ACCOUNT PRODUCTS SOLUTIONS SUPPORT ABOUT ALL Package : LFBGA356 LFBGA356 plastic, low profile fine-pitch ball grid array 356 bumps 0.8 mm pitch 17 mm x 17 mm x 1.54 mm body 4M FLASH, 1.5M RAM, Automotive Qualified Operating Characteristics CART Search... SPC5775KK2MMY3A Buy Options ENGLISH Environmental Information Quality Information Shipping Information Buy Options SPC5775KK2MMY3AActiveTRAY-Tray, Bakeable, Multiple in Drypack 935313243557 Distributor Min. Package Quantity: 90 Lead Time: 20 weeks SPC5775KK2MMY3ARActiveREEL-Reel 13" Q1/T1 in Drypack Distributor Min. Package Quantity: 1000 Lead Time: 20 weeks 935313243518 Operating Characteristics Parameter Value Description 4M FLASH, 1.5M RAM, Automotive Qualified Environmental Information PbFree EU RoHS Halogen Free RHF Indicator 2nd Level Interconnect REACH SVHC Weight (mg) SPC5775KK2MMY3A (935313243557) Yes Yes Certificate Of Analysis (CoA) Yes D e2 REACH SVHC 1385.5 SPC5775KK2MMY3AR (935313243518) Yes Yes Certificate Of Analysis (CoA) Yes D e2 REACH SVHC 1385.5 Material Declaration Quality Information Material Declaration Safe Assure Functional Safety Moisture Sensitivity Level (MSL) Peak Package Body Temperature (PPT) (C) Maximum Time at Peak Temperatures (s) Lead Free Soldering Lead Free Soldering Lead Free Soldering SPC5775KK2MMY3A (935313243557) ISO 26262 3 260 40 SPC5775KK2MMY3AR (935313243518) ISO 26262 3 260 40 Shipping Information Part Number Harmonized Tariff (US) Disclaimer Export Control Classification Number (US) SPC5775KK2MMY3A (935313243557) 854231 3A991A2 SPC5775KK2MMY3AR (935313243518) 854231 3A991A2 ABOUT NXP RESOURCES Investors Mobile Apps Press, News, Blogs Contact Us Careers Privacy | Terms of Use | Terms of Sale | Feedback FOLLOW US News 12 Dec 2017 NXP and Alibaba Cloud Announce Strategic Partnership for Edge Computing and IoT Security Read More (c)2006-2017 NXP Semiconductors. All rights reserved.