SN74AHC157 . . . D,DB,DGV,N,NS,
OR PW PACKAGE
(TOP VIEW)
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
4A
4B
NC
4Y
3A
1B
1Y
NC
2A
2B
SN54AHC157 . . . FK PACKAGE
(TOP VIEW)
1A
A/B
NC
3Y
3B
V
G
2Y
GND
NC
CC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A/B
1A
1B
1Y
2A
2B
2Y
GND
VCC
G
4A
4B
4Y
3A
3B
3Y
NC − No internal connection
SN74AHC157 . . . RGY PACKAGE
(TOP VIEW)
1 16
8 9
2
3
4
5
6
7
15
14
13
12
11
10
G
4A
4B
4Y
3A
3B
1A
1B
1Y
2A
2B
2Y
A/B
3Y V
GND
CC
SN54AHC157 . . . J or W PACKAGE
SN54AHC157
SN74AHC157
www.ti.com
SCLS345J –MAY 1996–REVISED JUNE 2013
QUADRUPLE 2-LINE TO 1-LINE DATA SELECTORS/MULTIPLEXERS
Check for Samples: SN54AHC157,SN74AHC157
1FEATURES
• Operating Range 2-V to 5.5-V • ESD Protection Exceeds JESD 22
• Latch-Up Performance Exceeds 250 mA Per – 2000-V Human-Body Model (A114-A)
JESD 17 – 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION
These quadruple 2-line to 1-line data selectors/multiplexers are designed for 2-V to 5.5-V VCC operation.
The ’AHC157 devices feature a common strobe (G) input. When the strobe is high, all outputs are low. When the
strobe is low, a 4-bit word is selected from one of two sources and is routed to the four outputs. The devices
provide true data.
FUNCTION TABLE
INPUTS OUTP
UT
G A/B A B Y
H X X X L
L L L X L
L L H X H
L H X L L
L H X H H
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 1996–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
2
3
5
6
11
10
14
13
15
1
G
A/B
4B
4A
3B
3A
2B
2A
1B
1A
4
7
9
12
1Y
2Y
3Y
4Y
SN54AHC157
SN74AHC157
SCLS345J –MAY 1996–REVISED JUNE 2013
www.ti.com
LOGIC DIAGRAM (POSITIVE LOGIC)
Pin numbers shown are for the D, DB, DGV, J, N, NS, PW, RGY, and W packages.
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SCLS345J –MAY 1996–REVISED JUNE 2013
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VALUE UNIT
Supply voltage range, VCC –0.5 to 7 V
Input voltage range, VI(2) –0.5 to 7 V
Output voltage range, VO(2) –0.5 to VCC + 0.5 V
Input clamp current, IIK (VI< 0) –20 mA
Output clamp current, IOK (VO< 0 or VO> VCC) ±20 mA
Continuous output current, IO(VO= 0 to VCC) ±25 mA
Continuous current through VCC or GND ±50 mA
D package(3) 73
DB package(3) 82
DGV package(3) 120
Package thermal impedance, θJA N package(3) 67 °C/W
NS package(3) 64
PW package(3) 108
RGY package(4) 39
Storage temperature range, Tstg –65 to 150 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) The package thermal impedance is calculated in accordance with JESD 51-5.
