SCBS005D − OCTOBER 1987 − REVISED APRIL 1994
Copyright 1994, Texas Instruments Incorporated
2−1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
•State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
•ESD Protection Exceeds 2000 V
Per MIL-STD-883C, Method 3015
•3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
•Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, Ceramic Chip
Carriers (FK) and Flatpacks (W), and
Standard Plastic and Ceramic 300-mil DIPs
(J, N)
description
These octal buffers and line drivers are designed
specifically to improve both the performance and
density of 3-state memory address drivers, clock
drivers, and bus-oriented receivers and
transmitters. Taken together with the ′BCT240
and ′BCT244, these devices provide the choice of
selected combinations of inverting and
noninverting outputs, symmetrical OE (active-low
output-enable) inputs, and complementary OE
and OE inputs.
The SN54BCT241 is characterized for operation
over the full military temperature range of −55°C
to 125°C. The SN74BCT241 is characterized for
operation from 0°C to 70°C.
FUNCTION TABLES
INPUTS
OUTPUT
1OE 1A
OUTPUT
1Y
L H H
LLL
H X Z
INPUTS
OUTPUT
2OE 2A
OUTPUT
2Y
H H H
HLL
L X Z
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
SN54BCT241 ...J OR W PACKAGE
SN74BCT241 . . . DB, DW OR N PACKAGE
(TOP VIEW)
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
1Y1
2A4
1Y2
2A3
1Y3
1A2
2Y3
1A3
2Y2
1A4
SN54BCT241...FK PACKAGE
(TOP VIEW)
2Y4
1A1
1OE
1Y4
2A2 2OE
2Y1
G
ND
2A1 VCC
!"#$%! & '("")% $& ! *(+,'$%! -$%).
"!-('%& '!!"# %! &*)''$%!& *)" %/) %)"#& ! )0$& &%"(#)%&
&%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-)
%)&%3 ! $,, *$"$#)%)"&.
SCBS005D − OCTOBER 1987 − REVISED APRIL 1994
2−2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
logic symbol†logic diagram (positive logic)
†This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
2
1A1 4
1A2 6
1A3 8
1A4
EN
1
1Y1
18
1Y2
16
1Y3
14
1Y4
12
11
2A1 13
2A2 15
2A3 17
2A4
EN
19
2OE
2Y1
9
2Y2
7
2Y3
5
2Y4
3
1OE 1
2
4
6
8
19
11
13
15
17 3
5
7
9
12
14
16
18
1A1
1A2
1A3
1A4
1Y1
2OE
2A1
2A2
2A3
2A4
2Y1
1Y2
1Y3
1Y4
2Y2
2Y3
2Y4
1OE
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC − 0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) − 0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the disabled or power-off state, VO− 0.5 V to 5.5 V. . . . . . . . . . . . . . .
Voltage range applied to any output in the high state, VO− 0.5 V to VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK −30 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current into any output in the low state: SN54BCT241 96 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74BCT241 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range: SN54BCT241 − 55°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74BCT241 0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range − 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
‡Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
SCBS005D − OCTOBER 1987 − REVISED APRIL 1994
2−3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
recommended operating conditions
SN54BCT241 SN74BCT241
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
IIK Input clamp current −18 −18 mA
IOH High-level output current −12 −15 mA
IOL Low-level output current 48 64 mA
TAOperating free-air temperature −55 125 0 70 °C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
SN54BCT241 SN74BCT241
UNIT
PARAMETER
TEST CONDITIONS
MIN TYP†MAX MIN TYP†MAX
UNIT
VIK VCC = 4.5 V, II = −18 mA −1.2 −1.2 V
IOH = −3 mA 2.4 3.3 2.4 3.3
V
OH
V
CC
= 4.5 V IOH = −12 mA 2 3.2 V
VOH
VCC = 4.5 V
IOH = −15 mA 2 3.1
V
VOL
VCC = 4.5 V
IOL = 48 mA 0.38 0.55
V
VOL VCC = 4.5 V IOL = 64 mA 0.42 0.55 V
IIVCC = 5.5 V, VI = 7 V 0.1 0.1 mA
IIH VCC = 5.5 V, VI = 2.7 V 20 20 µA
IIL
1OE or 2OE
VCC = 5.5 V,
VI = 0.5 V
−1 −1
mA
IIL Any A input VCC = 5.5 V, VI = 0.5 V −1.6 −1.6 mA
IOZH VCC = 5.5 V, VO = 2.7 V 50 50 µA
IOZL VCC = 5.5 V, VO = 0.5 V −50 −50 µA
IOS‡VCC = 5.5 V, VO = 0 −100 −225 −100 −225 mA
ICCH VCC = 5.5 V, Outputs open 23 43 23 43 mA
ICCL VCC = 5.5 V, Outputs open 53 85 53 85 mA
ICCZ VCC = 5.5 V, Outputs open 4 10 4 10 mA
CiVCC = 5 V, VI = 2.5 V or 0.5 V 6 6 pF
CoVCC = 5 V, VO = 2.5 V or 0.5 V 11 11 pF
†All typical values are at VCC = 5 V, TA = 25°C.
‡Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
SCBS005D − OCTOBER 1987 − REVISED APRIL 1994
2−4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
switching characteristics (see Note 2)
PARAMETER FROM
(INPUT) TO
(OUTPUT)
VCC = 5 V,
CL = 50 pF,
R1 = 500 Ω,
R2 = 500 Ω,
TA = 25°C
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
R1 = 500 Ω,
R2 = 500 Ω,
TA = MIN to MAX†UNIT
(INPUT)
(OUTPUT)
′BCT241 SN54BCT241 SN74BCT241
MIN TYP MAX MIN MAX MIN MAX
tPLH
A
Y
0.5 2.5 4.5 0.5 5.2 0.5 4.9
ns
tPHL A Y 1 3 5.4 1 6.3 1 5.9 ns
tPZH
OE or OE
Y
1 5.7 7.8 1 9.1 1 8.7
ns
tPZL
OE or OE
Y1 5.2 8.6 1 10 1 9.4 ns
tPHZ
OE or OE
Y
1 5.8 6.8 1 8.4 1 8.1
ns
tPLZ
OE or OE
Y
1 7 8.1 1 11 1 9.9
ns
†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 2: Load circuits and voltage waveforms are shown in Section 1.
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9074301M2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9074301MRA ACTIVE CDIP J 20 1 TBD Call TI Call TI
5962-9074301MSA ACTIVE CFP W 20 1 TBD Call TI Call TI
SN74BCT241DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI
SN74BCT241DW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT241DWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT241DWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT241N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74BCT241NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74BCT241NSR ACTIVE SO NS 20 TBD Call TI Call TI
SN74BCT241NSRE4 ACTIVE SO NS 20 TBD Call TI Call TI
SN74BCT241NSRG4 ACTIVE SO NS 20 TBD Call TI Call TI
SNJ54BCT241FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54BCT241J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SNJ54BCT241W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 2
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54BCT241, SN74BCT241 :
•Catalog: SN74BCT241
•Military: SN54BCT241
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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