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CIII51001-2.4

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Cyclone III Device Handbook

Volume 1

July 2012

ISO

9001:2008

Registered

1. Cyclone III Device Family Overview

Cyclone® III device family offers a unique combination of high functionality, low

power and low cost. Based on Taiwan Semiconductor Manufacturing Company

(TSMC) low-power (LP) process technology, silicon optimizations and software

features to minimize power consumption, Cyclone III device family provides the ideal

solution for your high-volume, low-power, and cost-sensitive applications. To address

the unique design needs, Cyclone III device family offers the following two variants:

■Cyclone III—lowest power, high functionality with the lowest cost

■Cyclone III LS—lowest power FPGAs with security

With densities ranging from about 5,000 to 200,000 logic elements (LEs) and

0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power

consumption, Cyclone III device family makes it easier for you to meet your power

budget. Cyclone III LS devices are the first to implement a suite of security features at

the silicon, software, and intellectual property (IP) level on a low-power and

high-functionality FPGA platform. This suite of security features protects the IP from

tampering, reverse engineering and cloning. In addition, Cyclone III LS devices

support design separation which enables you to introduce redundancy in a single

chip to reduce size, weight, and power of your application.

This chapter contains the following sections:

■“Cyclone III Device Family Features” on page 1–1

■“Cyclone III Device Family Architecture” on page 1–6

■“Reference and Ordering Information” on page 1–12

Cyclone III Device Family Features

Cyclone III device family offers the following features:

Lowest Power FPGAs

■Lowest power consumption with TSMC low-power process technology and

Altera® power-aware design flow

■Low-power operation offers the following benefits:

■Extended battery life for portable and handheld applications

■Reduced or eliminated cooling system costs

■Operation in thermally-challenged environments

■Hot-socketing operation support

July 2012

CIII51001-2.4

1–2 Chapter 1: Cyclone III Device Family Overview

Cyclone III Device Family Features

Cyclone III Device Handbook July 2012 Altera Corporation

Volume 1

Design Security Feature

Cyclone III LS devices offer the following design security features:

■Configuration security using advanced encryption standard (AES) with 256-bit

volatile key

■Routing architecture optimized for design separation flow with the Quartus®II

software

■Design separation flow achieves both physical and functional isolation

between design partitions

■Ability to disable external JTAG port

■Error Detection (ED) Cycle Indicator to core

■Provides a pass or fail indicator at every ED cycle

■Provides visibility over intentional or unintentional change of configuration

random access memory (CRAM) bits

■Ability to perform zeroization to clear contents of the FPGA logic, CRAM,

embedded memory, and AES key

■Internal oscillator enables system monitor and health check capabilities

Increased System Integration

■High memory-to-logic and multiplier-to-logic ratio

■High I/O count, low-and mid-range density devices for user I/O constrained

applications

■Adjustable I/O slew rates to improve signal integrity

■Supports I/O standards such as LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X,

LVPECL, bus LVDS (BLVDS), LVDS, mini-LVDS, RSDS, and PPDS

■Supports the multi-value on-chip termination (OCT) calibration feature to

eliminate variations over process, voltage, and temperature (PVT)

■Four phase-locked loops (PLLs) per device provide robust clock management and

synthesis for device clock management, external system clock management, and

I/O interfaces

■Five outputs per PLL

■Cascadable to save I/Os, ease PCB routing, and reduce jitter

■Dynamically reconfigurable to change phase shift, frequency multiplication or

division, or both, and input frequency in the system without reconfiguring the

device

■Remote system upgrade without the aid of an external controller

■Dedicated cyclical redundancy code checker circuitry to detect single-event upset

(SEU) issues

■Nios® II embedded processor for Cyclone III device family, offering low cost and

custom-fit embedded processing solutions

Chapter 1: Cyclone III Device Family Overview 1–3

Cyclone III Device Family Features

July 2012 Altera Corporation Cyclone III Device Handbook

Volume 1

■Wide collection of pre-built and verified IP cores from Altera and Altera

Megafunction Partners Program (AMPP) partners

■Supports high-speed external memory interfaces such as DDR, DDR2,

SDR SDRAM, and QDRII SRAM

■Auto-calibrating PHY feature eases the timing closure process and eliminates

variations with PVT for DDR, DDR2, and QDRII SRAM interfaces

Cyclone III device family supports vertical migration that allows you to migrate your

device to other devices with the same dedicated pins, configuration pins, and power

pins for a given package-across device densities. This allows you to optimize device

density and cost as your design evolves.

