1
Data sheet acquired from Harris Semiconductor
SCHS055E
Features
• High-Voltage Types (20V Rating)
• CD4070B - Quad Exclusive-OR Gate
• CD4077B - Quad Exclusive-NOR Gate
• Medium Speed Operation
-t
PHL, tPLH = 65ns (Typ) at VDD = 10V, CL = 50pF
• 100% Tested for Quiescent Current at 20V
• Standardized Symmetrical Output Characteristics
• 5V, 10V and 15V Parametric Ratings
• Maximum Input Current of 1µA at 18V Over Full
Package Temperature Range
- 100nA at 18V and 25oC
• Noise Margin (Over Full Package Temperature Range)
- 1V at VDD = 5V, 2V at VDD = 10V, 2.5V at VDD = 15V
• Meets All Requirements of JEDEC Standard No. 13B,
“Standard Specifications for Description of ‘B’ Series
CMOS Devices
Applications
• Logical Comparators
• Adders/Subtractors
• Parity Generators and Checkers
Description
The Harris CD4070B contains four independent Exclusive-
OR gates. The Harris CD4077B contains four independent
Exclusive-NOR gates.
The CD4070B and CD4077B provide the system designer
with a means for direct implementation of the Exclusive-OR
and Exclusive-NOR functions, respectively.
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
Ordering Information
PART NUMBER TEMP. RANGE
(oC) PACKAGE
CD4070BE -55 to 125 14 Ld PDIP
CD4070BF3A -55 to 125 14 Ld CERDIP
CD4070BM -55 to 125 14 Ld SOIC
CD4070BMT -55 to 125 14 Ld SOIC
CD4070BM96 -55 to 125 14 Ld SOIC
CD4070BNSR -55 to 125 14 Ld SOP
CD4070BPW -55 to 125 14 Ld TSSOP
CD4070BPWR -55 to 125 14 Ld TSSOP
CD4077BE -55 to 125 14 Ld PDIP
CD4077BF3A -55 to 125 14 Ld CERDIP
CD4077BM -55 to 125 14 Ld SOIC
CD4077BMT -55 to 125 14 Ld SOIC
CD4077BM96 -55 to 125 14 Ld SOIC
CD4077BNSR -55 to 125 14 Ld SOP
CD4077BPW -55 to 125 14 Ld TSSOP
CD4077BPWR -55 to 125 14 Ld TSSOP
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2003, Texas Instruments Incorporated
CD4070B,
CD4077B
CMOS Quad Exclusive-OR
and Exclusive-NOR Gate
[ /Title
(CD40
70B,
CD407
7B)
/Sub-
ject
(CMO
SQuad
Exclu-
sive-
OR
and
Exclu-
sive-
NOR
Gate)
/Autho
r ()
/Key-
words
(Har-
ris
Semi-
con-
ductor,
CD400
0,
metal
gate,
CMOS
, pdip,
cerdip,
mil,
January 1998 - Revised September 2003
2
Pinouts
CD4070B
(PDIP, CERDIP, SOIC, SOP, TSSOP)
TOP VIEW
CD4077B
(PDIP, CERDIP, SOIC, SOP, TSSOP)
TOP VIEW
A
B
J = A ⊕ B
K = C ⊕ D
C
D
VSS
VDD
H
G
M = G ⊕ H
L = E ⊕ F
F
E
1
2
3
4
5
6
7
14
13
12
11
10
9
8
A
B
J = A ⊕ B
K = C ⊕ D
C
D
VSS
VDD
H
G
M = G ⊕ H
L = E ⊕ F
F
E
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Functional Diagrams
CD4070B CD4077B
A
B
C
D
E
F
G
H
1
2
5
6
8
9
12
13
3
4
10
11
J = A ⊕ B
K = C⊕ D
M = G ⊕H
L = E ⊕ F
VSS = 7
VDD = 14
J
K
L
M
A
B
C
D
E
F
G
H
1
2
5
6
8
9
12
13
3
4
10
11
J=A
⊕ B
K = C ⊕ D
M = G ⊕ H
L=E
⊕ F
J
K
L
M
CD4070B, CD4077B
3
FIGURE 1. SCHEMATIC DIAGRAM FOR CD4070B
(1 OF 4 IDENTICAL GATES)
CD4070B TRUTH TABLE (1 OF 4 GATES)
ABJ
000
101
011
110
NOTE:
1 = High Level
0 = Low Level
J = A ⊕B
VDD
VSS
VSS
VDD
VDD
VSS
VSS
VDD
p
n
p
n
p
np
p
n
p
n
J
3(4,10,11
)
B†
2(5,9,12)
A†
1(6,8,13)
†INPUTS PROTECTED
BY CMOS PROTECTION
NETWORK
FIGURE 2. SCHEMATIC DIAGRAM FOR CD4077B
(1 OF 4 IDENTICAL GATES)
CD4077B TRUTH TABLE (1 OF 4 GATES)
ABJ
001
100
010
111
NOTE:
1 = High Level
0 = Low Level
J = A ⊕B
VDD
VSS
VSS
VDD
VDD
VSS
VSS
VDD
p
n
p
n
p
n
p
n
p
n
J
3(4,10,11
)
B†
2(5,9,12)
A†
1(6,8,13)
†INPUTS PROTECTED
BY CMOS PROTECTION
NETWORK
n
CD4070B, CD4077B
4
Absolute Maximum Ratings Thermal Information
DC Supply Voltage Range (VDD) . . . . . . . . . . . . . . . . . -0.5V to 20V
Input Voltage Range, All Inputs . . . . . . . . . . . . . . -0.5V to VDD 0.5V
DC Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .± 10mA
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range (Typical) . . . . . . . . . . . . . . . . . . . . 3V to 18V
Package Thermal Impedance, θJA (see Note 1):
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80oC/W
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86oC/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76oC/W
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 113oC/W
Maximum Junction Temperature (Hermetic Package or Die) . 175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
PARAMETER
CONDITIONS
LIMITS AT INDICATED TEMPERATURES (oC)
UNITS-55 -40 85 125
25
VO
(V) VIN
(V) VDD
(V) MIN TYP MAX
Quiescent Device Current
IDD Max - 0, 5 5 0.25 0.25 7.5 7.5 - 0.01 0.25 µA
- 0, 10 10 0.5 0.5 15 15 - 0.01 0.5 µA
