© 2009 Microchip Technology Inc. DS21703J-page 1
24AA16/24LC16B
Device Selection Table
Features:
Single Supply with Operation down to 1.7V
for 24AA16 Devices, 2.5V for 24LC16B Devices
Low-Power CMOS Technology:
- Active current 1 mA, typical
- Standby current, 1 μA, typical
2-Wire Serial Interface, I2C™ Compatible
Schmitt Trigger inputs for Noise Suppression
Output Slope Control to eliminate Ground Bounce
100 kHz and 400 kHz Clock Compatibility
Page Write Time 5 ms Max.
Self-Timed Erase/Write Cycle
16-Byte Page Write Buffer
Hardware Write-Protect
ESD Protection > 4,000V
More than 1 Million Erase/Write Cycles
Data Retention > 200 Years
Factory Programming Available
Packages include 8-lead PDIP, SOIC, TSSOP,
MSOP, DFN, TDFN, 5-lead SOT-23 and Chip Scale
Pb-Free and RoHS Compliant
Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
Description:
The Microchip Technology Inc. 24AA16/24LC16B
(24XX16*) is a 16 Kbit Electrically Erasable PROM.
The device is organized as eight blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.7V with standby
and active currents of only 1 μA and 1 mA,
respectively. The 24XX16 also has a page write
capability for up to 16 bytes of data. The 24XX16 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, 2x3 DFN, 2x3 TDFN and MSOP pack-
ages, and is also available in the 5-lead SOT-23, and
Chip Scale packages.
Block Diagram
Part
Number VCC
Range Max. Clock
Frequency Temp.
Ranges
24AA16 1.7-5.5 400 kHz (1) I
24LC16B 2.5-5.5 400 kHz I, E
Note 1: 100 kHz for VCC <2.5V.
HV
EEPROM
Array
Page
YDEC
XDEC
Sense Amp.
Memory
Control
Logic
I/O
Control
Logic
I/O
WP
SDA
SCL
VCC
VSS R/W Con trol
Latches
Generator
A0
A1
A2
VSS
VCC
WP
SCL
SDA
1
2
3
4
8
7
6
5
PDIP/MSOP/SOIC/TSSOP DFN/TDFN
A0
A1
A2
VSS
WP
SCL
SDA
VCC
8
7
6
5
1
2
3
4
SOT-23
1
2
34
5WP
VCC
SCL
VSS
SDA
CS (Chip Scale)(2)
12
3
45
VCC
WP SDA
SCL
VSS
(Top Down View,
Balls Not Visible)
Note 1: Pins A0, A1 and A2 are not used by the 24XX16 (no internal connections).
2: Available in I-temp, “AA” only.
16K I2C Serial EEPROM
*24XX16 is used in this document as a generic part number for the 24AA16/24LC16B devices.
24AA16/24LC16B
DS21703J-page 2 © 2009 Microchip Technology Inc.
1.0 ELECTRICAL CHARAC TERISTICS
Absolute Maximum Ratings (†)
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins......................................................................................................................................................≥ 4 kV
TABLE 1-1: DC CHARACTERISTICS
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above th ose indi cated in the opera tional li stings of this sp ecificati on is no t implie d. Exposu re to max imum rating
conditions for extended periods may affect device reliability.
DC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Param.
No. Symbol Characteristic Min. Typ. Max. Units Conditions
D1 VIH WP, SCL and SDA pins ——
D2 High-level input voltage 0.7 VCC ——V
D3 VIL Low-level input voltage 0.3 VCC V—
D4 VHYS Hysteresis of Schmitt
Trigger inputs .05 VCC ——V(Note 1)
D5 VOL Low-level output voltage 0.40 V IOL = 3.0 mA, VCC = 2.5V
D6 ILI Input leakage current ——±1μAVIN = VSS or VCC
D7 ILO Output le akage curren t ——±1μAVOUT = VSS or VCC
D8 CIN,
COUT Pin capacitance
(all inputs/ou tpu t s) ——10pFVCC = 5.0V (Note 1)
TA = 25°C, FCLK = 1 MHz
D9 ICC write Operating current ——3mAVCC = 5.5V, SCL = 400 kHz
D10 ICC read 0.01 1 mA
D11 ICCS Standby current
0.3
.01 1
5μA
μAIndustrial
Automotive
SDA = SCL = VCC
WP = VSS
Note 1: This parameter is periodically sampled and not 100% tested.