Table 1–1 lists Cyclone III device family features.

Table 1–1. Cyclone III Device Family Features

Family Device Logic

Elements

Number of

M9K

Blocks

Total RAM

Bits

18 x 18

Multipliers PLLs

Global

Clock

Networks

Maximum

User I/Os

Cyclone III

EP3C5 5,136 46 423,936 23 2 10 182

EP3C10 10,320 46 423,936 23 2 10 182

EP3C16 15,408 56 516,096 56 4 20 346

EP3C25 24,624 66 608,256 66 4 20 215

EP3C40 39,600 126 1,161,216 126 4 20 535

EP3C55 55,856 260 2,396,160 156 4 20 377

EP3C80 81,264 305 2,810,880 244 4 20 429

EP3C120 119,088 432 3,981,312 288 4 20 531

Cyclone III

EP3CLS70 70,208 333 3,068,928 200 4 20 429

EP3CLS100 100,448 483 4,451,328 276 4 20 429

EP3CLS150 150,848 666 6,137,856 320 4 20 429

EP3CLS200 198,464 891 8,211,456 396 4 20 429

1–4 Chapter 1: Cyclone III Device Family Overview

Cyclone III Device Family Features

Cyclone III Device Handbook July 2012 Altera Corporation

Volume 1

Table 1–2 lists Cyclone III device family package options, I/O pins, and differential

channel counts.

Table 1–2. Cyclone III Device Family Package Options, I/O pin and Differential Channel Counts (1), (2), (3), (4), (5)

Family Package E144 (7) M164 P240 F256 U256 F324 F484 U484 F780

Cyclone III

(8)

EP3C5 94, 22 106, 28 — 182, 68 182, 68 — — — —

EP3C10 94, 22 106, 28 — 182, 68 182, 68 — — — —

EP3C16 84, 19 92, 23 160, 47 168, 55 168, 55 — 346, 140 346, 140 —

EP3C25 82, 18 — 148, 43 156, 54 156, 54 215, 83 — — —

EP3C40 — — 128, 26 — — 195, 61 331, 127 331, 127 535, 227 (6)

EP3C55 — — — — — — 327, 135 327, 135 377, 163

EP3C80 — — — — — — 295, 113 295, 113 429, 181

EP3C120 — — — — — — 283, 106 — 531, 233

Cyclone III

EP3CLS70 — — — — — — 294, 113 294, 113 429, 181

EP3CLS100 — — — — — — 294, 113 294, 113 429, 181

EP3CLS150 — — — — — — 226, 87 — 429, 181

EP3CLS200 — — — — — — 226, 87 — 429, 181

Notes to Table 1–2:

(1) For each device package, the first number indicates the number of the I/O pin; the second number indicates the differential channel count.

(2) For more information about device packaging specifications, refer to the Cyclone III Package and Thermal Resistance webpage.

(3) The I/O pin numbers are the maximum I/O counts (including clock input pins) supported by the device package combination and can be affected

by the configuration scheme selected for the device.

(4) All packages are available in lead-free and leaded options.

(5) Vertical migration is not supported between Cyclone III and Cyclone III LS devices.

(6) The EP3C40 device in the F780 package supports restricted vertical migration. Maximum user I/Os are restricted to 510 I/Os if you enable

migration to the EP3C120 and are using voltage referenced I/O standards. If you are not using voltage referenced I/O standards, you can increase

the maximum number of I/Os.