RECOMMENDED OPERATING CONDITIONS(1)
SN54AHC157 SN74AHC157 UNIT
MIN MAX MIN MAX
VCC Supply voltage 2 5.5 2 5.5 V
VCC= 2 V 1.5 1.5
VIH High-level input voltage VCC= 3V 2.1 2.1 V
VCC= 5.5 V 3.85 3.85
VCC= 2 V 0.5 0.5
VIL Low-level Input voltage VCC= 3 V 0.9 0.9 V
VCC= 5.5 V 1.65 1.65
VIInput voltage 0 5.5 0 5.5 V
VOOutput voltage 0 VCC 0 VCC V
VCC= 2 V –50 –50
IOH High-level output current VCC= 3.3 V ± 0.3 V –4 –4 mA
VCC= 5 V ± 0.5 V –8 –8
VCC= 2 V 50 50
IOL Low-level output current VCC= 3.3 V ± 0.3 V 4 4 mA
VCC= 5 V ± 0.5 V 8 8
VCC= 3.3 V ± 0.3 V 100 100
Δt/Δv Input Transition rise or fall rate ns/V
VCC= 5 V ± 0.5 V 20 20
TAOperating free-air temperature –55 125 –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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SCLS345J –MAY 1996–REVISED JUNE 2013
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ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted) TA= –40°C TO
TA= –55°C TO TA= –40°C TO 125°C
125°C 85°C
TA= 25°C Recommended
PARAMETER TEST CONDITIONS VCC UNIT
SN54AHC157 SN74AHC157 SN74AHC157
MIN TYP MAX MIN MAX MIN MAX MIN MAX
2 V 1.9 2 1.9 1.9 1.9
IOH = –50 µA 3 V 2.9 3 2.9 2.9 2.9
VOH 4.5 V 4.4 4.5 4.4 4.4 4.4 V
IOH = –4 mA 3 V 2.58 2.48 2.48 2.48
IOH = –8 mA 4.5 V 3.94 3.8 3.8 3.8
2 V 0.1 0.1 0.1 0.1
IOL = 50 µA 3 V 0.1 0.1 0.1 0.1
VOL 4.5 V 0.1 0.1 0.1 0.1 V
IOH = 4 mA 3 V 0.36 0.5 0.44 0.5
IOH = 8 mA 4.5 V 0.36 0.5 0.44 0.5
0 V to 5.5
IIVI= 5.5 V or GND ±0.1 ±1(1) ±1 ±1 µA
V
VI= VCC or
ICC IO= 0 5.5 V 4 40 40 40 µA
GND,
CiVI= VCC or GND 5 V 2 10 10 pF
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
TA= –40°C TO
TA= –55°C TO TA= –40°C TO 125°C
125°C 85°C
TA= 25°C
FROM TO LOAD Recommended
PARAMETER UNIT
(INPUT) (OUTPUT) CAPACITANCE SN54AHC157 SN74AHC157 SN74AHC157
TYP MAX MIN MAX MIN MAX MIN MAX
tPLH 6.2(1) 9.7(1) 1(1) 11.5(1) 1 11.5 1 11.5
A or B Y CL= 15 pF ns
tPHL 6.2(1) 9.7(1) 1(1) 11.5(1) 1 11.5 1 11.5
tPLH 8.4(1) 13.2(1) 1(1) 15.5(1) 1 15.5 1 15.5
A/B Y CL= 15 pF ns
tPHL 8.4(1) 13.2(1) 1(1) 15.5(1) 1 15.5 1 15.5
tPLH 8.7(1) 13.6(1) 1(1) 16(1) 1 16 1 16
G Y CL= 15 pF ns
tPHL 8.7(1) 13.6(1) 1(1) 16(1) 1 16 1 16
tPLH 8.7 13.2 1 15 1 15 1 15
A or B Y CL= 50 pF ns
tPHL 8.7 13.2 1 15 1 15 1 15
tPLH 10.9 16.7 1 19 1 19 1 19
A/B Y CL= 50 pF ns
tPHL 10.9 16.7 1 19 1 19 1 19
tPLH 11.2 17.1 1 19.5 1 19.5 1 19.5
G Y CL= 50 pF ns
tPHL 11.2 17.1 1 19.5 1 19.5 1 19.5
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.
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SCLS345J –MAY 1996–REVISED JUNE 2013
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
TA= –40°C TO
TA= –55°C TO TA= –40°C TO 125°C
125°C 85°C
TA= 25°C
FROM TO LOAD Recommended
PARAMETER UNIT
(INPUT) (OUTPUT) CAPACITANCE SN54AHC157 SN74AHC157 SN74AHC157
TYP MAX MIN MAX MIN MAX MIN MAX
tPLH 4.1(1) 6.4(1) 1(1) 7.5(1) 1 7.5 1 7.5
A or B Y CL= 15 pF ns
tPHL 4.1(1) 6.4(1) 1(1) 7.5(1) 1 7.5 1 7.5
tPLH 5.3(1) 8.1(1) 1(1) 9.5(1) 1 9.5 1 9.5
A/B Y CL= 15 pF ns
tPHL 5.3(1) 8.1(1) 1(1) 9.5(1) 1 9.5 1 9.5
tPLH 5.6(1) 8.6(1) 1(1) 10(1) 1 10 1 10
G Y CL= 15 pF ns
tPHL 5.6(1) 8.6(1) 1(1) 10(1) 1 10 1 10
tPLH 5.6(1) 8.4(1) 1(1) 9.5(1) 1 9.5 1 9.5
A or B Y CL= 50 pF ns
tPHL 5.6(1) 8.4(1) 1(1) 9.5(1) 1 9.5 1 9.5
tPLH 6.8(1) 10.1(1) 1(1) 11.5(1) 1 11.5 1 11.5
A/B Y CL= 50 pF ns
tPHL 6.8(1) 10.1(1) 1(1) 11.5(1) 1 11.5 1 11.5
tPLH 7.1(1) 10.6(1) 1(1) 12(1) 1 12 1 12
G Y CL= 50 pF ns
tPHL 7.1(1) 10.6(1) 1(1) 12(1) 1 12 1 12
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.
