DS30392 Rev. 5 - 2 1 of 3 SDM03U40
www.diodes.com ã Diodes Incorporated
SDM03U40
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
Maximum Ratings @ TA = 25°C unless otherwise specified
·Low Forward Voltage Drop
·Guard Ring Die Construction for
Transient Protection
·Ideal for low logic level applications
·Low Capacitance
·Lead Free by Design/RoHS Compliant (Note 1)
·"Green" Device, Note 4 and 5
·Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Characteristic Symbol Value Unit
Peak Reverse Voltage VRM 40 V
DC Reverse Voltage VR30 V
RMS Reverse Voltage VR(RMS) 21 V
Average Rectified Current IO30 mA
Non-Repetitive Peak Forward Surge Current @8.3ms
Single half sine-wave superimposed on rated load (JEDEC
method)
IFSM 200 mA
Operating and Storage Temperature Range Tj, TSTG -40 to +125 °C
Electrical Characteristics
Characteristic Symbol Min Typ Max Unit Test Conditions
Reverse Breakdown Voltage (Note 3) V(BR)R 40 ¾ ¾ VIR = 10uA
Forward Voltage (Note 3) VF¾290 370 mV IF = 1mA
Peak Reverse Current (Note 3) IR¾ ¾ 0.5 mAVR = 30V
Total Capacitance Cj¾2¾pF VR = 1V, f = 1.0 MHz
@ TA = 25°C unless otherwise specified
TCUDORP WEN
·Case: SOD-523
·Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification
Rating 94V-0
·Moisture Sensitivity: Level 1 per J-STD-020C
·Terminal Connections: Cathode Band
·Terminals: Finish - Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
·Marking Code: LK
·Ordering Information: See Last Page
·Weight: 0.002 grams (approximate)
B
A
C
DG
E
CATHODE MARK
LK
MARKING CODE
SOD-523
Dim Min Max
A1.50 1.70
B1.10 1.30
C0.25 0.35
D0.70 0.90
E0.10 0.20
G0.55 0.65
All Dimensions in mm
Note: 1. No purposefully added lead.
2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website
at http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration pulse test used to minimize self-heating effect.
4. Diodes Inc.'s "Green" Policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with date code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product manufactured prior to date
code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
Thermal Characteristics @ TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Power Dissipation (Note 2) Pd150 mW
Thermal Resistance, Junction to Ambient (Note 2) RqJA 667 °C/W