This is information on a product in full production.
October 2012 Doc ID 17390 Rev 1 1/8
8
STPS340-Y
Automotive power Schottky rectifier
Datasheet production data
Features
Very small conduction losses
Negligible switching losses
Low forward voltage drop
Low thermal resistance
Extremely fast switching
Surface mounted device
Avalanche capability specified
AEC-Q101 qualified
Description
This single chip Schottky rectifier is suited for
switch mode power supplies and high frequency
DC to DC converters.
Packaged in SMB, and SMC, this device is
intended for use in low and medium voltage
operation, high frequency inverters, free wheeling
and polarity protection applications where low
switching losses are required for automotive
applications.
Table 1. Device summary
IF(AV) 3 A
VRRM 40 V
Tj (max) 150 °C
VF (max) 0.57 V
SMB
STPS340UY
SMC
STPS340SY
K
A
K
A
www.st.com
Characteristics STPS340-Y
2/8 Doc ID 17390 Rev 1
1 Characteristics
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 40 V
IF(RMS) Forward rms current 6 A
IF(AV) Average forward current SMB TL = 95 °C = 0.5 3 A
SMC TL = 105 °C = 0.5 3 A
IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A
PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1300 W
Tstg Storage temperature range -65 to + 150 °C
TjOperating junction temperature (1) range
1. condition to avoid thermal runaway for a diode on its own heatsink
-40 to +150 °C
Table 3. Thermal resistance
Symbol Parameter Value Unit
Rth(j-l) Junction to lead SMB 25 °C/W
SMC 20
Table 4. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1)
1. Pulse test: tp = 380 µs, < 2%
To evaluate the conduction losses use the following equation:
P = 0.42 x IF(AV) + 0.050 IF2(RMS)
Reverse leakage
current
Tj = 25 °C VR = VRRM
20 µA
Tj = 125 °C 2 10 mA
VF(1) Forward voltage drop
Tj = 25 °C IF = 3 A 0.63
V
Tj = 125 °C 0.52 0.57
Tj = 25 °C IF = 6 A 0.84
Tj = 125 °C 0.63 0.72
dPtot
dTj <1
Rth(j-a)
STPS340-Y Characteristics
Doc ID 17390 Rev 1 3/8
Figure 1. Average forward power dissipation
versus average forward current
(per diode)
Figure 2. Average forward current versus
ambient temperature
( = 0.5, per diode)
0.0
0.5
1.0
1.5
2.0
2.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
P (W)
F(AV)
T
δ=tp/T tp
I (A)
F(AV)
δ= 1
δ= 0.05
δ= 0.1 δ= 0.2 δ= 0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 25 50 75 100 125 150
I (A)
F(AV)
T (°C)
amb
R =65°C/W
th(j-a)
R=R
th(j-a) th(j-l)
SMB / SMC
T
δ
=tp/T tp
Figure 3. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB)
Figure 4. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMC)
0
1
2
3
4
5
6
7
8
9
10
1.E-03 1.E-02 1.E-01 1.E+00
IM
t
δ=0.5
I (A)
M
t(s)
T =25°C
a
T =75°C
a
T =125°C
a
SMB
Figure 5. Normalized avalanche power
derating versus pulse duration
Figure 6. Normalized avalanche power
derating versus junction
temperature
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t)
P (1µs)
ARM p
ARM
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P()
P (25°C)
ARM Tj
ARM
Characteristics STPS340-Y
4/8 Doc ID 17390 Rev 1
Figure 7. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMB)
Figure 8. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMC)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
T
δ=tp/T tp
t (s)
p
Single pulse
SMB
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
T
δ=tp/T tp
t (s)
p
Single pulse
SMC
Figure 9. Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 10. Junction capacitance versus
reverse voltage applied
(typical values)
I (mA)
R
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
0 5 10 15 20 25 30 35 40
T
j
=150°C
T
j
=125°C
T
j
=100°C
T
j
=75°C
T
j
=25°C
V (V)
R
10
100
1000
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
Figure 11. Forward voltage drop versus
forward current
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead
I (A)
FM
0.01
0.10
1.00
10.00
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
T
j
=25°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Maximum values)
V (V)
FM
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB / SMC
S (cm²)
CU
R (°C/W)
th(j-a)
Printed circuit board FR4
copper thickness = 35 µm
STPS340-Y Package information
Doc ID 17390 Rev 1 5/8
2 Package information
Epoxy meets UL94, V0
Band indicates cathode on SMB and SMC
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 13. SMB footprint (dimensions in mm)
Table 5. SMB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.50 0.030 0.059
E
C
L
E1
D
A1
A2
b
2.60
5.84
1.62
2.18
1.62
Package information STPS340-Y
6/8 Doc ID 17390 Rev 1
Figure 14. Footprint dimensions (in millimeters)
Table 6. SMC package dimensions
Ref
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 2.90 3.2 0.114 0.126
c 0.15 0.41 0.006 0.016
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
D 5.55 6.25 0.218 0.246
L 0.75 1.40 0.030 0.063
E
CLE2
E1
D
A1
A2
b
5.03
8.11
1.54
3.15
1.54
STPS340-Y Ordering information
Doc ID 17390 Rev 1 7/8
3 Ordering information
4 Revision history
Table 7. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS340UY U34Y SMB 0.107 g 2500 Tape and reel
STPS340SY S34Y SMC 0.243 g
Table 8. Document revision history
Date Revision Changes
24-Oct-2012 1 First issue.
STPS340-Y
8/8 Doc ID 17390 Rev 1
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