(7) The E144 package has an exposed pad at the bottom of the package. This exposed pad is a ground pad that must be connected to the ground

plane on your PCB. Use this exposed pad for electrical connectivity and not for thermal purposes.

(8) All Cyclone III device UBGA packages are supported by the Quartus II software version 7.1 SP1 and later, with the exception of the UBGA

packages of EP3C16, which are supported by the Quartus II software version 7.2.

Chapter 1: Cyclone III Device Family Overview 1–5

Cyclone III Device Family Features

July 2012 Altera Corporation Cyclone III Device Handbook

Volume 1

Table 1–3 lists Cyclone III device family package sizes.

Table 1–4 lists Cyclone III device family speed grades.

Table 1–3. Cyclone III Device Family Package Sizes

Family Package Pitch (mm) Nominal Area (mm2) Length x Width (mm  mm) Height (mm)

Cyclone III

E144 0.5 484 22  22 1.60

M164 0.5 64 8  8 1.40

P240 0.5 1197 34.6  34.6 4.10

F256 1.0 289 17  17 1.55

U256 0.8 196 14  14 2.20

F324 1.0 361 19  19 2.20

F484 1.0 529 23 23 2.60

U484 0.8 361 19  19 2.20

F780 1.0 841 29  29 2.60

Cyclone III LS

F484 1.0 529 23  23 2.60

U484 0.8 361 19  19 2.20

F780 1.0 841 29  29 2.60

Table 1–4. Cyclone III Device Family Speed Grades (Part 1 of 2)

Family Device E144 M164 P240 F256 U256 F324 F484 U484 F780

Cyclone III

EP3C5 C7, C8,

I7, A7

C7, C8,

I7 —C6, C7,

C8, I7, A7

C6, C7,

C8, I7, A7 ————

EP3C10 C7, C8,

I7, A7

C7, C8,

I7 —C6, C7,

C8, I7, A7

C6, C7,

C8, I7, A7 ————

EP3C16 C7, C8,

I7, A7

C7, C8,

I7 C8 C6, C7,

C8, I7, A7

C6, C7,

C8, I7, A7 —C6, C7,

C8, I7, A7

C6, C7,

C8, I7, A7 —

EP3C25 C7, C8,

I7, A7 —C8

C6, C7,

C8, I7, A7

C6, C7,

C8, I7, A7

C6, C7,

C8, I7, A7 ———

EP3C40 — — C8 — — C6, C7,

C8, I7, A7

C6, C7,

C8, I7, A7

C6, C7,

C8, I7, A7

C6, C7,

C8, I7

EP3C55 — — — — — — C6, C7,

C8, I7

C6, C7,

C8, I7

C6, C7,

C8, I7

EP3C80 — — — — — — C6, C7,

C8, I7

C6, C7,

C8, I7

C6, C7,

C8, I7

EP3C120 — — — — — — C7, C8, I7 — C7, C8,

1–6 Chapter 1: Cyclone III Device Family Overview

Cyclone III Device Family Architecture

Cyclone III Device Handbook July 2012 Altera Corporation

Volume 1

Table 1–5 lists Cyclone III device family configuration schemes.

Cyclone III Device Family Architecture

Cyclone III device family includes a customer-defined feature set that is optimized for

portable applications and offers a wide range of density, memory, embedded

multiplier, and I/O options. Cyclone III device family supports numerous external

memory interfaces and I/O protocols that are common in high-volume applications.

The Quartus II software features and parameterizable IP cores make it easier for you

to use the Cyclone III device family interfaces and protocols.

The following sections provide an overview of the Cyclone III device family features.

Logic Elements and Logic Array Blocks

The logic array block (LAB) consists of 16 logic elements and a LAB-wide control

block. An LE is the smallest unit of logic in the Cyclone III device family architecture.

Each LE has four inputs, a four-input look-up table (LUT), a register, and output logic.

The four-input LUT is a function generator that can implement any function with four

variables.

fFor more information about LEs and LABs, refer to the Logic Elements and Logic Array

Blocks in the Cyclone III Device Family chapter.

