• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
1
HMIC™ Silicon PIN Diode Switch RoHS Compliant
with Integrated Bias Network
Rev. V2
MASW-005102-13600
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Parameter Absolute Maximum
Operating Temperature -65oC to +125oC
Storage Temperature -65oC to +150oC
Junction Temperature +175oC
Applied Reverse Voltage 50V
RF Incident Power +33dBm C.W.1
Bias Current +25°C ±20mA
Note:
1. Maximum operating conditions for a
combination of RF power, D.C. bias and
temperature:
Features
♦ Broad Bandwidth Specified up to 18 GHz
♦ Usable up to 26 GHz
♦ Integrated Bias Network
♦ Low Insertion Loss / High Isolation
♦ Rugged, Glass Encapsulated Construction
♦ Fully Monolithic
Description
The MASW-005102-13600 device is a SP5T broadband
switch with integrated bias network utilizing M/A-COM's
HMICTM (Heterolithic Microwave Integrated Circuit)
process, US Patent 5,268,310. This process allows the
incorporation of silicon pedestals that form series and
shunt diodes or vias by imbedding them in low loss,
low dispersion glass. By using small spacing between
elements, this combination of silicon and glass gives
HMIC devices low loss and high isolation performance
with exceptional repeatability through low millimeter
frequencies. Large bond pads facilitate the use of low
inductance ribbon bonds, while gold backside
metallization allows for manual or automatic chip
bonding via 80/20 - Au/Sn, 62/36/2 - Sn/Pb/Ag solders
or electrically conductive silver epoxy.
Yellow areas denote wire bond pads
Applications
These high performance switches are suitable for use
in multi-band ECM, Radar, and instrumentation control
circuits where high isolation to insertion loss ratios are
required. With a standard +5V/-5V, TTL controlled PIN
diode driver, 80nS switching speeds can be achieved.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
2
HMIC™ Silicon PIN Diode Switch RoHS Compliant
with Integrated Bias Network
Rev. V2
MASW-005102-13600
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
MASW-005102-13600 (SP5T)
Electrical Specifications @ TAMB = +25oC, 10mA Bias current
1.Typical switching speed measured from 10% to 90% of detected RF signal driven by TTL compatible drivers using RC
output spiking network, R = 50 – 200Ω , C = 390 – 560pF.
Note:
Operation of the MASW-005102-13600
Operation of the MASW Series of PIN switches is achieved by the simultaneous application of negative DC
current to the low loss port and positive DC current to the remaining isolated switching ports per the Driver
Connections table below. The control currents should be supplied by constant current sources. For insertion
loss, -10mA bias results in approximately –2V, and for Isolation ,+10mA yields approximately +0.9V at the
respective bias nodes. The backside area of the die is the RF and DC return ground plane.
Driver Connections
PARAMETER FREQUENCY
BAND MIN TYP MAX UNITS
INSERTION LOSS
2GHz 1.5 dB
6GHZ 0.9 1.0 dB
12GHz 1.2 1.5 dB
18GHz 1.8 2.1 dB
ISOLATION
2GHz 45 50 dB
6GHZ 40 48 dB
12GHz 30 40 dB
18GHz 25 35 dB
INPUT RETURN LOSS
6GHZ 20 dB
12GHz 20 dB
18GHz 17 dB
OUTPUT RETURN LOSS
2GHz 22 dB
6GHZ 19 dB
12GHz 19 dB
18GHz 17 dB
SWITCHING SPEED 10GHz 80 ns
CONTROL LEVEL (DC CURRENT) CONDITION OF RF OUTPUT
B2 B3 B4 B5 B6 J2-J1 J3-J1 J4-J1 J5-J1 J6-J1
-10mA +10mA +10mA +10mA +10mA
Low Loss Isolation Isolation Isolation Isolation
+10mA -10mA +10mA +10mA +10mA Isolation
Low Loss Isolation Isolation Isolation
+10mA +10mA -10mA +10mA +10mA Isolation Isolation
Low Loss Isolation Isolation
+10mA +10mA +10mA
-10mA +10mA Isolation Isolation Isolation
Low Loss Isolation
+10mA +10mA +10mA +10mA