- 0, 15 15 1 1 30 30 - 0.01 1 µA
- 0, 20 20 5 5 150 150 - 0.02 5 µA
Output Low (Sink) Current
IOL Min 0.4 0, 5 5 0.64 0.61 0.42 0.36 0.51 1 - mA
0.5 0, 10 10 1.6 1.5 1.1 0.9 1.3 2.6 - mA
1.5 0, 15 15 4.2 4 2.8 2.4 3.4 6.8 - mA
Output High (Source) Current
IOH Min 4.6 0, 5 5 -0.64 -0.61 -0.42 -0.36 -0.51 -1 - mA
2.5 0, 5 5 -2 -1.8 -1.3 -1.15 -1.6 -3.2 - mA
9.5 0, 10 10 -1.6 -1.5 -1.1 -0.9 -1.3 -2.6 - mA
13.5 0, 15 15 -4.2 -4 -2.8 -2.4 -3.4 -6.8 - mA
Output Voltage: Low Level,
VOL Max - 0, 5 5 0.05 0.05 0.05 0.05 - 0 0.05 V
- 0, 10 10 0.05 0.05 0.05 0.05 - 0 0.05 V
- 0, 15 15 0.05 0.05 0.05 0.05 - 0 0.05 V
Output Voltage: High Level,
VOH Min - 0, 5 5 4.95 4.95 4.95 4.95 4.95 5 - V
- 0, 10 10 9.95 9.95 9.95 9.95 9.95 10 - V
- 0, 15 15 14.95 14.95 14.95 14.95 14.95 15 - V
Input Low Voltage,
VIL Max 0.5, 4.5 - 5 1.5 1.5 1.5 1.5 - - 1.5 V
1, 9-103333--3V
1.5, 13.5 - 15 4444--4V
Input High Voltage,
VIH Min 0.5, 4.5 - 5 3.5 3.5 3.5 3.5 3.5 - - V
1, 9-1077777--V
1.5, 13.5 - 15 11 11 11 11 11 - - V
Input Current, IIN Max - 0, 18 18 ±0.1 ±0.1 ±1±1-±10-5 ±0.1 µA
CD4070B, CD4077B
5
AC Electrical Specifications TA = 25oC, Input tr, tf = 20ns, CL = 50pF, RL = 200kΩ
PARAMETER SYMBOL
TEST CONDITIONS LIMITS ON ALL TYPES
UNITSVDD (V) TYP MAX
Propagation Delay Time tPHL, tPLH 5 140 280 ns
10 65 130 ns
15 50 100 ns
Transition Time tTHL, tTLH 5 100 200 ns
10 50 100 ns
15 40 80 ns
Input Capacitance CIN Any Input 5 7.5 pF
Typical Performance Curves
FIGURE 3. TYPICAL OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS FIGURE 4. MINIMUM OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS
FIGURE 5. TYPICAL OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS FIGURE 6. MINIMUM OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
TA = 25oC
GATE TO SOURCE VOLTAGE (VGS) = 15V
10V
5V
30
25
20
15
10
5
00 5 10 15
IOL, OUTPUT LOW (SINK) CURRENT (mA)
VDS, DRAIN TO SOURCE VOLTAGE (V)
TA = 25oC
GATE TO SOURCE VOLTAGE (VGS) = 15V
10V
5V
15
12.5
10
7.5
5
2.5
00 5 10 15
IOL, OUTPUT LOW (SINK) CURRENT (mA)
VDS, DRAIN TO SOURCE VOLTAGE (V)
TA = 25oC
GATE TO SOURCE VOLTAGE (VGS) = -5V
-10V
-15V
-5
-10
-15
-20
-25
-30
0
0-5-10-15
IOH, OUTPUT HIGH (SOURCE) CURRENT (mA)
VDS, DRAIN TO SOURCE VOLTAGE (V)
TA = 25oC
GATE TO SOURCE VOLTAGE (VGS) = -5V
-10V
-15V -15
-10
-5
0
0-5-10-15
IOH, OUTPUT HIGH (SINK) CURRENT (mA)
VDS, DRAIN TO SOURCE VOLTAGE (V)
CD4070B, CD4077B
6
FIGURE 7. TYPICAL TRANSITION TIME AS A FUNCTION OF
LOAD CAPACITANCE FIGURE 8. TYPICAL PROPAGATION DELAY TIME AS A
FUNCTION OF LOAD CAPACITANCE
FIGURE 9. TYPICAL PROPAGATION DELAY TIME AS A
FUNCTION OF SUPPLY VOLTAGE FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A
FUNCTION OF INPUT FREQUENCY
Typical Performance Curves (Continued)
TA = 25oC
SUPPLY VOLTAGE (VDD) = 5V
10V
15V
200
150
100
50
00204060
tTHL, tTLH, TRANSITION TIME (ns)
CL, LOAD CAPACITANCE (pF)
80 100 110
TA = 25oC
SUPPLY VOLTAGE (VDD) = 5V
10V
15V
300
200
100
00204060
tPHL, tPLH, PROPAGATION DELAY TIME (ns)
CL, LOAD CAPACITANCE (pF)
80 100
TA = 25oC
300
200
100
00 5 10 15
tPHL, tPLH, PROPAGATION DELAY TIME (ns)
VDD, SUPPLY VOLTAGE (V)
20
LOAD CAPACITANCE CL = 50pF
TA = 25oC
SUPPLY VOLTAGE (V
DD
) = 15V
5V
103
102
10
1
10-1
10-1 110
102
PD, POWER DISSIPATION (µW)
fI, INPUT FREQUENCY (kHz) 103104
104
105
10V
CL = 50pF
CL = 15pF
10V
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
CD4070BE ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD4070BEE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD4070BF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4070BF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4070BF3AS2534 OBSOLETE CDIP J 14 TBD Call TI Call TI
CD4070BM ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BM96 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BME4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BMG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BMT ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BMTE4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BMTG4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BNSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BPW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BE ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD4077BEE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD4077BF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4077BF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
