SPRS073L - AUGUST 1998 - REVISED JUNE 2005 D Excellent Price/Performance Digital Signal D D D Processors (DSPs): TMS320C62x (TMS320C6211 and TMS320C6211B) - Eight 32-Bit Instructions/Cycle - C6211, C6211B, C6711, and C6711B are Pin-Compatible - 150-, 167-MHz Clock Rates - 6.7-, 6-ns Instruction Cycle Time - 1200, 1333 MIPS - Extended Temperature Device (C6211B) VelociTI Advanced Very Long Instruction Word (VLIW) C62x DSP Core (C6211/11B) - Eight Highly Independent Functional Units: - Six ALUs (32-/40-Bit) - Two 16-Bit Multipliers (32-Bit Results) - Load-Store Architecture With 32 32-Bit General-Purpose Registers - Instruction Packing Reduces Code Size - All Instructions Conditional Instruction Set Features - Byte-Addressable (8-, 16-, 32-Bit Data) - 8-Bit Overflow Protection - Saturation - Bit-Field Extract, Set, Clear - Bit-Counting - Normalization L1/L2 Memory Architecture - 32K-Bit (4K-Byte) L1P Program Cache (Direct Mapped) - 32K-Bit (4K-Byte) L1D Data Cache (2-Way Set-Associative) - 512K-Bit (64K-Byte) L2 Unified Mapped RAM/Cache (Flexible Data/Program Allocation) D Device Configuration D D D D D D D D D D - Boot Mode: HPI, 8-, 16-, and 32-Bit ROM Boot - Endianness: Little Endian, Big Endian 32-Bit External Memory Interface (EMIF) - Glueless Interface to Asynchronous Memories: SRAM and EPROM - Glueless Interface to Synchronous Memories: SDRAM and SBSRAM - 512M-Byte Total Addressable External Memory Space Enhanced Direct-Memory-Access (EDMA) Controller (16 Independent Channels) 16-Bit Host-Port Interface (HPI) - Access to Entire Memory Map Two Multichannel Buffered Serial Ports (McBSPs) - Direct Interface to T1/E1, MVIP, SCSA Framers - ST-Bus-Switching Compatible - Up to 256 Channels Each - AC97-Compatible - Serial-Peripheral-Interface (SPI) Compatible (Motorola) Two 32-Bit General-Purpose Timers Flexible Phase-Locked-Loop (PLL) Clock Generator IEEE-1149.1 (JTAG) Boundary-Scan-Compatible 256-Pin Ball Grid Array (BGA) Package (GFN and ZFN Suffixes) 0.18-m/5-Level Metal Process - CMOS Technology 3.3-V I/Os, 1.8-V Internal Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TMS320C62x, VelociTI, and C62x are trademarks of Texas Instruments. Motorola is a trademark of Motorola, Inc. All trademarks are the property of their respective owners. IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture. Copyright 2004, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+ POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 1 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 Table of Contents revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 GFN and ZFN BGA packages (bottom view) . . . . . . . . . . . . 4 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 device characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 device compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 functional block and CPU (DSP core) diagram . . . . . . . . . . . 8 CPU (DSP core) description . . . . . . . . . . . . . . . . . . . . . . . . . . 9 memory map summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 peripheral register descriptions . . . . . . . . . . . . . . . . . . . . . . . 12 PWRD bits in CPU CSR register description . . . . . . . . . . . 17 EDMA channel synchronization events . . . . . . . . . . . . . . . . 18 interrupt sources and interrupt selector . . . . . . . . . . . . . . . . 19 signal groups description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 terminal functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 documentation support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 clock PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 power-down logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 power-supply sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 IEEE 1149.1 JTAG compatibility statement . . . . . . . . . . . . . 40 EMIF device speed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 bootmode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 2 POST OFFICE BOX 1443 absolute maximum ratings over operating case temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . 42 recommended operating conditions . . . . . . . . . . . . . . . . 42 electrical characteristics over recommended ranges of supply voltage and operating case temperature . 42 parameter measurement information . . . . . . . . . . . . . . . signal transition levels . . . . . . . . . . . . . . . . . . . . . . . . . . timing parameters and board routing analysis . . . . . . input and output clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . asynchronous memory timing . . . . . . . . . . . . . . . . . . . . . synchronous-burst memory timing . . . . . . . . . . . . . . . . . synchronous DRAM timing . . . . . . . . . . . . . . . . . . . . . . . . HOLD/HOLDA timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . BUSREQ timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . reset timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . external interrupt timing . . . . . . . . . . . . . . . . . . . . . . . . . . host-port interface timing . . . . . . . . . . . . . . . . . . . . . . . . . multichannel buffered serial port timing . . . . . . . . . . . . . timer timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . JTAG test-port timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . * HOUSTON, TEXAS 77251-1443 43 43 44 46 49 52 54 60 61 62 64 65 69 80 81 82 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 REVISION HISTORY This data sheet revision history highlights the technical changes made to the SPRS073K device-specific data sheet to make it an SPRS073L revision. Scope: Applicable updates to the C62x device family, specifically relating to the C6211 and C6211B devices, have been incorporated. PAGE(S) NO. ADDITIONS/CHANGES/DELETIONS Global: Added "ZFN" mechanical packaging information 3 Moved the Revision History to the front of the document 31 Device Support, Device and Development-Support Tool Nomenclature section: Updated the "To designate the stages in the product development cycle..." paragraph Updated the "TMX and TMP devices..." paragraph Added "The ZFN package, like the GFN package, is ..." paragraph 32 Figure 4. TMS320C6000 DSP Device Nomenclature (Including the TMS320C6211 and TMS320C6211B Devices): Deleted the "TMS320C6211/C6211B Device Part Numbers (P/Ns) and Ordering Information" table and associated paragraph Added "ZFN" package and associated footnote Added the "For actual device part numbers (P/Ns) and ordering information, ..." footnote 82, 83 Mechanical Data section: Deleted the "GFN (S-PBGA-N256)" mechanical data package diagram; now an automated merge process Added "thermal resistance characteristics (S-PBGA package) for ZFN" table Added new "Packaging Information" title and lead-in sentence POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 3 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 GFN and ZFN BGA packages (bottom view) GFN and ZFN 256-PIN BALL GRID ARRAY (BGA) PACKAGES ( BOTTOM VIEW ) Y W V U T R P N M L K J H G F E D C B A 1 3 2 4 5 4 7 6 POST OFFICE BOX 1443 9 8 11 10 13 12 15 14 17 16 19 18 * HOUSTON, TEXAS 77251-1443 20 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 description The TMS320C62x DSPs (including the TMS320C6211/C6211B devices) compose one of the fixed-point DSP families in the TMS320C6000 DSP platform. The TMS320C6211 (C6211) and TMS320C6211B (C6211B) devices are based on the high-performance, advanced VelociTI very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSPs an excellent choice for multichannel and multifunction applications. With performance of up to 1333 million instructions per second (MIPS) at a clock rate of 167 MHz, the C6211/C6211B device offers cost-effective solutions to high-performance DSP programming challenges. The C6211/C6211B DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. This processor has 32 general-purpose registers of 32-bit word length and eight highly independent functional units. The eight functional units provide six arithmetic logic units (ALUs) for a high degree of parallelism and two 16-bit multipliers for a 32-bit result. The C6211/C6211B can produce two multiply-accumulates (MACs) per cycle for a total of 333 million MACs per second (MMACS). The C6211/C6211B DSP also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals. The C6211/C6211B uses a two-level cache-based architecture and has a powerful and diverse set of peripherals. The Level 1 program cache (L1P) is a 32-Kbit direct mapped cache and the Level 1 data cache (L1D) is a 32-Kbit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of a 512-Kbit memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.The peripheral set includes two multichannel buffered serial ports (McBSPs), two general-purpose timers, a host-port interface (HPI), and a glueless external memory interface (EMIF) capable of interfacing to SDRAM, SBSRAM and asynchronous peripherals. The C6211/C6211B has a complete set of development tools which includes: a new C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution. TMS320C6000 is a trademark of Texas Instruments. Windows is a registered trademark of the Microsoft Corporation. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 5 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 device characteristics Table 1 provides an overview of the C6211/C6211B DSP. The table shows significant features of each device, including the capacity of on-chip RAM, the peripherals, the execution time, and the package type with pin count. For more details on the C6000 DSP device part numbers and part numbering, see Figure 4. Table 1. Characteristics of the C6211/C6211B Processors C6211 (FIXED-POINT DSP) C6211B (FIXED-POINT DSP) EMIF (Clock source = ECLKIN) 1 1 EDMA (Internal clock source = CPU clock frequency) 1 1 HPI 1 1 McBSPs (Internal clock source = CPU/2 clock frequency) 2 2 32-Bit Timers (Internal clock source = CPU/4 clock frequency) 2 2 HARDWARE FEATURES Peripherals Size (Bytes) 72K 72K On-Chip Memory Organization 4K-Byte (4KB) L1 Program (L1P) Cache 4KB L1 Data (L1D) Cache 64KB Unified Mapped RAM/Cache (L2) 4K-Byte (4KB) L1 Program (L1P) Cache 4KB L1 Data (L1D) Cache 64KB Unified Mapped RAM/Cache (L2) CPU ID+ CPU Rev ID Control Status Register (CSR.[31:16]) 0x0002 0x0002 Frequency MHz Cycle Time Voltage 167, 150 167, 150 6 ns (C6211-167) 6.7 ns (C6211-150) 6 ns (C6211B-167) 6.7 ns (C6211B-150) 6.7 ns (C6211BGFNA-150) Core (V) 1.8 1.8 I/O (V) 3.3 3.3 ns PLL Options CLKIN frequency multiplier BGA Packages 27 x 27 mm Process Technology m Product Status Product Preview (PP) Advance Information (AI) Production Data (PD) Bypass (x1), x4 Bypass (x1), x4 256-Pin BGA (GFN) 256-Pin BGA (GFN and ZFN) 0.18 m 0.18 m PD PD C6000 is a trademark of Texas Instruments. 6 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 device compatibility The TMS320C6211/C6211B and C6711/C6711B devices are pin-compatible and have the same peripheral set; thus, making new system designs easier and providing faster time to market. The following list summarizes the device characteristic differences among the C6211, C6211B, C6711, and C6711B devices: D The C6211 and C6211B devices have a fixed-point C62x CPU, while the C6711 and C6711B devices have a floating-point C67x CPU. D The C6211/C6211B device runs at -167 and -150 MHz clock speeds (with a C6211BGFNA extended temperature device that also runs at -150 MHz), while the C6711/C6711B device runs at -150 and -100 MHz (with a C6711BGFNA extended temperature device that also runs at -100 MHz). For a more detailed discussion on the similarities/differences between the C6211 and C6711 devices, see the How to Begin Development Today with the TMS320C6211 DSP and How to Begin Development with the TMS320C6711 DSP application reports (literature number SPRA474 and SPRA522, respectively). POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 7 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 functional block and CPU (DSP core) diagram SDRAM SBSRAM 32 SRAM External Memory Interface (EMIF) ROM/FLASH Timer 0 I/O Devices Timer 1 Multichannel Buffered Serial Port 1 (McBSP1) Framing Chips: H.100, MVIP, SCSA, T1, E1 AC97 Devices, SPI Devices, Codecs Multichannel Buffered Serial Port 0 (McBSP0) 16 Host Port Interface (HPI) Interrupt Selector 8 Enhanced DMA Controller (16 channel) AAA AAA AAA AAA AAA AAA AAA AAA AAA AAA AAA AAA AAA AAA AAA AAA C6211/C6211B Digital Signal Processors L1P Cache Direct Mapped 4K Bytes Total C6000 CPU (DSP Core) Instruction Fetch L2 Memory 4 Banks 64K Bytes Total PLL (x1, x4) POST OFFICE BOX 1443 Control Registers Instruction Dispatch Control Logic Instruction Decode Data Path A A Register File .L1 .S1 .M1 .D1 Data Path B Test B Register File .D2 .M2 .S2 .L2 L1D Cache 2-Way Set Associative 4K Bytes Total Power-Down Logic * HOUSTON, TEXAS 77251-1443 Boot Configuration In-Circuit Emulation Interrupt Control SPRS073L - AUGUST 1998 - REVISED JUNE 2005 CPU (DSP core) description The CPU fetches VelociTI advanced very-long instruction words (VLIW) (256 bits wide) to supply up to eight 32-bit instructions to the eight functional units during every clock cycle. The VelociTI VLIW architecture features controls by which all eight units do not have to be supplied with instructions if they are not ready to execute. The first bit of every 32-bit instruction determines if the next instruction belongs to the same execute packet as the previous instruction, or whether it should be executed in the following clock as a part of the next execute packet. Fetch packets are always 256 bits wide; however, the execute packets can vary in size. The variable-length execute packets are a key memory-saving feature, distinguishing the C62x CPU from other VLIW architectures. The CPU features two sets of functional units. Each set contains four units and a register file. One set contains functional units .L1, .S1, .M1, and .D1; the other set contains units .D2, .M2, .S2, and .L2. The two register files each contain 16 32-bit registers for a total of 32 general-purpose registers. The two sets of functional units, along with two register files, compose sides A and B of the CPU (see the functional block and CPU diagram and Figure 1). The four functional units on each side of the CPU can freely share the 16 registers belonging to that side. Additionally, each side features a single data bus connected to all the registers on the other side, by which the two sets of functional units can access data from the register files on the opposite side. While register