74AHC1G14GW,125 - NXP Semiconductors / Philips Semiconductors

1. General description

74AHC1G14 and 74AHCT1G14 are high-speed Si-gate CMOS devices. They provide an

inverting buffer function with Schmitt trigger action. These devices are capable of

transforming slowly changing input signals into sharply deﬁned, jitter-free output signals.

The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V.

The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.

2. Features

nSymmetrical output impedance

nHigh noise immunity

nESD protection:

uHBM JESD22-A114E: exceeds 2000 V

uMM JESD22-A115-A: exceeds 200 V

uCDM JESD22-C101C: exceeds 1000 V

nLow power dissipation

nBalanced propagation delays

nSOT353-1 and SOT753 package options

nSpeciﬁed from −40 °C to +125 °C

3. Applications

nWave and pulse shapers

nAstable multivibrators

nMonostable multivibrators

4. Ordering information

74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

Rev. 06 — 18 May 2009 Product data sheet

Table 1. Ordering information

Type number Package

Temperature range Name Description Version

74AHC1G14GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads;

body width 1.25 mm SOT353-1

74AHCT1G14GW

74AHC1G14GV −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753

74AHCT1G14GV

Product data sheet Rev. 06 — 18 May 2009 2 of 15

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

5. Marking

6. Functional diagram

7. Pinning information

7.1 Pinning

7.2 Pin description

Table 2. Marking codes

Type number Marking code

74AHC1G14GW AF

74AHCT1G14GW CF

74AHC1G14GV A14

74AHCT1G14GV C14

Fig 1. Logic symbol Fig 2. IEC logic symbol Fig 3. Logic diagram

mna023

2424

mna024 mna025

Fig 4. Pin conﬁguration

74AHC1G14

74AHCT1G14

n.c. VCC

GND Y

001aaf087

Table 3. Pin description

Symbol Pin Description

n.c. 1 not connected

A 2 data input

GND 3 ground (0 V)

Y 4 data output

VCC 5 supply voltage

Product data sheet Rev. 06 — 18 May 2009 3 of 15

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

8. Functional description

9. Limiting values

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

[2] For both TSSOP5 and SC-74A packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K.

10. Recommended operating conditions

Table 4. Function table

H = HIGH voltage level; L = LOW voltage level

Input Output

A Y

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage −0.5 +7.0 V

VIinput voltage −0.5 +7.0 V

IIK input clamping current VI < −0.5 V −20 - mA

IOK output clamping current VO < −0.5 V or VO>V

CC + 0.5 V [1] -±20 mA

IOoutput current −0.5 V < VO <V

CC + 0.5 V - ±25 mA

ICC supply current - 75 mA

IGND ground current −75 - mA

Tstg storage temperature −65 +150 °C

Ptot total power dissipation Tamb = −40 °C to +125 °C[2] - 250 mW

Table 6. Recommended operating conditions

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 74AHC1G14 74AHCT1G14 Unit

Min Typ Max Min Typ Max

VCC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V

VIinput voltage 0 - 5.5 0 - 5.5 V

VOoutput voltage 0 - VCC 0-V

CC V

Tamb ambient temperature −40 +25 +125 −40 +25 +125 °C

Product data sheet Rev. 06 — 18 May 2009 4 of 15

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

11. Static characteristics

Table 7. Static characteristics

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit

Min Typ Max Min Max Min Max

For type 74AHC1G14

VOH HIGH-level

output voltage VI= VT+ or VT−

IO=−50 µA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V

IO=−50 µA; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V

IO=−50 µA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V

IO=−4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V

IO=−8.0 mA; VCC = 4.5 V 3.94 - - 3.8 - 3.70 - V

VOL LOW-level

output voltage VI= VT+ or VT−

IO= 50 µA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V

IO= 50 µA; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V

IO= 50 µA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V

IO= 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V

IO= 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V

IIinput leakage

current VI= 5.5 Vor GND;

VCC = 0 V to 5.5 V - - 0.1 - 1.0 - 2.0 µA

ICC supply current VI=V

CC or GND; IO = 0 A;