2: Typical measurements taken at room temperature.
© 2009 Microchip Technology Inc. DS21703J-page 3
24AA16/24LC16B
TABLE 1-2: AC CHARACTERISTICS
AC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Param.
No. Symbol Characteristic Min. Max. Units Conditions
1F
CLK Clock frequency
400
100 kHz 2.5V VCC 5.5V
1.7V VCC < 2.5V (24AA16)
2THIGH Clock high time 600
4000
ns 2.5V VCC 5.5V
1.7V VCC < 2.5V (24AA16)
3T
LOW Clock low time 1300
4700
ns 2.5V VCC 5.5V
1.7V VCC < 2.5V (24AA16)
4TRSDA and SCL rise time
(Note 1)
300
1000 ns 2.5V VCC 5.5V (Note 1)
1.7V VCC < 2.5V (24AA16)
(No te 1)
5T
FSDA and SCL fall time 300 ns (Note 1)
6T
HD:STA Start condition hold time 600
4000
ns 2.5V VCC 5.5V
1.7V VCC < 2.5V (24AA16)
7TSU:STA Start condition setup time 600
4700
ns 2.5V VCC 5.5V
1.7V VCC < 2.5V (24AA16)
8THD:DAT Data input hold time 0 ns (Not e 2)
9TSU:DAT Data input setup time 100
250
ns 2.5V VCC 5.5V
1.7V VCC < 2.5V (24AA16)
10 TSU:STO Stop condition setup time 600
4000
ns 2.5V VCC 5.5V
1.7V VCC < 2.5V (24AA16)
11 TAA Output valid from clock
(Note 2)
900
3500 ns 2.5V VCC 5.5V
1.7V VCC < 2.5V (24AA16)
12 TBUF Bus free time: Time the bus
must be free before a new
transmission can start
1300
4700
ns 2.5V VCC 5.5V
1.7V VCC < 2.5V (24AA16)
13 TOF Output fall time from VIH
minimum to VIL maximum 20+0.1CB
250
250 ns 2.5V VCC 5.5V
1.7V VCC <2.5V (24AA16)
14 TSP Input filter spike suppression
(SDA and SCL pins) —50ns(Notes 1 and 3)
15 TWC Write cycl e time
(byte or page) —5ms
16 Endurance 1M cycles 25°C, (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The com bi ned TSP and VHYS spec ifi ca tio ns are due to new Schm itt Trig ge r in puts whi ch pro vi de im prov ed
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance es timates in a specific
applic ation, ple ase co ns ult the Total Endu ranc e™ Model w hic h c an be obt ained f r om Mi cro chi p’s web s ite
at www.microchip.com.
24AA16/24LC16B
DS21703J-page 4 © 2009 Microchip Technology Inc.
FIGURE 1-1: BUS TIMING DATA
FIGURE 1-2: BUS T IMING START/STOP
7
524
8910
12
11
14 6
SCL
SDA
IN
SDA
OUT
3
76
D4
10
Start Stop
SCL
SDA
© 2009 Microchip Technology Inc. DS21703J-page 5
24AA16/24LC16B
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
2.1 Serial Address/Data Input/Output
(SDA)
SDA is a bidirectional pin used to transfer addresses
and data into and out of the de vice . Sinc e it i s an open-
drain terminal, the SDA bus requires a pull-up resistor
to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating Start and Stop conditions.
2.2 Serial Clock (SCL)
The SCL in pu t is u se d to s ynchro ni ze th e da t a tra ns fer
to and from the device.
2.3 Wr ite-Protect (WP)
The WP pin must be connected to either VSS or VCC.
If tied to VSS, normal memory operation is enabled
(read/wri te the ent ire memory 000-7 FF).
If tied to VCC, write operations are inhibited. The entire
memory will be write-protected. Read operations are
not affected.
2.4 A0, A1, A2
The A0, A1 and A2 pins are not used by the 24XX16.
They may be left floating or tied to either VSS or VCC.
Name PDIP SOIC TSSOP DFN TDFN MSOP SOT-23 CS Description
A0 1 1 1 1 1 1 Not Connected
A1 2 2 2 2 2 2 Not Connected
A2 3 3 3 3 3 3 Not Connected
VSS 4 4 4 4 4 4 2 2 Ground
SDA 5 5 5 5 5 5 3 5 Serial Address/Data I/O
SCL 6 6 6 6 6 6 1 4 Serial Clock
WP 7 7 7 7 7 7 5 3 Write-Protect Input
VCC 8 8 8 8 8 8 4 1 +1.7 V to 5.5V Power Supply
24AA16/24LC16B
DS21703J-page 6 © 2009 Microchip Technology Inc.