-10mA Isolation Isolation Isolation Isolation Low Loss
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
3
HMIC™ Silicon PIN Diode Switch RoHS Compliant
with Integrated Bias Network
Rev. V2
MASW-005102-13600
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
MASW-005102-13600 TYPI CAL INSERTION LOSS
-5.00
-4.00
-3.00
-2.00
-1.00
0.00
2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00
FREQUENCY ( GHz )
IL ( dB )
J2 J3 J4 J5 J6
MAS W-005102-13600 TYPICAL IS OL ATI ON
-80.00
-70.00
-60.00
-50.00
-40.00
-30.00
-20.00
-10.00
0.00
2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00
FREQUENCY ( GHz )
ISO ( dB )
J2 J3 J4 J5 J6
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
4
HMIC™ Silicon PIN Diode Switch RoHS Compliant
with Integrated Bias Network
Rev. V2
MASW-005102-13600
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
MASW-00 5102- 1360 0
TYP ICAL I NPUT RETURN LOSS
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00
FREQUENCY ( GHz )
IRL ( dB )
J2 J3 J4 J5 J6
MASW 5102-13600
TYPIC A L OU TPUT R ETU R N LOSS
-30.00
-25.00
-20.00
-15.00
-10.00
-5.00
0.00
2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00
FREQUENCY ( GHz )
ORL ( dB )
J2 J3 J4 J5 J6
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
5
HMIC™ Silicon PIN Diode Switch RoHS Compliant
with Integrated Bias Network
Rev. V2
MASW-005102-13600
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
DC Bias
J1
(Input Common Port)
J2
J3 J5
J6
J4
MASW-005102-13600 Schematic
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
6
HMIC™ Silicon PIN Diode Switch RoHS Compliant
with Integrated Bias Network
Rev. V2
MASW-005102-13600
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
MASW-005102-13600
Chip Outline Drawing1,2
Notes:
1. Topside and backside metallization is gold , 2.5µM thick typical.
2. Yellow areas indicate wire bonding pads
DIM Mils Millimeters
MIN MAX MIN MAX
A 54 55 1.37 1.40
B 27 28 0.69 0.71
C 30 31 0.76 0.79
D 31 32 0.79 0.81
E 19 20 0.48 0.51
F 118.5 120.5 3.01 3.06
G 35 36 0.89 0.91
RF Bond Pads (J1-J6) .007 X .005 REF. .178 X .127 REF.
DC Bond Pads (B2-
B6) .005 X .005 REF. .127 X .127 REF.
Chip Thickness 0.005 REF. 0.127 REF.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
7
HMIC™ Silicon PIN Diode Switch RoHS Compliant
with Integrated Bias Network
Rev. V2
MASW-005102-13600
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Cleanliness
These chips should be handled in a clean environment.
Wire Bonding
Thermosonic wedge wire bonding using 0.00025” x 0.003” ribbon or 0.001” diameter gold wire is
recommended. A heat stage temperature of 150oC and a force of 18 to 22 grams should be used. Ultrasonic
energy should be adjusted to the minimum required to achieve a good bond. RF bond wires should be kept as
short and straight as possible.
Mounting
The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder
preform or conductive epoxy. Mounting surface must be clean and flat.
Eutectic Die Attachment
An 80/20, gold-tin, eutectic solder preform is recommended with a work surface temperature of 255oC and a
tool tip temperature of 265oC. When hot gas is applied, the tool tip temperature should be 290oC. The chip
should not be exposed to temperatures greater than 320oC for more than 20 seconds. No more than three
seconds should be required for attachment. Solders containing tin should not be used.
Epoxy Die Attachment
A minimum amount of epoxy should be used. A thin epoxy fillet should be visible around the perimeter of the
chip after placement. Cure epoxy per manufacturer’s schedule. (typically 125-150oC).
Wire/Ribbon and Die Attachment Recommendations
Part Number Package
MASW-005102-13600W Waffle Pack
Ordering Information
