2
DESCRIPTION OF P
ART NUMBER AND STRUCTURAL DRA
WING
LED chip
Epo
xy
Bonding wire
Cathode mark
Electrode
Substrate
■
Structure of SMT Type LED
BR
1
1
1
1
C
TR
Chip element
Shape
Chip
T
ype
Number
of chips
Pa
c
kage
Color
Additional
nu
mber of
Shape
Shape
T
aping
BR
(GaA
I
As Red)
AA
(GaAsP Orange)
AY
(GaAsP
Y
ellow)
PY
(GaP
Y
ellow-Green)
PG
(GaP Green)
BG
(GaP Pure Green)
FR
(AlInGaP Red)
FA
(
AlInGaP
Orange)
FY
(
AlInGaP
Y
ellow)
DG
(InGaN/SiC Green)
DC
(InGaN/SiC Bluish-Green)
DB
(InGaN/SiC Blue)
C:
Ultra compact type
H:
Compact type
R:
Rev
erse mounting type
F:
Right angle type
W:
Standard type
B:
Bath
T
ub (PLCC-2) type
TR:
Standard Mount
RR:
Rev
erse Mount
1 :
1chip
2 :
2chips
0 :
W
ater Clear
1 :
Milky White
■
Description of SMT Part Number
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