3.0 FUNCTIONAL DESCRIPTION
The 24XX16 supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
Serial Clock (SCL), controls the bus access and
generates the Start and Stop conditions, while the
24XX16 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
4.0 BUS CHARACTERISTICS
The following bus protocol has been defined:
Data transfer may be initiated only when the bus
is not busy.
During data transfer, the data line must remain
stab le when ever th e clock lin e is high. C hanges i n
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.1 Bus Not Busy (A)
Both data and clock lines remain high.
4.2 Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3 S top Data Transfer (C)
A low -t o- h i gh t ran si t io n of t h e SD A l in e whi l e t he c lo ck
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
4.4 Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each dat a transf er is initiated with a S tart cond ition and
terminated with a Stop condition. The number of data
bytes transferred between Start and Stop conditions is
determined by the master device and is, theoretically,
unlimited (although only the last sixteen will be stored
when doing a write operation). When an overwrite does
occur it will replace data in a first-in first-out (FIFO)
fashion.
4.5 Acknowledge
Each receiving device, when addressed, is obliged to
generate an Acknowledge after the reception of each
byte. Th e mast er device mus t ge nera te a n ex tra c lock
pulse which is associated with this Acknowledge bit.
The device that acknowledges, has to pull down the
SDA line d uring th e ackn owledge clock pulse in such a
way that the SDA line is stable-low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to t he sla ve by no t ge nerati ng an Ack nowl edge b it
on the las t by te tha t has be en c locked out of th e sl av e.
In this c as e, the sl ave (24XX16) w ill le av e th e d at a line
high to enable the master to generate the Stop
condition.
FIGURE 4-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS
Note: The 24XX16 does not generate any
Acknowledge bits if an internal
programming cycle is in progress.
SCL
SDA
(A) (B) (D) (D) (A)(C)
Start
Condition Address or
Acknowledge
Valid
Data
Allowed
to Change
Stop
Condition
© 2009 Microchip Technology Inc. DS21703J-page 7
24AA16/24LC16B
5.0 DEVICE ADDRESSING
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a four-bit control code.
For the 24XX16, this is set as ‘1010’ binary for read
and write operations. The next three bits of the control
byte are the block-select bits (B2, B1, B0). They are
used by the master device to select which of the eight
256 word-blocks of memory are to be accessed.
These bits ar e in effe ct t he thr ee Mo st Sign if ica nt bits
(MSb) of the word address. It should be noted that the
protoco l limits the si ze of th e memory to eight block s
of 25 6 words, th erefore, th e pr o to c ol c an s u pport on ly
one 24XX 16 per syst em .
The last bit of the control byte defines the operation to
be performed. When set to ‘1’, a read operation is
select ed. W hen set to ‘0 , a write operati on is se lecte d.
Follow in g the Start condi tio n, the 24XX16 moni tors the
SDA bus, checking the device type identifier being
transmitted and, upon receiving a ‘1010’ code, the
slave device outputs an Acknowledge signal on the
SDA line. Depending on the state of the R/W bit, the
24XX16 will select a read or write operation.
FIGU RE 5-1 : CONTROL BYTE
ALLOCATION
FIGURE 5-2: ADDRESS SEQUENCE BI T ASSIGN MENTS
Operation Control
Code Block Select R/W
Read 1010 Block Address 1
Write 1010 Block Address 0
1010B2 B1 B0 R/W ACK
Start Bit
Read/Write Bit
S
Slave Address
Acknowledge Bit
Control Code
Block
Select
Bits
1010B
2B
1B
0R/W A
7A
0
••••
Control Byte Address Low Byte
Control
Code Block
Select
bits
24AA16/24LC16B
DS21703J-page 8 © 2009 Microchip Technology Inc.