NOISE CHARACTERISTICS
VCC = 5 V, CL= 50 pF, TA= 25°C(1)
SN74AHC157 UNIT
PARAMETER MIN TYP MAX
VOL(P) Quiet output, maximum dynamic VOL 0.8 V
VOL(V) Quiet output, minimum dynamic VOL –0.8 V
VOH(V) Quiet output, minimum dynamic VOH 4.8 V
VIH(D) High-level dynamic input voltage 3.5 V
VIL(D) Low-level dynamic input voltage 1.5 V
(1) Characteristics are for surface-mount packages only.
OPERATING CHARACTERISTICS
VCC = 5 V, TA= 25°C PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load, f = 1 MHz 11 pF
Copyright © 1996–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
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50% VCC
VCC
VCC
0 V
0 V
th
tsu
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Data Input
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VCC
0 V
50% VCC
50% VCC
Input
Out-of-Phase
Output
In-Phase
Output
Timing Input
50% VCC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Control
Output
Waveform 1
S1 at VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
≈VCC
0 V
50% VCC VOL + 0.3 V
50% VCC
≈0 V
VCC
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
TEST S1
VCC
0 V
50% VCC
tw
VOLTAGE WAVEFORMS
PULSE DURATION
Input
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
S1
VCC
RL= 1 kΩ
GND
From Output
Under Test
CL
(see Note A)
Test
Point
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
Open
50% VCC
50% VCC 50% VCC
50% VCC
50% VCC 50% VCC
50% VCC 50% VCC
VOH – 0.3 V
SN54AHC157
SN74AHC157
SCLS345J –MAY 1996–REVISED JUNE 2013
www.ti.com
PARAMETER MEASUREMENT INFORMATION
A. CLincludes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output
control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output
control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤1 MHz, ZO= 50 Ω, tr≤3 ns, tf
≤3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
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SCLS345J –MAY 1996–REVISED JUNE 2013
REVISION HISTORY
Changes from Revision I (May 1996) to Revision J Page
• Changed document format from Quicksilver to DocZone. .................................................................................................... 1
• Extended operating temperature range to 125°C ................................................................................................................. 3
Copyright © 1996–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
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PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9764201Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9764201Q2A
SNJ54AHC
157FK
5962-9764201QEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9764201QE
A
SNJ54AHC157J
5962-9764201QFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9764201QF
A
SNJ54AHC157W
SN74AHC157D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC157
SN74AHC157DBR ACTIVE SSOP DB 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA157
SN74AHC157DGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA157
SN74AHC157DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC157
SN74AHC157DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC157
SN74AHC157N ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 125 SN74AHC157N
SN74AHC157NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 AHC157
SN74AHC157PW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA157
SN74AHC157PWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 HA157
SN74AHC157PWRG3 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 HA157
SN74AHC157RGYR ACTIVE VQFN RGY 16 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 HA157
SNJ54AHC157FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9764201Q2A
SNJ54AHC
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
157FK
SNJ54AHC157J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9764201QE
A
SNJ54AHC157J
SNJ54AHC157W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9764201QF
A
SNJ54AHC157W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74AHC157DBR SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74AHC157DGVR TVSOP DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74AHC157DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74AHC157NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74AHC157PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74AHC157PWRG3 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74AHC157RGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Apr-2014
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74AHC157DBR SSOP DB 16 2000 367.0 367.0 38.0
SN74AHC157DGVR TVSOP DGV 16 2000 367.0 367.0 35.0
SN74AHC157DR SOIC D 16 2500 333.2 345.9 28.6
SN74AHC157NSR SO NS 16 2000 367.0 367.0 38.0
SN74AHC157PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN74AHC157PWRG3 TSSOP PW 16 2000 364.0 364.0 27.0
SN74AHC157RGYR VQFN RGY 16 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Apr-2014
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
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used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
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enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
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third party, or a license from TI under the patents or other intellectual property of TI.
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and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
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