access by functional units on the same side of the CPU as the register file can service all the units in a single clock cycle, register access using the register file across the CPU supports one read and one write per cycle. Another key feature of the C62x CPU is the load/store architecture, where all instructions operate on registers (as opposed to data in memory). Two sets of data-addressing units (.D1 and .D2) are responsible for all data transfers between the register files and the memory. The data address driven by the .D units allows data addresses generated from one register file to be used to load or store data to or from the other register file. The C62x CPU supports a variety of indirect addressing modes using either linear- or circular-addressing modes with 5- or 15-bit offsets. All instructions are conditional, and most can access any one of the 32 registers. Some registers, however, are singled out to support specific addressing or to hold the condition for conditional instructions (if the condition is not automatically "true"). The two .M functional units are dedicated for multiplies. The two .S and .L functional units perform a general set of arithmetic, logical, and branch functions with results available every clock cycle. The processing flow begins when a 256-bit-wide instruction fetch packet is fetched from a program memory. The 32-bit instructions destined for the individual functional units are "linked" together by "1" bits in the least significant bit (LSB) position of the instructions. The instructions that are "chained" together for simultaneous execution (up to eight in total) compose an execute packet. A "0" in the LSB of an instruction breaks the chain, effectively placing the instructions that follow it in the next execute packet. If an execute packet crosses the fetch-packet boundary (256 bits wide), the assembler places it in the next fetch packet, while the remainder of the current fetch packet is padded with NOP instructions. The number of execute packets within a fetch packet can vary from one to eight. Execute packets are dispatched to their respective functional units at the rate of one per clock cycle and the next 256-bit fetch packet is not fetched until all the execute packets from the current fetch packet have been dispatched. After decoding, the instructions simultaneously drive all active functional units for a maximum execution rate of eight instructions every clock cycle. While most results are stored in 32-bit registers, they can be subsequently moved to memory as bytes or half-words as well. All load and store instructions are byte-, half-word, or word-addressable. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 9 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 CPU (DSP core) description (continued) AAAAAA AAAA A AAAAAAA AAAA AAAAAA AAAAAAAA AAAAAA AAAAAA AAAAAAA AAAAAAA AAAAAA AAAAAAAA AAAA A AAAAAA AA AA AAAA AAAA AAAAAA AA AA AAAA AAAA AAAAAAA AAAAAAA AAAAAA AAAAAAA AAAAAAA AAAA AAAAAA AAAAAAAA AAAAAA AAAA A AAAAAAA AAAAAAA AAAAAAA src1 .L1 src2 dst long dst long src ST1 Data Path A long src long dst dst .S1 src1 8 8 32 8 Register File A (A0-A15) src2 .M1 dst src1 src2 LD1 DA1 DA2 .D1 .D2 dst src1 src2 2X 1X src2 src1 dst LD2 src2 .M2 src1 dst src2 Data Path B src1 .S2 dst long dst long src ST2 long src long dst dst .L2 src2 Register File B (B0-B15) 8 32 8 src1 AAAAAA AAAAAA AAAAAA AAAAAAA AAAAAAA AAAAAA AAAAAA AAAAAAA AAAAAA AAAAAAA AAAAAAA AAAAAA AAAAAAA AAAAAAA AAAAAA AAAAAA AAAAAA AAAAAA AAAAAAA AAAAAAA AAAAAA AAAAAAA AAAAAA AAAAAA AAAAAAA AAAAAA AAAAAA AAAAAAA AAAAAAA AAAAAA AAAAAA AAAAAA A 8 Control Register File Figure 1. TMS320C62x CPU (DSP Core) Data Paths 10 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 memory map summary Table 2 shows the memory map address ranges of the C6211/C6211B devices. Internal memory is always located at address 0 and can be used as both program and data memory. The C6211/C6211B configuration registers for the common peripherals are located at the same hex address ranges. The external memory address ranges in the C6211/C6211B devices begin at the address location 0x8000 0000. Table 2. TMS320C6211/C6211B Memory Map Summary MEMORY BLOCK DESCRIPTION BLOCK SIZE (BYTES) Internal RAM (L2) 64K HEX ADDRESS RANGE 0000 0000 - 0000 FFFF Reserved 24M - 64K 0001 0000 - 017F FFFF External Memory Interface (EMIF) Registers 256K 0180 0000 - 0183 FFFF L2 Registers 256K 0184 0000 - 0187 FFFF HPI Registers 256K 0188 0000 - 018B FFFF McBSP 0 Registers 256K 018C 0000 - 018F FFFF McBSP 1 Registers 256K 0190 0000 - 0193 FFFF Timer 0 Registers 256K 0194 0000 - 0197 FFFF Timer 1 Registers 256K 0198 0000 - 019B FFFF Interrupt Selector Registers 256K 019C 0000 - 019F FFFF EDMA RAM and EDMA Registers 256K 01A0 0000 - 01A3 FFFF Reserved 6M - 256K 01A4 0000 - 01FF FFFF QDMA Registers 52 0200 0000 - 0200 0033 Reserved 736M - 52 0200 0034 - 2FFF FFFF McBSP 0/1 Data 256M 3000 0000 - 3FFF FFFF Reserved EMIF CE0 1G 4000 0000 - 7FFF FFFF 256M 8000 0000 - 8FFF FFFF EMIF CE1 EMIF CE2 256M 9000 0000 - 9FFF FFFF 256M A000 0000 - AFFF FFFF EMIF CE3 256M B000 0000 - BFFF FFFF Reserved 1G C000 0000 - FFFF FFFF The number of EMIF address pins (EA[21:2]) limits the maximum addressable memory (SDRAM) to 128MB per CE space. To get 256MB of addressable memory, additional general-purpose output pin or external logic is required. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 11 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 peripheral register descriptions Table 3 through Table 13 identify the peripheral registers for the C6211/C6211B device by their register names, acronyms, and hex address or hex address range. For more detailed information on the register contents, bit names, and their descriptions, see the TMS320C6000 DSP Peripherals Overview Reference Guide (literature number SPRU190). Table 3. EMIF Registers HEX ADDRESS RANGE ACRONYM 0180 0000 GBLCTL EMIF global control REGISTER NAME 0180 0004 CECTL1 EMIF CE1 space control 0180 0008 CECTL0 EMIF CE0 space control 0180 000C - 0180 0010 CECTL2 Reserved EMIF CE2 space control 0180 0014 CECTL3 EMIF CE3 space control 0180 0018 SDCTL EMIF SDRAM control 0180 001C SDTIM EMIF SDRAM refresh control 0180 0020 SDEXT EMIF SDRAM extension 0180 0024 - 0183 FFFF - Reserved Table 4. L2 Cache Registers 12 HEX ADDRESS RANGE ACRONYM 0184 0000 CCFG REGISTER NAME 0184 4000 L2FBAR L2 flush base address register 0184 4004 L2FWC L2 flush word count register 0184 4010 L2CBAR L2 clean base address register 0184 4014 L2CWC L2 clean word count register 0184 4020 L1PFBAR L1P flush base address register 0184 4024 L1PFWC L1P flush word count register 0184 4030 L1DFBAR L1D flush base address register 0184 4034 L1DFWC L1D flush word count register 0184 5000 L2FLUSH L2 flush register 0184 5004 L2CLEAN L2 clean register 0184 8200 MAR0 Controls CE0 range 8000 0000 - 80FF FFFF 0184 8204 MAR1 Controls CE0 range 8100 0000 - 81FF FFFF 0184 8208 MAR2 Controls CE0 range 8200 0000 - 82FF FFFF 0184 820C MAR3 Controls CE0 range 8300 0000 - 83FF FFFF 0184 8240 MAR4 Controls CE1 range 9000 0000 - 90FF FFFF 0184 8244 MAR5 Controls CE1 range 9100 0000 - 91FF FFFF 0184 8248 MAR6 Controls CE1 range 9200 0000 - 92FF FFFF 0184 824C MAR7 Controls CE1 range 9300 0000 - 93FF FFFF 0184 8280 MAR8 Controls CE2 range A000 0000 - A0FF FFFF 0184 8284 MAR9 Controls CE2 range A100 0000 - A1FF FFFF 0184 8288 MAR10 Controls CE2 range A200 0000 - A2FF FFFF 0184 828C MAR11 Controls CE2 range A300 0000 - A3FF FFFF 0184 82C0 MAR12 Controls CE3 range B000 0000 - B0FF FFFF 0184 82C4 MAR13 Controls CE3 range B100 0000 - B1FF FFFF 0184 82C8 MAR14 Controls CE3 range B200 0000 - B2FF FFFF 0184 82CC MAR15 Controls CE3 range B300 0000 - B3FF FFFF 0184 82D0 - 0187 FFFF - Cache configuration register Reserved POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 peripheral register descriptions (continued) Table 5. EDMA Registers HEX ADDRESS RANGE ACRONYM REGISTER NAME 01A0 FF9C - 01A0 FFDC - 01A0 FFE0 PQSR Reserved Priority queue status register 01A0 FFE4 CIPR Channel interrupt pending register 01A0 FFE8 CIER Channel interrupt enable register 01A0 FFEC CCER Channel chain enable register 01A0 FFF0 ER 01A0 FFF4 EER Event enable register 01A0 FFF8 ECR Event clear register 01A0 FFFC ESR Event set register 01A1 0000 - 01A3 FFFF - Event register Reserved Table 6. EDMA Parameter RAM HEX ADDRESS RANGE ACRONYM 01A0 0000 - 01A0 0017 - Parameters for Event 0 (6 words) REGISTER NAME 01A0 0018 - 01A0 002F - Parameters for Event 1 (6 words) 01A0 0030 - 01A0 0047 - Parameters for Event 2 (6 words) 01A0 0048 - 01A0 005F - Parameters for Event 3 (6 words) 01A0 0060 - 01A0 0077 - Parameters for Event 4 (6 words) 01A0 0078 - 01A0 008F - Parameters for Event 5 (6 words) 01A0 0090 - 01A0 00A7 - Parameters for Event 6 (6 words) 01A0 00A8 - 01A0 00BF - Parameters for Event 7 (6 words) 01A0 00C0 - 01A0 00D7 - Parameters for Event 8 (6 words) 01A0 00D8 - 01A0 00EF - Parameters for Event 9 (6 words) 01A0 00F0 - 01A0 00107 - Parameters for Event 10 (6 words) 01A0 0108 - 01A0 011F - Parameters for Event 11 (6 words) 01A0 0120 - 01A0 0137 - Parameters for Event 12 (6 words) 01A0 0138 - 01A0 014F - Parameters for Event 13 (6 words) 01A0 0150 - 01A0 0167 - Parameters for Event 14 (6 words) 01A0 0168 - 01A0 017F - Parameters for Event 15 (6 words) 01A0 0180 - 01A0 0197 - Reload/link parameters for Event M (6 words) 01A0 0198 - 01A0 01AF - Reload/link parameters for Event N (6 words) ... ... 01A0 07E0 - 01A0 07F7 - 01A0 07F8 - 01A0 07FF - Reload/link parameters for Event Z (6 words) Scratch pad area (2 words) The C6211/C6211B device has sixty-nine parameter sets [six (6) words each] that can be used to reload/link EDMA transfers. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 13 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 peripheral register descriptions (continued) Table 7. Quick DMA (QDMA) and Pseudo Registers HEX ADDRESS RANGE ACRONYM REGISTER NAME 0200 0000 QOPT QDMA options parameter register 0200 0004 QSRC QDMA source address register 0200 0008 QCNT QDMA frame count register 0200 000C QDST QDMA destination address register 0200 0010 QIDX QDMA index register 0200 0014 - 0200 001C - 0200 0020 QSOPT QDMA pseudo options register 0200 0024 QSSRC QDMA pseudo source address register 0200 0028 QSCNT QDMA pseudo frame count register 0200 002C QSDST QDMA pseudo destination address register 0200 0030 QSIDX Reserved QDMA pseudo index register All the QDMA and Pseudo registers are write-accessible only Table 8. Interrupt Selector Registers HEX ADDRESS RANGE 14 ACRONYM REGISTER NAME COMMENTS 019C 0000 MUXH Interrupt multiplexer high Selects which interrupts drive CPU interrupts 10-15 (INT10-INT15) 019C 0004 MUXL Interrupt multiplexer low Selects which interrupts drive CPU interrupts 4-9 (INT04-INT09) 019C 0008 EXTPOL External interrupt polarity Sets the polarity of the external interrupts (EXT_INT4-EXT_INT7) 019C 000C - 019F FFFF - Reserved POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 peripheral register descriptions (continued) Table 9. McBSP 0 Registers HEX ADDRESS RANGE ACRONYM REGISTER NAME 018C 0000 DRR0 McBSP0 data receive register via Peripheral Bus 0x3000 0000 - 0x33FF FFFF DRR0 McBSP0 data receive register via EDMA Bus 018C 0004 DXR0 McBSP0 data transmit register via Peripheral Bus 0x3000 0000 - 0x33FF FFFF DXR0 McBSP0 data transmit register via EDMA Bus 018C 0008 SPCR0 018C 000C RCR0 McBSP0 receive control register 018C 0010 XCR0 McBSP0 transmit control register 018C 0014 SRGR0 018C 0018 MCR0 McBSP0 multichannel control register 018C 001C RCER0 McBSP0 receive channel enable register 018C 0020 XCER0 McBSP0 transmit channel enable register 018C 0024 PCR0 018C 0028 - 018F FFFF - COMMENTS The CPU and DMA/EDMA controller can only read this register; they cannot write to it. McBSP0 serial port control register McBSP0 sample rate generator register McBSP0 pin control register Reserved Table 10. McBSP 1 Registers HEX ADDRESS RANGE ACRONYM REGISTER NAME 0190 0000 DRR1 Data receive register via Peripheral Bus 0x3400 0000 - 0x37FF FFFF DRR1 McBSP1 data receive register via EDMA Bus 0190 0004 DXR1 McBSP1 data transmit register via Peripheral Bus 0x3400 0000 - 0x37FF FFFF DXR1 McBSP1 data transmit register via EDMA Bus 0190 0008 SPCR1 0190 000C RCR1 McBSP1 receive control register 0190 0010 XCR1 McBSP1 transmit control register 0190 0014 SRGR1 0190 0018 MCR1 McBSP1 multichannel control register 0190 001C RCER1 McBSP1 receive channel enable register 0190 0020 XCER1 McBSP1 transmit channel enable register 0190 0024 PCR1 0190 0028 - 0193 FFFF - COMMENTS The CPU and DMA/EDMA controller can only read this register; they cannot write to it. McBSP1 serial port control register McBSP1 sample rate generator register McBSP1 pin control register Reserved POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 15 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 peripheral register descriptions (continued) Table 11. Timer 0 Registers HEX ADDRESS RANGE ACRONYM REGISTER NAME COMMENTS 0194 0000 CTL0 Timer 0 control register Determines the operating mode of the timer, monitors the timer status, and controls the function of the TOUT pin. 0194 0004 PRD0 Timer 0 period register Contains the number of timer input clock cycles to count. This number controls the TSTAT signal frequency. 0194 0008 CNT0 Timer 0 counter register Contains the current value of the incrementing counter. 0194 000C - 0197 FFFF - Reserved Table 12. Timer 1 Registers HEX ADDRESS RANGE ACRONYM REGISTER NAME COMMENTS 0198 0000 CTL1 Timer 1 control register Determines the operating mode of the timer, monitors the timer status, and controls the function of the TOUT pin. 0198 0004 PRD1 Timer 1 period register Contains the number of timer input clock cycles to count. This number controls the TSTAT signal frequency. 0198 0008 CNT1 Timer 1 counter register Contains the current value of the incrementing counter. 0198 000C - 019B FFFF - Reserved Table 13. HPI Registers 16 HEX ADDRESS RANGE ACRONYM - HPID HPI data register REGISTER NAME Host read/write access only COMMENTS - HPIA HPI address register Host read/write access only 0188 0000 HPIC HPI control register Both Host/CPU read/write access 0188 0001 - 018B FFFF - Reserved POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 PWRD bits in CPU CSR register description Table 14 identifies the PWRD field (bits 15-10) in the CPU CSR register. These bits control the device power-down modes. For more detailed information on the PWRD bit field of the CPU CSR register, see the TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189). Table 14. PWRD field bits in the CPU CSR Register HEX ADDRESS RANGE - ACRONYM CSR REGISTER NAME Control status register COMMENTS The PWRD field (bits 15-10 in the CPU CSR) controls the device power-down modes. Accessible by writing a value to the CSR register. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 17 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 EDMA channel synchronization events The C62x EDMA supports up to 16 EDMA channels. Four of the sixteen channels (channels 8-11) are reserved for EDMA chaining, leaving 12 EDMA channels available to service peripheral devices. Table 15 lists the source of synchronization events associated with each of the programmable EDMA channels. For the C6211/11B, the association of an event to a channel is fixed; each of the EDMA channels has one specific event associated with it. For more detailed information on the EDMA module, associated channels, and event-transfer chaining, see the TMS320C6000 DSP Enhanced Direct Memory Access (EDMA) Controller Reference Guide (literature number SPRU234). Table 15. TMS320C6211/C6211B EDMA Channel Synchronization Events EDMA CHANNEL EVENT NAME 0 DSP_INT 1 TINT0 Timer 0 interrupt 2 TINT1 Timer 1 interrupt 3 SD_INT 4 EXT_INT4 External interrupt pin 4 5 EXT_INT5 External interrupt pin 5 6 EXT_INT6 External interrupt pin 6 7 8 EXT_INT7 External interrupt pin 7 EVENT DESCRIPTION Host-port interface (HPI)-to-DSP interrupt EMIF SDRAM timer interrupt EDMA_TCC8 EDMA transfer complete code (TCC) 1000b interrupt 9 10 EDMA_TCC9 EDMA TCC 1001b interrupt EDMA_TCC10 EDMA TCC 1010b interrupt 11 EDMA_TCC11 EDMA TCC 1011b interrupt 12 XEVT0 McBSP0 transmit event 13 REVT0 McBSP0 receive event 14 XEVT1 McBSP1 transmit event 15 REVT1 McBSP1 receive event EDMA channels 8 through 11 are used for transfer chaining only. For more detailed information on event-transfer chaining, see the TMS320C6000 DSP Enhanced Direct Memory Access (EDMA) Controller Reference Guide (literature number SPRU234). 18 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 interrupt sources and interrupt selector The C62x DSP core supports 16 prioritized interrupts, which are listed in Table 16. The highest-priority interrupt is INT_00 (dedicated to RESET) while the lowest-priority interrupt is INT_15. The first four interrupts (INT_00-INT_03) are non-maskable and fixed. The remaining interrupts (INT_04-INT_15) are maskable and default to the interrupt source specified in Table 16. The interrupt source for interrupts 4-15 can be programmed by modifying the selector value (binary value) in the corresponding fields of the Interrupt Selector Control registers: MUXH (address 0x019C0000) and MUXL (address 0x019C0004). Table 16. C6211/C6211B DSP Interrupts INTERRUPT SELECTOR CONTROL REGISTER SELECTOR VALUE (BINARY) INTERRUPT EVENT INT_00 INT_01 - - RESET - - NMI INT_02 INT_03 - - Reserved Reserved. Do not use. - - Reserved Reserved. Do not use. INT_04 INT_05 MUXL[4:0] 00100 EXT_INT4 External interrupt pin 4 MUXL[9:5] 00101 EXT_INT5 External interrupt pin 5 INT_06 INT_07 MUXL[14:10] 00110 EXT_INT6 External interrupt pin 6 MUXL[20:16] 00111 EXT_INT7 External interrupt pin 7 INT_08 INT_09 MUXL[25:21] 01000 EDMA_INT EDMA channel (0 through 15) interrupt MUXL[30:26] 01001 Reserved INT_10 INT_11 MUXH[4:0] 00011 SD_INT MUXH[9:5] 01010 Reserved None, but programmable INT_12 INT_13 MUXH[14:10] 01011 Reserved None, but programmable MUXH[20:16] 00000 DSP_INT Host-port interface (HPI)-to-DSP interrupt INT_14 INT_15 MUXH[25:21] 00001 TINT0 Timer 0 interrupt MUXH[30:26] 00010 TINT1 Timer 1 interrupt - - 01100 XINT0 McBSP0 transmit interrupt - - 01101 RINT0 McBSP0 receive interrupt - - 01110 XINT1 McBSP1 transmit interrupt - - 01111 RINT1 McBSP1 receive interrupt - - 10000 - 11111 Reserved CPU INTERRUPT NUMBER INTERRUPT SOURCE None, but programmable EMIF SDRAM timer interrupt Reserved. Do not use. Interrupts INT_00 through INT_03 are non-maskable and fixed. Interrupts INT_04 through INT_15 are programmable by modifying the binary selector values in the Interrupt Selector Control registers fields. Table 16 shows the default interrupt sources for Interrupts INT_04 through INT_15. For more detailed information on interrupt sources and selection, see the TMS320C6000 DSP Interrupt Selector Reference Guide (literature number SPRU646). POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 19 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 signal groups description CLKIN CLKOUT2 CLKOUT1 CLKMODE0 PLLV PLLG PLLF Clock/PLL TMS TDO TDI TCK TRST EMU0 EMU1 EMU2 EMU3 EMU4 EMU5 Reset and Interrupts RESET NMI EXT_INT7 EXT_INT6 EXT_INT5 EXT_INT4 RSV5 IEEE Standard 1149.1 (JTAG) Emulation Reserved RSV4 RSV3 RSV2 RSV1 RSV0 Control/Status HD[15:0] HCNTL0 HCNTL1 16 Data HPI (Host-Port Interface) Register Select Control HHWIL Half-Word Select Figure 2. CPU (DSP Core) and Peripheral Signals 20 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 HAS HR/W HCS HDS1 HDS2 HRDY HINT SPRS073L - AUGUST 1998 - REVISED JUNE 2005 signal groups description (continued) 32 ED[31:0] Data Memory Control CE3 CE2 CE1 CE0 EA[21:2] BE3 BE2 BE1 BE0 TOUT1 Memory Map Space Select 20 Address Bus Arbitration ECLKIN ECLKOUT ARE/SDCAS/SSADS AOE/SDRAS/SSOE AWE/SDWE/SSWE ARDY HOLD HOLDA BUSREQ Byte Enables EMIF (External Memory Interface) Timer 1 Timer 0 TOUT0 TINP0 TINP1 Timers McBSP1 McBSP0 CLKX1 FSX1 DX1 Transmit Transmit CLKX0 FSX0 DX0 CLKR1 FSR1 DR1 Receive Receive CLKR0 FSR0 DR0 CLKS1 Clock Clock CLKS0 McBSPs (Multichannel Buffered Serial Ports) Figure 3. Peripheral Signals POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 21 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 Terminal Functions SIGNAL NAME NO. TYPE IPD/ IPU DESCRIPTION CLOCK/PLL CLKIN A3 I IPD Clock Input CLKOUT1 D7 O IPD Clock output at device speed The CLK1EN bit in the EMIF GBLCTL register controls the CLKOUT1 pin. CLK1EN = 0: CLKOUT1 is disabled CLK1EN = 1: CLKOUT1 enabled to clock [default] CLKOUT2 Y12 O IPD Clock output at half of device speed When the CLKOUT2 pin is enabled, the CLK2EN bit in the EMIF global control register (GBLCTL) controls the CLKOUT2 pin. CLK2EN = 0: CLKOUT2 is disabled CLK2EN = 1: CLKOUT1 enabled to clock [default] CLKMODE0 C4 I IPU Clock mode select * Selects whether the CPU clock frequency = input clock frequency x4 or x1 PLLV PLLG A4 A A PLL analog VCC connection for the low-pass filter C6 B5 A PLL low-pass filter connection to external components and a bypass capacitor PLLF PLL analog GND connection for the low-pass filter JTAG EMULATION TMS B7 I IPU JTAG test-port mode select TDO A8 O/Z IPU JTAG test-port data out TDI A7 I IPU JTAG test-port data in TCK A6 I IPU JTAG test-port clock TRST B6 I IPD JTAG test-port reset EMU5 B12 I/O/Z IPU Emulation pin 5. Reserved for future use, leave unconnected. EMU4 C11 I/O/Z IPU Emulation pin 4. Reserved for future use, leave unconnected. EMU3 B10 I/O/Z IPU Emulation pin 3. Reserved for future use, leave unconnected. EMU2 D10 I/O/Z IPU EMU1 B9 I/O/Z IPU Emulation pin 2. Reserved for future use, leave unconnected. Emulation pin 1# EMU0 D9 I/O/Z IPU Emulation pin 0# RESET A13 I IPU Device reset NMI C13 I IPD Nonmaskable interrupt * Edge-driven (rising edge) Any noise on the NMI pin may trigger an NMI interrupt; therefore, if the NMI pin is not used, it is recommended that the NMI pin be grounded versus relying on the IPD. I IPU External interrupts * Edge-driven * Polarity independently selected via the External Interrupt Polarity Register bits (EXTPOL.[3:0]) RESETS AND INTERRUPTS EXT_INT7 E3 EXT_INT6 D2 EXT_INT5 C1 EXT_INT4 C2 HINT J20 O IPU Host interrupt (from DSP to host) HCNTL1 G19 I IPU Host control - selects between control, address, or data registers HCNTL0 G18 I IPU Host control - selects between control, address, or data registers HHWIL H20 I IPU Host half-word select - first or second half-word (not necessarily high or low order) HOST-PORT INTERFACE (HPI) HR/W G20 I IPU Host read or write select I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-k IPD or IPU resistor. To pull up a signal to the opposite supply rail, a 1-k resistor should be used.) 22 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 PLLV and PLLG are not part of external voltage supply or ground. See the CLOCK/PLL documentation for information on how to connect these pins. A = Analog signal (PLL Filter) # The EMU0 and EMU1 pins are internally pulled up with 30-k resistors; therefore, for emulation and normal operation, no external pullup/pulldown resistors are necessary. However, for boundary scan operation, pull down the EMU1 and EMU0 pins with a dedicated 1-k resistor. Terminal Functions (Continued) SIGNAL NAME NO. TYPE IPD/ IPU DESCRIPTION HOST-PORT INTERFACE (HPI) (CONTINUED) HD15 B14 IPU HD14 C14 IPU HD13 A15 IPU HD12 C15 IPU HD11 A16 IPU HD10 B16 IPU HD9 C16 IPU HD8 B17 HD7 A18 HD6 C17 IPU HD5 B18 IPU HD4 C19 IPD HD3 C20 IPU HD2 D18 IPU HD1 D20 IPU HD0 E20 HAS E18 I IPU Host address strobe HCS F20 I IPU Host chip select HDS1 E19 I IPU Host data strobe 1 HDS2 F18 I IPU Host data strobe 2 HRDY H19 O IPD Host ready (from DSP to host) IPU I/O/Z IPU Host-port data * Used for transfer of data, address, and control * Also controls initialization of DSP modes at reset via pullup/pulldown resistors - Device Endian mode HD8: 0 - Big Endian 1 - Little Endian - Boot mode HD[4:3]: 00 - HPI boot 01 - 8-bit ROM boot with default timings 10 - 16-bit ROM boot with default timings 11 - 32-bit ROM boot with default timings IPU EMIF - CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY CE3 V6 O/Z IPU CE2 W6 O/Z IPU CE1 W18 O/Z IPU CE0 V17 O/Z IPU BE3 V5 O/Z IPU BE2 Y4 O/Z IPU BE1 U19 O/Z IPU Memory space enables * Enabled by bits 28 through 31 of the word address * Only one asserted during any external data access Byte-enable control * Decoded from the two lowest bits of the internal address * Byte-write enables for most types of memory * Can be directly connected to SDRAM read and write mask signal (SDQM) BE0 V20 O/Z IPU I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-k IPD or IPU resistor. To pull up a signal to the opposite supply rail, a 1-k resistor should be used.) POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 23 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 Terminal Functions (Continued) SIGNAL NAME NO. TYPE IPD/ IPU DESCRIPTION EMIF - BUS ARBITRATION HOLDA J18 O IPU Hold-request-acknowledge to the host HOLD J17 I IPU Hold request from the host BUSREQ J19 O IPU Bus request output EMIF - ASYNCHRONOUS/SYNCHRONOUS DRAM/SYNCHRONOUS BURST SRAM MEMORY CONTROL ECLKIN Y11 I IPD EMIF input clock ECLKOUT Y10 O IPD EMIF output clock (based on ECLKIN) ARE/SDCAS/ SSADS V11 O/Z IPU Asynchronous memory read enable/SDRAM column-address strobe/SBSRAM address strobe AOE/SDRAS/ SSOE W10 O/Z IPU Asynchronous memory output enable/SDRAM row-address strobe/SBSRAM output enable AWE/SDWE/ SSWE V12 O/Z IPU Asynchronous memory write enable/SDRAM write enable/SBSRAM write enable ARDY Y5 I IPU Asynchronous memory ready input EMIF - ADDRESS EA21 U18 EA20 Y18 EA19 W17 EA18 Y16 EA17 V16 EA16 Y15 EA15 W15 EA14 Y14 EA13 W14 EA12 V14 EA11 W13 EA10 V10 EA9 Y9 EA8 V9 EA7 Y8 EA6 W8 EA5 V8 EA4 W7 EA3 V7 O/Z IPU EMIF external address EA2 Y6 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-k IPD or IPU resistor. To pull up a signal to the opposite supply rail, a 1-k resistor should be used.) 24 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 Terminal Functions (Continued) SIGNAL NAME NO. TYPE IPD/ IPU DESCRIPTION EMIF - DATA ED31 N3 ED30 P3 ED29 P2 ED28 P1 ED27 R2 ED26 R3 ED25 T2 ED24 T1 ED23 U3 ED22 U1 ED21 U2 ED20 V1 ED19 V2 ED18 Y3 ED17 W4 ED16 V4 ED15 T19 ED14 T20 ED13 T18 ED12 R20 ED11 R19 ED10 P20 ED9 P18 ED8 N20 ED7 N19 ED6 N18 ED5 M20 ED4 M19 ED3 L19 ED2 L18 ED1 K19 I/O/Z IPU External data ED0 K18 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-k IPD or IPU resistor. To pull up a signal to the opposite supply rail, a 1-k resistor should be used.) POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 25 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 Terminal Functions (Continued) SIGNAL NAME NO. TYPE IPD/ IPU DESCRIPTION TIMER 1 TOUT1 F1 O IPD Timer 1 or general-purpose output TINP1 F2 I IPD Timer 1 or general-purpose input TIMER 0 TOUT0 G1 O IPD Timer 0 or general-purpose output TINP0 G2 I IPD Timer 0 or general-purpose input CLKS1 E1 I IPD External clock source (as opposed to internal) CLKR1 M1 I/O/Z IPD Receive clock CLKX1 L3 I/O/Z IPD Transmit clock DR1 M2 I IPU Receive data DX1 L2 O/Z IPU Transmit data FSR1 M3 I/O/Z IPD Receive frame sync FSX1 L1 I/O/Z IPD Transmit frame sync CLKS0 K3 I IPD External clock source (as opposed to internal) CLKR0 H3 I/O/Z IPD Receive clock CLKX0 G3 I/O/Z IPD Transmit clock DR0 J1 I IPU Receive data DX0 H2 O/Z IPU Transmit data FSR0 J3 I/O/Z IPD Receive frame sync FSX0 H1 I/O/Z IPD Transmit frame sync RSV0 C12 O IPU Reserved (leave unconnected, do not connect to power or ground) RSV1 D12 O IPU Reserved (leave unconnected, do not connect to power or ground) RSV2 A5 O IPU Reserved (leave unconnected, do not connect to power or ground) RSV3 D3 O Reserved (leave unconnected, do not connect to power or ground) RSV4 N2 O Reserved (leave unconnected, do not connect to power or ground) MULTICHANNEL BUFFERED SERIAL PORT 1 (McBSP1) MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP0) RESERVED FOR TEST RSV5 Y20 O Reserved (leave unconnected, do not connect to power or ground) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground IPD = Internal pulldown, IPU = Internal pullup. (These IPD/IPU signal pins feature a 30-k IPD or IPU resistor. To pull up a signal to the opposite supply rail, a 1-k resistor should be used.) 26 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 Terminal Functions (Continued) SIGNAL NAME NO. TYPE DESCRIPTION SUPPLY VOLTAGE PINS A17 B3 B8 B13 C5 C10 D1 D16 D19 F3 H18 J2 M18 N1 DVDD R1 S 3.3-V supply voltage S 1.8-V supply voltage R18 T3 U5 U7 U12 U16 V13 V15 V19 W3 W9 W12 Y7 Y17 A9 A10 A12 B2 B19 C3 CVDD C7 C18 D5 D6 D11 D14 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 27 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 Terminal Functions (Continued) SIGNAL NAME NO. TYPE DESCRIPTION SUPPLY VOLTAGE PINS (CONTINUED) D15 F4 F17 K1 K4 K17 L4 L17 L20 R4 CVDD R17 S 1.8-V supply voltage U6 U10 U11 U14 U15 V3 V18 W2 W19 GROUND PINS A1 A2 A11 A14 A19 A20 B1 B4 B11 VSS B15 GND Ground pins B20 C8 C9 D4 D8 D13 D17 E2 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground 28 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 Terminal Functions (Continued) SIGNAL NAME NO. TYPE DESCRIPTION GROUND PINS (CONTINUED) E4 E17 F19 G4 G17 H4 H17 J4 K2 K20 M4 M17 N4 N17 P4 P17 P19 VSS T4 GND Ground pins T17 U4 U8 U9 U13 U17 U20 W1 W5 W11 W16 W20 Y1 Y2 Y13 Y19 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 29 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 development support TI offers an extensive line of development tools for the TMS320C6000 DSP platform, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The following products support development of C6000 DSP-based applications: Software Development Tools: Code Composer Studio Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time Foundation Software (DSP/BIOS), which provides the basic run-time target software needed to support any DSP application. Hardware Development Tools: Extended Development System (XDS) Emulator (supports C6000 DSP multiprocessor system debug) EVM (Evaluation Module) For a complete listing of development-support tools for the TMS320C6000 DSP platform, visit the Texas Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL) and select "Find Development Tools". For device-specific tools, under "Semiconductor Products", select "Digital Signal Processors", choose a product family, and select the particular DSP device. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor. Code Composer Studio, DSP/BIOS, and XDS are trademarks of Texas Instruments. 30 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 device and development-support tool nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (e.g., TMS320C6211GFN167). Texas Instruments recommends two of three possible prefix designators for support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX / TMDX) through fully qualified production devices/tools (TMS / TMDS). Device development evolutionary flow: TMX Experimental device that is not necessarily representative of the final device's electrical specifications TMP Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification TMS Fully qualified production device Support tool development evolutionary flow: TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing. TMDS Fully qualified development-support product TMX and TMP devices and TMDX development-support tools are shipped with the following disclaimer: "Developmental product is intended for internal evaluation purposes." TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, GFN), the temperature range (for example, blank is the default commercial temperature range), and the device speed range in megahertz (for example, -167 is 167 MHz). The ZFN package, like the GFN package, is a 256-ball plastic BGA only with Pb-free balls. For device part numbers and further ordering information for TMS320C6211/6211B in the GFN and ZFN, package types, see the TI website (http://www.ti.com) or contact your TI sales representative. TMS320 is a trademark of Texas Instruments. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 31 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 device and development-support tool nomenclature (continued) TMS 320 C 6211 GFN ( ) 167 PREFIX TMX = Experimental device TMP = Prototype device TMS = Qualified device SMJ = MIL-PRF-38535, QML SM = High Rel (non-38535) DEVICE FAMILY 32 or 320 = TMS320 DSP family DEVICE SPEED RANGE 100 MHz 120 MHz 150 MHz 167 MHz 200 MHz 233 MHz 250 MHz 300 MHz TEMPERATURE RANGE (DEFAULT: 0C TO 90C) Blank = 0C to 90C, commercial temperature A = -40C to 105C, extended temperature PACKAGE TYPE GDP = 272-pin plastic BGA GFN = 256-pin plastic BGA GGP = 352-pin plastic BGA GJC = 352-pin plastic BGA GJL = 352-pin plastic BGA GLS = 384-pin plastic BGA GLW = 340-pin plastic BGA GNY = 384-pin plastic BGA GNZ = 352-pin plastic BGA GLZ = 532-pin plastic BGA GHK = 288-pin plastic MicroStar BGAt PYP = 208-pin PowerPADt plastic QFP ZFN = 256-pin plastic BGA, with Pb-free soldered balls DEVICE C6000 DSPs: C6201 C6211B DM641 C6712 C6202 C6411 DM642 C6712C C6202B C6412 C6701 C6712D C6203B C6414 C6711 C6713 C6204 C6415 C6711B C6713B C6205 C6416 C6711C C6211 DM640 C6711D TECHNOLOGY C = CMOS BGA = Ball Grid Array QFP = Quad Flatpack The ZFN mechanical package designator represents the version of the GFN with Pb-Free soldered balls. For actual device part numbers (P/Ns) and ordering information, see the Mechanical Data section of this document or the TI website (www.ti.com). Figure 4. TMS320C6000 DSP Device Nomenclature (Including the TMS320C6211 and TMS320C6211B Devices) MicroStar BGA is a trademark of Texas Instruments. 32 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 documentation support Extensive documentation supports all TMS320 DSP family generations of devices from product announcement through applications development. The types of documentation available include: data sheets, such as this document, with design specifications; complete user's reference guides for all devices and tools; technical briefs; development-support tools; on-line help; and hardware and software applications. The following is a brief, descriptive list of support documentation specific to the C6000 DSP devices: For device-specific datasheets and related documentation, visit the TI web site at: http://www.ti.com. The TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189) describes the C6000 CPU (DSP core) architecture, instruction set, pipeline, and associated interrupts. The TMS320C6000 DSP Peripherals Overview Reference Guide (literature number SPRU190) provides an overview and briefly describes the functionality of the peripherals available on the C6000 DSP platform of devices. This document also includes a table listing the peripherals available on the C6000 devices along with literature numbers and hyperlinks to the associated peripheral documents. The TMS320C6000 Technical Brief (literature number SPRU197) gives an introduction to the TMS320C62x/TMS320C67x devices, associated development tools, and third-party support. The TMS320C6000 DSP Interrupt Selector Reference Guide (literature number SPRU646) describes the interrupt selector, interrupt selector registers, and the available interrupts in the TMS320C6000 DSPs. The TMS320C6000 DSP Enhanced Direct Memory Access (EDMA) Controller Reference Guide (literature number SPRU234) describes the operation of the enhanced direct memory access (EDMA) controller in the TMS320C6000 DSPs. The TMS320C62x/C67x Power Consumption Summary application report (literature number SPRA486) discusses the power consumption for user applications with the TMS320C6211 and TMS320C6211B DSP devices. The TMS320C6211/TMS320C6211B Digital Signal Processors Silicon Errata (literature number SPRZ154) describes the known exceptions to the functional specifications for the TMS320C6211 and TMS320C6211B DSP devices. The Using IBIS Models for Timing Analysis application report (literature number SPRA839) describes how to properly use IBIS models to attain accurate timing analysis for a given system. The tools support documentation is electronically available within the Code Composer Studio Integrated Development Environment (IDE). For a complete listing of C6000 DSP latest documentation, visit the Texas Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL). See the Worldwide Web URL for the application reports How To Begin Development Today with the TMS320C6211 DSP (literature number SPRA474) and How To Begin Development with the TMS320C6711 DSP (literature number SPRA522), which describe in more detail the similarities/differences between the C6211 and C6711 C6000 DSP devices. TMS320C67x is a trademark of Texas Instruments. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 33 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 clock PLL All of the internal C62x clocks are generated from a single source through the CLKIN pin. This source clock either drives the PLL, which multiplies the source clock in frequency to generate the internal CPU clock, or bypasses the PLL to become the internal CPU clock. To use the PLL to generate the CPU clock, the external PLL filter circuit must be properly designed. Figure 5 shows the external PLL circuitry for either x1 (PLL bypass) or x4 PLL multiply modes. Figure 6 shows the external PLL circuitry for a system with ONLY x1 (PLL bypass) mode. To minimize the clock jitter, a single clean power supply should power both the C62x device and the external clock oscillator circuit. Noise coupling into PLLF will directly impact PLL clock jitter. The minimum CLKIN rise and fall times should also be observed. For the input clock timing requirements, see the input and output clocks electricals section. Rise/fall times, duty cycles (high/low pulse durations), and the load capacitance of the external clock source must meet the DSP requirements in this data sheet (see the electrical characteristics over recommended ranges of suppy voltage and operating case temperature table and the input and output clocks electricals section). Table 17 lists some examples of compatible CLKIN external clock sources. Table 17. Compatible CLKIN External Clock Sources COMPATIBLE PARTS FOR EXTERNAL CLOCK SOURCES (CLKIN) PART NUMBER MANUFACTURER JITO-2 Fox Electronix STA series, ST4100 series SaRonix Corporation Oscillators PLL SG-636 Epson America 342 Corning Frequency Control MK1711-S, ICS525-02 Integrated Circuit Systems 3.3V EMI Filter PLLV Internal to C6211/C6211B PLL CLKMODE0 C3 10 mF PLLMULT C4 0.1 mF PLLCLK CLKIN CLKIN 1 LOOP FILTER 0 CPU CLOCK PLL Multiply Factors CPU Clock Frequency f(CPUCLOCK) 0 x1(BYPASS) 1 x f(CLKIN) 1 x4 4 x f(CLKIN) C2 PLLG CLKMODE0 PLLF Available Multiply Factors (For C1, C2, and R1 values, see Table 18.) C1 R1 NOTES: A. Keep the lead length and the number of vias between the PLLF pin, the PLLG pin, and R1, C1, and C2 to a minimum. In addition, place all PLL external components (R1, C1, C2, C3, C4, and the EMI Filter) as close to the C6000 device as possible. For the best performance, TI recommends that all the PLL external components be on a single side of the board without jumpers, switches, or components other than the ones shown. B. For reduced PLL jitter, maximize the spacing between switching signals and the PLL external components (R1, C1, C2, C3, C4, and the EMI filter). C. The 3.3-V supply for the EMI filter must be from the same 3.3-V power plane supplying the I/O voltage, DVDD. D. EMI filter manufacturer: TDK part number ACF451832-333, 223, 153, 103. Panasonic part number EXCCET103U. Figure 5. External PLL Circuitry for Either PLL x4 Mode or x1 (Bypass) Mode 34 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 clock PLL (continued) 3.3V PLLV Internal to C6211/C6211B PLL CLKMODE0 PLLMULT PLLCLK CLKIN CLKIN LOOP FILTER 1 CPU CLOCK PLLG PLLF 0 NOTES: A. For a system with ONLY PLL x1 (bypass) mode, short the PLLF terminal to the PLLG terminal. B. The 3.3-V supply for the EMI filter must be from the same 3.3-V power plane supplying the I/O voltage, DVDD. Figure 6. External PLL Circuitry for x1 (Bypass) Mode Only Table 18. C6211/C6211B PLL Component Selection CLKMODE CLKIN RANGE (MHz) CPU CLOCK FREQUENCY (CLKOUT1) RANGE (MHz) CLKOUT2 RANGE (MHz) R1 [1%] () C1 [10%] (nF) C2 [10%] (pF) TYPICAL LOCK TIME (s) x4 16.3-41.6 65-167 32.5-83 60.4 27 560 75 Under some operating conditions, the maximum PLL lock time may vary as much as 150% from the specified typical value. For example, if the typical lock time is specified as 100 s, the maximum value may be as long as 250 s. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 35 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 power-down mode logic Figure 7 shows the power-down mode logic on the C6211/C6211B. CLKOUT1 CLKOUT2 Internal Clock Tree Clock Distribution and Dividers PD1 PD2 PowerDown Logic Clock PLL IFR Internal Peripherals IER PWRD CSR CPU PD3 TMS320C6211/C6211B CLKIN RESET External input clocks, with the exception of CLKIN, are not gated by the power-down mode logic. Figure 7. Power-Down Mode Logic triggering, wake-up, and effects The power-down modes and their wake-up methods are programmed by setting the PWRD field (bits 15-10) of the control status register (CSR). The PWRD field of the CSR is shown in Figure 8 and described in Table 19. When writing to the CSR, all bits of the PWRD field should be set at the same time. Logic 0 should be used when "writing" to the reserved bit (bit 15) of the PWRD field. The CSR is discussed in detail in the TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189). 36 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 31 16 15 14 13 12 11 10 Reserved Enable or Non-Enabled Interrupt Wake Enabled Interrupt Wake PD3 PD2 PD1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 7 9 8 0 Legend: R/W-x = Read/write reset value NOTE: The shadowed bits are not part of the power-down logic discussion and therefore are not covered here. For information on these other bit fields in the CSR register, see the TMS320C6000 CPU and Instruction Set Reference Guide (literature number SPRU189). Figure 8. PWRD Field of the CSR Register A delay of up to nine clock cycles may occur after the instruction that sets the PWRD bits in the CSR before the PD mode takes effect. As best practice, NOPs should be padded after the PWRD bits are set in the CSR to account for this delay. If PD1 mode is terminated by a non-enabled interrupt, the program execution returns to the instruction where PD1 took effect. If PD1 mode is terminated by an enabled interrupt, the interrupt service routine with be executed first, then the program execution returns to the instruction where PD1 took effect. In the case with an enabled interrupt, the GIE bit in the CSR and the NMIE bit in the interrupt enable register (IER) must also be set in order for the interrupt service routine to execute; otherwise, execution returns to the instruction where PD1 took effect upon PD1 mode termination by an enabled interrupt. PD2 and PD3 modes can only be aborted by device reset. Table 19 summarizes all the power-down modes. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 37 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 Table 19. Characteristics of the Power-Down Modes PRWD FIELD (BITS 15-10) POWER-DOWN MODE WAKE-UP METHOD 000000 No power-down -- -- 001001 PD1 Wake by an enabled interrupt 010001 PD1 Wake by an enabled or non-enabled interrupt 011010 011100 PD2 PD3 EFFECT ON CHIP'S OPERATION CPU halted (except for the interrupt logic) Power-down mode blocks the internal clock inputs at the boundary of the CPU, preventing most of the CPU's logic from switching. During PD1, EDMA transactions can proceed between peripherals and internal memory. Wake by a device reset Output clock from PLL is halted, stopping the internal clock structure from switching and resulting in the entire chip being halted. All register and internal RAM contents are preserved. All functional I/O "freeze" in the last state when the PLL clock is turned off. Wake by a device reset Input clock to the PLL stops generating clocks. All register and internal RAM contents are preserved. All functional I/O "freeze" in the last state when the PLL clock is turned off. Following reset, the PLL needs time to re-lock, just as it does following power-up. Wake-up from PD3 takes longer than wake-up from PD2 because the PLL needs to be re-locked, just as it does following power-up. All others Reserved -- -- When entering PD2 and PD3, all functional I/O remains in the previous state. However, for peripherals which are asynchronous in nature or peripherals with an external clock source, output signals may transition in response to stimulus on the inputs. Under these conditions, peripherals will not operate according to specifications. 38 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 power-supply sequencing TI DSPs do not require specific power sequencing between the core supply and the I/O supply. However, systems should be designed to ensure that neither supply is powered up for extended periods of time if the other supply is below the proper operating voltage. system-level design considerations System-level design considerations, such as bus contention, may require supply sequencing to be implemented. In this case, the core supply should be powered up at the same time as, or prior to (and powered down after), the I/O buffers. This is to ensure that the I/O buffers receive valid inputs from the core before the output buffers are powered up, thus, preventing bus contention with other chips on the board. power-supply design considerations For systems using the C6000 DSP platform of devices, the core supply may be required to provide in excess of 2 A per DSP until the I/O supply is powered up. This extra current condition is a result of uninitialized logic within the DSP(s) and is corrected once the CPU sees an internal clock pulse. With the PLL enabled, as the I/O supply is powered on, a clock pulse is produced stopping the extra current draw from the supply. With the PLL disabled, as many as five external clock cycle pulses may be required to stop this extra current draw. A normal current state returns once the I/O power supply is turned on and the CPU sees a clock pulse. Decreasing the amount of time between the core supply power up and the I/O supply power up can minimize the effects of this current draw. A dual-power supply with simultaneous sequencing, such as available with TPS563xx controllers or PT69xx plug-in power modules, can be used to eliminate the delay between core and I/O power up [see the Using the TPS56300 to Power DSPs application report (literature number SLVA088)]. A Schottky diode can also be used to tie the core rail to the I/O rail, effectively pulling up the I/O power supply to a level that can help initialize the logic within the DSP. Core and I/O supply voltage regulators should be located close to the DSP (or DSP array) to minimize inductance and resistance in the power delivery path. Additionally, when designing for high-performance applications utilizing the C6000 platform of DSPs, the PC board should include separate power planes for core, I/O, and ground, all bypassed with high-quality low-ESL/ESR capacitors. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 39 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 IEEE 1149.1 JTAG compatibility statement The TMS320C6211/C6211B DSP requires that both TRST and RESET resets be asserted upon power up to be properly initialized. While RESET initializes the DSP core, TRST initializes the DSP's emulation logic. Both resets are required for proper operation. While both TRST and RESET need to be asserted upon power up, only RESET needs to be released for the DSP to boot properly. TRST may be asserted indefinitely for normal operation, keeping the JTAG port interface and DSP's emulation logic in the reset state. TRST only needs to be released when it is necessary to use a JTAG controller to debug the DSP or exercise the DSP's boundary scan functionality. For maximum reliability, the TMS320C6211/C6211B DSP includes an internal pulldown (IPD) on the TRST pin to ensure that TRST will always be asserted upon power up and the DSP's internal emulation logic will always be properly initialized. JTAG controllers from Texas Instruments actively drive TRST high. However, some third-party JTAG controllers may not drive TRST high but expect the use of an external pullup resistor on TRST. When using this type of JTAG controller, assert TRST to initialize the DSP after powerup and externally drive TRST high before attempting any emulation or boundary scan operations. Following the release of RESET, the low-to-high transition of TRST must be "seen" to latch the state of EMU1 and EMU0. The EMU[1:0] pins configure the device for either Boundary Scan mode or Emulation mode. For more detailed information, see the terminal functions section of this data sheet. EMIF device speed TI recommends utilizing the input/output buffer information specification (IBIS) models to analyze all AC timings. To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing Analysis application report (literature number SPRA839). 40 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 bootmode The C62x device resets using the active-low signal RESET signal (for the C6211/C6211B device, the RESET signal is the same as the internal reset signal). While RESET is low, the internal reset is also asserted and the device is held in reset and is initialized to the prescribed reset state. Refer to reset timing for reset timing characteristics and states of device pins during reset. The release of the internal reset signal (see the Reset Phase 3 discussion in the Reset Timing section of this data sheet) starts the processor running with the prescribed device configuration and boot mode. The C6211/C6211B has three types of boot modes: D Host boot If host boot is selected, upon release of internal reset, the CPU is internally "stalled" while the remainder of the device is released. During this period, an external host can initialize the CPU's memory space as necessary through the host interface, including internal configuration registers, such as those that control the EMIF or other peripherals. Once the host is finished with all necessary initialization, it must set the DSPINT bit in the HPIC register to complete the boot process. This transition causes the boot configuration logic to bring the CPU out of the "stalled" state. The CPU then begins execution from address 0. The DSPINT condition is not latched by the CPU, because it occurs while the CPU is still internally "stalled". Also, DSPINT brings the CPU out of the "stalled" state only if the host boot process is selected. All memory may be written to and read by the host. This allows for the host to verify what it sends to the DSP if required. After the CPU is out of the "stalled" state, the CPU needs to clear the DSPINT, otherwise, no more DSPINTs can be received. D Emulation boot Emulation boot mode is a variation of host boot. In this mode, it is not necessary for a host to load code or to set DSPINT to release the CPU from the "stalled" state. Instead, the emulator will set DSPINT if it has not been previously set so that the CPU can begin executing code from address 0. Prior to beginning execution, the emulator sets a breakpoint at address 0. This prevents the execution of invalid code by halting the CPU prior to executing the first instruction. Emulation boot is a good tool in the debug phase of development. D EMIF boot (using default ROM timings) Upon the release of internal reset, the 1K-Byte ROM code located in the beginning of CE1 is copied to address 0 by the EDMA using the default ROM timings, while the CPU is internally "stalled". The data should be stored in the endian format that the system is using. The boot process also lets you choose the width of the ROM. In this case, the EMIF automatically assembles consecutive 8-bit bytes or 16-bit half-words to form the 32-bit instruction words to be copied. The transfer is automatically done by the EDMA as a single-frame block transfer from the ROM to address 0. After completion of the block transfer, the CPU is released from the "stalled" state and start running from address 0. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 41 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 absolute maximum ratings over operating case temperature range (unless otherwise noted) Supply voltage range, CVDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 0.3 V to 2.3 V Supply voltage range, DVDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 4 V Input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 4 V Output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 4 V Operating case temperature ranges, TC:(default) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0_C to 90_C (A version) [C6211BGFNA only] . . . . . . . . . . . . . . -40_C to105_C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65_C to 150_C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values are with respect to VSS. recommended operating conditions MIN NOM MAX UNIT CVDD Supply voltage, Core 1.71 1.8 1.89 V DVDD Supply voltage, I/O 3.14 3.3 3.46 V VSS VIH Supply ground 0 0 0 V High-level input voltage 2 VIL Low-level input voltage IOH High-level output current IOL Low-level output current 0.8 V All signals except CLKOUT1, CLKOUT2, and ECLKOUT -4 mA CLKOUT1, CLKOUT2, and ECLKOUT -8 mA All signals except CLKOUT1, CLKOUT2, and ECLKOUT 4 mA CLKOUT1, CLKOUT2, and ECLKOUT 8 mA 0 90 _C -40 105 _C Default TC Operating case temperature V A version (C6211BGFNA only) electrical characteristics over recommended ranges of supply voltage and operating case temperature (unless otherwise noted) TEST CONDITIONS PARAMETER VOH VOL High-level output voltage II IOZ Input current IDD2V IDD2V DVDD = MIN, DVDD = MIN, Low-level output voltage IOH = MAX IOL = MAX MIN TYP MAX 2.4 UNIT V 0.4 V 150 uA 10 uA Off-state output current VI = VSS to DVDD VO = DVDD or 0 V Supply current, CPU + CPU memory access C6211, CVDD = NOM, CPU clock = 150 MHz C6211B, CVDD = NOM, CPU clock = 150 MHz 270 mA 270 mA C6211, CVDD = NOM, CPU clock = 150 MHz 220 mA C6211B, CVDD = NOM, CPU clock = 150 MHz Supply current, peripherals IDD3V Supply current, I/O pins Ci Input capacitance 220 mA C6211, DVDD = NOM, CPU clock = 150 MHz 60 mA C6211B, DVDD = NOM, CPU clock = 150 MHz 60 mA 7 pF Co Output capacitance 7 pF For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table. Measured with average activity (50% high/50% low power). For more details on CPU, peripheral, and I/O activity, refer to the TMS320C62x/C67x Power Consumption Summary application report (literature number SPRA486). 42 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 PARAMETER MEASUREMENT INFORMATION IOL Tester Pin Electronics 50 Vcomm Output Under Test CT IOH Where: IOL IOH Vcomm CT = = = = 2 mA 2 mA 0.8 V 10-15-pF typical load-circuit capacitance Figure 9. Test Load Circuit for AC Timing Measurements signal transition levels All input and output timing parameters are referenced to 1.5 V for both "0" and "1" logic levels. Vref = 1.5 V Figure 10. Input and Output Voltage Reference Levels for ac Timing Measurements All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks, and VOL MAX and VOH MIN for output clocks. Vref = VIH MIN (or VOH MIN) Vref = VIL MAX (or VOL MAX) Figure 11. Rise and Fall Transition Time Voltage Reference Levels POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 43 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 PARAMETER MEASUREMENT INFORMATION (CONTINUED) timing parameters and board routing analysis The timing parameter values specified in this data sheet do not include delays by board routings. As a good board design practice, such delays must always be taken into account. Timing values may be adjusted by increasing/decreasing such delays. TI recommends utilizing the available I/O buffer information specification (IBIS) models to analyze the timing characteristics correctly. If needed, external logic hardware such as buffers may be used to compensate any timing differences. For example: D In typical boards with the C6211B commercial temperature device, the routing delay improves the external memory's ability to meet the DSP's EMIF data input hold time requirement [th(EKOH-EDV)]. D In some boards with the C6211BGFNA extended temperature device, the routing delay improves the external memory's ability to meet the DSP's EMIF data input hold time requirement [th(EKOH-EDV)]. In addition, it may be necessary to add an extra delay to the input clock of the external memory to robustly meet the DSP's data input hold time requirement. If the extra delay approach is used, memory bus frequency adjustments may be needed to ensure the DPS's input setup time requirement [tsu(EDV-EKOH)] is still maintained. For inputs, timing is most impacted by the round-trip propagation delay from the DSP to the external device and from the external device to the DSP. This round-trip delay tends to negatively impact the input setup time margin, but also tends to improve the input hold time margins (see Table 20 and Figure 12). Figure 12 represents a general transfer between the DSP and an external device. The figure also represents board route delays and how they are perceived by the DSP and the external device. 