6.0 WRITE OPERATION
6.1 Byte Write
Following the Start condition from the master, the
dev ice co de (4 bits), the block address (3 bits) and the
R/W bi t, wh ich is a lo gic-low, is placed onto the bus by
the master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will
follow once it has generated an Ac knowledge b it during
the nint h clock cycl e. Therefor e, the next byt e transmit-
ted by the master is the word address and will be
written into the Address Pointer of the 24XX16. After
receiving another Acknowledge signal from the
24XX16, the master device will transmit the data word
to be written into the addressed memory location. The
24XX16 acknowledges again and the master
generates a Stop condition. This initiates the internal
write cycle and, during this time, the 24XX16 will not
generate Ackno w led ge sig na ls (Fig ure 6-1).
6.2 Page Write
The write control byte, word address and the first data
byte are transm itted to the 24 XX16 in th e sam e way a s
in a byte write. However, instead of generating a Stop
condition, the master transmits up to 16 data bytes to
the 24XX16, which are temporarily stored in the on-
chip page buffer and will be written into memory once
the master has transmitted a Stop condition. Upon
receipt of each word, the four lower-order Address
Pointer bits are internally incremented by ‘1’. The
higher-order 7 bits of the word address remain
constant. If the master should transmit more than 16
bytes prior to generating the Stop condition, the
address counter will roll over and the previously
receive d dat a will be overwri tten. As w ith the by te write
operation, once the Stop condition is received an
internal write cycle will begin (Figure 6-2).
6.3 Write Protection
The W P pin a llows th e user t o writ e-prote ct the entire
array (000-7FF) when the pin is tied to VCC. If tied to
VSS the write protection is disabled.
FIGURE 6-1: BYTE WRITE
Note: Page write opera tions are l imited to wri ting
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
‘pag e-siz e’) and end a t addre sses that a re
integer multiples of [page size – 1]. If a
page write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being w ritten to the next page, as migh t be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
S P
Bus Acti vity
Master
SDA Line
Bus Activity
S
T
A
R
T
S
T
O
P
Control
Byte Word
Address Data
A
C
K
A
C
K
A
C
K
1010B2 B1 B0 0
Block
Select
Bits
© 2009 Microchip Technology Inc. DS21703J-page 9
24AA16/24LC16B
FIGURE 6-2: PAGE WRITE
S P
Bus Acti vity
Master
SDA Line
Bus Activit y
S
T
A
R
T
Control
Byte Word
Address (n) Data (n) Data (n + 15)
S
T
O
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
Data (n + 1)
B1
B2 B0
10100
Block
Select
Bits
24AA16/24LC16B
DS21703J-page 10 © 2009 Microchip Technology Inc.
7.0 ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a write
comma nd has been is sued from the master , the device
initiate s the internally-timed write cycle and ACK polling
can then be initiated immediately. This involves the
master sending a S tart c ondition fo llowed by t he contro l
byte for a write com mand (R/W = 0). If the devic e is still
busy wi th the write cycle, no ACK will be returned. If the
cycle is complete, the device will return the ACK and
the mas ter can then pr oceed with the nex t read or w rite
command. See Figure 7-1 for a flow diagram of this
operation.
FIGURE 7-1: ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
Next
Operation
No
Yes
© 2009 Microchip Technology Inc. DS21703J-page 11
24AA16/24LC16B
8.0 READ OPERATION
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to1’. There are three basic types
of read operat ions: current address read , rand om rea d
and sequential read.
8.1 Current Address Read
The 24XX16 contains an address counter that main-
tains the address of the last word accessed, internally
incremented by ‘1’. Therefore, if the previous access
(either a re ad or write opera tion) was to ad dre ss n, the
next curren t addre ss read operation woul d access data
from address n + 1. Upon receip t of the slave add res s
with R/W bit set to ‘1’, the 24XX16 issues an acknowl-
edge and tran smits the 8-bit dat a word. The maste r will
not acknowledge the transfer , but does generate a S top
condition and the 24XX16 discontinues transmission
(Figure 8- 1).
8.2 Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this typ e of re ad ope ratio n, the word add res s mus t firs t
be set. This is accomplished by sending the word
address to the 24XX16 as part of a write operation.
Once th e word address is s ent, the master ge nerates a
Start condition following the acknowledge. This
terminates the write operation, but not before the inter-
nal Address Pointer is set. The master then issues the
control byt e agai n, but wi th the R /W bit se t to a ‘ 1’. The
24XX16 will then issue an acknowledge and transmit
the 8-bit data word. The master will not acknowledge
the transfer , but do es generate a S top condition and the
24XX16 will discontinue transmission (Figure 8-2).
