacity
CBUS
Figure 45. I/O circuit diagram
EEPROM
21/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Cautions on Microcontroller Connection
RS In I2C BUS, it is recommended that SDA por t is of open drain in put/outp ut. However, when to use CMOS input / output of
tri state to SDA port, insert a series resistance Rs between the pull up resistance Rpu and the SDA terminal of EEPROM.
This is controls over current that occurs when PMOS of the microcontroller and NMOS of EEPROM are turned ON
simultaneously. Rs also plays the role of protection of SDA terminal against surge. Therefore, even when SDA port is
open drain input/output, Rs can be used.
Maximum value of Rs
The maximum value of Rs is determin ed by the following relations.
SDA rise time to be determined b y the c apacity (CBUS) of bus line of Rpu and SDA should b e tR or bel ow.
And AC timing should be satisfied even when SDA rise time is late.
The bus electric potential A to be determined by Rpu and Rs the moment when EEPROM outputs 'L' to SDA bus
sufficiently secure the input 'L' level (VIL) of microcontroller including recommended noise margin 0.1Vcc.
Minimum value of Rs
The minimum value of Rs is determin ed by over current at bus collision. When over current flows, noises in power source
line, and instantaneous power failure of power source may occur. When allowable over current is defined as I, the
following relation must be satisfied. Determi ne the allowable current in consideration of impedance of p ower source line
in set and so forth. Set the over current to EEPROM 10mA or below.
RPU
Microcontroller
RS
EEPROM
Figure 46. I/O circuit diagram Figure 47. Input / output collision timing
A
CK
'L' output of EEPROM
'H' output of microcontroller
Over current flows to SDA line by 'H'
output of microcontroller and 'L'
output of EEPROM.
SCL
SDA
Microcontroller EEPROM
'L'output
R
S
R
PU
'H' output
Over current I
Figure 49. I/O circuit diagram
1.67kΩ]
0.3×30.40.1×3 ×20×103
1.1×30.3×3
RS
×R
PU
1.1VCC-VIL
Ex.VCC=3V VIL=0.3VCC VOL=0.4V RPU=20kΩ
RSVILVOL0.1VCC
(VCCVOL)×RS+V
OL+0.1VCCVIL
RPU+RS
V
CC
R
S
V
CC
I
300[Ω]
Ex.) VCC=3V, I=10mA
R
S
3
10×10
-3
I
R
S
RPU
Micro controller
RS
EEPROM
IOL
A
Bus line
capacity
CBUS
VOL
VCC
VIL
Figure 48. I/O Circuit Diagram
22/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
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TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
I/O Equivalence Circuit
Input (A2,A1,A0,SCL, WP)Input / output (SDA)
Power-up / Down Conditions
At power on, in IC internal circuit and set, Vcc rises through unstable low voltage area, and IC inside is not completely reset,
and malfunction may occur. To prevent this, functions of POR circuit and LVCC circuit are equipped. To assure the action,
observe the following conditions at power on.
1. Set SDA = 'H' and SCL ='L' or 'H’
2. Start power source so as to satisfy the recommended conditions of tR, tOFF, and Vbot for operating POR circuit.
tOFF
tR
Vbot
0
VCC
3. Set SDA and SCL so as not to become 'Hi-Z'.
When the above conditions 1 and 2 cannot be observed, take the following countermeasur es.
a) In the case when the above condition 1 c annot be observed. When SDA becomes 'L' at power on .
Control SCL and SDA as shown below, to make SCL and SDA, 'H' and 'H'.
b) In the case when the above condition 2 cannot be observed.
After power source becomes stable, execute software reset(P18).
) In the case when the above conditions 1 and 2 cannot be observed.
Carry out a), and then carry out b).
Low Voltage Malfunction Preve ntion Func tion
LVCC circuit prevents data rewrite action at low power, and preve nts wrong write. At LVCC voltage (Typ. =1.2V) or below, it
prevent data rewrite.
Noise Countermeasures
Bypass capacitor
When noise or surge gets in the po wer source line, malfun ction ma y occu r, therefore, for removing these, it is recommende d
to attach a by pass capacitor (0.1μF) between IC Vcc and GND. At that moment, attach it as close to IC as possible.
