
IMX8
DUAL NPN SMALL SIGNAL SURF ACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Complementary PNP Type Available (IMT4)
• Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device, Note 4 and 5
Mechanical Data
• Case: SOT-26
• Case Material: Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminal Connections: See Diagram
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over
Copper leadframe).
• Marking Information: KX8, See Page 3
• Ordering & Date Code Information: See Page 3
• Weight: 0.016 grams (approximate)
SOT-26
Dim Min Max Typ
A 0.35 0.50 0.38
B 1.50 1.70 1.60
C 2.70 3.00 2.80
D ⎯ ⎯ 0.95
F ⎯ ⎯ 0.55
H 2.90 3.10 3.00
J 0.013 0.10 0.05
K 1.00 1.30 1.10
L 0.35 0.55 0.40
M 0.10 0.20 0.15
α 0° 8° ⎯
All Dimens ons in mm i
A
M
JL
DF
BC
H
K
B
2
B
1
E
1
C
2
E
2
C
1
B
2
B
1
E
1
C
2
E
2
C
1
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage VCBO 120 V
Collector-Emitter Voltage VCEO 120 V
Emitter-Base Voltage VEBO 5.0 V
Collector Current - Continuous IC50 mA
Power Dissipation (Note 1) Pd300 mW
Thermal Resistance, Junction to Ambient (Note 1) RθJA 417 °C/W
Operating and Storage Temperature Range Tj, TSTG -55 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 2)
Collector-Base Breakdown Voltage V(BR)CBO 120 ⎯ ⎯ V IC = 50μA
Collector-Emitter Breakdown Voltage V(BR)CEO 120 ⎯ ⎯ V IC = 1.0mA
Emitter-Base Breakdown Voltage V(BR)EBO 5.0 ⎯ ⎯ V IE = 50μA
Collector Cutoff Current ICBO ⎯ ⎯ 0.5 μA VCB = 100V
Emitter Cutoff Current IEBO ⎯ ⎯ 0.5 μA VEB = 4.0V
ON CHARACTERISTICS (Note 2)
DC Current Gain hFE 180 ⎯ 820 ⎯ IC = 2.0mA, VCE = 6.0V
Collector-Emitter Saturation Voltage VCE(SAT) ⎯ ⎯ 0.5 V IC = 10mA, IB = 1.0mA
SMALL SIGNAL CHARACTERISTICS
Current Gain-Bandwidth Product fT⎯ 140 ⎯ MHz VCE = 12V, IC = 2.0mA,
f = 100MHz
Notes: 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf. 200mW per element must not be exceeded.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30304 Rev. 8 - 2 1 of 3
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