8.3 Sequential Read
Sequential reads are initiated in the same way as a
random read, except that once the 24XX16 transmits
the first data byte, the master issues an acknowledge
as opposed to a Stop condition in a random read. This
directs the 24XX16 to transmit the next sequentially-
addressed 8-bit word (Figure 8-3).
To provide sequential reads, the 24XX16 contains an
internal Address Pointer that is incremented by one
upon completion of each operation. This Address
Pointer allows the entire memory contents to be serially
read during one operation.
8.4 Noise Protection
The 24XX16 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.5V at nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.
FIGURE 8-1: CURRENT ADDRESS READ
SP
Bus Activity
Master
SDA Line
Bus Activity
S
T
O
P
Control
Byte Data (n)
A
C
K
N
o
A
C
K
S
T
A
R
T
1010 1
B2 B1 B0
Block
Select
Bits
24AA16/24LC16B
DS21703J-page 12 © 2009 Microchip Technology Inc.
FIGURE 8-2: RANDOM READ
FIGURE 8-3: SEQUENTIAL READ
S P
S
Bus Acti vity
Master
SDA Line
Bus Acti vity
S
T
A
R
T
S
T
O
P
Control
Byte
A
C
K
Word
Address (n) Control
Byte
S
T
A
R
TData (n)
A
C
K
A
C
K
N
o
A
C
K
1010 0
B2B1B0 11
001
B2B1B0
Block
Select
Bits
Block
Select
Bits
P
Bus Acti vity
Master
SDA Line
Bus Acti vity
S
T
O
P
Control
Byte
A
C
K
N
o
A
C
K
Data (n) Data (n + 1) Data (n + 2) Data (n + x)
A
C
K
A
C
K
A
C
K
1
© 2009 Microchip Technology Inc. DS21703J-page 13
24AA16/24LC16B
9.0 PACKAGING INFORMATION
9.1 Package Marking Information
XXXXXXXX
T/XXXNNN
YYWW
8-Lead PDIP (300 mil) Example:
8-Lead SOIC (3.90 mm) Example:
XXXXXXXT
XXXXYYWW
NNN
8-Lead TSSOP Example:
24LC16B
I/P 13F
0527
24LC16BI
SN 0527
13F
8-Lead MSOP Example:
XXXX
TYWW
NNN
XXXXXT
YWWNNN
4L16
I527
13F
4L16I
52713F
5-Le a d S OT-23 Example:
XXNN B53F
8-Lead 2x3 DFN Example:
254
527
13
XXX
YWW
NN
3
e
3
e
8-Lead 2x3 TDFN Example:
A54
527
13
XXX
YWW
NN
24AA16/24LC16B
DS21703J-page 14 © 2009 Microchip Technology Inc.
Part Number
1st Line Marking Codes
TSSOP MSOP SOT-23 DFN TDFN
I Temp. E Temp. I Temp. E Temp. I Temp. E Temp.
24AA16 4A16 4A16T B5NN 251 A51
24LC16B 4L16 4L16T M5NN N5NN 254 255 A54 A55
Note: T = Temperature grade (I, E)
NN = Alphanumeric traceability code
5-Lead Chip Scale
XW
Example:
57
Legend: XX...X Part number or part number code
T Temperature (I, E)
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week c ode (w eek of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note: For very small pa ckages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
Note: In the event the full Mi croch ip pa rt numbe r canno t be ma rked on one line , it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
© 2009 Microchip Technology Inc. DS21703J-page 15
24AA16/24LC16B


  !"#$%&"' ()"&'"!&)&#*&&&#
 +%&,&!&
- '!!#.#&"#'#%!&"!!#%!&"!!!&$#/!#
 '!#&.0
1,21!'!&$& "!**&"&&!
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 7,8.
'!9'&! 7 7: ;
7"')%! 7 <
& 1,
&& = = 
##44!!   - 
1!&&   = =
"#&"#>#& .  - -
##4>#& .   <
: 9& -< -? 
&& 9  - 
9#4!! <  
69#>#& )  ? 
9*9#>#& )  < 
: *+ 1 = = -
N
E1
NOTE 1
D
12
3
A
A1
A2
L
b1
b
e
E
eB
c
  * ,<1
24AA16/24LC16B
DS21703J-page 16 © 2009 Microchip Technology Inc.
 ! ""#$%& !'

