MPSA27RLRAG - ON SEMICONDUCTOR

©Semiconductor Components Industries, LLC, 2007

April, 2007 -- Rev. 4

1Publication Order Number:

MPSA27/D

MPSA27

Darlington Transistor

NPN Silicon

Features

•These are Pb--Free Devices*

MAXIMUM RATINGS

Rating Symbol Value Unit

Collector--Emitter Voltage VCES 60 Vdc

Emitter--Base Voltage VEBO 10 Vdc

Collector Current -- Continuous IC500 mAdc

Total Device Dissipation @ TA=25°C

Derate above 25°C

PD625

5.0

mW/°C

Operating and Storage Junction

Temperature Range

TJ,T

stg --55 to +150 °C

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Thermal Resistance, Junction--to--Ambient RθJA 200 °C/W

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

*For additional information on our Pb--Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

http://onsemi.com

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

MPSA27RLRA TO--92 2000/Tape & Reel

MPSA27RLRAG TO--92

(Pb--Free)

2000/Tape & Reel

Device Package Shipping†

MPSA27G TO--92

(Pb--Free)

5000 Units/Bulk

ORDERING INFORMATION

COLLECTOR

BASE

EMITTER

123

BENT LEAD

TAPE & REEL

AMMO PACK

STRAIGHT LEAD

BULK PACK

TO--92

CASE 29

STYLE 1

MPS

A27

AYWW G

A = Assembly Location

Y = Year

WW = Work Week

G= Pb--Free Package

(Note: Microdot may be in either location)

MARKING DIAGRAM

MPSA27

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ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

OFF CHARACTERISTICS

Collector--Emitter Breakdown Voltage

(IC= 100 mAdc, VBE =0)

V(BR)CES 60 -- -- Vdc

Collector--Base Breakdown Voltage

(IC= 100 mAdc, IE=0)

V(BR)CBO 60 -- -- Vdc

Collector Cutoff Current

(VCB =30V,I

E=0)

(VCB =40V,I

E=0)

(VCB =50V,I

E=0)

ICBO -- -- 100 nAdc

Collector Cutoff Current

(VCE =30V,V

BE =0)

(VCE =40V,V

BE =0)

(VCE =50V,V

BE =0)

ICES -- -- 500 nAdc

Emitter Cutoff Current

(VEB =10Vdc)

IEBO -- -- 100 nAdc

ON CHARACTERISTICS (Note 1)

DC Current Gain

(IC=10mA,V

CE =5.0V)

(IC= 100 mA, VCE =5.0V)

hFE 10,000

10,000

Collector--Emitter Saturation Voltage

(IC= 100 mA, IB=0.1mAdc)

VCE(sat) -- -- 1.5 Vdc

Base--Emitter On Voltage

(IC= 100 mA, VCE =5.0Vdc)

VBE(on) -- -- 2.0 Vdc

SMALL--SIGNAL CHARACTERISTICS

Small Signal Current Gain

(IC=10mA,V

CE =5.0V,f=100MHz)

hfe 1.25 2.4 -- --

1. Pulse Test: Pulse Width ≤300 ms, Duty Cycle ≤2.0%.

MPSA27

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Figure 1. DC Current Gain Figure 2. “ON” Voltages

Figure 3. Collector Saturation Region Figure 4. High Frequency Current Gain

Figure 5. Active Region -- Safe Operating Area

100 1 k1.0

IC, COLLECTOR CURRENT (mA)

120

100

IC, COLLECTOR CURRENT (mA)

100 1 k1.0

1.4

1.0

0.8

0.6

100 5001.0

IB, BASE CURRENT (mA)

1.1

1.0

0.9

0.8

0.7

IC, COLLECTOR CURRENT (mA)

1.00.5

1.0

2.0

0.8

0.6

0.4

0.2

2.0200

2.0 101.0

VCE, COLLECTOR--EMITTER VOLTAGE (VOLTS)

200

100

4.0

VCE =5.0V

hFE, DC CURRENT GAIN (k)

V, VOLTAGE (VOLTS)

h , SMALL--SIGNAL CURRENT GAIN

0102.0 3.0 20 30 200 500

TA= 125°C

TA=25°C

TA=--55°C

200 5002.0 10 20

1.2

1.6 TA=25°C

VBE(S) @I

C/IB=1.0k

VCE(S) @I

C/IB=1.0k

VBE(ON) @V

CE =5.0V

2.0 5.0 10 20 50 10 20 100 200

, COLLECTOR CURRENT (mA)IC

20 50

500

1.0 ms

1.0 s

TA=25°C

CURRENT LIMIT

THERMAL LIMIT

SECOND BREAKDOWN LIMIT

100 ms

TC=25°C

TA=25°C

IC=10mA

IC= 100 mA IC= 250 mA

IC= 500 mA

1k0.1 0.2 0.5

1.3

1.2

1.4

1.6

1.5

, COLLECTOR--EMITTER VOLTAGE (VOLTS)

4.0

5.0 50050

VCE =5.0V

f = 100 MHz

TA=25°C

6.0 40 60

3.0 30

MPSA27

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PACKAGE DIMENSIONS

TO--92

(

TO--226

)

CASE 29--11

ISSUE AM

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. CONTOUR OF PACKAGE BEYOND DIMENSION R

IS UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN P AND

BEYOND DIMENSION K MINIMUM.

SECTION X--X

SEATING

PLANE DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.175 0.205 4.45 5.20

B0.170 0.210 4.32 5.33

C0.125 0.165 3.18 4.19

D0.016 0.021 0.407 0.533

G0.045 0.055 1.15 1.39

H0.095 0.105 2.42 2.66

J0.015 0.020 0.39 0.50

K0 . 5 0 0 -- -- -- 1 2 . 7 0 -- -- --

L0 . 2 5 0 -- -- -- 6 . 3 5 -- -- --

N0.080 0.105 2.04 2.66

P-- -- -- 0 . 1 0 0 -- -- -- 2 . 5 4

R0.115 ------ 2.93 ------

V0 . 1 3 5 -- -- -- 3 . 4 3 -- -- --

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. CONTOUR OF PACKAGE BEYOND

DIMENSION R IS UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN P

AND BEYOND DIMENSION K MINIMUM.

SECTION X--X

SEATING

PLANE DIM MIN MAX

MILLIMETERS

A4.45 5.20

B4.32 5.33

C3.18 4.19

D0.40 0.54

G2.40 2.80

J0.39 0.50

K12.70 ------

N2.04 2.66

P1.50 4.00

R2 . 9 3 -- -- --

V3 . 4 3 -- -- --

STRAIGHT LEAD

BULK PACK

BENT LEAD

TAPE & REEL

AMMO PACK

STYLE 1:

PIN 1. EMITTER

2. BASE

3. COLLECTOR

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

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MPSA27/D

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