Cyclone III

EP3CLS70 — — — — — — C7, C8, I7 C7, C8, I7 C7, C8,

EP3CLS100 — — — — — — C7, C8, I7 C7, C8, I7 C7, C8,

EP3CLS150 — — — — — — C7, C8, I7 — C7, C8,

EP3CLS200 — — — — — — C7, C8, I7 — C7, C8,

Table 1–4. Cyclone III Device Family Speed Grades (Part 2 of 2)

Family Device E144 M164 P240 F256 U256 F324 F484 U484 F780

Table 1–5. Cyclone III Device Family Configuration Schemes

Configuration Scheme Cyclone III Cyclone III LS

Active serial (AS) v v

Active parallel (AP) v —

Passive serial (PS) v v

Fast passive parallel (FPP) v v

Joint Test Action Group (JTAG) v v

Chapter 1: Cyclone III Device Family Overview 1–7

Cyclone III Device Family Architecture

July 2012 Altera Corporation Cyclone III Device Handbook

Volume 1

Memory Blocks

Each M9K memory block of the Cyclone III device family provides nine Kbits of

on-chip memory capable of operating at up to 315 MHz for Cyclone III devices and up

to 274 MHz for Cyclone III LS devices. The embedded memory structure consists of

M9K memory blocks columns that you can configure as RAM, first-in first-out (FIFO)

buffers, or ROM. The Cyclone III device family memory blocks are optimized for

applications such as high throughout packet processing, embedded processor

program, and embedded data storage.

The Quartus II software allows you to take advantage of the M9K memory blocks by

instantiating memory using a dedicated megafunction wizard or by inferring memory

directly from the VHDL or Verilog source code.

M9K memory blocks support single-port, simple dual-port, and true dual-port

operation modes. Single-port mode and simple dual-port mode are supported for all

port widths with a configuration of ×1, ×2, ×4, ×8, ×9, ×16, ×18, ×32, and ×36. True

dual-port is supported in port widths with a configuration of ×1, ×2, ×4, ×8, ×9, ×16,

and ×18.

fFor more information about memory blocks, refer to the Memory Blocks in the Cyclone

III Device Family chapter.

Embedded Multipliers and Digital Signal Processing Support

Cyclone III devices support up to 288 embedded multiplier blocks and Cyclone III LS

devices support up to 396 embedded multiplier blocks. Each block supports one

individual 18 × 18-bit multiplier or two individual 9 × 9-bit multipliers.

The Quartus II software includes megafunctions that are used to control the operation

mode of the embedded multiplier blocks based on user parameter settings.

Multipliers can also be inferred directly from the VHDL or Verilog source code. In

addition to embedded multipliers, Cyclone III device family includes a combination

of on-chip resources and external interfaces, making them ideal for increasing

performance, reducing system cost, and lowering the power consumption of digital

signal processing (DSP) systems. You can use Cyclone III device family alone or as

DSP device co-processors to improve price-to-performance ratios of DSP systems.

The Cyclone III device family DSP system design support includes the following

features:

■DSP IP cores:

■Common DSP processing functions such as finite impulse response (FIR), fast

Fourier transform (FFT), and numerically controlled oscillator (NCO) functions

■Suites of common video and image processing functions

■Complete reference designs for end-market applications

■DSP Builder interface tool between the Quartus II software and the MathWorks

Simulink and MATLAB design environments

■DSP development kits

fFor more information about embedded multipliers and digital signal processing

support, refer to the Embedded Multipliers in Cyclone III Devices chapter.

1–8 Chapter 1: Cyclone III Device Family Overview

Cyclone III Device Family Architecture

Cyclone III Device Handbook July 2012 Altera Corporation

Volume 1

Clock Networks and PLLs

Cyclone III device family includes 20 global clock networks. You can drive global

clock signals from dedicated clock pins, dual-purpose clock pins, user logic, and

PLLs. Cyclone III device family includes up to four PLLs with five outputs per PLL to

provide robust clock management and synthesis. You can use PLLs for device clock

management, external system clock management, and I/O interfaces.