VCC = 5.5 V - - 1.0 - 10 - 40 µA

CIinput

capacitance - 1.5 10 - 10 - 10 pF

For type 74AHCT1G14

VOH HIGH-level

output voltage VI= VT+ or VT−; VCC = 4.5 V

IO=−50 µA 4.4 4.5 - 4.4 - 4.4 - V

IO=−8.0 mA 3.94 - - 3.8 - 3.70 - V

VOL LOW-level

output voltage VI= VT+ or VT−; VCC = 4.5 V

IO= 50 µA - 0 0.1 - 0.1 - 0.1 V

IO= 8.0 mA - - 0.36 - 0.44 - 0.55 V

IIinput leakage

current VI= 5.5 Vor GND;

VCC = 0 V to 5.5 V - - 0.1 - 1.0 - 2.0 µA

ICC supply current VI=V

CC or GND; IO = 0 A;

VCC = 5.5 V - - 1.0 - 10 - 40 µA

∆ICC additional

supply current per input pin; VI= 3.4 V;

other inputs at VCC or GND;

IO= 0 A; VCC = 5.5 V

- - 1.35 - 1.5 - 1.5 mA

CIinput

capacitance - 1.5 10 - 10 - 10 pF

Product data sheet Rev. 06 — 18 May 2009 5 of 15

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

11.1 Transfer characteristics

Table 8. Transfer characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Figure 7 and Figure 8.

Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit

Min Typ Max Min Max Min Max

For type 74AHC1G14

VT+ positive-going

threshold

voltage

VCC = 3.0 V - - 2.2 - 2.2 - 2.2 V

VCC = 4.5 V - - 3.15 - 3.15 - 3.15 V

VCC = 5.5 V - - 3.85 - 3.85 - 3.85 V

VT−negative-going

threshold

voltage

VCC = 3.0 V 0.9 - - 0.9 - 0.9 - V

VCC = 4.5 V 1.35 - - 1.35 - 1.35 - V

VCC = 5.5 V 1.65 - - 1.65 - 1.65 - V

VHhysteresis

voltage VCC = 3.0 V 0.3 - 1.2 0.3 1.2 0.25 1.2 V

VCC = 4.5 V 0.4 - 1.4 0.4 1.4 0.35 1.4 V

VCC = 5.5 V 0.5 - 1.6 0.5 1.6 0.45 1.6 V

For type 74AHCT1G14

VT+ positive-going

threshold

voltage

VCC = 4.5 V - - 2.0 - 2.0 - 2.0 V

VCC = 5.5 V - - 2.0 - 2.0 - 2.0 V

VT−negative-going

threshold

voltage

VCC = 4.5 V 0.5 - - 0.5 - 0.5 - V

VCC = 5.5 V 0.6 - - 0.6 - 0.6 - V

VHhysteresis

voltage VCC = 4.5 V 0.4 - 1.4 0.4 1.4 0.35 1.4 V

VCC = 5.5 V 0.4 - 1.6 0.4 1.6 0.35 1.6 V

Product data sheet Rev. 06 — 18 May 2009 6 of 15

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

12. Dynamic characteristics

[1] tpd is the same as tPLH and tPHL.

[2] Typical values are measured at VCC = 3.3 V.

[3] Typical values are measured at VCC = 5.0 V.

[4] CPD is used to determine the dynamic power dissipation PD(µW).

PD=C

PD ×VCC2×fi+∑(CL×VCC2×fo) where:

fi= input frequency in MHz;

fo= output frequency in MHz;

CL= output load capacitance in pF;

VCC = supply voltage in Volts.

Table 9. Dynamic characteristics

GND = 0 V; t

= t

≤

3.0 ns. For waveform see Figure 5. For test circuit see Figure 6.

Symbol Parameter Conditions 25 °C−40 °C to +85 °C−40 °C to +125 °C Unit

Min Typ Max Min Max Min Max

For type 74AHC1G14

tpd propagation

delay A to Y; [1]

VCC = 3.0 V to 3.6 V [2]

CL= 15 pF - 4.2 12.8 1.0 15.0 1.0 16.5 ns

CL= 50 pF - 6.0 16.3 1.0 18.5 1.0 20.5 ns

VCC = 4.5 V to 5.5 V [3]

CL= 15 pF - 3.2 8.6 1.0 10.0 1.0 11.0 ns

CL= 50 pF - 4.6 10.6 1.0 12.0 1.0 13.5 ns

CPD power

dissipation

capacitance

per buffer;

CL=50pF;f=1 MHz;

VI= GND to VCC

[4] -12- - - - - pF

For type 74AHCT1G14

tpd propagation

delay A to Y;

VCC = 4.5 V to 5.5 V [1]

[3]

CL= 15 pF - 4.1 7.0 1.0 8.0 1.0 9.0 ns

CL= 50 pF - 5.9 8.5 1.0 10.0 1.0 11.0 ns

CPD power

dissipation

capacitance

per buffer;

VI= GND to VCC

[4] -13- - - - - pF

Product data sheet Rev. 06 — 18 May 2009 7 of 15

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

13. Waveforms

13.1 Transfer characteristic waveforms

The test data is given in Table 10 Test data is given in Table 9.

Deﬁnitions for test circuit:

CL = Load capacitance.

RT = Termination resistance should be equal to output

impedance Zo of the pulse generator.

Fig 5. The input (A) to output (Y) propagation delays Fig 6. Load circuitry for switching times

mna033

A input

Y output

tPHL tPLH

mna101

VCC

VIVO

RTCL

PULSE

GENERATOR DUT

Table 10. Test data

Type number Input Output

VIVMVM

74AHC1G14 GND to VCC 0.5 ×VCC 0.5 ×VCC

74AHCT1G14 GND to 3.0 V 1.5 V 0.5 ×VCC

Fig 7. Transfer characteristic Fig 8. The deﬁnitions of VT+, VT− and VH

mna026

VHVI

VT−VT+

mna027

VIVH

VT+

VT−

Product data sheet Rev. 06 — 18 May 2009 8 of 15

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

Fig 9. Typical 74AHC1G14 transfer characteristics;

VCC = 3.0 V Fig 10. Typical 74AHC1G14 transfer characteristics;

VCC = 4.5 V

001 3

1.5

0.5

mna401

2VI (V)

ICC

(mA)

VI (V)

ICC

(mA)

mna402

1234

Fig 11. Typical 74AHC1G14 transfer characteristics; VCC = 5.5 V

02 6

mna403

4VI (V)

ICC

(mA)

Product data sheet Rev. 06 — 18 May 2009 9 of 15

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

14. Application information

The slow input rise and fall times cause additional power dissipation, which can be

calculated using the following formula:

Padd =f

i×(tr×∆ICC(AV) +t

f×∆ICC(AV))×VCC where:

Padd = additional power dissipation (µW);

fi= input frequency (MHz);

tr= input rise time (ns); 10 % to 90 %;

tf= input fall time (ns); 90 % to 10 %;

∆ICC(AV) = average additional supply current (µA).

Average additional ICC differs with positive or negative input transitions, as shown in

Figure 14 and Figure 15.

For 74AHC1G14 and 74AHCT1G14 used in relaxation oscillator circuit, see Figure 16.

Note to the application information:

1. All values given are typical unless otherwise speciﬁed.

Fig 12. Typical 74AHCT1G14 transfer characteristics;

VCC = 4.5 V Fig 13. Typical 74AHCT1G14 transfer characteristics;

VCC = 5.5 V

VI (V)

ICC

(mA)

mna404

1234 02 6

mna405

4VI (V)

ICC

(mA)

Product data sheet Rev. 06 — 18 May 2009 10 of 15

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

Fig 14. Average additional ICC for 74AHC1G14 Schmitt

trigger devices; linear change of VI between

0.1VCC to 0.9VCC

Fig 15. Average additional ICC for 74AHCT1G14

Schmitt trigger devices; linear change of VI

between 0.1VCC to 0.9VCC

mna036

0 2.0 4.0 6.0

VCC (V)

200

150

100

∆ICC(AV)

(µA)

positive-going

edge

negative-going

edge

mna058

0462VCC (V)

200

100

150

∆ICC(AV)

(µA)

positive-going

edge

negative-going

edge

For 74AHC1G14:

For 74AHCT1G14:

Fig 16. Relaxation oscillator using the 74AHC1G14 and 74AHCT1G14

mna035

--- 1

0.55 RC×

-------------------------

≈=

--- 1

0.60 RC×

-------------------------

≈=

Product data sheet Rev. 06 — 18 May 2009 11 of 15

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

15. Package outline

Fig 17. Package outline SOT353-1 (TSSOP5)

UNIT A1

max. A2A3bpLHELpwyv

ceD(1) E(1) Z(1) θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.1

01.0

0.8 0.30

0.15 0.25

0.08 2.25

1.85 1.35

1.15 0.65

1.3 2.25

2.0 0.60

0.15 7°

0°

0.1 0.10.30.425

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

0.46

0.21

SOT353-1 MO-203 SC-88A 00-09-01

03-02-19

0.15

(A3)

detail X

vMA

1.5 3 mm0

scale

TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1

1.1

Product data sheet Rev. 06 — 18 May 2009 12 of 15

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

Fig 18. Package outline SOT753 (SC-74A)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT753 SC-74A

wBM

detail X

vMA

0 1 2 mm

scale

132

Plastic surface-mounted package; 5 leads SOT753

UNIT A1bpcDEHELpQywv

mm 0.100

0.013 0.40

0.25 3.1

2.7

0.26

0.10 1.7

1.3

0.95 3.0

2.5 0.2 0.10.2

DIMENSIONS (mm are the original dimensions)

0.6

0.2 0.33

0.23

1.1

0.9

02-04-16

06-03-16

Product data sheet Rev. 06 — 18 May 2009 13 of 15

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

16. Abbreviations

17. Revision history

Table 11. Abbreviations

Acronym Description

CDM Charged Device Model

CMOS Complementary Metal-Oxide Semiconductor

DUT Device Under Test

ESD ElectroStatic Discharge

HBM Human Body Model

MM Machine Model

TTL Transistor-Transistor Logic

Table 12. Revision history

Document ID Release date Data sheet status Change notice Supersedes

74AHC_AHCT1G14_6 20090518 Product data sheet - 74AHC_AHCT1G14_5

Modiﬁcations: •Table 7: the conditions for HIGH-level output voltage and LOW-level output voltage have

been changed.

74AHC_AHCT1G14_5 20070629 Product data sheet - 74AHC_AHCT1G14_4

74AHC_AHCT1G14_4 20020528 Product speciﬁcation - 74AHC_AHCT1G14_3

74AHC_AHCT1G14_3 20020218 Product speciﬁcation - 74AHC_AHCT1G14_2

74AHC_AHCT1G14_2 20010222 Product speciﬁcation - 74AHC_AHCT1G14_1

74AHC_AHCT1G14_1 19990805 Product speciﬁcation - -

Product data sheet Rev. 06 — 18 May 2009 14 of 15

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

18. Legal information

18.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

18.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

18.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

18.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

19. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Deﬁnition

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.

Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.

Product [short] data sheet Production This document contains the product speciﬁcation.

NXP Semiconductors 74AHC1G14; 74AHCT1G14

Inverting Schmitt trigger

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 18 May 2009

Document identifier: 74AHC_AHCT1G14_6

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

20. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

5 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2

8 Functional description . . . . . . . . . . . . . . . . . . . 3

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

10 Recommended operating conditions. . . . . . . . 3

11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4

11.1 Transfer characteristics. . . . . . . . . . . . . . . . . . . 5

12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6

13 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

13.1 Transfer characteristic waveforms. . . . . . . . . . . 7

14 Application information. . . . . . . . . . . . . . . . . . . 9

15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11

16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13

17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13

18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14

18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14

18.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

18.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 14

18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14

19 Contact information. . . . . . . . . . . . . . . . . . . . . 14

20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15