SCAS069B - AUGUST 1988 - REVISED APRIL 1996 D Inputs Are TTL-Voltage Compatible D Generates Either Odd or Even Parity for D OR N PACKAGE (TOP VIEW) Nine Data Lines B A PARITY I/O GND PARITY ERROR XMIT I D Cascadable for n-Bits Parity D Center-Pin VCC and GND Configurations D D D Minimize High-Speed Switching Noise EPICt (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125C Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) 1 14 2 13 3 12 4 11 5 10 6 9 7 8 C D E VCC F G H description The 74ACT11286 universal 9-bit parity generator/checker features a local output for parity checking and a bus-driving parity I/O port for parity generation/checking. The word-length capability is easily expanded by cascading. The XMIT control input is implemented specifically to accommodate cascading. When the XMIT is low, the parity tree is disabled and the PARITY ERROR output remains at a high logic level, regardless of the input levels. When XMIT is high, the parity tree is enabled. PARITY ERROR indicates a parity error when either an even number of inputs (A through I) are high and PARITY I/O is forced to a low logic level, or when an odd number of inputs are high and PARITY I/O is forced to a high logic level. The I/O control circuitry is designed so that the I/O port remains in the high-impedance state during power up or power down, to prevent bus glitches. The 74ACT11286 is characterized for operation from -40C to 85C. FUNCTION TABLE NUMBER OF INPUTS (A-I ) THAT ARE HIGH XMIT INPUT PARITY I/O PARITY ERROR OUTPUT 0, 2, 4, 6, 8 l H H 1, 3, 5, 7, 9 l L H h h H h l L h h L h l H 0, 2, 4, 6, 8 1, 3, 5, 7, 9 h = high input level, H = high output level, I = low input level, L = low output level Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC is a trademark of Texas Instruments Incorporated. Copyright 1996, Texas Instruments Incorporated !"#$%! & '("")% $& ! *(+,'$%! -$%). "!-('%& '!!"# %! &*)''$%!& *)" %/) %)"#& ! )0$& &%"(#)%& &%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-) %)&%3 ! $,, *$"$#)%)"&. * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * 1 SCAS069B - AUGUST 1988 - REVISED APRIL 1996 logic symbol A B C D E F G H I XMIT 2 2k 1 14 13 1 12 3 PARITY I/O N2 10 9 8 2, 1 7 6 5 PARITY ERROR EN 1 This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) A B C D E F G H I PARITY I/O XMIT 2 2 1 14 13 12 10 5 PARITY ERROR 9 8 7 3 6 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * SCAS069B - AUGUST 1988 - REVISED APRIL 1996 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA Maximum power dissipation at TA = 55C (in still air) (see Note 2): D package . . . . . . . . . . . . . . . . . . . 1.25 W N package . . . . . . . . . . . . . . . . . . . . 1.1 W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The maximum package power dissipation is calculated using a junction temperature of 150_C and a board trace length of 750 mils, except for the N package, which has a trace length of zero. recommended operating conditions MIN MAX 4.5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO IOH Output voltage 0 High-level input voltage 2 UNIT V V 0.8 V VCC VCC V High-level output current -24 mA IOL Dt/Dv Low-level output current 24 mA 0 10 ns/V TA Operating free-air temperature -40 85 C Input transition rise or fall rate * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * V 3 SCAS069B - AUGUST 1988 - REVISED APRIL 1996 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN 4.5 V 4.4 4.4 5.5 V 5.4 5.4 4.5 V 3.94 3.8 IOH = -24 mA 5.5 V 4.94 4.8 IOH = -75 mA 5.5 V IOH = -50 mA A VOH IL = 50 mA A VOL IOZ II IOL = 24 mA PARITY I/O Except PARITY I/O ICC TA = 25C TYP MAX VCC MIN MAX UNIT V 3.85 4.5 V 0.1 5.5 V 0.1 0.1 0.1 4.5 V 0.36 0.44 5.5 V 0.36 0.44 V IOL = 75 mA VO = VCC or GND 5.5 V 5.5 V 0.5 5 mA VI = VCC or GND VI = VCC or GND, 5.5 V 0.1 1 mA 5.5 V 8 80 mA 5.5 V 0.9 1 mA IO = 0 DICC One input at 3.4 V, Other inputs at GND or VCC Ci VI = VCC or GND VO = VCC or GND 1.65 5V 3.5 pF Co PARITY I/O 5V 8 Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms. This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V to VCC. pF switching characteristics over recomended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL Any A-I PARITY I/O tPLH tPHL Any A-I PARITY ERROR tPLH tPHL PARITY I/O PARITY ERROR tPZH tPZL XMIT PARITY I/O tPHZ tPLZ XMIT PARITY I/O TA = 25C MIN TYP MAX MIN MAX 2.7 6.1 9 2.7 10.4 3.6 7.3 10.8 3.6 12 3 6.9 9.7 3 11.3 3.9 7.7 11.4 3.9 12.9 2.2 4.6 6.8 2.2 7.7 3.1 5.6 8.3 3.1 9.1 1.8 4.2 6.3 1.8 7.3 3 6.3 9.4 3 11.4 4.7 6.5 7.9 4.7 8.5 4.1 6 7.3 4.1 7.8 UNIT ns ns ns ns ns operating characteristics, VCC = 5 V, TA = 25C PARAMETER TEST CONDITIONS Outputs enabled Cpd 4 Power dissipation capacitance Outputs disabled * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * TYP UNIT 56 CL = 50 pF, f = 1 MHz 50 pF SCAS069B - AUGUST 1988 - REVISED APRIL 1996 PARAMETER MEASUREMENT INFORMATION 2 x VCC 500 From Output Under Test S1 Open GND CL = 50 pF (see Note A) 500 TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 x VCC GND 1.5 V 1.5 V LOAD CIRCUIT Output Control (low-level enabling) 3V Input 1.5 V 1.5 V 0V tPHL tPLH 50% VCC 0V tPZL tPLZ Output Waveform 1 S1 at 2 x VCC (see Note B) VOH Output 3V Output Waveform 2 S1 at GND (see Note B) 50% VCC VOL 50% VCC [ VCC 20% VCC VOL tPHZ tPZH 50% VCC 80% VCC VOH [0V VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 3 ns, tf = 3 ns. D. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * 5 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ACT11286D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11286DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11286DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11286DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11286DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ACT11286DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device 74ACT11286DR Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.0 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) 74ACT11286DR SOIC D 14 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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