1. Product profile
1.1 General description
Schottky barrier quadruple diode with an integrated guard ring for stress protection. Two
electrically isolated dual Schottky barrier diodes series, encapsulated in a SOT363 very
small SMD plastic package.
1.2 Features
Low forward voltage
Ultra small SMD plastic package
Low capacitance
1.3 Applications
Ultra high-speed switching
Voltage clamping
Line termination
Inverse-po lar ity pr ot ec tio n
1.4 Quick reference data
[1] Pulse test: tp30 ms; δ ≤ 0.02.
BAT54XY
Schottky barrier quadruple diode in very small SOT363
package
Rev. 02 — 13 January 2010 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VRcontinuous reverse voltage - - 30 V
IFcontinuous forward current - - 200 mA
VFforward voltage IF = 10 mA;
see Figure 1 [1] --400mV
BAT54XY_2 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 13 January 2010 2 of 9
NXP Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
2. Pinning information
3. Ordering information
4. Marking
[1] * = -: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 2. Pinning
Pin Description Simplified outline Symbol
1 anode 1
2 cathode 2
3 anode 3 / cathode 4
4 anode 4
5 cathode 3
6 cathode 1 / anode 2
132
4
56
006aaa25
6
654
123
Table 3. Ordering i nformation
Type number Package
Name Description Version
BAT54XY SC-88 plastic surface mounted package; 6 leads SOT363
Table 4. Marking codes
Type number Marking code[1]
BAT54XY *C5
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRcontinuous reverse voltage - 30 V
IFcontinuous forward current - 200 mA
IFRM repetitive peak forward
current tp 1 s; δ ≤ 0.5 - 300 mA
IFSM non-repetitive peak forward
current tp < 10 ms - 600 mA
Tjjunction temperature - 125 °C
Tamb ambient temperature 65 +125 °C
Tstg storage temperature 65 +150 °C
BAT54XY_2 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 13 January 2010 3 of 9
NXP Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
6. Thermal characteristics
[1] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
[1] Pulse test: tp300 μs; δ≤0.02.
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-s) thermal resistance from junction to
soldering point in free air [1] --260K/W
Table 7. Characteristics
Tamb = 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VFforward voltage see Figure 1;[1]
IF = 0.1 mA - - 240 mV
IF = 1 mA - - 320 mV
IF = 10 mA - - 400 mV
IF = 30 mA - - 500 mV
IF = 100 mA - - 800 mV
IRreverse current VR = 25 V; see Figure 2 --2μA
Cddiode capacitance VR = 1 V; f = 1 MHz;
see Figure 3 --10pF
BAT54XY_2 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 13 January 2010 4 of 9
NXP Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
Fig 1. Forward current as a function of forward
voltage; typical values Fig 2. Reverse current as a function o f reverse
voltage; typical values
Tamb =25°C; f = 1 MHz
Fig 3. Diod e capacitance as a function of reverse voltage; typical values
103
102
101
IF
(mA)
VF (V)
10
1
1.20.80.40
msa892
(3)(2)(1)
(3)(2)(1)
0102030
VR (V)
103
102
101
IR
(μA)
10
1
(1)
(2)
(3)
msa893
0102030
0
5
10
15
V
R
(V)
C
d
(pF)
msa891
BAT54XY_2 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 13 January 2010 5 of 9
NXP Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
8. Package outline
Fig 4. Package outline SOT363 (SC-88)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT363 SC-88
wBM
bp
D
e1
e
pin 1
index A
A1
Lp
Q
detail X
HE
E
vMA
AB
y
0 1 2 mm
scale
c
X
132
456
Plastic surface-mounted package; 6 leads SOT36
3
UNIT A1
max bpcDEe1HELpQywv
mm 0.1 0.30
0.20
2.2
1.8
0.25
0.10
1.35
1.15 0.65
e
1.3 2.2
2.0 0.2 0.10.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
0.25
0.15
A
1.1
0.8
04-11-08
06-03-16
BAT54XY_2 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 13 January 2010 6 of 9
NXP Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
9. Packing information
[1] For further information and the availability of packing methods, see Section 12.
[2] T1: normal taping
[3] T2: reverse taping
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 10000
BAT54XY SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165
BAT54XY_2 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 13 January 2010 7 of 9
NXP Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
10. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BAT54XY_2 20100113 Product data sheet - BAT54XY_1
Modifications: This data sheet was changed to reflec t the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
Table 2 “Pinning: updated
Figure 4 “Package outline SOT363 (SC-88): updated
BAT54XY_1 20050117 Product data sheet - -
BAT54XY_2 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 02 — 13 January 2010 8 of 9
NXP Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
11. Legal information
11.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semicond uctors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre va il.
11.3 Disclaimers
General — In formation in this document is believed to be accurate and
reliable. However, NXP Semiconductors d oes not give any repr esentatio ns or
warranties, expressed or impli ed, as to the accuracy or completeness of such
information and shall have no liability for th e co nsequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors product s are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or application s and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ra tings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other co nditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may af fect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sal e, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between inf ormation in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or inte llectual property right s.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
11.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respective ow ners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors BAT54XY
Schottky barrier quadruple diode in very small SOT363 package
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 January 2010
Document identifier: BAT54XY_2
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
13. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Packing information . . . . . . . . . . . . . . . . . . . . . 6
10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
11 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11 .3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9