Rev 1
June 2005 1/9
9
STTH212
High voltage ultrafast diode
Main product characteristics
Features and benefits
■Low forward voltage drop
■High reliability
■High surge current capability
■Soft switching for reduced EMI disturbances
■Planar technology
Description
The STTH212, which is using ST ultrafast high
voltage planar technology, is specially suited for
free-wheeling, clamping, snubbering,
demagnetization in power supplies and other
power switching applications.
Housed in axial, SMB, and SMC packages, this
diode will reduce the losses in high switching
freqency operations.
Order codes
IF(AV) 2 A
VRRM 1200 V
Tj175°C
VF (typ) 1.0 V
trr (max) 75 ns
Part Number Marking
STTH212 STTH212
STTH212RL STTH212
STTH212U U22
STTH212S S12
KA
SMB
STTH212U
SMC
STTH212S
DO-201AD
STTH212
www.st.com
1 Electrical characteristics STTH212
2/9
1 Electrical characteristics
To evaluate the conduction losses use the following equation: P = 1.26 x IF(AV) + 0.12 IF2(RMS)
Table 1. Absolute Ratings (limiting values)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 1200 V
V(RMS) RMS voltage 850 V
IF(AV) Average forward current
δ = 0.5
DO-201AD Tl = 105°C
2ASMB Tl = 90°C
SMC Tl = 105°C
IF(RMS) RMS forward current DO-201AD, SMB, SMC 10 A
IFSM Forward surge current tp = 8.3ms DO-201AD, SMB, SMC 40 A
Tstg Storage temperature range -50 to + 175 °C
TjMaximum operating junction temperature 175 °C
Table 2. Thermal parameters
Symbol Parameter Value Unit
Rth(j-l) Junction to lead
L = 10 mm DO-201AD 20
°C/WSMB 25
SMC 20
Rth(j-a) Junction to ambient L = 10 mm DO-201AD 75 °C/W
Table 3. Static Electrical Characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
IRReverse leakage current
Tj = 25°C
VR = VRRM
10
µA
Tj = 125°C 100
VFForward voltage drop
Tj = 25°C
IF = 2A
1.75
V
Tj = 125°C 1.07 1.50
Tj = 150°C 1.0 -
STTH212 1 Electrical characteristics
3/9
Table 4. Dynamic Electrical Characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
trr Reverse recovery
time Tj = 25°C IF = 1A dIF/dt = -100 A/µs VR =30V 75 ns
tfr Forward recovery
time Tj = 25°C IF = 2A dIF/dt = 50 A/µs
VFR = 1.1 x VFmax
500 ns
VFP Forward recovery
voltage 30 V
Figure 1. Conduction losses versus average
forward current
Figure 2. Forward voltage drop versus
forward current
Figure 3. Relative variation of thermal
impedance junction to ambient
versus pulse duration (Epoxy
printed circuit board FR4,
LLeads = 10mm)
Figure 4. Relative variation of thermal
impedance junction to ambient
versus pulse duration (Epoxy
printed circuit board FR4,
SCU =1cm
2)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50
T
δ
=tp/T tp
I (A)
F(AV)
P(W)
δ= 0.05
δ= 0.1 δ= 0.2
δ= 1
δ= 0.5
0
5
10
15
20
25
30
35
40
45
50
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
I (A)
FM
V (V)
FM
T =125°C
(typical values)
j
T =25°C
(maximum values)
j
T =125°C
(maximum values)
j
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
DO-201AD
Lleads=10mm
Zth(j-a)/Rth(j-a)
tp(s)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
SMB
S
Cu
=1cm²
Zth(j-a)/Rth(j-a)
tp(s)
1 Electrical characteristics STTH212
4/9
Figure 5. Relative variation of thermal
impedance junction to ambient
versus pulse duration (Epoxy
printed circuit board FR4,
SCU =1cm
2)
Figure 6. Reverse recovery current versus
dIF/dt (typical values)
Figure 7. Reverse recovery time versus dIF/dt
(typical values)
Figure 8. Reverse recovery charges versus
dIF/dt (typical values)
Figure 9. Softness factor versus dIF/dt
(typical values)
Figure 10. Relative variations of dynamic
parameters versus junction
temperature
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
SMC
SCu=1cm²
Zth(j-a)/Rth(j-a)
tp(s)
0
1
2
3
4
5
6
7
8
9
10
11
0 20 40 60 80 100 120 140 160 180 200
VR=600V
Tj
=125°C
I
F=2 x I
F(AV )
I
F=2 x I
F(AV )
I
F=0.5 xI
F(AV )
I
F=0.5 xI
F(AV )
I
F=I
F(AV )
I
F=I
F(AV )
I (A)
RM
dl /dt(A/µs)
F
0
100
200
300
400
500
600
700
800
900
0 50 100 150 200 250 300 350 400 450 500
VR
=600V
Tj=125°C
IF
=0.5 x I
F(AV)
IF
=2 x I
F(AV)
IF
=I
F(AV)
IF
=I
F(AV)
trr(ns)
dl /dt(A/µs)
F0
200
400
600
800
1000
1200
1400
0 50 100 150 200 250 300 350 400 450 500
Qrr(nC)
VR=600V
Tj
=125°C
I
F=I
F(AV )
I
F=0.5 x I
F(AV )
I
F=2 x I
F(AV )
dl /dt(A/µs)
F
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0 25 50 75 100 125 150 175 200 225 250
SFACTOR
I
F=I
F(AV )
VR=600V
Tj
=125°C
dl /dt(A/µs)
F0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
25 50 75 100 125
Tj(°C)
I
RM
QRR
SFA C TO R
I
F=I
F(AV )
VR=600V
Reference:Tj
=125°C
STTH212 1 Electrical characteristics
5/9
Figure 11. Transient peak forward voltage
versus dIF/dt (typical values)
Figure 12. Forward recovery time versus dIF/dt
(typical values)
Figure 13. Junction capacitance versus
reverse voltage applied (typical
values)
Figure 14. Thermal resistance versus lead
length
Figure 15. Thermal resistance junction to
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, eCU = 35µm)
Figure 16. Thermal resistance junction to
ambient versus copper surface
under each lead (Epoxy printed
circuit board FR4, ecu = 35 µm)
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
0 102030405060708090100
V (V)
FP
I
F=I
F(AV )
Tj
=125°C
dl /dt(A/µs)
F200
220
240
260
280
300
320
340
360
380
400
420
0 20 40 60 80 100
t (ns)
FR
I
F=I
F(AV )
VFR =1.1 x VFmax.
Tj
=125°C
dl /dt(A/µs)
F
1
10
100
1 10 100 1000
C(pF)
V (V)
R
F=1MHz
Vosc=30mVRMS
Tj=25°C
0
10
20
30
40
50
60
70
80
90
100
5 10152025
R (°C/W)
th(j-a)
L (mm)
Leads
DO201-AD
R
th(j-a)
R
th(j-l)
0
10
20
30
40
50
60
70
80
012345678910
R (°C/W)
th(j-a)
S (cm )
Cu 2
DO-201AD
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm )
Cu 2
SMB
SMC
2 Package mechanical data STTH212
6/9
2 Package mechanical data
Table 5. SMB dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.41 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.60 0.030 0.063
Figure 17. SMB references to dimensions
table
Figure 18. SMB footprint dimensions
(in millimetres)
E
CL
E1
D
A1
A2
b
1.64
6.10
2.23
2.30
2.23
STTH212 2 Package mechanical data
7/9
Note: 1 The lead diameter D is not controlled over zone E.
2 The minimum length which must stay straight between the right angles after bending is 15 mm
(0.59 inch).
Table 6. SMC dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 2.90 3.2 0.114 0.126
c 0.15 0.41 0.006 0.016
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
D 5.55 6.25 0.218 0.246
L 0.75 1.60 0.030 0.063
Figure 19. SMC references to dimensions
table
Figure 20. SMC footprint dimensions
(in millimetres)
Table 7. DO-201AD dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A - 9.5 - 0.37
B 25.4 - 1.00 -
C - 5.3 - 0.21
D - 1.3 - 0.051
E - 1.25 - 0.048
E
CLE2
E1
D
A1
A2
b
4.25
8.65
2.20
3.30
2.20
ØC
ØD
A
EE
Note 2
Note 1 Note 1
BB
3 Ordering information STTH212
8/9
3 Ordering information
4 Revision history
Part Number Marking Package Weight Base qty Delivery mode
STTH212 STTH212 DO-201AD 1.12 g 600 Ammopack
STTH212RL STTH212 1900 Tape & reel
STTH212U U22 SMB 0.11 g 2500 Tape & reel
STTH212S S12 SMC 0.243 g 2500 Tape & reel
Date Revision Description of Changes
28-Jun-2005 1 First issue.
STTH212 4 Revision history
9/9
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