  !"#$%&"' ()"&'"!&)&#*&&&#
 +%&,&!&
- '!!#.#&"#'#%!&"!!#%!&"!!!&$#''!#
 '!#&.0
1,2 1!'!&$& "!**&"&&!
.32 %'!("!"*&"&&(%%'&"!!
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 99..
'!9'&! 7 7: ;
7"')%! 7 <
& 1,
: 8& = = 
##44!!   = =
&#%%+  = 
: >#& . ?1,
##4>#& . -1,
: 9& 1,
,'%@&A  = 
3&9& 9  = 
3&& 9 .3
3& IB = <B
9#4!!  = 
9#>#& ) - = 
#%& DB = B
#%&1&&' EB = B
D
N
e
E
E1
NOTE 1
12 3
b
A
A1
A2
L
L1
c
h
h
φ
β
α
  * ,1
© 2009 Microchip Technology Inc. DS21703J-page 17
24AA16/24LC16B
 ! ""#$%& !'
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
24AA16/24LC16B
DS21703J-page 18 © 2009 Microchip Technology Inc.
() )"* ! (+%+( !

  !"#$%&"' ()"&'"!&)&#*&&&#
 '!!#.#&"#'#%!&"!!#%!&"!!!&$#''!#
- '!#&.0
1,2 1!'!&$& "!**&"&&!
.32 %'!("!"*&"&&(%%'&"!!
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 99..
'!9'&! 7 7: ;
7"')%! 7 <
& ?1,
: 8& = = 
##44!!  <  
&#%%   = 
: >#& . ?1,
##4>#& . -  
##49&  - -
3&9& 9  ? 
3&& 9 .3
3& IB = <B
9#4!!  = 
9#>#& )  = -
D
N
E
E1
NOTE 1
12
b
e
c
A
A1
A2
L1 L
φ
  * ,<?1
© 2009 Microchip Technology Inc. DS21703J-page 19
24AA16/24LC16B
,$*-.'/00%&,

  !"#$%&"' ()"&'"!&)&#*&&&#
 4' '$!#&)!&#!
- 4!!*!"&#
 '!#&.0
1,2 1!'!&$& "!**&"&&!
.32 %'!("!"*&"&&(%%'&"!!
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 99..
'!9'&! 7 7: ;
7"')%! 7 <
& 1,
: 8& <  
&#%%    
,&&4!! - .3
: 9& 1,
: >#& . -1,
.$!##9&  - = 
.$!##>#& .  = 
,&&>#& )   -
,&&9& 9 -  
,&&&.$!## C  = =
D
N
E
NOTE 1
12
EXPOSED PAD
NOTE 1
21
D2
K
L
E2
N
e
b
A3 A1
A
NOTE 2
BOTTOM VIEW
TOP VIEW
  * ,-,
24AA16/24LC16B
DS21703J-page 20 © 2009 Microchip Technology Inc.
,$*-.'/00%&,
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
© 2009 Microchip Technology Inc. DS21703J-page 21
24AA16/24LC16B
,$*-./00%12(,
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
24AA16/24LC16B
DS21703J-page 22 © 2009 Microchip Technology Inc.
,$*-./00%12(,
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
© 2009 Microchip Technology Inc. DS21703J-page 23
24AA16/24LC16B
." !*-. . !

  !"#$%&"' ()"&'"!&)&#*&&&#
 '!!#.#&"#'#%!&"!!#%!&"!!!&$#''!#
- '!#&.0
1,2 1!'!&$& "!**&"&&!
.32 %'!("!"*&"&&(%%'&"!!
 3&'!&"&4#*!(!!&4%&&#&
&&255***''54
6&! 99..
'!9'&! 7 7: ;
7"')%! 7 <
& ?1,
: 8& = = 
##44!!   < 
&#%%   = 
: >#& . 1,
##4>#& . -1,
: 9& -1,
3&9& 9  ? <
3&& 9 .3
3& IB = <B
9#4!! < = -
9#>#& )  = 
D
N
E
E1
NOTE 1
12
e
b
A
A1
A2
c
L1 L
φ
  * ,1
24AA16/24LC16B
DS21703J-page 24 © 2009 Microchip Technology Inc.
2 !(""!( !(/

 '!!#.#&"#'#%!&"!!#%!&"!!!&$#''!#
 '!#&.0
1,2 1!'!&$& "!**&"&&!
 3&'!&"&4#*!(!!&4%&&#&
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6&! 99..