You can dynamically reconfigure the Cyclone III device family PLLs to enable

auto-calibration of external memory interfaces while the device is in operation. This

feature enables the support of multiple input source frequencies and corresponding

multiplication, division, and phase shift requirements. PLLs in Cyclone III device

family may be cascaded to generate up to ten internal clocks and two external clocks

on output pins from a single external clock source.

fFor more PLL specifications and information, refer to the Cyclone III Device Data Sheet,

Cyclone III LS Device Data Sheet, and Clock Networks and PLLs in the Cyclone III Device

Family chapters.

I/O Features

Cyclone III device family has eight I/O banks. All I/O banks support single-ended

and differential I/O standards listed in Table 1–6.

The Cyclone III device family I/O also supports programmable bus hold,

programmable pull-up resistors, programmable delay, programmable drive strength,

programmable slew-rate control to optimize signal integrity, and hot socketing.

Cyclone III device family supports calibrated on-chip series termination (RS OCT) or

driver impedance matching (Rs) for single-ended I/O standards, with one OCT

calibration block per side.

fFor more information, refer to the I/O Features in the Cyclone III Device Family chapter.

High-Speed Differential Interfaces

Cyclone III device family supports high-speed differential interfaces such as BLVDS,

LVDS, mini-LVDS, RSDS, and PPDS. These high-speed I/O standards in Cyclone III

device family provide high data throughput using a relatively small number of I/O

pins and are ideal for low-cost applications. Dedicated differential output drivers on

the left and right I/O banks can send data rates at up to 875 Mbps for Cyclone III

devices and up to 740 Mbps for Cyclone III LS devices, without the need for external

resistors. This saves board space or simplifies PCB routing. Top and bottom I/O banks

support differential transmission (with the addition of an external resistor network)

data rates at up to 640 Mbps for both Cyclone III and Cyclone III LS devices.

Table 1–6. Cyclone III Device Family I/O Standards Support

Type I/O Standard

Single-Ended I/O LVTTL, LVCMOS, SSTL, HSTL, PCI, and PCI-X

Differential I/O SSTL, HSTL, LVPECL, BLVDS, LVDS, mini-LVDS, RSDS, and PPDS

Chapter 1: Cyclone III Device Family Overview 1–9

Cyclone III Device Family Architecture

July 2012 Altera Corporation Cyclone III Device Handbook

Volume 1

fFor more information, refer to the High-Speed Differential Interfaces in the Cyclone III

Device Family chapter.

Auto-Calibrating External Memory Interfaces

Cyclone III device family supports common memory types such as DDR, DDR2,

SDR SDRAM, and QDRII SRAM. DDR2 SDRAM memory interfaces support data

rates up to 400 Mbps for Cyclone III devices and 333 Mbps for Cyclone III LS devices.

Memory interfaces are supported on all sides of Cyclone III device family. Cyclone III

device family has the OCT, DDR output registers, and 8-to-36-bit programmable DQ

group widths features to enable rapid and robust implementation of different

memory standards.

An auto-calibrating megafunction is available in the Quartus II software for DDR and

QDR memory interface PHYs. This megafunction is optimized to take advantage of

the Cyclone III device family I/O structure, simplify timing closure requirements, and

take advantage of the Cyclone III device family PLL dynamic reconfiguration feature

to calibrate PVT changes.

fFor more information, refer to the External Memory Interfaces in the Cyclone III Device

Family chapter.

Support for Industry-Standard Embedded Processors

To quickly and easily create system-level designs using Cyclone III device family, you

can select among the ×32-bit soft processor cores: Freescale®V1 Coldfire, ARM®

Cortex M1, or Altera Nios®II, along with a library of 50 other IP blocks when using

the system-on-a-programmable-chip (SOPC) Builder tool. SOPC Builder is an Altera

Quartus II design tool that facilitates system-integration of IP blocks in an FPGA

design. The SOPC Builder automatically generates interconnect logic and creates a

testbench to verify functionality, saving valuable design time.

