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DS-PLA170-R02 1
PLA170
Single Pole OptoMORelay
e
3
RoHS
2002/95/EC
Part # Description
PLA170 6 Pin DIP (50/tube)
PLA170S 6 Pin Surface Mount (50/tube)
PLA170STR 6 Pin Surface Mount (1000/Reel)
PLA170 Units
Load Voltage 800 VP
Load Current
AC/DC Configuration 100 mA
DC Configuration 180 mA
Max RON
AC/DC Configuration 50
DC Configuration 14
Applications
Features
Description
Ordering Information
Pin Configuration
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment—Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
100% Solid State
Small 6 Pin Package
Low Drive Power Requirements (TTL/CMOS
Compatible)
Arc-Free With No Snubbing Circuits
3750Vrms Input/Output Isolation
No EMI/RFI Generation
Machine Insertable, Wave Solderable
800V blocking
The PLA170 is a 1-Form-A Solid State Relay which
uses optically coupled MOSFET technology to provide
enhanced input-to-output isolation of 3750Vrms. The
efficient MOSFET switches and photovoltaic die use
Clare’s patented OptoMOS® architecture.
The optically-coupled output is controlled by a GaAIAs
infrared LED. The PLA170 is designed to replace
electromechanical relays and offers the superior
reliability associated with Solid State devices. This
device provides bounce-free switching in a more
compact surface mount or through hole package.
1
3
2
4
5
6
+ Control
– Control
NC
Load
Do Not Use
Load
AC/DC Configuration
PLA170 Pinout
Switching Characteristics of
Normally Open (Form A) Devices
CONTROL
LOAD 10% 10%
90%
+
TON
TOFF
+
+
Approvals
UL Recognized File: E76270
CSA Certified File: LR 43639-10
Certified to:
EN 60950
EN 41003
1
3
2
4
5
6
+ Control
– Control
NC
+ Load
– Load
DC Only Configuration
PLA170 Pinout
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PLA170
R02
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings (@ 25˚ C)
Parameter Ratings Units
Blocking Voltage 800 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate Linearly 3.33 mw / ºC
2 Derate Linearly 6.67 mw / ºC
Electrical Characteristcs
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics @ 25°C
Load Current
AC/DC Configuration 1
Continuous IL- - 100 mA
DC Configuration 180
Peak Load Current 10ms ILPK - - 350 mA
On-Resistance 2
AC/DC Configuration IL= Load Current RON
- - 50
DC Configuration - - 14
Off-State Leakage Current VL=800V ILEAK - - 1 µA
Switching Speeds
Turn-On IF=5mA, VL=10V TON - - 5 ms
Turn-Off IF =5mA, VL=10V TOFF - - 5 ms
Output Capacitance 50V; f=1MHz COUT - 50 - pF
Input Characteristics @ 25°C
Input Control Current 3IL=Load Current IF5 - - mA
Input Dropout Current - IF0.3 0.7 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR- - 10 µA
Common Characteristics @ 25°C
Input to Output Capacitance - CI/O - 3 - pF
Input to Output Isolation 60 Hz, 60 seconds VI/O 3750 - - Vrms
1 Load derates linearly from 100mA @ 25oC to 90mA @80oC.
2 Measurement taken within 1 second of on time.
3 For applications requiring high temperature operation (greater than 60oC) an LED drive current of 10mA is recommended.
PLA170
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R02
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our
application department.
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
PLA170
DC
35
30
25
20
15
10
5
0
39 41 43 4540 42 44
Device Count (N)
0
35
30
25
20
15
10
5
0
880 890 900 905875 885 895
Blocking Voltage (V)
Device Count (N)
0.65 1.17 1.690.39 0.91 1.43 1.95
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
PLA170
Typical IF for Switch Operation
(N=50 Ambient Tempurature = 25ºC)
(Load Current = 100mADC)
0.30 0.40 0.50 0.600.35 0.45 0.55
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
0
PLA170
Typical Maximum Load Current
vs. Temperature
Load Current (mA)
220
200
180
160
140
120
100
80
60
40
-40 -20 0 20 40 60 80 120100
DC Configuration
AC/DC Configuration
IF = 5mA
IF = 5mA
IF = 10mA
PLA170
Typical Leakage vs. Temperature
(Measured across Pins 4 & 6)
-40
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-20 0 20 40 60 80 100
PLA170
Typical Blocking Voltage
vs. Temperature
Blocking Voltage (V)
-40
1050
1000
950
900
850
800
750
700
-20 0 20 40 60 80 100
PLA170
Typical Turn-On vs. Temperature
(Load Current = 70mADC)
Turn-On (ms)
-40
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100
IF = 5mA
IF = 10mA
PLA170
Typical Turn-Off vs. Temperature
(Load Current = 70mADC)
Turn-Off (ms)
-40
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
-20 0 20 40 60 80 100
IF = 5mA
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PLA170
R02
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our
application department.
PLA170
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
IF = 50mA
IF = 10mA
IF = 5mA
PLA170
Typical Turn-On vs. LED Forward Current
(Load Current = 100mADC)
LED Forward Current (mA)
Turn-On (ms)
05 10 15 20 25 30 35 40 45
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
PLA170
Typical Turn-Off vs. LED Forward Current
(Load Current = 100mADC)
LED Forward Current (mA)
Turn-Off (ms)
05 10 15 20 25 30 35 40 45
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
50
PLA170
Typical On-Resistance vs. Temperature
(Load Current = 50mADC)
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
IF = 5mA
PLA170
Typical IF for Switch Operation
vs. Temperature
(Load Current = 70mADC)
LED Current (mA)
-40
3.000
2.500
2.000
1.500
1.000
0.500
0.000
-20 0 20 40 60 80 100
PLA170
Typical IF for Switch Dropout
vs. Temperature
(Load Current = 70mADC)
LED Current (mA)
-40
3.000
2.500
2.000
1.500
1.000
0.500
0.000
-20 0 20 40 60 80 100
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-6 -4 -2 0 2 4 6
PLA170
Energy Rating Curve
Time
Load Current (A)
10µs
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100µs 100ms 1s
10ms 10s 100s
PLA170
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R02
Manufacturing Information
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Recommended soldering processes are limited to
260ºC component body temperature for 10 seconds.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
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RoHS
2002/95/EC
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product
descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no
liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement
of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended
to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to
discontinue or make changes to its products at any time without notice.
Specification: DS-PLA170-R02
©Copyright 2006, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
All rights reserved. Printed in USA.
10/18/06
For additional information please visit our website at: www.clare.com
MECHANICAL DIMENSIONS
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
K1 = 3.80
(0.150)
W = 16.30 MAX
(0.642 MAX)
B0 = 10.30
(0.406)
A0 = 10.30
(0.406)
P = 12.00
(0.472)
330.2 DIA.
(13.00 DIA.)
K0 = 4.90
(0.193)
0.254 TYP
(0.010 TYP)
7.239 TYP
(0.285 TYP)
Tape and Reel Packaging for 6 Pin Surface Mount Package
Top Cover
Tape
Embossment
Embossment Carrier
User Direction of Feed
PC Board Pattern
(Top View)
6 Pin DIP Through Hole (Standard)
Dimensions:
mm
(inches)
PC Board Pattern
(Top View)
6-0.800 DIA.
(6-0.031 DIA.)
6 Pin Surface Mount ("S" Suffix)