SLCS141D − M AY 2003 − REVISED APRIL 2008
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DQualified for Automotive Applications
DESD Protection Exceeds 1000 V Per
MIL-STD-883, Method 3015; Exceeds 100 V
Using Machine Model (C = 200 pF, R = 0)
DSingle Supply or Dual Supplies
DLow Supply-Current Drain Independent of
Supply Voltage . . . 0.4 mA Typ Per
Comparator
DLow Input Bias Current . . . 25 nA Typ
DLow Input Offset Current ...5 nA Typ
DLow Input Offset Voltage ...2 mV Typ
DCommon-Mode Input Voltage Range
Includes Ground
DDifferential Input Voltage Range Equal to
Maximum-Rated Supply Voltage . . . ±36 V
DLow Output Saturation Voltage
DOutput Compatible With TTL, MOS, and
CMOS
description/ordering information
This device consists of two independent voltage comparators that are designed to operate from a single power
supply over a wide range of voltages. Operation from dual supplies is possible, as long as the difference
between the two supplies is 2 V to 36 V, and VCC is at least 1.5 V more positive than the input common-mode
voltage. Current drain is independent of the supply voltage. The outputs can be connected to other
open-collector outputs to achieve wired-AND relationships.
The LM2903Q is tested from −40°C to 125°C and is manufactured to demanding automotive requirements.
ORDERING INFORMATION{
TAVIOmax
AT 25°CMAX VCC PACKAGE‡ORDERABLE
PART NUMBER TOP-SIDE
MARKING
7 mV 30 V SOIC (D) Tape and reel LM2903QDRQ1 2903Q1
7 mV 30 V TSSOP (PW) Tape and reel LM2903QPWRQ1 2903Q1
−40°C to 125°C
7 mV 32 V SOIC (D) Tape and reel LM2903VQDRQ1 2903VQ1
−40
°
C to 125
°
C
7 mV 32 V TSSOP (PW) Tape and reel LM2903VQPWRQ1 2903VQ1
2 mV 32 V SOIC (D) Tape and reel LM2903AVQDRQ1 2903AVQ
2 mV 32 V TSSOP (PW) Tape and reel LM2903AVQPWRQ1 2903AVQ
†For the most current package and ordering information, see the Package Option Addendum at the end of this document,
or see the TI web site at http://www.ti.com.
‡Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
symbol (each comparator)
IN+
IN− OUT
Copyright 2008, Texas Instruments Incorporated
!"# $"%&! '#(
'"! ! $#!! $# )# # #* "#
'' +,( '"! $!#- '# #!#&, !&"'#
#- && $##(
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
GND
VCC
2OUT
2IN−
2IN+
D OR PW PACKAGE
(TOP VIEW)
SLCS141D − M AY 2003 − REVISED APRIL 2008
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
schematic (each comparator)
80-µA
Current Regulator
80 µA
60 µA10 µA
VCC
10 µA
OUT
GND
IN+
IN−
Epi-FET
Diodes
Resistors
Transistors
Current values shown are nominal.
COMPONENT COUNT
1
2
2
30
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2) ±36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (either input) −0.3 V to 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage, VO 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, IO 20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short-circuit to ground (see Note 3) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 4): D package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 149°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or PW package 260°C. . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to GND.
2. Differential voltages are at IN+ with respect to IN−.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. The package thermal impedance is calculated in accordance with JESD 51-7.
SLCS141D − M AY 2003 − REVISED APRIL 2008
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS TA†MIN TYP MAX UNIT
V = 1.4 V,
Non-A devices
25°C 2 7
VIO
Input offset voltage
VO = 1.4 V,
VIC = VIC(min),
Non-A devices Full range 15
mV
VIO Input offset voltage
O
V
IC
= V
IC(min)
,
VCC = 5 V to MAX
‡
A-suffix devices
25°C 1 2 mV
VCC = 5 V to MAX‡
A-suffix devices Full range 4
IIO
Input offset current
VO = 1.4 V
25°C 5 50
nA
IIO Input offset current VO = 1.4 V Full range 200 nA
IIB
Input bias current
VO = 1.4 V
25°C −25 −250
nA
IIB Input bias current VO = 1.4 V Full range −500 nA
VICR
Common-mode §
25°C0 to
VCC−1.5
V
VICR
Common-mode
input voltage range§Full range 0 to
VCC−2
V
AVD Large-signal
differential-voltage
amplification
VCC = 15 V,
VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC 25°C 25 100 V/mV
IOH
High-level
VOH = 5 V
VID = 1 V
25°C 0.1 50 nA
IOH
High-level
output current VOH = VCC MAX‡VID = 1 V Full range 1µA
VOL
Low-level
IOL = 4 mA,
VID = −1 V
25°C 150 400
mV
VOL
Low-level
output voltage IOL = 4 mA, VID = −1 V Full range 700 mV
IOL Low-level
output current VOL = 1.5 V, VID = −1 V 25°C 6 mA
ICC
Supply current
RL = ∞
VCC = 5 V 25°C 0.8 1
mA
I
CC
Supply current
R
L
=
∞VCC = MAX‡Full range 2.5
mA
†Full range (MIN or MAX) for LM2903Q is −40°C to 125°C. All characteristics are measured with zero common-mode input voltage, unless
otherwise specified.
‡VCC MAX = 30 V for non-V devices and 32 V for V-suffix devices.
§The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage
range is VCC+ − 1.5 V, but either or both inputs can go to 30 V (32 V for V-suffix devices) without damage.
switching characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Response time
RL connected to 5 V through 5.1 k
Ω
,
¶
100-mV input step with 5-mV overdrive 1.3
µs
Response time
RL connected to 5 V through 5.1 kΩ,
CL = 15 pF¶, See Note 5 TTL-level input step 0.3 µ
s
¶CL includes probe and jig capacitance.
NOTE 5: The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
PACKAGE OPTION ADDENDUM
www.ti.com 12-Oct-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
LM2903AVQDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM2903AVQDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM2903AVQPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM2903AVQPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM2903QDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM2903QDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM2903QPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM2903QPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM2903VQDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM2903VQDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM2903VQPWRG4Q1 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM2903VQPWRQ1 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
PACKAGE OPTION ADDENDUM
www.ti.com 12-Oct-2011
Addendum-Page 2
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM2903-Q1 :
•Catalog: LM2903
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