Cyclone III device family expands the peripheral set, memory, I/O, or performance of

legacy embedded processors. Single or multiple Nios II embedded processors are

designed into Cyclone III device family to provide additional co-processing power, or

even replace legacy embedded processors in your system. Using the Cyclone III

device family and Nios II together provide low-cost, high-performance embedded

processing solutions, which in turn allow you to extend the life cycle of your product

and improve time-to-market over standard product solutions.

1Separate licensing of the Freescale and ARM embedded processors are required.

Hot Socketing and Power-On-Reset

Cyclone III device family features hot socketing (also known as hot plug-in or hot

swap) and power sequencing support without the use of external devices. You can

insert or remove a board populated with one or more Cyclone III device family

during a system operation without causing undesirable effects to the running system

bus or the board that was inserted into the system.

1–10 Chapter 1: Cyclone III Device Family Overview

Cyclone III Device Family Architecture

Cyclone III Device Handbook July 2012 Altera Corporation

Volume 1

The hot socketing feature allows you to use FPGAs on PCBs that also contain a

mixture of 3.3-V, 2.5-V, 1.8-V, 1.5-V, and 1.2-V devices. The Cyclone III device family

hot socketing feature eliminates power-up sequence requirements for other devices

on the board for proper FPGA operation.

fFor more information about hot socketing and power-on-reset, refer to the

Hot-Socketing and Power-on Reset in the Cyclone III Device Family chapter.

SEU Mitigation

Cyclone III LS devices offer built-in error detection circuitry to detect data corruption

due to soft errors in the CRAM cells. This feature allows CRAM contents to be read

and verified to match a configuration-computed CRC value. The Quartus II software

activates the built-in 32-bit CRC checker, which is part of the Cyclone III LS device.

fFor more information about SEU mitigation, refer to the SEU Mitigation in the

Cyclone III Device Family chapter.

JTAG Boundary Scan Testing

Cyclone III device family supports the JTAG IEEE Std. 1149.1 specification. The

boundary-scan test (BST) architecture offers the capability to test pin connections

without using physical test probes and captures functional data while a device is

operating normally. Boundary-scan cells in the Cyclone III device family can force

signals onto pins or capture data from pins or from logic array signals. Forced test

data is serially shifted into the boundary-scan cells. Captured data is serially shifted

out and externally compared to expected results. In addition to BST, you can use the

IEEE Std. 1149.1 controller for the Cyclone III LS device in-circuit reconfiguration

(ICR).

fFor more information about JTAG boundary scan testing, refer to the IEEE 1149.1

(JTAG) Boundary-Scan Testing for the Cyclone III Device Family chapter.

Quartus II Software Support

The Quartus II software is the leading design software for performance and

productivity. It is the only complete design solution for CPLDs, FPGAs, and ASICs in

the industry. The Quartus II software includes an integrated development

environment to accelerate system-level design and seamless integration with leading

third-party software tools and flows.

The Cyclone III LS devices provide both physical and functional separation between

security critical design partitions. Cyclone III LS devices offer isolation between

design partitions. This ensures that device errors do not propagate from one partition

to another, whether unintentional or intentional. The Quartus II software design

separation flow facilitates the creation of separation regions in Cyclone III LS devices

by tightly controlling the routing in and between the LogicLock regions. For ease of

use, the separation flow integrates in the existing incremental compilation flow.

fFor more information about the Quartus II software features, refer to the Quartus II

Handbook.

Chapter 1: Cyclone III Device Family Overview 1–11

Cyclone III Device Family Architecture

July 2012 Altera Corporation Cyclone III Device Handbook

Volume 1

Configuration

Cyclone III device family uses SRAM cells to store configuration data. Configuration

data is downloaded to Cyclone III device family each time the device powers up.