CD4077BM ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BM96 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BME4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BMG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BMT ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BMTE4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BMTG4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BNSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BPW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
JM38510/17203BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 2
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
CD4070BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4070BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4070BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
CD4077BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4077BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4077BPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4070BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4070BNSR SO NS 14 2000 346.0 346.0 33.0
CD4070BPWR TSSOP PW 14 2000 346.0 346.0 29.0
CD4077BM96 SOIC D 14 2500 346.0 346.0 33.0
CD4077BNSR SO NS 14 2000 346.0 346.0 33.0
CD4077BPWR TSSOP PW 14 2000 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
CD4070BE ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
CD4070BEE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
CD4070BF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4070BF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4070BF3AS2534 OBSOLETE CDIP J 14 TBD Call TI Call TI
CD4070BM ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BM96 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BME4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BMG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BMT ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BMTE4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BMTG4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BNSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BPW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
CD4070BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4070BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BE ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
CD4077BEE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
CD4077BF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4077BF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
CD4077BM ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BM96 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BME4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BMG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BMT ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BMTE4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BMTG4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BNSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BNSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
CD4077BNSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BPW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4077BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
JM38510/17203BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
M38510/17203BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4070B, CD4070B-MIL, CD4077B, CD4077B-MIL :
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
CD4070BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4070BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4070BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4070BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD4077BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4077BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
CD4077BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4070BM96 SOIC D 14 2500 367.0 367.0 38.0
CD4070BMT SOIC D 14 250 367.0 367.0 38.0
CD4070BNSR SO NS 14 2000 367.0 367.0 38.0
CD4070BPWR TSSOP PW 14 2000 367.0 367.0 35.0
CD4077BM96 SOIC D 14 2500 367.0 367.0 38.0
CD4077BMT SOIC D 14 250 367.0 367.0 38.0
CD4077BNSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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