And, it is also recommended to attach a bypass capacitor bet ween board V cc and GND.
Figure 52. Rise waveform diagram
tLOW
tSU:DAT tDH
A
fter Vcc becomes stable
SCL
VCC
SDA
tSU:DAT
A
ft er Vcc becomes stable
Recommended conditions of tR, tOFF,Vbot
tR tOFF Vbot
10ms or belo
w
10ms or larger 0.3V or below
100 or below 10ms or larger 0.2V or below
Figure 50. Input pin circuit diagram Figure 51. Input / output pin circuit diagram
Figure 53. When SCL= 'H' and SDA= 'L' Figure 54. When SCL='L' and SDA='L'
23/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Operational Notes
(1) Described numeric values and data are design representative values, and the values a r e not guaranteed.
(2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further
sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin in
consideration of static characteristics and transition characteristics an d fluctuations of external parts and our LSI.
(3) Absolute maximum ratings
If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded, LSI
may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear
exceeding the absolute maxi mum ratings, take physical safety countermeasur es such as fuses, and see to it that conditions
exceeding the absol ute maximum ratings should not be im pressed to LSI.
(4) GND electric potential
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that of
GND terminal.
(5) Terminal design
In consideration of permissible loss in actual use condition, carry out heat design with sufficient margin.
(6) Terminal to terminal shortcircuit and wrong packaging
When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may
destruct LSI. And in the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND owing
to foreign matter, LSI may be destructed.
(7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently.
24/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Part Numbering
B R 2 4 G 0 2 x x x - 3 A x x x x
Lineup
Capacity Package Orderable Part Number Remark
Type Quantity
2K
DIP-T8 Tube of 2000 BR24G02 -3A Not Halogen free 100% Sn
SOP8 Reel of 2500 BR24G02F -3AGTE2 Halogen free 100% Sn
SOP-J8 BR24G02FJ -3AGTE2 Halogen free 100% Sn
TSSOP-B8 Reel of 3000 BR24G02FVT -3AGE2 Halogen free 100% Sn
TSSOP-B8J Reel of 2500 BR24G02FVJ -3AGTE2 Halogen free 100% Sn
MSOP8 Reel of 3000 BR24G02FVM -3AGTTR Halogen free 100% Sn
VSON008X2030 Reel of 4 000 BR24G02NUX -3ATTR Halogen free 100% Sn
BUS type
24 : I2C
Operating temperature/
Operating Voltage
-40 to +85 / 1.6V to 5.5V
Process code
Packaging and forming specification
E2 : Embossed tape and reel
(SOP8, SOP-J8, TSSOP-B8, TSSOP-B8J)
TR : Embossed tape and reel
(MSOP8, VSON008X2030)
None : Tube
(DIP-T8)
Revision
Package
Blank
FJ
FVJ
NUX
: DIP-T8
: SOP-J8
: TSSOP-B8J
: VSON008X2030
F
FVT
FVM
: SOP8
: TSSOP-B8
: MSOP8
Capacity
02=2K
G : Halogen free
Blank : Not Halogen free
As an exception, VSON008X2030 package will be Halogen free with “Blank”
T : 100% Sn
Blank : 100% Sn
25/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Physical Dimensions Tape and Reel Information
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
TubeContainer
Quantity
Direction of feed 2000pcs
Direction of products is fixed in a container tube
(Unit : mm)
DIP-T8
0°−15°
7.62
0.3±0.1
9.3±0.3
6.5±0.3
85
14
0.51Min.
