All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
SPECIFICATIONS Board to Board Connector
QT8H series
0.80mm [.031”] Pitch
Right Angle, Receptacle
for Slim type ODD application
Mated with QT8G series
Mechanical
Mating Force: 90gf max. per Contact
Unmating Force: 10gf min. per Contact
Durability: 100 Cycles
Electrical
Current Rati ng: 0.5A DC
Contact Resistance: 75m
Ω
max.(initial) , 85m
Ω
max.(after)
Dielectrical Withstanding V oltage: 300V
Insulation Resistance: 500M
Ω
min.(initial) , 100 M
Ω
min.(after)
Physical
Housing: LCP, UL 94V-0 in Ivory White Color
Contact: Phosphor Bronze
Plating: 50u” min. Nickel Base Plat ing
10u” min. Gold Plating on Contact Area
100u” min Tin/Lead on Solder Tail Area
Metal Ear: Brass
Operatin g Temperat ure: -55
℃
to +85
℃
DRAWING
ORDERING INFORMATION
Lock Type
=W/ Board-Lock
1=W/ Screw
2=W/ B/L&Screw
Package
0=Tray
Profile Height:
Contact Area Plating:
6=10u" Gold Min.
Contact Solder Type
1=Through Hole Type
Board To Board Conn.
8=0.8[.031"] pitch
Fine Pitch
NO. of Pos.
050=50Pin
H=Rec. R/A Type
PRODUCT NO .: Q T 8 H * * * 6 - * 1 0 * (*) R=Reverse Type