Low-cost configuration options include the Altera EPCS family serial flash devices as

well as commodity parallel flash configuration options. These options provide the

flexibility for general-purpose applications and the ability to meet specific

configuration and wake-up time requirements of the applications. Cyclone III device

family supports the AS, PS, FPP, and JTAG configuration schemes. The AP

configuration scheme is only supported in Cyclone III devices.

fFor more information about configuration, refer to the Configuration, Design Security,

and Remote System Upgrades in the Cyclone III Device Family chapter.

Remote System Upgrades

Cyclone III device family offers remote system upgrade without an external

controller. The remote system upgrade capability in Cyclone III device family allows

system upgrades from a remote location. Soft logic (either the Nios II embedded

processor or user logic) implemented in Cyclone III device family can download a

new configuration image from a remote location, store it in configuration memory,

and direct the dedicated remote system upgrade circuitry to start a reconfiguration

cycle. The dedicated circuitry performs error detection during and after the

configuration process, and can recover from an error condition by reverting to a safe

configuration image. The dedicated circuitry also provides error status information.

Cyclone III devices support remote system upgrade in the AS and AP configuration

scheme. Cyclone III LS devices support remote system upgrade in the AS

configuration scheme only.

fFor more information, refer to the Configuration, Design Security, and Remote System

Upgrades in the Cyclone III Device Family chapter.

Design Security (Cyclone III LS Devices Only)

Cyclone III LS devices offer design security features which play a vital role in the large

and critical designs in the competitive military and commercial environments.

Equipped with the configuration bit stream encryption and anti-tamper features,

Cyclone III LS devices protect your designs from copying, reverse engineering and

tampering. The configuration security of Cyclone III LS devices uses AES with 256-bit

security key.

fFor more information, refer to the Configuration, Design Security, and Remote System

Upgrades in Cyclone III Device Family chapter.

1–12 Chapter 1: Cyclone III Device Family Overview

Reference and Ordering Information

Cyclone III Device Handbook July 2012 Altera Corporation

Volume 1

Reference and Ordering Information

Figure 1–1 and Figure 1–2 show the ordering codes for Cyclone III and Cyclone III LS

devices.

Figure 1–1. Cyclone III Device Packaging Ordering Information

Family Signature

Package Type

Package Code

Operating Temperature

Speed Grade

Optional Suffix

Indicates specific device

options or shipment method

EP3C : Cyclone III

5 : 5,136 logic elements

10 : 10,320 logic elements

16 : 15,408 logic elements

25 : 24,624 logic elements

25E : 24,624 logic elements

40 : 39,600 logic elements

55 : 55,856 logic elements

80 : 81,264 logic elements

120 : 119,088 logic elements

E : Plastic Enhanced Quad Flat Pack (EQFP)

Q : Plastic Quad Flat Pack (PQFP)

F : FineLine Ball-Grid Array (FBGA)

U : Ultra FineLine Ball-Grid Array (UBGA)

M : Micro FineLine Ball-Grid Array (MBGA)

144 : 144 pins

164 : 164 pins

240 : 240 pins

256 : 256 pins

324 : 324 pins

484 : 484 pins

780 : 780 pins

C : Commercial temperature (T

= 0° C to 85° C)

I : Industrial temperature (T

= -40° C to 100° C)

A : Automotive temperature (T

= -40° C to 125° C)

6 (fastest)

N : Lead-free packaging

ES : Engineering sample

EP3C 25 F 324 C 7 N

Member Code

Figure 1–2. Cyclone III LS Device Packaging Ordering Information

Family Signature

Package Type

Package Code

Operating Temperature

Speed Grade

Optional Suffix

Indicates specific device

options or shipment method

EP3CLS : Cyclone III LS

70 : 70,208 logic elements

100 : 100,448 logic elements

150 : 150,848 logic elements

200 : 198,464 logic elements

F : FineLine Ball-Grid Array (FBGA)

U : Ultra FineLine Ball-Grid Array (UBGA)

484 : 484 pins

780 : 780 pins

C : Commercial temperature (TJ = 0° C to 85° C)

I : Industrial temperature (TJ = -40° C to 100° C)

7 (fastest)

N : Lead-free packaging

ES : Engineering sample

EP3CLS 70 F 484 C 7 N

Member Code

Chapter 1: Cyclone III Device Family Overview 1–13

Document Revision History

July 2012 Altera Corporation Cyclone III Device Handbook

Volume 1

Document Revision History

Table 1–7 lists the revision history for this document.