3.4±0.3
3.2±0.2
2.54 0.5±0.1
26/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
SOP8
0.9±0.15
0.3MIN
4
°
+
6
°
4
°
0.17 +0.1
-
0.05
0.595
6
43
8
2
5
1
7
5.0±0.2
6.2±0.3
4.4±0.2
(MAX 5.35 include BURR)
1.27
0.11
0.42±0.1
1.5±0.1
S
0.1 S
27/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
SOP-J8
4°+6°
4°
0.2±0.1
0.45MIN
234
5678
1
4.9±0.2
0.545
3.9±0.2
6.0±0.3
(MAX 5.25 include BURR)
0.42±0.1
1.27
0.175
1.375±0.1
0.1 S
S
28/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
E2
()
1pin
(Unit : mm)
TSSOP-B8
0.08 S
0.08 M
4 ± 4
234
8765
1
1.0±0.05
1PIN MARK
0.525
0.245+0.05
0.04
0.65
0.145+0.05
0.03
0.1±0.05
1.2MAX
3.0±0.1
4.4±0.1
6.4±0.2
0.5±0.15
1.0±0.2
(MAX 3.35 include BURR)
S
29/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
1pin
(Unit : mm)
TSSOP-B8J
0.08 M
0.08 S
S
4 ± 4
(MAX 3.35 include BURR)
578
1234
6
3.0±0.1
1PIN MARK
0.95±0.2
0.65
4.9±0.2
3.0±0.1
0.45±0.15
0.85±0.05
0.145
0.1±0.05
0.32
0.525
1.1MAX
+0.05
0.03
+0.05
0.04
30/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Direction of feed
Reel
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
TR
()
1pin
(Unit : mm)
MSOP8
0.08 S
S
4.0±0.2
8
3
2.8±0.1
1
6
2.9±0.1
0.475
4
57
(MAX 3.25 include BURR)
2
1PIN MARK
0.9MAX
0.75±0.05
0.65
0.08±0.05
0.22 +0.05
0.04
0.6±0.2
0.29±0.15
0.145 +0.05
0.03
4°
+6°
4°
31/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper right when you hold
reel on the left hand and you pull out the tape on the right hand
4000pcs
TR
()
Direction of feed
Reel 1pin
(Unit : mm)
VSON008X2030
5
1
8
4
1.4±0.1
0.25
1.5±0.1
0.5
0.3±0.1
0.25 +0.05
0.04
C0.25
0.6MAX
(0.12)
0.02+0.03
0.02 3.0±0.1
2.0±0.1
1PIN MARK
0.08 S
S
32/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Marking Diagrams (TOP VIEW)
SOP8(TOP VIEW)
4G02A
Part Number Marking
LOT Numbe
r
1PIN MARK
SOP-J8(TOP VIEW)
4G02A
Part Number Marking
LOT Number
1PIN MARK
TSSOP-B8J(TOP VIEW)
2A3
Part Number Marking
LOT Number
1PIN MARK
4G0
VSON008X2030 (TOP VIEW)
2A3
Part Number Marking
LOT Number
1PIN MARK
4G0
MSOP8(TOP VIEW)
4GB Part Number Marking
LOT Number
1PIN MARK
A
TSSOP-B8(TOP VIEW)
4G02A
Part Number Marking
LOT Numbe
r
1PIN MARK
DIP-T8 (TOP VIEW)
BR24G02A
Part Number Marking
LOT Number
33/33
Datasheet
Datasheet
BR24G02-3A
© 2014 ROHM Co., Ltd. All rights reserved.
www.rohm.co
TSZ2211115001 TSZ02201-0R2R0G100570-1-2
27.Aug.2014 REV.003
Revision History
Date Revision Changes
26.Dec.2012 001 New Release
31.May.2013 002 P1 Change format of package line-up table and change title.
P.2 Add VESD in Absolute Maximum Ratings
P.5 Add directions in Pi n Descriptions
27.Aug.2014 003 P.3 Modified tSU:STA (0.25->0.20)
P.24 Update Part Numbering. Add Lineup Table
Datasheet
Datasheet
Notice – GE Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parti es arising from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASS CLASS CLASSb CLASS
CLASS CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-produci ng comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding nor mal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending o n Ambient temper ature (Ta). When us ed in se aled area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in an y way responsible or liable for failure induced under dev iant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlor ine, bromin e, etc.) flux is used, the residue of flux ma y negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specificati on
Datasheet
Datasheet
Notice – GE Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own indepe ndent verificati on and judgme nt in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry con dition (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperatur e / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, sold erability of products out of recommende d storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a hum idity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using a n authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the developm ent of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.