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APPLICATIONS
■Rectification
■Freewheel Diode
■DC Motor Control
■Power Supplies
■Welding
■Battery Chargers
FEATURES
■High Surge Capability
VOLTAGE RATINGS
KEY PARAMETERS
VRRM 2000V
IF(AV) 220A
IFSM 4000A
2000
1400
1000
600
SV20 20 M or K(R)
SV20 14 M or K(R)
SV20 10 M or K(R)
SV20 06 M or K(R)
Conditions
VRSM = VRRM + 100V
Lower voltage grades available.
M for M12 thread. K for 1/2" - 20UNF thread, R for reverse
polarity.
Add C to type number for DO8C package.
Type Number Repetitive Peak
Reverse Voltage
VRRM
V
CURRENT RATINGS
Symbol Parameter Conditions
Single Side Cooled
IF(AV) Mean forward current
IF(RMS) RMS value
IFContinuous (direct) forward current
UnitsMax.
Half wave resistive load, Tcase = 100oC 220 A
Tcase = 100oC 350 A
Tcase = 100oC 297 A
Outline type codes: DO8C and DO8
See Package Details for further information.
SV20
Rectifier Diode
Replaces March 1998 version, DS4085-2.3 DS4085-3.0 January 2000
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SURGE RATINGS
Conditions
10ms half sine; Tcase = 175oC
VR = 50% VRRM - 1/4 sine
10ms half sine; Tcase =175oC
VR = 0
Max. Units
Symbol Parameter
IFSM Surge (non-repetitive) forward current
I2tI
2
t for fusing
IFSM Surge (non-repetitive) forward current
I2tI2t for fusing A2s
4.0 kA
51.2 x 103A2s
3.2 kA
80.0 x 103
THERMAL AND MECHANICAL DATA
Conditions Min. Max. Units
oC/W- 0.08
Thermal resistance - case to heatsinkRth(c-h)
Thermal resistance - junction to caseRth(j-c)
Symbol Parameter
- 0.23 oC/W
175 oC
Tvj Virtual junction temperature
Tstg Storage temperature range -55 200 oC
-
- 175 oC
Mounting torque 15.0Nm
with mounting compound
Forward (conducting)
Reverse (blocking)
dc
Mounting Torque- 12.0 15.0 Nm
CHARACTERISTICS
Forward voltage
Peak reverse current
Parameter
µC-
QSTotal stored charge
Symbol
VFM
IRRM
IRM Peak recovery current 70* - A
200*
At VRRM, Tcase = 175oC-20mA
- 1.4 VAt 600A peak, Tcase = 25oC
Conditions Typ. Max. Units
At Tvj = 175˚C -
VTO Threshold voltage
rTSlope resistance 1.0 mΩ
At Tvj = 175˚C - 0.8 V
trr reverse recovery time 5.5* - µs
IF = 100A, dIRR/dt = 20A/µs, Tcase = 25˚C
*Typical values.
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CURVES
SV20
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SV20
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SV20
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PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Thread M12
1/2" 20 UNF
163 ± 10
Type No + K - 20.6 ± 0.6
Type No + M - 18.0 ± 0.5
8 min
Ø27 max
8 min
3.17 max
Ø8.4 ± 0.3
20 max
Nominal weight: 120g
Mounting torque: 15Nm ±10%
Package outine type code: DO8
Nominal weight: 120g
Mounting torque: 15Nm ±10%
Package outine type code: DO8C
Thread M12
1/2" 20 UNF
60 max
Type No + K - 20.6 ± 0.6
Type No + M - 18.0 ± 0.5
12 ± 0.5
Ø27 max
8 min
3.17 max
Ø5.2 ± 0.2 12 ± 0.5
ASSOCIATED PUBLICATIONS
Title Application Note
Number
Calculating the junction temperature or power semiconductors AN4506
Thyristor and diode measurement with a multi-meter AN4853
Use of VTO, rT on-state characteristic AN5001
SV20
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CUSTOMER SERVICE CENTRES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Germany Tel: 07351 827723
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS4085-3 Issue No. 3.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-
tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