Table 1–7. Document Revision History

Date Version Changes

July 2012 2.4 Updated 484 pin package code in Figure 1–1.

December 2011 2.3

■Updated Table 1–1 and Table 1–2.

■Updated Figure 1–1 and Figure 1–2.

■Updated hyperlinks.

■Minor text edits.

December 2009 2.2 Minor text edits.

July 2009 2.1 Minor edit to the hyperlinks.

June 2009 2.0

■Added Table 1–5.

■Updated Table 1–1, Table 1–2, Table 1–3, and Table 1–4.

■Updated “Introduction”, “Cyclone III Device Family Architecture”, “Embedded Multipliers

and Digital Signal Processing Support ”, “Clock Networks and PLLs ”, “I/O Features ”,

“High-Speed Differential Interfaces ”, “Auto-Calibrating External Memory Interfaces ”,

“Quartus II Software Support”, “Configuration ”, and “Design Security (Cyclone III LS

Devices Only)”.

■Removed “Referenced Document” section.

October 2008 1.3

■Updated “Increased System Integration” section.

■Updated “Memory Blocks” section.

■Updated chapter to new template.

May 2008 1.2

■Added 164-pin Micro FineLine Ball-Grid Array (MBGA) details to Table 1–2, Table 1–3 and

Table 1–4.

■Updated Figure 1–2 with automotive temperature information.

■Updated “Increased System Integration” section, Table 1–6, and “High-Speed Differential

Interfaces” section with BLVDS information.

July 2007 1.1

■Removed the text “Spansion” in “Increased System.

■Integration” and “Configuration” sections.

■Removed trademark symbol from “MultiTrack” in “MultiTrack Interconnect”.

■Removed registered trademark symbol from “Simulink” and “MATLAB” from “Embedded

Multipliers and Digital.

■Signal Processing Support” section.

■Added chapter TOC and “Referenced Documents” section.

March 2007 1.0 Initial release.

1–14 Chapter 1: Cyclone III Device Family Overview

Document Revision History

Cyclone III Device Handbook July 2012 Altera Corporation

Volume 1

Mouser Electronics

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EP3C10F256I7N EP3C10F256C6 EP3C120F484C7 EP3C25F324C8N EP3C55U484I7N EP3C5E144C7

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EP3C80F484C7N EP3C40U484C6 EP3C25U256C8 EP3CLS150F484I7 EP3C55F484C7 EP3CLS100F780C7N

EP3C5F256C6N EP3C5U256C6N EP3C120F484C8 EP3C80F780C8N EP3C80U484C8 EP3C16F484C6

EP3C16F484C7N EP3CLS70F780I7 EP3CLS100F780I7 EP3CLS100U484I7 EP3C5E144I7 EP3C25E144C7N

EP3CLS200F484C8 EP3C55F780C8 EP3CLS70F484I7 EP3C25Q240C8 EP3C25F256C6N EP3CLS100F780C8N

EP3C120F780C7 EP3CLS150F780C8 EP3CLS150F780I7N EP3C40F484C7N EP3C40U484I7N EP3C10F256I7

EP3C40Q240C8 EP3C55F780C6N EP3C80F484C6 EP3CLS70U484I7N EP3C16F256A7N EP3CLS200F780C7

EP3C16F256I7 EP3C55U484C7N EP3C10E144C8N EP3CLS70F780C7N EP3C10E144C8 EP3C80F780C6N

EP3C5M164C8N EP3CLS200F780C8 EP3C40U484I7 EP3C10U256C8