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:"&!#9#&  1,
: 8&  = 
##44!!  < = -
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3& B = -B
9#4!! < = ?
9#>#& )  = 
φ
N
b
E
E1
D
123
e
e1
A
A1
A2 c
L
L1
  * ,1
© 2009 Microchip Technology Inc. DS21703J-page 25
24AA16/24LC16B
APPENDIX A: REVISION HISTORY
Revision D
Corrections to Section 1.0, Electrical Characteristics.
Revision E
Added DFN package.
Revision F
Revised Figure 3-2 Control Byte Allocation; Figure 4-1
Byte Write; Figure 4-2 Page Write; Section 6.0 Write
Protectio n; Figure 7-1 Curre nt Address Read ; Figure 7-
2 Random Read; Figure 7-3 Sequential Read; Section
8.3 Write-Protect (WP).
Revision G (02/2007)
Changed 1.8V to 1.7V; Revised Features Section;
Replaced Package Drawings; Revised Product ID
Section.
Revision H (01/2009)
Added TDFN Package; Updated Package Drawings.
Revision J (10/2009)
Added 5-Lead Chip Scale Package.
24AA16/24LC16B
DS21703J-page 26 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS21703J-page 27
24AA16/24LC16B
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Technical s upport is a vailable through the web si te
at: http://support.microchip.com
24AA16/24LC16B
DS21703J-page 28 © 2009 Microchip Technology Inc.
READER RESP ONSE
It is ou r intentio n to provide you w it h th e b es t do cument ation po ss ib le to ensure suc c es sfu l u se of y ou r M ic roc hip prod-
uct. If you wi sh to prov ide you r comment s on org aniza tion, clar ity, subj ect matte r , and ways i n which o ur docum entatio n
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DS21703J24AA16/24LC16B
1. What are t he best featu res of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
© 2009 Microchip Technology Inc. DS21703J-page 29
24AA16/24LC16B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX
PackageTemperature
Range
Device
24A A16: = 1.7V, 16 Kbit I2C Serial EEPROM
24AA16T: = 1.7V, 16 Kbit I2C Serial EEPROM
(Tape and Reel)
24LC16B: = 2.5V, 16 Kbit I2C Serial EEPROM
24LC16BT: = 2. 5V, 16 Kbit I2C Serial EEPRO M
(Tape and Reel)
Temperature
Range: I = -40°C to +85°C
E = -40°C to +125°C
Package: MC = 2x3 DFN, 8-lead
P = Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (3.90 mm body), 8-lead
ST = Plas tic TSSOP (4.4 mm), 8-lead
MS = Plastic Micro Small Outline (MSOP),
8-lead
OT = SOT-23, 5-lead (Tape and Reel only)
MNY(1) = TDFN, (2x3x0.75 mm body), 8-lead
CS16K (2) = Chip Scale (CS), 5-lead (I-temp, “AA”
Tape and Reel only)
Note 1: “Y” indicates a Nickel Palladium Gold (NiPdAu) finish.
2: “16K” indicates 160K technology.
Examples:
a) 24AA16-I/P: Industrial Temperature,1.7V,
PDIP package
b) 24AA16-I/SN: Industrial Temper ature,1.7V,
SOIC package
c) 24AA16T-I/OT: Industrial Temperature,
1.7V, SOT-23 package, Tape and Reel
d) 24LC16B-I/P: Industrial T emperature, 2.5V,
PDIP package
e) 24LC16B-E/SN: Automotive Temp.,2.5V
SOIC package
f) 24LC16BT-I/OT: Industrial Temperat ure,
2.5V, SOT-23 package, Tape and Reel
24AA16/24LC16B
DS21703J-page 30 © 2009 Microchip Technology Inc.
NOTES:
© 2009 Microchip Technology Inc. DS21703J-page 31
Information contained in this publication regarding device
applications and the like is provided only for your con ve nience
and may be superseded by u pdates. It is y our respo ns ibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
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suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPL AB, PIC , PI Cmi cro, PI CSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Contr ol
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONIT OR, FanSense, HI- TIDE , In - Circuit Seria l
Programming, ICSP, Mindi, MiWi, MPASM, MPLA B Cert ified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Tec hnology Incorporat ed in the
U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporat ed, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that it s family of products is one of the most secure families of its kind on the market today, when used in t he
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contai ned in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such act s
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code ho pping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21703J-page 32 © 2009 Microchip Technology Inc.
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