SN54HC244, SN74HC244
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Wide Operating Voltage Range of 2 V to 6 V
D
High-Current Outputs Drive Up To
15 LSTTL Loads
D
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
D
Low Power Consumption, 80-µA Max ICC
D
Typical tpd = 11 ns
D
±6-mA Output Drive at 5 V
D
Low Input Current of 1 µA Max
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
SN54HC244 ...J OR W PACKAGE
SN74HC244 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
1Y1
2A4
1Y2
2A3
1Y3
1A2
2Y3
1A3
2Y2
1A4
SN54HC244 . . . FK PACKAGE
(TOP VIEW)
2Y4
1A1
1OE
1Y4
2A2 2OE
2Y1
GND
2A1 VCC
description/ordering information
These octal buffers and line drivers are designed specifically to improve both the performance and density of
3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HC244
devices are organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low,
the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
–40 C to 85 C
PDIP – N T ube of 20 SN74HC244N SN74HC244N
–40 C to 85 C
SOIC – DW
T ube of 25 SN74HC244DW
HC244
–40 C to 85 C
SOIC – DW
Reel of 2000 SN74HC244DWR
HC244
–40
°
C to 85
°
C
SOP – NS Reel of 2000 SN74HC244NSR HC244
–40°C to 85°C
SSOP – DB Reel of 2000 SN74HC244DBR HC244
TSSOP – PW
T ube of 70 SN74HC244PW
HC244
TSSOP – PW
Reel of 2000 SN74HC244PWR
HC244
Reel of 250 SN74HC244PWT
–55 C to 125 C
CDIP – J T ube of 20 SNJ54HC244J SNJ54HC244J
–55
°
C to 125
°
C
CFP – W T ube of 85 SNJ54HC244W SNJ54HC244W
LCCC – FK T ube of 55 SNJ54HC244FK SNJ54HC244FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54HC244, SN74HC244
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
(each buffer/driver)
INPUTS
OUTPUT
OE A
OUTPUT
Y
L H H
LLL
H X Z
logic diagram (positive logic)
1
2
4
6
8
19
11
13
15
17 3
5
7
9
12
14
16
18 1Y1 2Y1
1Y2
1Y3
1Y4
2Y2
2Y3
2Y4
2OE
1OE
2A1
2A2
2A3
2A4
1A1
1A2
1A3
1A4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±35 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±70 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 69°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
SN54HC244, SN74HC244
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 3)
SN54HC244 SN74HC244
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 2 5 6 2 5 6 V
V
High-level input voltage
VCC = 2 V 1.5 1.5
V
VIH
High-level input voltage
VCC = 4.5 V 3.15 3.15
V
IH
VCC = 6 V 4.2 4.2
V
Low-level input voltage
VCC = 2 V 0.5 0.5
V
VIL
Low-level input voltage
VCC = 4.5 V 1.35 1.35
V
IL
VCC = 6 V 1.8 1.8
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
t/ v
Input transition rise/fall time
VCC = 2 V 1000 1000
ns
∆
t/
∆
v
Input transition rise/fall time
VCC = 4.5 V 500 500
ns
VCC = 6 V 400 400
TAOperating free-air temperature –55 125 –40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54HC244 SN74HC244
UNIT
PARAMETER
TEST CONDITIONS
VCC
MIN TYP MAX MIN MAX MIN MAX
UNIT
V
I = –20 A
2 V 1.9 1.998 1.9 1.9
V
V
IOH = –20
µ
A
4.5 V 4.4 4.499 4.4 4.4
V
VOH
OH
6 V 5.9 5.999 5.9 5.9
V
OH
IOH = –6 mA 4.5 V 3.98 4.3 3.7 3.84
IOH = –7.8 mA 6 V 5.48 5.8 5.2 5.34
V
I = 20 A
2 V 0.002 0.1 0.1 0.1
V
V
IOL = 20
µ
A
4.5 V 0.001 0.1 0.1 0.1
V
VOL
OL
6 V 0.001 0.1 0.1 0.1
V
OL
IOL = 6 mA 4.5 V 0.17 0.26 0.4 0.33
IOL = 7.8 mA 6 V 0.15 0.26 0.4 0.33
IIVI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
IOZ VO = VCC or 0, VI = VIH or VIL 6 V ±0.01 ±0.5 ±10 ±5µA
ICC VI = VCC or 0, IO = 0 6 V 8 160 80 µA
Ci2 V to 6 V 3 10 10 10 pF
SN54HC244, SN74HC244
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC244 SN74HC244
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
MIN TYP MAX MIN MAX MIN MAX
UNIT
t
A
Y
2 V 40 115 170 145
ns
tpd
A
Y
4.5 V 13 23 34 29
ns
pd
6 V 11 20 29 25
t
OE
Y
2 V 75 150 225 190
ns
ten
OE
Y
4.5 V 15 30 45 38
ns
en
6 V 13 26 38 32
t
OE
Y
2 V 75 150 225 190
ns
tdis
OE
Y
4.5 V 15 30 45 38
ns
dis
6 V 13 26 38 32
t
Y
2 V 28 60 90 75
ns
tt
Y
4.5 V 8 12 18 15
ns
t
6 V 6 10 15 13
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC244 SN74HC244
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
MIN TYP MAX MIN MAX MIN MAX
UNIT
t
A
Y
2 V 56 165 245 210
ns
tpd
A
Y
4.5 V 18 33 49 42
ns
pd
6 V 15 28 42 35
t
OE
Y
2 V 100 200 300 250
ns
ten
OE
Y
4.5 V 20 40 60 50
ns
en
6 V 17 34 51 43
