TLP2719(D4-TP,E - TOSHIBA - Datasheet.Company

TLP2719

1

Photocouplers GaAℓAs Infrared LED & Photo IC

TLP2719

Start of commercial production

2018-05

1.

1. Applications

Applications

• Intelligent Power Module Signal Isolation

• Factory Automation (FA)

• Industrial Inverters

2.

2. General

General

The TLP2719 consists of a high-output GaAℓAs light-emitting diode coupled with a high-gain, high-speed photo

detector. It is housed in the SO6L package.

This product can be mounted on the same land-pattern as Toshiba's SDIP6 packages.

In addition, the SO6L packages has a maximum height of 2.3 mm, which is approximately 45 % thinner than the

conventional SDIP6 packages. Its low profile package contributes to system size reduction and can be placed in

height-restricted locations, such as the back of a board.

Also, since TLP2719 guarantees high Isolation Voltage of 5 kVrms (min), this product satisfies the reinforced

insulation class according to international safety standards.

3.

3. Features

Features

(1) Inverter logic type (open collector output)

(2) Package: SO6L

(3) Operating temperature: -40 to 100 

(4) Supply voltage: -0.5 to 30 V

(5) Data transfer rate: 1 MBd (typ.) (NRZ)

(6) Common-mode transient immunity: ±10 kV/µs (min)

(7) Isolation voltage: 5000 Vrms (min)

(8) Safety standards

UL-approved: UL1577, File No.E67349

cUL-approved: CSA Component Acceptance Service No.5A File No.E67349

VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Pending) (Note 1)

(Note 1)

CQC-approved: GB4943.1, GB8898 Japan Factory (Pending)

Note 1: When a VDE approved type is needed, please designate the Option (D4)

Option (D4)

Option (D4).

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

2

4.

4. Packaging (Note)

Packaging (Note)

TLP2719

11-4N1A

TLP2719(LF4)

11-4N101A

Note: Lead-formed product: (LF4)

5.

5. Pin Assignment

Pin Assignment

1: Anode

2: N.C.

3: Cathode

4: GND

5: VO (Output)

6: VCC

6.

6. Internal Circuit (Note)

Internal Circuit (Note)

Note: A 0.1-µF bypass capacitor must be connected between pin 6 and pin 4.

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

3

7.

7. Principle of Operation

Principle of Operation

7.1.

7.1. Truth Table

Truth Table

Input

H

L

LED

ON

OFF

Output

L

H

7.2.

7.2. Mechanical Parameters

Mechanical Parameters

Characteristics

Creepage distances

Clearance distances

Internal isolation thickness

Min

8.0

0.4

Unit

mm

8.

8. Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

LED

Detector

Common

Characteristics

Input forward current

Input forward current derating

Input forward current (pulsed)

Input forward current derating

(pulsed)

Peak transient input forward

current

Peak transient input forward

current derating

Input power dissipation

derating

Input reverse voltage

Output current

Output current derating

Output voltage

Supply voltage

Output power dissipation

derating

Operating temperature

Storage temperature

Lead soldering temperature

Isolation voltage

(Ta ≥ 70 )

(10 s)

AC, 60 s, R.H. ≤ 60 %

Symbol

IF

∆IF/∆Ta

IFP

∆IFP/∆Ta

IFPT

∆IFPT/∆Ta

PD

∆PD/∆Ta

VR

IO

∆IO/∆Ta

VO

VCC

PO

∆PO/∆Ta

Topr

Tstg

Tsol

BVS

Note

(Note 1)

(Note 2)

(Note 3)

Rating

25

-0.45

50

-0.9

1

-18

40

-0.72

5

8

0.15

-0.5 to 20

-0.5 to 30

100

-1.8

-40 to 100

-55 to 125

260

5000

Unit

mA

mA/

mA

mA/

A

mA/

mW

mW/

V

mA

mA/

V

mW

mW/



Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Pulse width (PW) ≤ 1 ms, duty = 50 %

Note 2: Pulse width (PW) ≤ 1 µs, 300 pps

Note 3: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6

are shorted together.

