FDG6324L - ON SEMICONDUCTOR - Datasheet.Company

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June 1999

FDG6324L

Integrated Load Switch

General Description Features

Absolute Maximum Ratings TA = 25°C unless otherwise noted

Symbol Parameter FDG6324LUnits

VIN Input Voltage Range 3 - 20 V

VON/OFF On/Off Voltage Range 2.5 - 8 V

I L Load Current - Continuous (Note 1) 0.6 A

- Pulsed (Note 1 & 3) 1.8

PDMaximum Power Dissipation (Note 2) 0.3 W

TJ,TSTG Operating and Storage Temperature Range -55 to 150 °C

ESD Electrostatic Discharge Rating

Human Body Model (100pf/1500Ohm) 6kV

THERMAL CHARACTERISTICS

RθJA Thermal Resistance, Junction-to-Ambient (Note 2) 415 °C/W

FDG6324L Rev.D

This device is intended to be configured as a load switch and

is particularly suited for compact computer peripheral

switching applications where 3V to 20V input and 0.6A output

current capability are needed. This device features a small

N-Channel MOSFET (Q1) together with a large P-Channel

Power MOSFET (Q2) in a single SC70-6 package.

VDROP=0.2V @ VIN=12V, IL=0.36A. R(ON) = 0.55Ω. VDROP=0.2V @

VIN=5V, IL=0.27A. R(ON) = 0.75Ω.

Very small package outline (SC70-6).

Control MOSFET (Q1) includes Zener protection for ESD

ruggedness (>6KV Human Body Model).

High density cell design for extremely low on-resistance.

See Application Circuit

4V , C

OUT 1

V , R

IN 1

ON/OFF

R , C1

V , COUT 1IN OUT

ON/OFF

EQUIVALENT APPLICATION

VDROP

pin 1

SC70-6

.24

SOT-23 SuperSOTTM-8 SO-8 SOT-223

SC70-6 SuperSOTTM-6

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter Conditions Min Typ Max Units

OFF CHARACTERISTICS

IFL Forward Leakage Current VIN = 20 V, VON/OFF = 0 V 1µA

ON CHARACTERISTICS (Note 3)

VDROP Conduction Voltage Drop VIN = 12 V, VON/OFF = 3.3 V, IL = 0.36 A 0.14 0.2 V

VIN = 5 V, VON/OFF = 3.3 V, IL = 0.27 A 0.16 0.2

R(ON) Q2 - Static On-Resistance VGS = -12 V, ID = -0.6 A0.37 0.55 Ω

VGS = -5 V, ID = -0.5 A 0.58 0.75

ILLoad Current VDROP = 0.2 V, VIN = 12 V, VON/OFF = 3.3 V 0.36 A

VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V 0.27

Notes:

1. Range of Vin can be up to 25V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -20V.

2. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is

guaranteed by design while RθCA is determined by the user's board design. Thermal ratings based on minimum mounting pad.

3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%

FDG6324L Load Switch Application

External Component Recommendation

For Co ≤ 1uF applications:

R1 is required to turn Q2 off.

R2 and C1 are optional for slew rate control.

First select R2, 100 -1KΩ, for slew rate control.

Then select R1 such that the ratio R1/R2 is maintained between 10-100.

SPICE model (FDG6324L.MOD) available at www.fairchildsemi.com.

FDG6324L Rev.D

APPLICATION CIRCUIT

IN OUT

LOAD

ON/OFF

Q1 Co

FDG6324L Rev.D

Typical Electrical Characteristics (TA = 25 OC unless otherwise noted )

00.5 11.5 2

0.2

0.4

0.6

0.8

1.2

I , (A)

V , (V)

DROP

V = 12V

V = 2.5 - 8V

PW =300us, D≤ 2%

ON/OFF

T = 125°C

T = 25°C

00.4 0.8 1.2 1.6 2

0.3

0.6

0.9

1.2

I , (A)

V , (V)

DROP

V = 5V

V = 2.5 - 8V

PW =300us, D≤ 2%

ON/OFF

T = 125°C

T = 25°C

2 4 6 8 10 12

0.3

0.6

0.9

1.2

1.5

V , (V)

R ,(Ohm)

I = 0.5A

V = 2.5 - 8V

PW =300us, D≤ 2%

ON/OFF

(ON)

T = 125°C

25°C

Figure 1. Conduction Voltage Drop

Variation with Load Current. Figure 2. Conduction Voltage Drop

Variation with Load Current.

Figure 4. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in Note

2. Transient thermal response will change depending on the circuit board

0.0001 0.001 0.01 0.1 1 10 100 200

0.002

0.005

0.01

0.02

0.05

0.1

0.2

0.5

t , TIME (sec)

TRANSIENT THERMAL RESISTANCE

r(t), NORMALIZED EFFECTIVE

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t / t

1 2

T - T = P * R (t)

P(pk)

1 t 2

θJA

R (t) = r(t) * R

R =415 °C/W

θJA

Figure 3. On-Resistance Variation

with Input Voltage.

TRADEMARKS

ACEx™

CoolFET™

CROSSVOLT™

E2CMOSTM

FACT™

FACT Quiet Series™

FAST®

FASTr™

GTO™

HiSeC™

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is

not intended to be an exhaustive list of all such trademarks.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORA TION.

As used herein:

1. Life support devices or systems are devices or

systems which, (a) are intended for surgical implant into

the body, or (b) support or sustain life, or (c) whose

failure to perform when properly used in accordance

with instructions for use provided in the labeling, can be

reasonably expected to result in significant injury to the

user.

2. A critical component is any component of a life

support device or system whose failure to perform can

be reasonably expected to cause the failure of the life

support device or system, or to affect its safety or

effectiveness.

PRODUCT ST A TUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information

Preliminary

No Identification Needed

Obsolete

This datasheet contains the design specifications for

product development. Specifications may change in

any manner without notice.

This datasheet contains preliminary data, and

supplementary data will be published at a later date.

Fairchild Semiconductor reserves the right to make

changes at any time without notice in order to improve

design.

This datasheet contains final specifications. Fairchild

Semiconductor reserves the right to make changes at

any time without notice in order to improve design.

This datasheet contains specifications on a product

that has been discontinued by Fairchild semiconductor.

The datasheet is printed for reference information only.

Formative or

In Design

First Production

Full Production

Not In Production

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER

NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD

DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT

OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS P ATENT

RIGHTS, NOR THE RIGHTS OF OTHERS.

TinyLogic™

UHC™

VCX™

ISOPLANAR™

MICROWIRE™

POP™

PowerTrench™

QFET™

QS™

Quiet Series™

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

www.onsemi.com

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ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent

coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.

ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,

regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification

in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized

application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and

expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such

claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This

literature is subject to all applicable copyright laws and is not for resale in any manner.

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