44 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 PARAMETER MEASUREMENT INFORMATION (CONTINUED) Table 20. IBIS Timing Parameters Example (see Figure 12) NO. DESCRIPTION 1 Clock route delay 2 Minimum DSP hold time 3 Minimum DSP setup time 4 External device hold time requirement 5 External device setup time requirement 6 Control signal route delay 7 External device hold time 8 External device access time 9 DSP hold time requirement 10 DSP setup time requirement 11 Data route delay ECLKOUT (Output from DSP) 1 ECLKOUT (Input to External Device) Control Signals (Output from DSP) 2 3 4 5 Control Signals (Input to External Device) 6 7 Data Signals (Output from External Device) 8 10 9 11 Data Signals (Input to DSP) Control signals include data for Writes. Data signals are generated during Reads from an external device. Figure 12. IBIS Input/Output Timings POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 45 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 INPUT AND OUTPUT CLOCKS timing requirements for CLKIN (see Figure 13) -150 CLKMODE = x4 NO. MIN 1 2 3 -167 CLKMODE = x1 MAX MIN CLKMODE = x4 MAX MIN CLKMODE = x1 MAX MIN tc(CLKIN) tw(CLKINH) Cycle time, CLKIN 26.7 6.7 24 6 ns Pulse duration, CLKIN high 0.4C 0.45C 0.4C 0.45C ns tw(CLKINL) tt(CLKIN) Pulse duration, CLKIN low 0.4C 0.45C 0.4C 0.45C ns 4 Transition time, CLKIN 5 1 The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN. C = CLKIN cycle time in ns. For example, when CLKIN frequency is 40 MHz, use C = 25 ns. 1 5 1 4 2 CLKIN 3 4 Figure 13. CLKIN Timings 46 UNIT MAX POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 ns SPRS073L - AUGUST 1998 - REVISED JUNE 2005 INPUT AND OUTPUT CLOCKS (CONTINUED) switching characteristics over recommended operating conditions for CLKOUT1 (see Figure 14) -150 -167 NO. PARAMETER CLKMODE = x4 MIN 1 2 3 4 tc(CKO1) tw(CKO1H) Cycle time, CLKOUT1 tw(CKO1L) tt(CKO1) UNIT CLKMODE = x1 MAX MIN MAX P - 0.7 P + 0.7 P - 0.7 P + 0.7 ns Pulse duration, CLKOUT1 high (P/2) - 0.7 (P/2 ) + 0.7 PH - 0.7 PH + 0.7 ns Pulse duration, CLKOUT1 low (P/2) - 0.7 (P/2 ) + 0.7 PL - 0.7 PL + 0.7 ns 2 ns Transition time, CLKOUT1 2 The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN. P = 1/CPU clock frequency in nanoseconds (ns) PH is the high period of CLKIN in ns and PL is the low period of CLKIN in ns. 1 4 2 CLKOUT1 3 4 Figure 14. CLKOUT1 Timings switching characteristics over recommended operating conditions for CLKOUT2 (see Figure 15) NO. 1 2 3 -150 -167 PARAMETER UNIT MIN MAX 2P - 0.7 2P + 0.7 ns tc(CKO2) tw(CKO2H) Cycle time, CLKOUT2 Pulse duration, CLKOUT2 high P - 0.7 P + 0.7 ns tw(CKO2L) tt(CKO2) Pulse duration, CLKOUT2 low P - 0.7 P + 0.7 ns 2 ns 4 Transition time, CLKOUT2 The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN. P = 1/CPU clock frequency in ns 1 4 2 CLKOUT2 3 4 Figure 15. CLKOUT2 Timings POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 47 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 INPUT AND OUTPUT CLOCKS (CONTINUED) timing requirements for ECLKIN (see Figure 16) -150 -167 NO. MIN 1 2 3 4 UNIT MAX tc(EKI) tw(EKIH) Cycle time, ECLKIN 10 ns Pulse duration, ECLKIN high 4.5 ns tw(EKIL) tt(EKI) Pulse duration, ECLKIN low 4.5 ns Transition time, ECLKIN 2.2 ns The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN. 1 4 2 ECLKIN 3 4 Figure 16. ECLKIN Timings switching characteristics over recommended operating conditions for ECLKOUT (see Figure 17) NO. 1 2 3 4 5 6 -150 -167 PARAMETER MAX E - 0.7 E + 0.7 ns tc(EKO) tw(EKOH) Cycle time, ECLKOUT Pulse duration, ECLKOUT high EH - 0.7 EH + 0.7 ns tw(EKOL) tt(EKO) Pulse duration, ECLKOUT low EL - 0.7 EL + 0.7 ns 2 ns td(EKIH-EKOH) td(EKIL-EKOL) Delay time, ECLKIN high to ECLKOUT high 1 7 ns Delay time, ECLKIN low to ECLKOUT low 1 7 ns Transition time, ECLKOUT The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN. E = ECLKIN period in ns EH is the high period of ECLKIN in ns and EL is the low period of ECLKIN in ns. ECLKIN 6 1 2 5 3 ECLKOUT Figure 17. ECLKOUT Timings 48 UNIT MIN POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 4 4 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 ASYNCHRONOUS MEMORY TIMING timing requirements for asynchronous memory cycles (see Figure 18-Figure 19) NO. MIN 3 4 6 7 C6211B-150 C6211B-167 C6211BGFNA-150 C6211-150 C6211-167 MAX MIN UNIT MAX tsu(EDV-AREH) th(AREH-EDV) Setup time, EDx valid before ARE high 9 9 ns Hold time, EDx valid after ARE high 1 2 ns tsu(ARDY-EKOH) th(EKOH-ARDY) Setup time, ARDY valid before ECLKOUT high 3 3 ns Hold time, ARDY valid after ECLKOUT high 1 2 ns To ensure data setup time, simply program the strobe width wide enough. ARDY is internally synchronized. The ARDY signal is recognized in the cycle for which the setup and hold time is met. To use ARDY as an asynchronous input, the pulse width of the ARDY signal should be wide enough (e.g., pulse width = 2E) to ensure setup and hold time is met. RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters are programmed via the EMIF CE space control registers. E = ECLKOUT period in ns switching characteristics over recommended operating conditions for asynchronous memory cycles for C6211 and C6211B (see Figure 18-Figure 19) NO. 1 2 5 8 9 PARAMETER C6211-150 C6211-167 C6211B-150 C6211B-167 MIN MIN MAX tosu(SELV-AREL) toh(AREH-SELIV) Output setup time, select signals valid to ARE low RS * E - 3 RS * E - 3 Output hold time, ARE high to select signals invalid RH * E - 3 RH * E - 3 td(EKOH-AREV) tosu(SELV-AWEL) Delay time, ECLKOUT high to ARE vaild toh(AWEH-SELIV) td(EKOH-AWEV) Output hold time, AWE high to select signals invalid Output setup time, select signals valid to AWE low 1.5 WS * E - 3 WH * E - 3 8 1.5 UNIT MAX ns ns 8 WS * E - 3 ns ns WH * E - 3 ns 10 Delay time, ECLKOUT high to AWE vaild 1.5 8 1.2 8 ns RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters are programmed via the EMIF CE space control registers. E = ECLKOUT period in ns Select signals include: CEx, BE[3:0], EA[21:2], AOE; and for writes, include ED[31:0]. switching characteristics over recommended operating conditions for asynchronous memory cycles for C6211BGFNA (see Figure 18-Figure 19) C6211BGFNA-150 NO. 1 2 5 8 9 10 PARAMETER MIN MAX UNIT tosu(SELV-AREL) toh(AREH-SELIV) Output setup time, select signals valid to ARE low RS * E - 3 ns Output hold time, ARE high to select signals invalid RH * E - 3 ns td(EKOH-AREV) tosu(SELV-AWEL) Delay time, ECLKOUT high to ARE vaild toh(AWEH-SELIV) td(EKOH-AWEV) Output hold time, AWE high to select signals invalid Output setup time, select signals valid to AWE low Delay time, ECLKOUT high to AWE vaild 1.5 8 WS * E - 3 ns WH * E - 3 ns ns RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters are programmed via the EMIF CE space control registers. E = ECLKOUT period in ns Select signals include: CEx, BE[3:0], EA[21:2], AOE; and for writes, include ED[31:0]. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 1 ns 8 49 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 ASYNCHRONOUS MEMORY TIMING (CONTINUED) Setup = 2 Strobe = 3 Not Ready Hold = 2 ECLKOUT 1 2 CEx 1 2 BE[3:0] BE 1 2 EA[21:2] Address 3 4 ED[31:0] 1 2 Read Data AOE/SDRAS/SSOE 5 5 ARE/SDCAS/SSADS AWE/SDWE/SSWE 7 6 7 6 ARDY AOE/SDRAS/SSOE, ARE/SDCAS/SSADS, and AWE/SDWE/SSWE operate as AOE (identified under select signals), ARE, and AWE, respectively, during asynchronous memory accesses. Figure 18. Asynchronous Memory Read Timing 50 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 ASYNCHRONOUS MEMORY TIMING (CONTINUED) Setup = 2 Strobe = 3 Hold = 2 Not Ready ECLKOUT 8 9 CEx 8 9 BE[3:0] BE 8 9 EA[21:2] Address 8 9 ED[31:0] Write Data AOE/SDRAS/SSOE ARE/SDCAS/SSADS 10 10 AWE/SDWE/SSWE 7 6 7 6 ARDY AOE/SDRAS/SSOE, ARE/SDCAS/SSADS, and AWE/SDWE/SSWE operate as AOE (identified under select signals), ARE, and AWE, respectively, during asynchronous memory accesses. Figure 19. Asynchronous Memory Write Timing POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 51 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 SYNCHRONOUS-BURST MEMORY TIMING timing requirements for synchronous-burst SRAM cycles (see Figure 20) C6211-150 C6211-167 NO. MIN 6 tsu(EDV-EKOH) Setup time, read EDx valid before ECLKOUT high 7 th(EKOH-EDV) Hold time, read EDx valid after ECLKOUT high C6211BGFNA-150 MAX MIN MAX C6211B-150 C6211B-167 MIN UNIT MAX 2.5 2.5 2.5 ns 1 2.5 2 ns The C6211/C6211B SBSRAM interface takes advantage of the internal burst counter in the SBSRAM. Accesses default to incrementing 4-word bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain continuous data flow. switching characteristics over recommended operating conditions for synchronous-burst SRAM cycles (see Figure 20 and Figure 21) NO. C6211-150 C6211-167 PARAMETER C6211BGFNA-150 C6211B-150 C6211B-167 UNIT MIN MAX MIN MAX MIN MAX 1.5 6.5 1 6.5 1.2 6.5 ns 6.5 ns 1 td(EKOH-CEV) Delay time, ECLKOUT high to CEx valid 2 td(EKOH-BEV) Delay time, ECLKOUT high to BEx valid 3 td(EKOH-BEIV) Delay time, ECLKOUT high to BEx invalid 4 td(EKOH-EAV) Delay time, ECLKOUT high to EAx valid 5 td(EKOH-EAIV) Delay time, ECLKOUT high to EAx invalid 1.5 8 td(EKOH-ADSV) Delay time, ECLKOUT high to ARE/SDCAS/SSADS valid 1.5 6.5 1 6.5 1.2 6.5 ns 9 td(EKOH-OEV) Delay time, ECLKOUT high to AOE/SDRAS/SSOE valid 1.5 6.5 1 6.5 1.2 6.5 ns 10 td(EKOH-EDV) Delay time, ECLKOUT high to EDx valid 7 ns 11 td(EKOH-EDIV) Delay time, ECLKOUT high to EDx invalid 1.5 12 td(EKOH-WEV) Delay time, ECLKOUT high to AWE/SDWE/SSWE valid 1.5 6.5 1.5 6.5 1 6.5 1.2 6.5 1 7 6.5 1.2 7 1 6.5 1 ns ns 1.2 6.5 1.2 ns ns 6.5 ns The C6211/C6211B SBSRAM interface takes advantage of the internal burst counter in the SBSRAM. Accesses default to incrementing 4-word bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain continuous data flow. ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM accesses. 52 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 SYNCHRONOUS-BURST MEMORY TIMING (CONTINUED) ECLKOUT 1 1 CEx BE[3:0] 2 BE1 3 BE2 BE3 4 BE4 5 EA[21:2] EA 6 ED[31:0] 7 Q1 Q2 Q3 Q4 8 8 ARE/SDCAS/SSADS 9 9 AOE/SDRAS/SSOE AWE/SDWE/SSWE ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM accesses. Figure 20. SBSRAM Read Timing ECLKOUT 1 1 CEx BE[3:0] 2 BE1 3 BE2 BE3 5 4 EA[21:2] ED[31:0] BE4 EA 10 Q1 8 11 Q2 Q3 Q4 8 ARE/SDCAS/SSADS AOE/SDRAS/SSOE 12 12 AWE/SDWE/SSWE ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE operate as SSADS, SSOE, and SSWE, respectively, during SBSRAM accesses. Figure 21. SBSRAM Write Timing POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 53 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 SYNCHRONOUS DRAM TIMING timing requirements for synchronous DRAM cycles (see Figure 22) C6211-150 C6211-167 NO. MIN 6 tsu(EDV-EKOH) Setup time, read EDx valid before ECLKOUT high 7 th(EKOH-EDV) Hold time, read EDx valid after ECLKOUT high C6211BGFNA-150 MAX MIN MAX C6211B-150 C6211B-167 MIN UNIT MAX 2.5 2.5 2.5 ns 1 2.5 2 ns The C6211/C6211B SDRAM interface takes advantage of the internal burst counter in the SDRAM. Accesses default to incrementing 4-word bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain continuous data flow. switching characteristics over recommended operating conditions for synchronous DRAM cycles (see Figure 22-Figure 28) NO. C6211-150 C6211-167 PARAMETER C6211BGFNA-150 C6211B-150 C6211B-167 UNIT MIN MAX MIN MAX MIN MAX 1.5 6.5 1 6.5 1.2 6.5 ns 6.5 ns 1 td(EKOH-CEV) Delay time, ECLKOUT high to CEx valid 2 td(EKOH-BEV) Delay time, ECLKOUT high to BEx valid 3 td(EKOH-BEIV) Delay time, ECLKOUT high to BEx invalid 4 td(EKOH-EAV) Delay time, ECLKOUT high to EAx valid 5 td(EKOH-EAIV) Delay time, ECLKOUT high to EAx invalid 1.5 8 td(EKOH-CASV) Delay time, ECLKOUT high to ARE/SDCAS/SSADS valid 1.5 9 td(EKOH-EDV) Delay time, ECLKOUT high to EDx valid 10 td(EKOH-EDIV) Delay time, ECLKOUT high to EDx invalid 1.5 11 td(EKOH-WEV) Delay time, ECLKOUT high to AWE/SDWE/SSWE valid 1.5 6.5 1 6.5 1.2 6.5 ns 12 td(EKOH-RAS) Delay time, ECLKOUT high to AOE/SDRAS/SSOE valid 1.5 6.5 1 6.5 1.2 6.5 ns 6.5 1.5 6.5 1 6.5 1.2 6.5 1 6.5 1 7 ns 6.5 1.2 6.5 1.2 7 1 ns ns 6.5 ns 7 ns 1.2 ns The C6211/C6211B SDRAM interface takes advantage of the internal burst counter in the SDRAM. Accesses default to incrementing 4-word bursts, but random bursts and decrementing bursts are done by interrupting bursts in progress. All burst types can sustain continuous data flow. ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses. 54 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 SYNCHRONOUS DRAM TIMING (CONTINUED) READ ECLKOUT 1 1 CEx 2 BE1 BE[3:0] EA[21:13] EA[11:2] 4 Bank 5 4 Column 5 4 3 BE2 BE3 BE4 5 EA12 6 D1 ED[31:0] 7 D2 D3 D4 AOE/SDRAS/SSOE 8 8 ARE/SDCAS/SSADS AWE/SDWE/SSWE ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses. Figure 22. SDRAM Read Command (CAS Latency 3) POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 55 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 SYNCHRONOUS DRAM TIMING (CONTINUED) WRITE ECLKOUT 1 2 CEx 2 3 4 BE[3:0] BE1 4 BE2 BE3 BE4 D2 D3 D4 5 Bank EA[21:13] 5 4 Column EA[11:2] 4 5 EA12 9 10 9 ED[31:0] D1 AOE/SDRAS/SSOE 8 8 11 11 ARE/SDCAS/SSADS AWE/SDWE/SSWE ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses. Figure 23. SDRAM Write Command 56 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 SYNCHRONOUS DRAM TIMING (CONTINUED) ACTV ECLKOUT 1 1 CEx BE[3:0] 4 Bank Activate 5 EA[21:13] 4 Row Address 5 EA[11:2] 4 Row Address 5 EA12 ED[31:0] 12 12 AOE/SDRAS/SSOE ARE/SDCAS/SSADS AWE/SDWE/SSWE ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses. Figure 24. SDRAM ACTV Command DCAB ECLKOUT 1 1 4 5 12 12 11 11 CEx BE[3:0] EA[21:13, 11:2] EA12 ED[31:0] AOE/SDRAS/SSOE ARE/SDCAS/SSADS AWE/SDWE/SSWE ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses. Figure 25. SDRAM DCAB Command POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 57 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 SYNCHRONOUS DRAM TIMING (CONTINUED) DEAC ECLKOUT 1 1 CEx BE[3:0] 4 5 Bank EA[21:13] EA[11:2] 4 5 12 12 11 11 EA12 ED[31:0] AOE/SDRAS/SSOE ARE/SDCAS/SSADS AWE/SDWE/SSWE ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses. Figure 26. SDRAM DEAC Command REFR ECLKOUT 1 1 12 12 8 8 CEx BE[3:0] EA[21:2] EA12 ED[31:0] AOE/SDRAS/SSOE ARE/SDCAS/SSADS AWE/SDWE/SSWE ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses. Figure 27. SDRAM REFR Command 58 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 SYNCHRONOUS DRAM TIMING (CONTINUED) MRS ECLKOUT 1 1 4 MRS value 5 12 12 8 8 11 11 CEx BE[3:0] EA[21:2] ED[31:0] AOE/SDRAS/SSOE ARE/SDCAS/SSADS AWE/SDWE/SSWE ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE operate as SDCAS, SDWE, and SDRAS, respectively, during SDRAM accesses. Figure 28. SDRAM MRS Command POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 59 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 HOLD/HOLDA TIMING timing requirements for the HOLD/HOLDA cycles (see Figure 29) -150 -167 NO. MIN 3 toh(HOLDAL-HOLDL) E = ECLKIN period in ns Output hold time, HOLD low after HOLDA low UNIT MAX E ns switching characteristics over recommended operating conditions for the HOLD/HOLDA cycles (see Figure 29) NO. -150 -167 PARAMETER MIN 1 2 4 td(HOLDL-EMHZ) td(EMHZ-HOLDAL) Delay