Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 7 1Publication Order Number:
MBRB2060CT/D
MBRB2060CT
Preferred Device
SWITCHMODE
Power Rectifier
D2PAK Surface Mount Power Package
These state−of−the−art devices employ the use of the Schottky
Barrier principle with a platinum barrier metal.
Features
Package Designed for Power Surface Mount Applications
Center−Tap Configuration
Guardring for Stress Protection
Low Forward Voltage
175°C Operating Junction Temperature
Epoxy Meets UL 94 V−0 @ 0.125 in
Short Heat Sink Tab Manufactured − Not Sheared
Similar in Size to Industry Standard TO−220 Package
Pb−Free Packages are Available
Mechanical Characteristics:
Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
Weight: 1.7 Grams (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Device Meets MSL1 Requirements
ESD Ratings: Machine Model, C (>400 V)
Human Body Model, 3B (>8000 V)
MAXIMUM RATINGS (Per Leg)
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
60 V
Average Rectified Forward Current
(Rated VR, TC = 110°C) Total Device IF(AV) 10
20 A
Peak Repetitive Forward Current
(Rated VR, Square W ave,
20 kHz, TC = 100°C)
IFRM 20 A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM 150 A
Peak Repetitive Reverse Surge Current
(2.0 s, 1.0 kHz) IRRM 0.5 A
Storage Temperature Range Tstg −65 to +175 °C
Operating Junction Temperature (Note 1) TJ−65 to +175 °C
Voltage Rate of Change (Rated VR) dv/dt 10,000 V/s
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RJA.
SCHOTTKY BARRIER
RECTIFIER
20 AMPERES, 60 VOLTS
1
3
4
Preferred devices are recommended choices for future use
and best overall value.
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See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
D2PAK
CASE 418B
STYLE 3
3
4
1
MARKING DIAGRAM
B2060G
AKA
A = Assembly Location
Y = Year
WW = Work Week
B2060 = Device Code
G = Pb−Free Package
AKA = Diode Polarity
AY WW
MBRB2060CT
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2
THERMAL CHARACTERISTICS (Per Leg)
Characteristic Symbol Value Unit
Thermal Resistance, Junction−to−Case
Junction−to−Ambient (Note 2) RJC
RJA 2.0
50 °C/W
2. When mounted using minimum recommended pad size on FR−4 board.
ELECTRICAL CHARACTERISTICS (Per Leg)
Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage (Note 3)
(iF = 20 Amps, TJ = 125°C)
(iF = 20 Amps, TJ = 25°C)
vF0.85
0.95
V
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, TJ = 125°C)
(Rated dc Voltage, TJ = 25°C)
iR35
0.15
mA
3. Pulse Test: Pulse Width = 300 s, Duty Cycle 2.0%.
ORDERING INFORMATION
Device Package Shipping
MBRB2060CT D2PAK 50 Units / Rail
MBRB2060CTG D2PAK
(Pb−Free) 50 Units / Rail
MBRB2060CTT4 D2PAK 800 Units / Tape & Reel
MBRB2060CTT4G D2PAK
(Pb−Free) 800 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Figure 1. Typical Forward Voltage Per Diode Figure 2. Typical Reverse Current Per Diode
Figure 3. Typical Current Derating, Case,
Per Leg Figure 4. Average Power Dissipation and
Average Current
0.01
0.1
1
10
120100806040200
VR, REVERSE VOLTAGE (VOLTS)
IR, REVERSE CURRENT (mA)
TJ = 150°C
TJ = 125°C
TJ = 100°C
TJ = 25°C
0.5
0
vF, INSTANTANEOUS VOLTAGE (VOLTS)
1
3
5
10
20
50
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
iF, INSTANTANEOUS FORWARD CURRENT (AMPS
TJ = 25°C
100°C
150°C
125°C
32
80
TC, CASE TEMPERATURE (°C)
28
24
20
16
12
8
4
090 100 110 120 130
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
DC
RATED VOLTAGE
APPLIED
0
AVERAGE CURRENT (AMPS)
0
2
4
6
8
10
12
14
16
18
20
2 4 6 8 10 12 14 16 18 20
AVERAGE POWER (WATTS)
TJ = 125°C
SQUARE
WAVE
DC
IPK/IAV = 10
IPK/IAV = 20
PI
IPK/IAV = 5
SQUARE
WAVE
RJC = 2°C/W
140 150 160
MBRB2060CT
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3
PACKAGE DIMENSIONS
D2PAK 3
CASE 418B−04
ISSUE J
SEATING
PLANE
S
G
D
−T−
M
0.13 (0.005) T
231
4
3 PL
K
J
H
V
E
C
A
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.340 0.380 8.64 9.65
B0.380 0.405 9.65 10.29
C0.160 0.190 4.06 4.83
D0.020 0.035 0.51 0.89
E0.045 0.055 1.14 1.40
G0.100 BSC 2.54 BSC
H0.080 0.110 2.03 2.79
J0.018 0.025 0.46 0.64
K0.090 0.110 2.29 2.79
S0.575 0.625 14.60 15.88
V0.045 0.055 1.14 1.40
−B−
M
B
W
W
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
F0.310 0.350 7.87 8.89
L0.052 0.072 1.32 1.83
M0.280 0.320 7.11 8.13
N0.197 REF 5.00 REF
P0.079 REF 2.00 REF
R0.039 REF 0.99 REF
M
L
F
M
L
F
M
L
F
VARIABLE
CONFIGURATION
ZONE RN P
U
VIEW W−W VIEW W−W VIEW W−W
123
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8.38
0.33
1.016
0.04
17.02
0.67
10.66
0.42
3.05
0.12
5.08
0.20
mm
inches
SCALE 3:1
MBRB2060CT
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4
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to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
MBRB2060CT/D
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
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