33
C702E Smart Card Connectors with PCB Mount Wiping Contacts
ISO
22,08
2,9
42
8,7
1,4 - 1,68
-0,0
+0,1
ø3,2
4,6
6,7
3,81
LEITERPLATTENDICKE / PCB THICKNESS =
4
±0,4
BESTÜCKUNGSSEITE / COMPONENTS SIDE
C6
C7
C8
C5
C2
C3
C4
S
C1
20
S
62
40 50,5
38,1
-0,0
+0,1
ø1 ø0,1
(62)
58
12,7
3 x (=7,62)2,54
(40)
ø0,1
2,5
0,7
Description Contact position Termination Part No.
with board lock and ISO Dip solder pin C702 10M008 272 4
self-cleaning switch, acc. to EMV
C702E Smart Card Connectors with PCB Mount Wiping Contacts
22,08
26 24,3
ø1
ø3
POSITION OF STAND - OFFS
LAGE DER ABSTANDSBOLZEN
1414
SPACE FOR GUIDING PIN
PLATZBEDARF ZAPFEN
10
ø5
24,425,8
17,317,3
2,9
1,8
3,5
7,5
40
42
7
8,7
3
-0,0
+0,1
ø3,2
6,7
3,81
LEITERPLATTENDICKE / PCB THICKNESS = 1,4 - 1,68
±0,4
BESTÜCKUNGSSEITE / COMPONENTS SIDE
ISO
C6
C7
C8
C5
C2
C3
C4
S
C1
20
S
62
50,5
38,1
-0,0
+0,1 ø0,1
(62)
58
12,7
3 x (=7,62)2,54
(40)
ø0,1
Description Contact position Termination Part No.
with board lock and ISO Dip solder pin C702 10M008 255 4
self-cleaning switch and
3 mm stand-offs, acc. to EMV