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

4

9.

9. Recommended Operating Conditions (Note)

Recommended Operating Conditions (Note)

Characteristics

Input on-state current

Input off-state voltage

Supply voltage

Operating temperature

Symbol

IF(ON)

VF(OFF)

VCC

Topr

Note

(Note 1)

(Note 2)

Min

10

0

4.5

-40

Typ.



Max

20

0.8

20

100

Unit

mA

V



Note: The recommended operating conditions are given as a design guide necessary to obtain the intended

performance of the device. Each parameter is an independent value. When creating a system design using

this device, the electrical characteristics specified in this data sheet should also be considered.

Note : A ceramic capacitor (0.1 µF) should be connected between pin 6 and pin 4 to stabilize the operation of a high-

gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be

placed within 1 cm of each pin.

Note 1: The rise and fall times of the input on-current should be less than 0.5 µs.

Note 2: Denotes the operating range, not the recommended operating condition.

10.

10. Electrical Characteristics (Note)

Electrical Characteristics (Note)

(Unless otherwise specified, T

(Unless otherwise specified, Ta

a

a = -40 to 100

= -40 to 100

= -40 to 100 



)

)

Characteristics

Input forward voltage

temperature

coefficient

Input reverse current

Input capacitance

High-level output

current

Low-level output

voltage

High-level supply

current

Current transfer ratio

Symbol

VF

∆VF/∆Ta

IR

Ct

IOH

VOL

ICCH

IO/IF

Test

Circuit



Fig.

13.1.1

Fig.

13.1.2

Fig.

13.1.3

Fig.

13.1.4

Test Condition

IF = 16 mA, Ta = 25 

IF = 16 mA

VR = 5 V, Ta = 25 

V = 0 V, f = 1 MHz, Ta = 25 

VF = 0.8 V, VO = 5.5 V, VCC = 5.5 V, Ta = 25 

VF = 0.8 V, VO = 20 V, VCC = 30 V, Ta = 25 

VF = 0.8 V, VO = 20 V, VCC = 30 V, Ta = 70 

VF = 0.8 V, VO = 20 V, VCC = 30 V

IF = 16 mA, IO = 2.4 mA, VCC = 4.5 to 30 V

VF = 0.8 V, VCC = 30 V

IF = 16 mA, VO = 0.4 V, VCC = 4.5 to 30 V,

Ta = 25 

IF = 16 mA, VO = 0.4 V, VCC = 4.5 to 30 V

Min

1.45



20

15

Typ.

1.6

-1.0



40



0.21



37

Max

1.85



10



500

5

50

65

0.4

1

55

Unit

V

mV/

µA

pF

nA

µA

V

µA

%

Note: All typical values are at Ta = 25 .

11.

11. Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

Characteristics

Total capacitance (input to output)

Isolation resistance

Isolation voltage

Symbol

CS

RS

BVS

Note

(Note 1)

Test Condition

VS = 0 V, f = 1 MHz

VS = 500 V, R.H. ≤ 60 %

AC, 60 s

Min



1 × 1012

5000

Typ.

0.3

1014



Max



Unit

pF

Ω

Vrms

Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6

are shorted together.

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

5

12.

12. Switching Characteristics (Note)

Switching Characteristics (Note)

(Unless otherwise specified, T

(Unless otherwise specified, Ta

a

a = -40 to 100

= -40 to 100

= -40 to 100 



, V

, V

, VCC

CC

CC = 5 V)

= 5 V)

Characteristics

Propagation delay time (H/L)

Propagation delay time (L/H)

High-level common-mode

transient immunity

Low-level common-mode

transient immunity

Symbol

tpHL

tpLH

CMH

CML

Note

(Note 1)

Test

Circuit

Fig.

13.1.5

Fig.

13.1.6

Test Condition

IF = 0 → 16 mA, RL = 1.9 kΩ,

CL = 15 pF, VO ≤ 1.5 V, Ta =

25 

IF = 0 → 16 mA, RL = 1.9 kΩ,

CL = 15 pF, VO ≤ 1.5 V

IF = 16 → 0 mA, RL = 1.9 kΩ,

CL = 15 pF, VO ≥ 1.5 V, Ta =

25 

IF = 16 → 0 mA, RL = 1.9 kΩ,

CL = 15 pF, VO ≥ 1.5 V

IF = 16 → 0 mA, RL = 1.9 kΩ,

CL = 15 pF, VO ≥ 2.5 V

VCM = 400 Vp-p, IF = 0 mA,

RL = 1.9 kΩ, VO ≤ 2 V, Ta =

25 

VCM = 400 Vp-p, IF = 16 mA,

RL = 1.9 kΩ, VO ≥ 0.8 V, Ta =

25 

Min



±10

Typ.

0.20

0.21

0.30



Max

0.8

0.85

0.8

1.9

2



Unit

µs

kV/µs

Note: All typical values are at Ta = 25 .

Note 1: Input signal (f = 1 kHz, duty = 10 %, input current tr = tf = 5 ns or less )

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

6

13.

13. Test Circuits and Characteristics Curves

Test Circuits and Characteristics Curves

13.1.

13.1. Test Circuits

Test Circuits

Fig.

Fig. 13.1.1

13.1.1

13.1.1 I

I

IOH

OH

OH Test Circuit

Test Circuit

Test Circuit Fig.

Fig.

Fig. 13.1.2

13.1.2

13.1.2 V

V

VOL

OL

OL Test Circuit

Test Circuit

Fig.

Fig. 13.1.3

13.1.3

13.1.3 I

I

ICCH

CCH

CCH Test Circuit

Test Circuit

Test Circuit Fig.

Fig.

Fig. 13.1.4

13.1.4

13.1.4 I

I

IO

O

O Test Circuit

Test Circuit

Fig.

Fig. 13.1.5

13.1.5

13.1.5 Switching Time Test Circuit and Waveform

Switching Time Test Circuit and Waveform

Fig.

Fig. 13.1.6

13.1.6

13.1.6 Common-Mode Transient Immunity Test Circuit and Waveform

Common-Mode Transient Immunity Test Circuit and Waveform

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

7

13.2.

13.2. Characteristics Curves (Note)

Characteristics Curves (Note)

Fig.

Fig. 13.2.1

13.2.1

13.2.1 I

I

IF

F

F - V

- V

- VF

F

FFig.

Fig.

Fig. 13.2.2

13.2.2

13.2.2 I

I

IF

F

F - T

- T

- Ta

a

Fig.

Fig. 13.2.3

13.2.3

13.2.3 I

I

IOH

OH

OH - T

- T

- Ta

a

aFig.

Fig.

Fig. 13.2.4

13.2.4

13.2.4 I

I

IO

O

O - I

- I

- IF

F

Fig.

Fig. 13.2.5

13.2.5

13.2.5 I

I

IO

O

O / I

/ I

/ IF

F

F - I

- I

- IF

F

FFig.

Fig.

Fig. 13.2.6

13.2.6

13.2.6 I

I

IO

O

O / I

/ I

/ IF

F

F - T

- T

- Ta

a

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

8

Fig.

Fig. 13.2.7

13.2.7

13.2.7 I

I

IO

O

O / I

/ I

/ IF

F

F - T

- T

- Ta

a

aFig.

Fig.

Fig. 13.2.8

13.2.8

13.2.8 I

I

IO

O

O - V

- V

- VO

O

Fig.

Fig. 13.2.9

13.2.9

13.2.9 V

V

VO

O

O - I

- I

- IF

F

FFig.

Fig.

Fig. 13.2.10

13.2.10

13.2.10 V

V

VOL

OL

OL - T

- T

- Ta

a

Fig.

Fig. 13.2.11

13.2.11

13.2.11 t

t

tpHL

pHL

pHL,t

,t

,tpLH

pLH

pLH - R

- R

- RL

L

LFig.

Fig.

Fig. 13.2.12

13.2.12

13.2.12 t

t

tpHL

pHL

pHL,t

,t

,tpLH

pLH

pLH - T

- T

- Ta

a

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

9

14.

14. Soldering and Storage

Soldering and Storage

14.1.

14.1. Precautions for Soldering

Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective

of whether a soldering iron or a reflow soldering method is used.

• When using soldering reflow.

The soldering temperature profile is based on the package surface temperature.

(See the figure shown below, which is based on the package surface temperature.)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used

• When using soldering flow

Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds.

Mounting condition of 260  within 10 seconds is recommended.

Flow soldering must be performed once.

• When using soldering Iron

Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not

exceeding 350 

Heating by soldering iron must be done only once per lead.

14.2.

14.2. Precautions for General Storage

Precautions for General Storage

• Avoid storage locations where devices may be exposed to moisture or direct sunlight.

• Follow the precautions printed on the packing label of the device for transportation and storage.

• Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %,

respectively.

• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

• When restoring devices after removal from their packing, use anti-static containers.

• Do not allow loads to be applied directly to devices while they are in storage.

• If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

10

15.

15. Land Pattern Dimensions (for reference only)

Land Pattern Dimensions (for reference only)

Unit: mm

TLP2719

Fig.

Fig. 15.1

15.1

15.1 Lead Forming Option (standard)

Lead Forming Option (standard)

TLP2719(LF4)

Fig.

Fig. 15.2

15.2

15.2 Lead Forming Option (LF4)

Lead Forming Option (LF4)

16.

16. Marking

Marking

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

11

17.

17. EN60747-5-5 Option (D4) Specification

EN60747-5-5 Option (D4) Specification

• Part number: TLP2719 (Note 1)

(Note 1)

• The following part naming conventions are used for the devices that have been qualified according to

option (D4) of EN60747.

Example: TLP2719(D4-TP,E

D4: EN60747 option

TP: Tape type

E: [[G]]/RoHS COMPATIBLE (Note 2)

(Note 2)

Note 1: Use TOSHIBA standard type number for safety standard application.

e.g., TLP2719(D4-TP,E → TLP2719

Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the

restriction of the use of certain hazardous substances in electrical and electronic equipment.

Fig.

Fig. 17.1

17.1

17.1 EN60747 Insulation Characteristics

EN60747 Insulation Characteristics

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

12

Fig.

Fig. 17.2

17.2

17.2 Insulation Related Specifications (Note)

Insulation Related Specifications (Note)

Note: This photocoupler is suitable for safe electrical isolation

safe electrical isolation

safe electrical isolation only within the safety limit data.

Maintenance of the safety data shall be ensured by means of protective circuits.

Fig.

Fig. 17.3

17.3

17.3 Marking on Packing for EN60747

Marking on Packing for EN60747

Fig.

Fig. 17.4

17.4

17.4 Marking Example (Note)

Marking Example (Note)

Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747.

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

13

Fig.

Fig. 17.5

17.5

17.5 Measurement Procedure

Measurement Procedure

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

14

18.

18. Embossed-Tape Packing (TP) Specification for Mini-Flat Photocouplers

Embossed-Tape Packing (TP) Specification for Mini-Flat Photocouplers

18.1.

18.1. Applicable Package

Applicable Package

Package Name

SO6L / SO6L(LF4)

Product Type

Long creepage mini flat

coupler

18.2.

18.2. Product Naming Conventions

Product Naming Conventions

Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification

is as below.

Example) TLP2719(TP,E

Part number: TLP2719

Tape type: TP

[[G]]/RoHS COMPATIBLE: E (Note 1)

(Note 1)

Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the

restriction of the use of certain hazardous substances in electrical and electronic equipment.

18.3.

18.3. Tape Dimensions Specification

Tape Dimensions Specification

Tape Type

TP / TP4

Division



Packing Amount

(A unit per reel)

1500

18.3.1.

18.3.1. Orientation of Device in Relation to Direction of Feed

Orientation of Device in Relation to Direction of Feed

Device orientation in the carrier cavities as shown in the following figure.

Fig.

Fig. 18.3.1.1

18.3.1.1

18.3.1.1 Orientation of Device in Relation to Direction of Tape Movement

Orientation of Device in Relation to Direction of Tape Movement

18.3.2.

18.3.2. Empty Cavities

Empty Cavities

Characteristics

Occurrences of 2 or more

successive empty cavities

Single empty cavity

Criterion

0 device

6 devices (max) per reel

Remarks

Within any given 40-mm section of tape, not including leader

and trailer

Not including leader and trailer

18.3.3.

18.3.3. Tape Leader and Trailer

Tape Leader and Trailer

The start of the tape has 14 or more empty holes. The end of the tape has 34 or more empty holes and a cover

tape of 30 mm or longer.

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

15

18.3.4.

18.3.4. Tape Dimensions

Tape Dimensions

Tape material: Plastic (for protection against static electricity)

Table

Table Tape Dimensions (unit: mm, tolerance:

Tape Dimensions (unit: mm, tolerance:

Tape Dimensions (unit: mm, tolerance: ±

±

±0.1)

0.1)

Symbol

A

B

D

E

F

G

K

K0

Dimension

(standard)

10.4

4.24

7.5

1.75

12.0

4.0

2.7

2.4

Dimension

(LF4)

11.55

4.24

7.5

1.75

16.0

4.0

2.8

2.4

Remark



Center line of embossed cavity and sprocket hole

Distance between tape edge and sprocket hole center

Cumulative error +0.1/-0.3 per 10 empty cavities holes

Cumulative error +0.1/-0.3 per 10 sprocket holes



Internal space

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

16

18.3.5.

18.3.5. Reel Specification

Reel Specification

Material: Plastic (for protection against static electricity)

Table

Table Reel Dimensions (unit: mm)

Reel Dimensions (unit: mm)

Symbol

A

B

C

E

U

W1

W2

Dimension

φ330 ± 2.0

φ100 ± 1.0

φ13 ± 0.5

2.0 ± 0.5

4.0 ± 0.5

17.4 ± 1.0

21.4 ± 1.0

18.4.

18.4. Packing (Note)

Packing (Note)

1 reel/carton (unit: mm)

Note: Taping reel diameter: φ330 mm

18.5.

18.5. Label Format

Label Format

(1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc.

(2) Reel: The label provides the part number, the taping name, quantity, lot number, etc.

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

17

19.

19. Ordering Information (Example of Item Name)

Ordering Information (Example of Item Name)

Item Name

TLP2719(E

TLP2719(TP,E

TLP2719(D4,E

TLP2719(D4-TP,E

TLP2719(LF4,E

TLP2719(TP4,E

TLP2719(D4-LF4,E

TLP2719(D4-TP4,E

Packaging

LF4, Wide forming

VDE Option

EN60747-5-5

Packing (MOQ)

Magazine (125 pcs)

Tape and reel (1500 pcs)

Magazine (125 pcs)

Tape and reel (1500 pcs)

Magazine (125 pcs)

Tape and reel (1500 pcs)

Magazine (125 pcs)

Tape and reel (1500 pcs)

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

18

Package Dimensions

Unit: mm

TLP2719

Weight: 0.126 g (typ.)

Package Name(s)

TOSHIBA: 11-4N1A

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

19

Package Dimensions

Unit: mm

TLP2719(LF4)

Weight: 0.126 g (typ.)

Package Name(s)

TOSHIBA: 11-4N101A

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP2719

20

RESTRICTIONS ON PRODUCT USE

Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA".

Hardware, software and systems described in this document are collectively referred to as "Product".

• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's

written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible

for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which

minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage

to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate

the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA

information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the

precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application

with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,

including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating

and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample

application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.

TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY

CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE").

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation,

equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,

trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,

elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR

IF YOU USE PRODUCT FOR

UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.

UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales

representative.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any

intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,

INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING

WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND

(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,

OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.

Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products

(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and

regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration

Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all

applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

2018-05-21

Rev.1.0

Toshiba Electronic Devices & Storage Corporation