t
Y
2 V 45 210 315 265
ns
tt
Y
4.5 V 17 42 63 53
ns
t
6 V 13 36 53 45
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per buffer/driver No load 35 pF
SN54HC244, SN74HC244
OCTAL BUFFERS AND LINE DRIVERS
WITH 3-STATE OUTPUTS
SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
50%50% 10%10% 90% 90% VCC
0 V
trtf
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50% 10%10% 90% 90%
VCC
VOH
VOL
0 V
trtf
Input
In-Phase
Output
50%
tPLH tPHL
50% 50%
10% 10% 90%90% VOH
VOL
tr
tf
tPHL tPLH
Out-of-Phase
Output
50%
10%
90%
VCC
≈VCC
VOL
0 V
Output
Control
(Low-Level
Enabling)
Output
W aveform 1
(See Note B)
50%
tPZL tPLZ
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
VOH
≈0 V
50%
50%
tPZH tPHZ
Output
W aveform 2
(See Note B)
≈VCC
Test
Point
From Output
Under Test
CL
(see Note A)
RL
V
CC
S1
S2
LOAD CIRCUIT
PARAMETER CL
tPZH
tpd or tt
tdis
ten tPZL
tPHZ
tPLZ
1 kΩ
1 kΩ
50 pF
or
150 pF
50 pF
Open Closed
RLS1
Closed Open
S2
Open Closed
Closed Open
50 pF
or
150 pF Open Open––
NOTES: A. CL includes probe and test-fixture capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily . All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-8409601VRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
5962-8409601VSA ACTIVE CFP W 20 25 TBD Call TI N / A for Pkg Type
84096012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
8409601RA ACTIVE CDIP J 20 1 TBD Call TI Call TI
8409601SA ACTIVE CFP W 20 1 TBD Call TI Call TI
JM38510/65705B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/65705BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
JM38510/65705BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
M38510/65705B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
M38510/65705BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
M38510/65705BSA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
SN54HC244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SN74HC244ADBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI
SN74HC244APWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI
SN74HC244DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI
SN74HC244DBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244DWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74HC244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC244N3 OBSOLETE PDIP N 20 TBD Call TI Call TI
SN74HC244NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC244NSR ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244NSRE4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244PW ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI
SN74HC244PWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244PWT ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244PWTG4 ACTIVE TSSOP PW 20 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC244QDWRG4Q1 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54HC244FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54HC244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SNJ54HC244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2012
Addendum-Page 3
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC244, SN54HC244-SP, SN74HC244 :
•Catalog: SN74HC244, SN54HC244
•Automotive: SN74HC244-Q1, SN74HC244-Q1
•Enhanced Product: SN74HC244-EP, SN74HC244-EP
•Military: SN54HC244
•Space: SN54HC244-SP
NOTE: Qualified Version Definitions:
PACKAGE OPTION ADDENDUM
www.ti.com 28-Aug-2012
Addendum-Page 4
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC244DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74HC244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1
SN74HC244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74HC244NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1
SN74HC244PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
SN74HC244PWT TSSOP PW 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC244DBR SSOP DB 20 2000 367.0 367.0 38.0
SN74HC244DWR SOIC DW 20 2000 600.0 144.0 84.0
SN74HC244DWR SOIC DW 20 2000 367.0 367.0 45.0
SN74HC244NSR SO NS 20 2000 367.0 367.0 45.0
SN74HC244PWR TSSOP PW 20 2000 367.0 367.0 38.0
SN74HC244PWT TSSOP PW 20 250 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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