time, HOLD low to EMIF Bus high impedance td(HOLDH-EMLZ) td(EMLZ-HOLDAH) Delay time, HOLD high to EMIF Bus low impedance Delay time, EMIF Bus high impedance to HOLDA low UNIT 2E MAX ns 0 2E ns 2E 7E ns 5 Delay time, EMIF Bus low impedance to HOLDA high 0 2E ns E = ECLKIN period in ns EMIF Bus consists of CE[3:0], BE[3:0], ED[31:0], EA[21:2], ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE. All pending EMIF transactions are allowed to complete before HOLDA is asserted. If no bus transactions are occurring, then the minimum delay time can be achieved. Also, bus hold can be indefinitely delayed by setting NOHOLD = 1. External Requestor Owns Bus DSP Owns Bus DSP Owns Bus 3 HOLD 2 5 HOLDA EMIF Bus 1 C6211/C6211B 4 C6211/C6211B EMIF Bus consists of CE[3:0], BE[3:0], ED[31:0], EA[21:2], ARE/SDCAS/SSADS, AOE/SDRAS/SSOE, and AWE/SDWE/SSWE. Figure 29. HOLD/HOLDA Timing 60 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 BUSREQ TIMING switching characteristics over recommended operating conditions for the BUSREQ cycles (see Figure 30) NO. 1 -150 -167 PARAMETER td(EKOH-BUSRV) Delay time, ECLKOUT high to BUSREQ valid UNIT MIN MAX 1.5 11 ns ECLKOUT 1 1 BUSREQ Figure 30. BUSREQ Timing POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 61 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 RESET TIMING timing requirements for reset (see Figure 31) -150 -167 NO. MIN UNIT MAX Width of the RESET pulse (PLL stable) 10P ns 1 tw(RST) Width of the RESET pulse (PLL needs to sync up) 250 s 14 tsu(HD) th(HD) Setup time, HD boot configuration bits valid before RESET high Hold time, HD boot configuration bits valid after RESET high 2P ns 15 2P ns P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. This parameter applies to CLKMODE x1 when CLKIN is stable, and applies to CLKMODE x4 when CLKIN and PLL are stable. This parameter applies to CLKMODE x4 only (it does not apply to CLKMODE x1). The RESET signal is not connected internally to the clock PLL circuit. The PLL, however, may need up to 250 s to stabilize following device power up or after PLL configuration has been changed. During that time, RESET must be asserted to ensure proper device operation. See the clock PLL section for PLL lock times. HD[4:3] are the boot configuration pins during device reset. switching characteristics over recommended operating conditions during reset#|| (see Figure 31) NO. 2 3 4 5 6 7 8 9 10 11 12 13 -150 -167 PARAMETER UNIT MIN MAX td(RSTL-ECKI) td(RSTH-ECKI) Delay time, RESET low to ECLKIN synchronized internally 2P + 3E 3P + 4E ns Delay time, RESET high to ECLKIN synchronized internally 2P + 3E 3P + 4E ns td(RSTL-EMIFZHZ) td(RSTH-EMIFZV) Delay time, RESET low to EMIF Z group high impedance 2P + 3E td(RSTL-EMIFHIV) td(RSTH-EMIFHV) Delay time, RESET low to EMIF high group invalid td(RSTL-EMIFLIV) td(RSTH-EMIFLV) Delay time, RESET low to EMIF low group invalid td(RSTL-HIGHIV) td(RSTH-HIGHV) Delay time, RESET low to high group invalid td(RSTL-ZHZ) td(RSTH-ZV) Delay time, RESET low to Z group high impedance 2P ns Delay time, RESET high to Z group valid 2P ns Delay time, RESET high to EMIF Z group valid ns 3P + 4E 2P + 3E Delay time, RESET high to EMIF high group valid ns 3P + 4E 2P + 3E Delay time, RESET high to EMIF low group valid ns ns 3P + 4E 2P Delay time, RESET high to high group valid ns ns ns 4P ns P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. # E = ECLKIN period in ns || EMIF Z group consists of: EA[21:2], ED[31:0], CE[3:0], BE[3:0], ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE EMIF high group consists of: HOLDA EMIF low group consists of: BUSREQ High group consists of: HRDY and HINT Z group consists of: HD[15:0], CLKX0, CLKX1, FSX0, FSX1, DX0, DX1, CLKR0, CLKR1, FSR0, FSR1, TOUT0, and TOUT1. 62 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 RESET TIMING (CONTINUED) CLKOUT1 CLKOUT2 1 14 15 RESET ECLKIN 2 3 4 5 6 7 8 9 EMIF Z Group EMIF High Group EMIF Low Group 10 11 12 13 High Group Z Group HD[8, 4:3] ECLKIN should be provided during reset in order to drive EMIF signals to the correct reset values. ECLKOUT continues to clock as long as ECLKIN is provided. EMIF Z group consists of: EA[21:2], ED[31:0], CE[3:0], BE[3:0], ARE/SDCAS/SSADS, AWE/SDWE/SSWE, and AOE/SDRAS/SSOE EMIF high group consists of: HOLDA EMIF low group consists of: BUSREQ High group consists of: HRDY and HINT Z group consists of: HD[15:0], CLKX0, CLKX1, FSX0, FSX1, DX0, DX1, CLKR0, CLKR1, FSR0, FSR1, TOUT0, and TOUT1. HD[8, 4:3] are the endianness and boot configuration pins during device reset. Figure 31. Reset Timing POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 63 SPRS073L - AUGUST 1998 - REVISED JUNE 2005 EXTERNAL INTERRUPT TIMING timing requirements for external interrupts (see Figure 32) -150 -167 NO. MIN 1 2 tw(ILOW) tw(IHIGH) Width of the interrupt pulse low 2P ns Width of the interrupt pulse high 2P ns P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. 1 2 EXT_INT, NMI Figure 32. External/NMI Interrupt Timing 64 UNIT MAX POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 HOST-PORT INTERFACE TIMING timing requirements for host-port interface cycles [C6211] (see Figure 33, Figure 34, Figure 35, and Figure 36) C6211-150 C6211-167 NO. MIN 1 tsu(SELV-HSTBL) th(HSTBL-SELV) Setup time, select signals valid before HSTROBE low Hold time, select signals valid after HSTROBE low tw(HSTBL) tw(HSTBH) UNIT MAX 5 ns 4 ns Pulse duration, HSTROBE low 4P ns Pulse duration, HSTROBE high between consecutive accesses Setup time, select signals valid before HAS low 4P ns 5 ns Hold time, select signals valid after HAS low 3 ns Setup time, host data valid before HSTROBE high 5 ns Hold time, host data valid after HSTROBE high 3 ns Hold time, HSTROBE low after HRDY low. HSTROBE should not be inactivated until HRDY is active (low); otherwise, HPI writes will not complete properly. 2 ns Setup time, HAS low before HSTROBE low 2 ns 19 Hold time, HAS low after HSTROBE low 2 HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS. P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. Select signals include: HCNTL[1:0], HR/W, and HHWIL. ns 2 3 4 10 11 12 tsu(SELV-HASL) th(HASL-SELV) 13 tsu(HDV-HSTBH) th(HSTBH-HDV) 14 th(HRDYL-HSTBL) 18 tsu(HASL-HSTBL) th(HSTBL-HASL) switching characteristics over recommended operating conditions during host-port interface cycles [C6211] (see Figure 33, Figure 34, Figure 35, and Figure 36) NO. PARAMETER C6211-150 C6211-167 MIN UNIT MAX Delay time, HCS to HRDY 1 15 ns 6 td(HCS-HRDY) td(HSTBL-HRDYH) Delay time, HSTROBE low to HRDY high# 3 15 ns 7 td(HSTBL-HDLZ) Delay time, HSTROBE low to HD low impedance for an HPI read 8 Delay time, HD valid to HRDY low 9 td(HDV-HRDYL) toh(HSTBH-HDV) 15 td(HSTBH-HDHZ) 16 17 5 2 ns 2P - 4 2P ns Output hold time, HD valid after HSTROBE high 3 15 ns Delay time, HSTROBE high to HD high impedance 3 15 ns td(HSTBL-HDV) Delay time, HSTROBE low to HD valid 3 15 ns td(HSTBH-HRDYH) td(HASL-HRDYH) Delay time, HSTROBE high to HRDY high|| 3 15 ns 20 Delay time, HAS low to HRDY high 3 15 ns HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS. P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. HCS enables HRDY, and HRDY is always low when HCS is high. The case where HRDY goes high when HCS falls indicates that HPI is busy completing a previous HPID write or READ with autoincrement. # This parameter is used during an HPID read. At the beginning of the first half-word transfer on the falling edge of HSTROBE, the HPI sends the request to the EDMA internal address generation hardware, and HRDY remains high until the EDMA internal address generation hardware loads the requested data into HPID. || This parameter is used after the second half-word of an HPID write or autoincrement read. HRDY remains low if the access is not an HPID write or autoincrement read. Reading or writing to HPIC or HPIA does not affect the HRDY signal. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 65 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 HOST-PORT INTERFACE TIMING (CONTINUED) timing requirements for host-port interface cycles [C6211BGFNA/C6211B] (see Figure 33, Figure 34, Figure 35, and Figure 36) C6211B-150 C6211B-167 C6211BGFNA-150 NO. MIN 1 2 3 4 10 11 12 13 tsu(SELV-HSTBL) th(HSTBL-SELV) Setup time, select signals valid before HSTROBE low Hold time, select signals valid after HSTROBE low tw(HSTBL) tw(HSTBH) tsu(SELV-HASL) th(HASL-SELV) tsu(HDV-HSTBH) th(HSTBH-HDV) 14 th(HRDYL-HSTBL) 18 tsu(HASL-HSTBL) th(HSTBL-HASL) 19 UNIT MAX 5 ns 4 ns Pulse duration, HSTROBE low 4P ns Pulse duration, HSTROBE high between consecutive accesses Setup time, select signals valid before HAS low 4P ns 5 ns Hold time, select signals valid after HAS low 3 ns Setup time, host data valid before HSTROBE high 5 ns Hold time, host data valid after HSTROBE high 3 ns Hold time, HSTROBE low after HRDY low. HSTROBE should not be inactivated until HRDY is active (low); otherwise, HPI writes will not complete properly. 2 ns Setup time, HAS low before HSTROBE low 2 ns Hold time, HAS low after HSTROBE low 2 ns HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS. P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. Select signals include: HCNTL[1:0], HR/W, and HHWIL. switching characteristics over recommended operating conditions during host-port interface cycles [C6211BGFNA/C6211B] (see Figure 33, Figure 34, Figure 35, and Figure 36) NO. C6211BGFNA-150 PARAMETER MIN 5 MAX C6211B-150 C6211B-167 MIN UNIT MAX Delay time, HCS to HRDY 1 13 1 12 ns Delay time, HSTROBE low to HRDY high# 3 13 3 12 ns Delay time, HSTROBE low to HD low impedance for an HPI read 2 6 td(HCS-HRDY) td(HSTBL-HRDYH) 7 td(HSTBL-HDLZ) 8 Delay time, HD valid to HRDY low 9 td(HDV-HRDYL) toh(HSTBH-HDV) 15 td(HSTBH-HDHZ) 16 17 2 ns 2P - 4 2P 2P - 4 2P ns Output hold time, HD valid after HSTROBE high 3 13 3 12 ns Delay time, HSTROBE high to HD high impedance 3 13 3 12 ns td(HSTBL-HDV) Delay time, HSTROBE low to HD valid 3 13 3 12 ns td(HSTBH-HRDYH) td(HASL-HRDYH) Delay time, HSTROBE high to HRDY high|| 3 13 3 12 ns 20 Delay time, HAS low to HRDY high 3 13 3 12 ns HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS. P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. HCS enables HRDY, and HRDY is always low when HCS is high. The case where HRDY goes high when HCS falls indicates that HPI is busy completing a previous HPID write or READ with autoincrement. # This parameter is used during an HPID read. At the beginning of the first half-word transfer on the falling edge of HSTROBE, the HPI sends the request to the EDMA internal address generation hardware, and HRDY remains high until the EDMA internal address generation hardware loads the requested data into HPID. || This parameter is used after the second half-word of an HPID write or autoincrement read. HRDY remains low if the access is not an HPID write or autoincrement read. Reading or writing to HPIC or HPIA does not affect the HRDY signal. 66 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 HOST-PORT INTERFACE TIMING (CONTINUED) HAS 1 1 2 2 HCNTL[1:0] 1 1 2 2 HR/W 1 1 2 2 HHWIL 4 3 HSTROBE 3 HCS 15 9 7 15 9 16 HD[15:0] (output) 1st halfword 5 2nd halfword 8 17 5 HRDY (case 1) 6 8 17 5 HRDY (case 2) HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS. Figure 33. HPI Read Timing (HAS Not Used, Tied High) HAS 19 11 19 10 11 10 HCNTL[1:0] 11 11 10 10 HR/W 11 11 10 10 HHWIL 4 3 HSTROBE 18 18 HCS 15 7 9 15 16 9 HD[15:0] (output) 1st half-word 5 8 2nd half-word 17 5 17 5 HRDY (case 1) 20 8 HRDY (case 2) For correct operation, strobe the HAS signal only once per HSTROBE active cycle. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS. Figure 34. HPI Read Timing (HAS Used) POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 67 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 HOST-PORT INTERFACE TIMING (CONTINUED) HAS 1 1 2 2 HCNTL[1:0] 1 1 2 2 HR/W 1 1 2 2 HHWIL 3 3 4 14 HSTROBE HCS 12 12 13 13 HD[15:0] (input) 1st halfword 5 17 2nd halfword 5 HRDY HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS. Figure 35. HPI Write Timing (HAS Not Used, Tied High) HAS 19 19 11 11 10 10 HCNTL[1:0] 11 11 10 10 HR/W 11 11 10 10 HHWIL 3 14 HSTROBE 4 18 18 HCS 12 13 12 13 HD[15:0] (input) 5 1st half-word 2nd half-word 17 HRDY For correct operation, strobe the HAS signal only once per HSTROBE active cycle. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS. Figure 36. HPI Write Timing (HAS Used) 68 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 5 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 MULTICHANNEL BUFFERED SERIAL PORT TIMING timing requirements for McBSP (see Figure 37) -150 -167 NO. 2 3 tc(CKRX) tw(CKRX) Cycle time, CLKR/X CLKR/X ext Pulse duration, CLKR/X high or CLKR/X low CLKR/X ext 5 tsu(FRH-CKRL) Setup time, external FSR high before CLKR low 6 th(CKRL-FRH) Hold time, external FSR high after CLKR low 7 tsu(DRV-CKRL) Setup time, DR valid before CLKR low 8 th(CKRL-DRV) Hold time, DR valid after CLKR low 10 tsu(FXH-CKXL) Setup time, external FSX high before CLKX low 11 th(CKXL-FXH) Hold time, external FSX high after CLKX low UNIT MIN 2P CLKR int 0.5tc(CKRX) - 1 20 CLKR ext 1 CLKR int 6 CLKR ext 3 CLKR int 22 CLKR ext 3 CLKR int 3 CLKR ext 4 CLKX int 23 CLKX ext 1 CLKX int 6 CLKX ext 3 MAX ns ns ns ns ns ns ns ns CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also inverted. P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. The minimum CLKR/X period is twice the CPU cycle time (2P). This means that the maximum bit rate for communications between the McBSP and other device is 83 Mbps for 167 MHz CPU clock or 75 Mbps for 150 MHz CPU clock; where the McBSP is either the master or the slave. Care must be taken to ensure that the AC timings specified in this data sheet are met. The maximum bit rate for McBSP-to-McBSP communications is 33 Mbps; therefore, the minimum CLKR/X clock cycle is either twice the CPU cycle time (2P), or 30 ns (33 MHz), whichever value is larger. For example, when running parts at 167 MHz (P = 6 ns), use 30 ns as the minimum CLKR/X clock cycle (by setting the appropriate CLKGDV ratio or external clock source). When running parts at 60 MHz (P = 16.67 ns), use 2P = 33 ns (30 MHz) as the minimum CLKR/X clock cycle. The maximum bit rate for McBSP-to-McBSP communications applies when the serial port is a master of the clock and frame syncs (with CLKR connected to CLKX, FSR connected to FSX, CLKXM = FSXM = 1, and CLKRM = FSRM = 0) in data delay 1 or 2 mode (R/XDATDLY = 01b or 10b) and the other device the McBSP communicates to is a slave. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 69 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED) switching characteristics over recommended operating conditions for McBSP (see Figure 37) NO. -150 -167 PARAMETER Delay time, CLKS high to CLKR/X high for internal CLKR/X generated from CLKS input UNIT MIN MAX 4 26 2P C - 1# C + 1# ns ns 1 td(CKSH-CKRXH) 2 Cycle time, CLKR/X CLKR/X int 3 tc(CKRX) tw(CKRX) Pulse duration, CLKR/X high or CLKR/X low CLKR/X int 4 td(CKRH-FRV) Delay time, CLKR high to internal FSR valid CLKR int -11 3 CLKX int -11 3 CLKX ext 3 9 CLKX int -9 4 CLKX ext CLKX int 3 -9+ D1|| 9 4 + D2|| CLKX ext 3 + D1|| 19 + D2|| 9 td(CKXH-FXV) Delay time, CLKX high to internal FSX valid 12 tdis(CKXH-DXHZ) Disable time, DX high impedance following last data bit from CLKX high 13 td(CKXH-DXV) Delay time, CLKX high to DX valid 14 td(FXH-DXV) ns ns Delay time, FSX high to DX valid FSX int -1 3 ONLY applies when in data delay 0 (XDATDLY = 00b) mode FSX ext 3 9 ns ns ns ns CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also inverted. Minimum delay times also represent minimum output hold times. P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. The minimum CLKR/X period is twice the CPU cycle time (2P). This means that the maximum bit rate for communications between the McBSP and other device is 83 Mbps for 167 MHz CPU clock or 75 Mbps for 150 MHz CPU clock; where the McBSP is either the master or the slave. Care must be taken to ensure that the AC timings specified in this data sheet are met. The maximum bit rate for McBSP-to-McBSP communications is 33 Mbps; therefore, the minimum CLKR/X clock cycle is either twice the CPU cycle time (2P), or 30 ns (33 MHz), whichever value is larger. For example, when running parts at 167 MHz (P = 6 ns), use 30 ns as the minimum CLKR/X clock cycle (by setting the appropriate CLKGDV ratio or external clock source). When running parts at 60 MHz (P = 16.67 ns), use 2P = 33 ns (30 MHz) as the minimum CLKR/X clock cycle. The maximum bit rate for McBSP-to-McBSP communications applies when the serial port is a master of the clock and frame syncs (with CLKR connected to CLKX, FSR connected to FSX, CLKXM = FSXM = 1, and CLKRM = FSRM = 0) in data delay 1 or 2 mode (R/XDATDLY = 01b or 10b) and the other device the McBSP communicates to is a slave. # C = H or L S = sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency) = sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period) H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the maximum limit (see footnote above). || Extra delay from CLKX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR. If DXENA = 0, then D1 = D2 = 0 If DXENA = 1, then D1 = 2P, D2 = 4P 70 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED) CLKS 1 2 3 3 CLKR 4 4 FSR (int) 5 6 FSR (ext) 7 DR 8 Bit(n-1) (n-2) (n-3) 2 3 3 CLKX 9 FSX (int) 11 10 FSX (ext) FSX (XDATDLY=00b) 12 DX Bit 0 14 13 Bit(n-1) 13 (n-2) (n-3) Figure 37. McBSP Timings POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 71 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED) timing requirements for FSR when GSYNC = 1 (see Figure 38) -150 -167 NO. MIN 1 2 tsu(FRH-CKSH) th(CKSH-FRH) Setup time, FSR high before CLKS high 4 ns Hold time, FSR high after CLKS high 4 ns CLKS 1 2 FSR external CLKR/X (no need to resync) CLKR/X (needs resync) Figure 38. FSR Timing When GSYNC = 1 72 UNIT MAX POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED) timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0 (see Figure 39) -150 -167 NO. MASTER MIN 4 tsu(DRV-CKXL) th(CKXL-DRV) Setup time, DR valid before CLKX low MAX 26 5 Hold time, DR valid after CLKX low 4 P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. UNIT SLAVE MIN MAX 2 - 6P ns 6 + 12P ns switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 0 (see Figure 39) -150 -167 NO. PARAMETER MASTER 2 th(CKXL-FXL) td(FXL-CKXH) Hold time, FSX low after CLKX low Delay time, FSX low to CLKX high# 3 td(CKXH-DXV) Delay time, CLKX high to DX valid 6 tdis(CKXL-DXHZ) Disable time, DX high impedance following last data bit from CLKX low 7 tdis(FXH-DXHZ) Disable time, DX high impedance following last data bit from FSX high 1 UNIT SLAVE MIN MAX T-9 T+9 L-9 L+9 -9 9 L-9 L+9 MIN MAX ns ns 6P + 4 10P + 20 ns ns 2P + 3 6P + 20 ns 8 td(FXL-DXV) Delay time, FSX low to DX valid 4P + 2 8P + 20 ns P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. S = Sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency) = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period) T = CLKX period = (1 + CLKGDV) * S H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX and FSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP # FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (CLKX). POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 73 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED) CLKX 1 2 FSX 7 6 DX 8 3 Bit 0 Bit(n-1) 4 DR Bit 0 (n-2) (n-3) (n-4) 5 Bit(n-1) (n-2) (n-3) (n-4) Figure 39. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 74 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED) timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0 (see Figure 40) -150 -167 NO. MASTER MIN 4 tsu(DRV-CKXH) th(CKXH-DRV) Setup time, DR valid before CLKX high UNIT SLAVE MAX 26 5 Hold time, DR valid after CLKX high 4 P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. MIN MAX 2 - 6P ns 6 + 12P ns switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 0 (see Figure 40) -150 -167 NO. PARAMETER MASTER 2 th(CKXL-FXL) td(FXL-CKXH) Hold time, FSX low after CLKX low Delay time, FSX low to CLKX high# 3 td(CKXL-DXV) Delay time, CLKX low to DX valid tdis(CKXL-DXHZ) Disable time, DX high impedance following last data bit from CLKX low 1 6 UNIT SLAVE MIN MAX L-9 L+9 MIN MAX T-9 T+9 -9 9 6P + 4 10P + 20 ns -9 9 6P + 3 10P + 20 ns ns ns 7 td(FXL-DXV) Delay time, FSX low to DX valid H-9 H+9 4P + 2 8P + 20 ns P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. S = Sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency) = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period) T = CLKX period = (1 + CLKGDV) * S H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX and FSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP # FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (CLKX). CLKX 1 2 6 Bit 0 7 FSX DX 3 Bit(n-1) 4 DR Bit 0 (n-2) (n-3) (n-4) 5 Bit(n-1) (n-2) (n-3) (n-4) Figure 40. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 75 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED) timing requirements for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1 (see Figure 41) -150 -167 NO. MASTER MIN 4 tsu(DRV-CKXH) th(CKXH-DRV) Setup time, DR valid before CLKX high MAX 26 5 Hold time, DR valid after CLKX high 4 P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. UNIT SLAVE MIN MAX 2 - 6P ns 6 + 12P ns switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 10b, CLKXP = 1 (see Figure 41) -150 -167 NO. PARAMETER MASTER 2 th(CKXH-FXL) td(FXL-CKXL) Hold time, FSX low after CLKX high Delay time, FSX low to CLKX low# 3 td(CKXL-DXV) Delay time, CLKX low to DX valid 6 tdis(CKXH-DXHZ) Disable time, DX high impedance following last data bit from CLKX high 7 tdis(FXH-DXHZ) Disable time, DX high impedance following last data bit from FSX high 1 UNIT SLAVE MIN MAX T-9 T+9 H-9 H+9 -9 9 H-9 H+9 MIN MAX ns ns 6P + 4 10P + 20 ns ns 2P + 3 6P + 20 ns 8 td(FXL-DXV) Delay time, FSX low to DX valid 4P + 2 8P + 20 ns P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. S = Sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency) = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period) T = CLKX period = (1 + CLKGDV) * S H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX and FSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP # FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (CLKX). 76 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED) CLKX 1 2 FSX 7 6 DX 8 3 Bit 0 Bit(n-1) 4 DR Bit 0 (n-2) (n-3) (n-4) 5 Bit(n-1) (n-2) (n-3) (n-4) Figure 41. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 77 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED) timing requirements for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1 (see Figure 42) -150 -167 NO. MASTER MIN 4 tsu(DRV-CKXH) th(CKXH-DRV) Setup time, DR valid before CLKX high MAX 26 5 Hold time, DR valid after CLKX high 4 P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. UNIT SLAVE MIN MAX 2 - 6P ns 6 + 12P ns switching characteristics over recommended operating conditions for McBSP as SPI master or slave: CLKSTP = 11b, CLKXP = 1 (see Figure 42) -150 -167 NO. PARAMETER MASTER 2 th(CKXH-FXL) td(FXL-CKXL) Hold time, FSX low after CLKX high Delay time, FSX low to CLKX low# 3 td(CKXH-DXV) Delay time, CLKX high to DX valid tdis(CKXH-DXHZ) Disable time, DX high impedance following last data bit from CLKX high 1 6 UNIT SLAVE MIN MAX H-9 H+9 MIN MAX T-9 T+9 -9 9 6P + 4 10P + 20 ns -9 9 6P + 3 10P + 20 ns ns ns 7 td(FXL-DXV) Delay time, FSX low to DX valid L-9 L+9 4P + 2 8P + 20 ns P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1. S = Sample rate generator input clock = 2P if CLKSM = 1 (P = 1/CPU clock frequency) = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period) T = CLKX period = (1 + CLKGDV) * S H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even = (CLKGDV + 1)/2 * S if CLKGDV is odd or zero FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX and FSR is inverted before being used internally. CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP # FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock (CLKX). 78 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 MULTICHANNEL BUFFERED SERIAL PORT TIMING (CONTINUED) CLKX 1 2 FSX 7 6 DX 3 Bit 0 Bit(n-1) 4 DR Bit 0 (n-2) (n-3) (n-4) 5 Bit(n-1) (n-2) (n-3) (n-4) Figure 42. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 79 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 TIMER TIMING timing requirements for timer inputs (see Figure 43) -150 -167 NO. MIN 1 2 tw(TINPH) tw(TINPL) UNIT MAX Pulse duration, TINP high 2P ns Pulse duration, TINP low 2P ns P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. switching characteristics over recommended operating conditions for timer outputs (see Figure 43) NO. -150 -167 PARAMETER MIN 3 4 tw(TOUTH) tw(TOUTL) Pulse duration, TOUT high 4P -3 ns Pulse duration, TOUT low 4P -3 ns P = 1/CPU clock frequency in ns. For example, when running parts at 167 MHz, use P = 6 ns. 2 1 TINPx 4 3 TOUTx Figure 43. Timer Timing 80 UNIT MAX POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 JTAG TEST-PORT TIMING timing requirements for JTAG test port (see Figure 44) -150 -167 NO. MIN 1 UNIT MAX tc(TCK) tsu(TDIV-TCKH) Cycle time, TCK 35 ns 3 Setup time, TDI/TMS/TRST valid before TCK high 10 ns 4 th(TCKH-TDIV) Hold time, TDI/TMS/TRST valid after TCK high 9 ns switching characteristics over recommended operating conditions for JTAG test port (see Figure 44) NO. 2 -150 -167 PARAMETER td(TCKL-TDOV) Delay time, TCK low to TDO valid UNIT MIN MAX -3 18 ns 1 TCK 2 2 TDO 4 3 TDI/TMS/TRST Figure 44. JTAG Test-Port Timing POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 81 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 MECHANICAL DATA The following tables show the thermal resistance characteristics for the GFN and ZFN mechanical packages. thermal resistance characteristics (S-PBGA package) for GFN NO 1 C/W Air Flow (m/s) RJC RJA Junction-to-case 6.4 N/A Junction-to-free air 25.5 0.0 RJA RJA Junction-to-free air 23.1 0.5 Junction-to-free air 22.3 1.0 5 RJA Junction-to-free air m/s = meters per second 21.2 2.0 C/W Air Flow (m/s) 2 3 4 thermal resistance characteristics (S-PBGA package) for ZFN NO 1 RJC RJA Junction-to-case 6.4 N/A Junction-to-free air 25.5 0.0 RJA RJA Junction-to-free air 23.1 0.5 Junction-to-free air 22.3 1.0 RJA Junction-to-free air m/s = meters per second 21.2 2.0 2 3 4 5 82 POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 SPRS073L - AUGUST 1998 - REVISED JUNE 2004 packaging information The following packaging information and addendum reflect the most current released data available for the designated device(s). This data is subject to change without notice and without revision of this document. POST OFFICE BOX 1443 * HOUSTON, TEXAS 77251-1443 83 PACKAGE OPTION ADDENDUM www.ti.com 10-Jul-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE BGA GFN 256 1 TBD SNPB Level-4-220C-72 HR TMS320C6211BGFN167 ACTIVE BGA GFN 256 1 TBD SNPB Level-4-220C-72 HR TMS320C6211BGFN180 OBSOLETE BGA GFN 256 TBD Call TI Call TI TMS320C6211BZFN150 ACTIVE BGA ZFN 256 40 Pb-Free (RoHS) SNAGCU Level-4-260C-72HRS TMS320C6211BZFN167 ACTIVE BGA ZFN 256 40 Pb-Free (RoHS) SNAGCU Level-4-260C-72HRS TMS320C6211GFN150 OBSOLETE BGA GFN 256 TBD Call TI Call TI TMS320C6211GFN167 OBSOLETE BGA GFN 256 TBD Call TI Call TI TMS320C6211GFN180 OBSOLETE BGA GFN 256 TBD Call TI Call TI TMS320C6211GFN180H OBSOLETE BGA GFN 256 TBD Call TI Call TI TMS32C6211B1GFN150 OBSOLETE BGA GFN 256 TBD Call TI Call TI TMS32C6211B1GFN167 OBSOLETE BGA GFN 256 TBD Call TI Call TI TMS32C6211B1GFN180 OBSOLETE BGA GFN 256 TBD Call TI Call TI TMS32C6211BGFN150F OBSOLETE BGA GFN 256 TBD Call TI Call TI TMS32C6211BGFNA150 ACTIVE BGA GFN 256 TBD SNPB Level-4-220C-72 HR TMS32C6211BZFN180H OBSOLETE BGA ZFN 256 TBD Call TI Call TI TMS32C6211BZFNA150 ACTIVE BGA ZFN 256 Pb-Free (RoHS) SNAGCU TMX320C6211BZFN150 OBSOLETE BGA ZFN 256 TBD Call TI Call TI TMX320C6211GFN OBSOLETE BGA GFN 256 TBD Call TI Call TI TMX320C6211GFN150 OBSOLETE BGA GFN 256 TBD Call TI Call TI TMX320C6211GFN167 OBSOLETE BGA GFN 256 TBD Call TI Call TI TMX320C6211GFN180 OBSOLETE BGA GFN 256 TBD Call TI Call TI TMX320C6211GFN21 OBSOLETE BGA GFN 256 TBD Call TI Call TI TMX320C6211GFNB OBSOLETE BGA GFN 256 TBD Call TI Call TI 40 (1) Level-4-260C-72HRS The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples (Requires Login) TMS320C6211BGFN150 40 (3) PACKAGE OPTION ADDENDUM www.ti.com 10-Jul-2012 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MBGA002C - JANUARY 1995 - REVISED MARCH 2002 GFN (S-PBGA-N256) PLASTIC BALL GRID ARRAY 27,20 SQ 26,80 24,70 SQ 23,80 24,13 TYP 1,27 0,635 A1 Corner 0,635 1,27 Y W V U T R P N M L K J H G F E D C B A 1 3 2 5 4 7 6 9 8 10 11 13 15 17 19 12 14 16 18 20 Bottom View 2,32 MAX 1,17 NOM Seating Plane 0,40 0,30 0,90 0,60 0,15 M 0,70 0,50 0,15 4040185-2/D 02/02 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MO-151 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated