TLP2719 Photocouplers GaAAs Infrared LED & Photo IC TLP2719 1. Applications * Intelligent Power Module Signal Isolation * Factory Automation (FA) * Industrial Inverters 2. General The TLP2719 consists of a high-output GaAAs light-emitting diode coupled with a high-gain, high-speed photo detector. It is housed in the SO6L package. This product can be mounted on the same land-pattern as Toshiba's SDIP6 packages. In addition, the SO6L packages has a maximum height of 2.3 mm, which is approximately 45 % thinner than the conventional SDIP6 packages. Its low profile package contributes to system size reduction and can be placed in height-restricted locations, such as the back of a board. Also, since TLP2719 guarantees high Isolation Voltage of 5 kVrms (min), this product satisfies the reinforced insulation class according to international safety standards. 3. Features (1) Inverter logic type (open collector output) (2) Package: SO6L (3) Operating temperature: -40 to 100 (4) Supply voltage: -0.5 to 30 V (5) Data transfer rate: 1 MBd (typ.) (NRZ) (6) Common-mode transient immunity: 10 kV/s (min) (7) Isolation voltage: 5000 Vrms (min) (8) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Pending) (Note 1) CQC-approved: GB4943.1, GB8898 Japan Factory (Pending) Note 1: When a VDE approved type is needed, please designate the Option (D4) (D4). Start of commercial production (c)2018 Toshiba Electronic Devices & Storage Corporation 1 2018-05 2018-05-21 Rev.1.0 TLP2719 4. Packaging (Note) TLP2719 TLP2719(LF4) 11-4N1A Note: 11-4N101A Lead-formed product: (LF4) 5. Pin Assignment 1: Anode 2: N.C. 3: Cathode 4: GND 5: VO (Output) 6: VCC 6. Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 6 and pin 4. (c)2018 Toshiba Electronic Devices & Storage Corporation 2 2018-05-21 Rev.1.0 TLP2719 7. Principle of Operation 7.1. Truth Table Input LED Output H ON L L OFF H 7.2. Mechanical Parameters Characteristics Min Unit Creepage distances 8.0 mm Clearance distances 8.0 Internal isolation thickness 0.4 8. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Input forward current Input forward current derating IF 25 mA -0.45 mA/ (Ta 70 ) IFP/Ta IFP 50 mA -0.9 mA/ 1 A IFPT/Ta -18 mA/ PD 40 mW PD/Ta -0.72 mW/ VR 5 V IFPT (Ta 70 ) Input power dissipation Input power dissipation derating Unit IF/Ta Peak transient input forward current Peak transient input forward current derating Rating (Ta 70 ) Input forward current (pulsed) Input forward current derating (pulsed) Note (Ta 70 ) Input reverse voltage Detector Output current (Note 1) (Note 2) IO 8 mA IO/Ta 0.15 mA/ Output voltage VO -0.5 to 20 V Supply voltage VCC -0.5 to 30 Output current derating (Ta 70 ) Output power dissipation Output power dissipation derating (Ta 70 ) Common Operating temperature Storage temperature Lead soldering temperature Isolation voltage PO 100 mW PO/Ta -1.8 mW/ Topr -40 to 100 Tstg -55 to 125 (10 s) Tsol 260 AC, 60 s, R.H. 60 % BVS (Note 3) 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) 1 ms, duty = 50 % Note 2: Pulse width (PW) 1 s, 300 pps Note 3: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. (c)2018 Toshiba Electronic Devices & Storage Corporation 3 2018-05-21 Rev.1.0 TLP2719 9. Recommended Operating Conditions (Note) Characteristics Symbol Note Min Typ. Input on-state current IF(ON) (Note 1) 10 Input off-state voltage VF(OFF) 0 4.5 20 -40 100 Supply voltage VCC Operating temperature Topr (Note 2) Max Unit 20 mA 0.8 V Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. Note : A ceramic capacitor (0.1 F) should be connected between pin 6 and pin 4 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. Note 1: The rise and fall times of the input on-current should be less than 0.5 s. Note 2: Denotes the operating range, not the recommended operating condition. 10. Electrical Characteristics (Note) (Unless otherwise specified, Ta = -40 to 100 ) Characteristics Symbol Test Circuit Input forward voltage VF IF = 16 mA, Ta = 25 Input forward voltage temperature coefficient VF/Ta Input reverse current IR Min Typ. Max Unit 1.45 1.6 1.85 V IF = 16 mA -1.0 mV/ VR = 5 V, Ta = 25 10 A V = 0 V, f = 1 MHz, Ta = 25 40 pF VF = 0.8 V, VO = 5.5 V, VCC = 5.5 V, Ta = 25 500 nA VF = 0.8 V, VO = 20 V, VCC = 30 V, Ta = 25 5 A VF = 0.8 V, VO = 20 V, VCC = 30 V, Ta = 70 50 Input capacitance Ct High-level output current IOH Fig. 13.1.1 Test Condition VF = 0.8 V, VO = 20 V, VCC = 30 V 65 Low-level output voltage VOL Fig. 13.1.2 IF = 16 mA, IO = 2.4 mA, VCC = 4.5 to 30 V 0.21 0.4 V High-level supply current ICCH Fig. 13.1.3 VF = 0.8 V, VCC = 30 V 1 A Current transfer ratio IO/IF Fig. 13.1.4 IF = 16 mA, VO = 0.4 V, VCC = 4.5 to 30 V, Ta = 25 20 37 55 % IF = 16 mA, VO = 0.4 V, VCC = 4.5 to 30 V 15 37 55 % Min Typ. Max Unit 0.3 pF 1014 Vrms Note: All typical values are at Ta = 25 . 11. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Total capacitance (input to output) CS Isolation resistance Isolation voltage RS BVS Note Test Condition (Note 1) VS = 0 V, f = 1 MHz VS = 500 V, R.H. 60 % AC, 60 s 1x 1012 5000 Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. (c)2018 Toshiba Electronic Devices & Storage Corporation 4 2018-05-21 Rev.1.0 TLP2719 12. Switching Characteristics (Note) (Unless otherwise specified, Ta = -40 to 100 , VCC = 5 V) Characteristics Propagation delay time (H/L) Propagation delay time (L/H) Symbol Note tpHL (Note 1) Test Circuit Fig. 13.1.5 tpLH High-level common-mode transient immunity CMH Low-level common-mode transient immunity CML Fig. 13.1.6 Test Condition Min Typ. Max Unit IF = 0 16 mA, RL = 1.9 k, CL = 15 pF, VO 1.5 V, Ta = 25 0.20 0.8 s IF = 0 16 mA, RL = 1.9 k, CL = 15 pF, VO 1.5 V 0.20 0.85 IF = 16 0 mA, RL = 1.9 k, CL = 15 pF, VO 1.5 V, Ta = 25 0.21 0.8 IF = 16 0 mA, RL = 1.9 k, CL = 15 pF, VO 1.5 V 0.21 1.9 IF = 16 0 mA, RL = 1.9 k, CL = 15 pF, VO 2.5 V 0.30 2 VCM = 400 Vp-p, IF = 0 mA, RL = 1.9 k, VO 2 V, Ta = 25 10 VCM = 400 Vp-p, IF = 16 mA, RL = 1.9 k, VO 0.8 V, Ta = 25 10 kV/s Note: All typical values are at Ta = 25 . Note 1: Input signal (f = 1 kHz, duty = 10 %, input current tr = tf = 5 ns or less ) (c)2018 Toshiba Electronic Devices & Storage Corporation 5 2018-05-21 Rev.1.0 TLP2719 13. Test Circuits and Characteristics Curves 13.1. Test Circuits Fig. 13.1.1 IOH Test Circuit Fig. 13.1.2 VOL Test Circuit Fig. 13.1.3 ICCH Test Circuit Fig. 13.1.4 IO Test Circuit Fig. 13.1.5 Switching Time Test Circuit and Waveform Fig. 13.1.6 Common-Mode Transient Immunity Test Circuit and Waveform (c)2018 Toshiba Electronic Devices & Storage Corporation 6 2018-05-21 Rev.1.0 TLP2719 13.2. Characteristics Curves (Note) Fig. 13.2.1 IF - VF Fig. 13.2.2 IF - Ta Fig. 13.2.3 IOH - Ta Fig. 13.2.4 IO - IF Fig. 13.2.5 IO / IF - IF Fig. 13.2.6 IO / IF - Ta (c)2018 Toshiba Electronic Devices & Storage Corporation 7 2018-05-21 Rev.1.0 TLP2719 Note: Fig. 13.2.7 IO / IF - Ta Fig. 13.2.8 IO - VO Fig. 13.2.9 VO - IF Fig. 13.2.10 VOL - Ta Fig. 13.2.11 tpHL,tpLH - RL Fig. 13.2.12 tpHL,tpLH - Ta The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. (c)2018 Toshiba Electronic Devices & Storage Corporation 8 2018-05-21 Rev.1.0 TLP2719 14. Soldering and Storage 14.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. * When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used * When using soldering flow Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds. Mounting condition of 260 within 10 seconds is recommended. Flow soldering must be performed once. * When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 Heating by soldering iron must be done only once per lead. 14.2. Precautions for General Storage * Avoid storage locations where devices may be exposed to moisture or direct sunlight. * Follow the precautions printed on the packing label of the device for transportation and storage. * Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %, respectively. * Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. * Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. * When restoring devices after removal from their packing, use anti-static containers. * Do not allow loads to be applied directly to devices while they are in storage. * If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. (c)2018 Toshiba Electronic Devices & Storage Corporation 9 2018-05-21 Rev.1.0 TLP2719 15. Land Pattern Dimensions (for reference only) Unit: mm TLP2719 TLP2719(LF4) Fig. 15.1 Lead Forming Option (standard) Fig. 15.2 Lead Forming Option (LF4) 16. Marking (c)2018 Toshiba Electronic Devices & Storage Corporation 10 2018-05-21 Rev.1.0 TLP2719 17. EN60747-5-5 Option (D4) Specification * Part number: TLP2719 (Note 1) * The following part naming conventions are used for the devices that have been qualified according to option (D4) of EN60747. Example: TLP2719(D4-TP,E D4: EN60747 option TP: Tape type E: [[G]]/RoHS COMPATIBLE (Note 2) Note 1: Use TOSHIBA standard type number for safety standard application. e.g., TLP2719(D4-TP,E TLP2719 Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Fig. 17.1 EN60747 Insulation Characteristics (c)2018 Toshiba Electronic Devices & Storage Corporation 11 2018-05-21 Rev.1.0 TLP2719 Fig. 17.2 Insulation Related Specifications (Note) Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Fig. 17.3 Marking on Packing for EN60747 Fig. 17.4 Marking Example (Note) Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747. (c)2018 Toshiba Electronic Devices & Storage Corporation 12 2018-05-21 Rev.1.0 TLP2719 Fig. 17.5 Measurement Procedure (c)2018 Toshiba Electronic Devices & Storage Corporation 13 2018-05-21 Rev.1.0 TLP2719 18. Embossed-Tape Packing (TP) Specification for Mini-Flat Photocouplers 18.1. Applicable Package Package Name Product Type SO6L / SO6L(LF4) Long creepage mini flat coupler 18.2. Product Naming Conventions Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification is as below. Example) TLP2719(TP,E Part number: TLP2719 Tape type: TP [[G]]/RoHS COMPATIBLE: E (Note 1) Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 18.3. Tape Dimensions Specification Tape Type Division Packing Amount (A unit per reel) TP / TP4 1500 18.3.1. Orientation of Device in Relation to Direction of Feed Device orientation in the carrier cavities as shown in the following figure. Fig. 18.3.1.1 Orientation of Device in Relation to Direction of Tape Movement 18.3.2. Empty Cavities Characteristics Criterion Occurrences of 2 or more successive empty cavities Single empty cavity Remarks 0 device Within any given 40-mm section of tape, not including leader and trailer 6 devices (max) per reel Not including leader and trailer 18.3.3. Tape Leader and Trailer The start of the tape has 14 or more empty holes. The end of the tape has 34 or more empty holes and a cover tape of 30 mm or longer. (c)2018 Toshiba Electronic Devices & Storage Corporation 14 2018-05-21 Rev.1.0 TLP2719 18.3.4. Tape Dimensions Tape material: Plastic (for protection against static electricity) Table Symbol Tape Dimensions (unit: mm, tolerance: 0.1) Dimension Dimension (standard) (LF4) Remark A 10.4 11.55 B 4.24 4.24 D 7.5 7.5 Center line of embossed cavity and sprocket hole E 1.75 1.75 Distance between tape edge and sprocket hole center F 12.0 16.0 Cumulative error +0.1/-0.3 per 10 empty cavities holes G 4.0 4.0 Cumulative error +0.1/-0.3 per 10 sprocket holes K 2.7 2.8 K0 2.4 2.4 Internal space (c)2018 Toshiba Electronic Devices & Storage Corporation 15 2018-05-21 Rev.1.0 TLP2719 18.3.5. Reel Specification Material: Plastic (for protection against static electricity) Table Reel Dimensions (unit: mm) Symbol Dimension A 330 2.0 B 100 1.0 C 13 0.5 E 2.0 0.5 U 4.0 0.5 W1 17.4 1.0 W2 21.4 1.0 18.4. Packing (Note) 1 reel/carton (unit: mm) Note: Taping reel diameter: 330 mm 18.5. Label Format (1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc. (2) Reel: The label provides the part number, the taping name, quantity, lot number, etc. (c)2018 Toshiba Electronic Devices & Storage Corporation 16 2018-05-21 Rev.1.0 TLP2719 19. Ordering Information (Example of Item Name) Item Name Packaging VDE Option Packing (MOQ) TLP2719(E Magazine (125 pcs) TLP2719(TP,E Tape and reel (1500 pcs) TLP2719(D4,E EN60747-5-5 Magazine (125 pcs) TLP2719(D4-TP,E EN60747-5-5 Tape and reel (1500 pcs) TLP2719(LF4,E LF4, Wide forming TLP2719(TP4,E LF4, Wide forming TLP2719(D4-LF4,E LF4, Wide forming EN60747-5-5 Magazine (125 pcs) TLP2719(D4-TP4,E LF4, Wide forming EN60747-5-5 Tape and reel (1500 pcs) (c)2018 Toshiba Electronic Devices & Storage Corporation Magazine (125 pcs) Tape and reel (1500 pcs) 17 2018-05-21 Rev.1.0 TLP2719 Package Dimensions Unit: mm TLP2719 Weight: 0.126 g (typ.) Package Name(s) TOSHIBA: 11-4N1A (c)2018 Toshiba Electronic Devices & Storage Corporation 18 2018-05-21 Rev.1.0 TLP2719 Package Dimensions Unit: mm TLP2719(LF4) Weight: 0.126 g (typ.) Package Name(s) TOSHIBA: 11-4N101A (c)2018 Toshiba Electronic Devices & Storage Corporation 19 2018-05-21 Rev.1.0 TLP2719 RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". * TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. 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No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. 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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. (c)2018 Toshiba Electronic Devices & Storage Corporation 20 2018-05-21 Rev.1.0