© Semiconductor Components Industries, LLC, 2007
November, 2007 - Rev. 0
1Publication Order Number:
ULN2003A/D
ULN2003A, ULQ2003A
High Voltage, High Current
Darlington Transistor Arrays
The seven NPN Darlington connected transistors in these arrays are
well suited for driving lamps, relays, or printer hammers in a variety of
industrial and consumer applications. Their high breakdown voltage
and internal suppression diodes insure freedom from problems
associated with inductive loads. Peak inrush currents to 500 mA
permit them to drive incandescent lamps.
The ULx2003A with a 2.7 kW series input resistor is well suited for
systems utilizing a 5.0 V TTL or CMOS Logic.
Features
•These are Pb-Free Devices
Figure 1. Representative Schematic Diagram
5.0 k
3.0 k
Pin 9
1/7 ULx2003A
2.7 k
Figure 2. Pin Connections
9
10
11
12
13
14
15
16
8
7
6
5
4
3
2
1
(Top View)
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1
16
SOIC-16
D SUFFIX
CASE 751B
Device Package Shipping†
ORDERING INFORMATION
ULQ2003ADR2G SOIC-16
(Pb-Free)
2500 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
ULN2003ADR2G SOIC-16
(Pb-Free)
2500 Tape & Reel
MARKING
DIAGRAMS
ULN2003AG
AWLYWW
1
16
ULQ2003AG
AWLYWW
1
16
A = Assembly Location
WL = Wafer Lot
Y = Year
WW = Work Week
G = Pb-Free Package
ULN2003A, ULQ2003A
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2
MAXIMUM RATINGS (TA = 25°C, and rating apply to any one device in the package, unless otherwise noted.)
Rating Symbol Value Unit
Output Voltage VO50 V
Input Voltage VI30 V
Collector Current - Continuous IC500 mA
Base Current - Continuous IB25 mA
Operating Ambient Temperature Range
ULN2003A
ULQ2003A
TA
-20 to +85
-40 to +85
°C
Storage Temperature Range Tstg -55 to +150 °C
Junction Temperature TJ150 °C
Thermal Resistance, Junction-to-Ambient
Case 751B, D Suffix
RqJA
100
°C/W
Thermal Resistance, Junction-to-Case
Case 751B, D Suffix
RqJC
20
°C/W
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM)
Machine Model (MM)
Charged Device Model (CDM)
ESD
2000
400
1500
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ULN2003A, ULQ2003A
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3
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Output Leakage Current
(VO = 50 V, TA = +85°C)
(VO = 50 V, TA = +25°C)
ICEX
-
-
-
-
100
50
mA
Collector-Emitter Saturation Voltage
(IC = 350 mA, IB = 500 mA)
(IC = 200 mA, IB = 350 mA)
(IC = 100 mA, IB = 250 mA)
VCE(sat)
-
-
-
1.1
0.95
0.85
1.6
1.3
1.1
V
Input Current - On Condition
(VI = 3.85 V)
II(on)
- 0.93 1.35
mA
Input Voltage - On Condition
(VCE = 2.0 V, IC = 200 mA)
(VCE = 2.0 V, IC = 250 mA)
(VCE = 2.0 V, IC = 300 mA)
VI(on)
-
-
-
-
-
-
2.4
2.7
3.0
V
Input Current - Off Condition
(IC = 500 mA, TA = 85°C)
II(off) 50 100 - mA
DC Current Gain
(VCE = 2.0 V, IC = 350 mA)
hFE 1000 - - -
Input Capacitance CI- 15 30 pF
Turn-On Delay Time
(50% EI to 50% EO)
ton - 0.25 1.0 ms
Turn-Off Delay Time
(50% EI to 50% EO)
toff - 0.25 1.0 ms
Clamp Diode Leakage Current
(VR = 50 V)
TA = +25°C
TA = +85°C
IR-
-
-
-
50
100
mA
Clamp Diode Forward Voltage
(IF = 350 mA)
VF- 1.5 2.0 V
ULN2003A, ULQ2003A
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4
1 Output Conducting at a Time
PIN 10
1
% DUTY CYCLE
VI, INPUT VOLTAGE (V)
VCE(sat), SATURATION VOLTAGE (V)
100
1000
700
500
300
3
10
2
4
5
6
200
10070503020
1.0
2.5
2.0
1.5
1.0
0.5
00
7
7.04.0 5.0 8.03.0 6.02.0
0
100
200
400
300
500
700
600
0.4 0.6 0.8 1.0 1.2 1.4
800
1.60 0.2
IC, COLLECTOR CURRENT (mA)
II, INPUT CURRENT (mA)
IC, COLLECTOR CURRENT (mA)
NUMBER OF DRIVERS USED
PIN 13
100
400300 350250200150100
400
0
300
200
0
II, INPUT CURRENT (mA)
50
IO, OUTPUT CURRENT (mA)
TYPICAL PERFORMANCE CURVES - TA = 25°C
VI, INPUT VOLTAGE (V)
01.0 2.0 3.0 4.0 5.0 109.08.0 11 12
400
300
200
100
0
IO, OUTPUT CURRENT (mA)
Figure 3. Output Current versus Input Voltage Figure 4. Output Current versus Input Current
Figure 5. Typical Output Characteristics Figure 6. Input Characteristics
Figure 7. Maximum Collector Current
versus Duty Cycle
(and Number of Drivers in Use)
PIN 16
Maximum
Typical
ULN2003A, ULQ2003A
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5
PACKAGE DIMENSIONS
SOIC-16
D SUFFIX
CASE 751B-05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
RX 45_
G
8 PLP
-B-
-A-
M
0.25 (0.010) B S
-T-
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019
____
6.40
16X
0.58
16X 1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
16
89
8X
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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ULN2003A/D
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