ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com MSP430TM SoC with RF Core FEATURES 1 * 23 * * * True System-on-Chip (SoC) for Low-Power Wireless Communication Applications Wide Supply Voltage Range: 1.8 V to 3.6 V Ultra-Low Power Consumption: - CPU Active Mode (AM): 160 A/MHz - Standby Mode (LPM3 RTC Mode):2.0 A - Off Mode (LPM4 RAM Retention): 1.0 A - Radio in RX: 15 mA, 250 kbps, 915 MHz MSP430TM System and Peripherals - 16-Bit RISC Architecture, Extended Memory, up to 20-MHz System Clock - Wake-Up From Standby Mode in Less Than 6 s - Flexible Power Management System with SVS and Brownout - Unified Clock System with FLL - 16-Bit Timer TA0, Timer_A with Five Capture/Compare Registers - 16-Bit Timer TA1, Timer_A with Three Capture/Compare Registers - Hardware Real-Time Clock - Two Universal Serial Communication Interfaces - USCI_A0 supporting UART, IrDA, SPI - USCI_B0 supporting I2C, SPI - 12-Bit A/D Converter With Internal Reference, Sample-and-Hold, and Autoscan Features (CC430F613x and CC430F513x Only) - Comparator - Integrated LCD Driver With Contrast Control for up to 96 Segments (CC430F61xx Only) - 128-bit AES Security Encryption/Decryption Coprocessor - 32-Bit Hardware Multiplier - Three-Channel Internal DMA - Serial Onboard Programming, No External Programming Voltage Needed - Embedded Emulation Module (EEM) * * * High-Performance Sub-1-GHz RF Transceiver Core - Same as in CC1101 - Wide Supply Voltage Range: 2.0 V to 3.6 V - Frequency Bands: 300 MHz to 348 MHz, 389 MHz to 464 MHz, and 779 MHz to 928 MHz - Programmable Data Rate From 0.6 kBaud to 500 kBaud - High Sensitivity (-117 dBm at 0.6 kBaud, -111 dBm at 1.2 kBaud, 315 MHz, 1% Packet Error Rate) - Excellent Receiver Selectivity and Blocking Performance - Programmable Output Power Up to +12 dBm for All Supported Frequencies - 2-FSK, 2-GFSK, and MSK Supported as well as OOK and Flexible ASK Shaping - Flexible Support for Packet-Oriented Systems: On-Chip Support for Sync Word Detection, Address Check, Flexible Packet Length, and Automatic CRC Handling - Support for Automatic Clear Channel Assessment (CCA) Before Transmitting (for Listen-Before-Talk Systems) - Digital RSSI Output - Suited for Systems Targeting Compliance With EN 300 220 (Europe) and FCC CFR Part 15 (US) - Suited for Systems Targeting Compliance With Wireless M-Bus Standard EN 13757-4:2005 - Support for Asynchronous and Synchronous Serial Receive/Transmit Mode for Backward Compatibility With Existing Radio Communication Protocols Family Members are Summarized in Table 1. For Complete Module Descriptions, See the CC430 Family User's Guide (SLAU259). 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. MSP430 is a trademark of Texas Instruments. I2C is a trademark of others. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com DESCRIPTION The Texas Instruments CC430 family of ultra-low-power microcontroller system-on-chip with integrated RF transceiver cores consists of several devices featuring different sets of peripherals targeted for a wide range of applications. The architecture, combined with five low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features the powerful MSP430TM 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The CC430 family provides a tight integration between the microcontroller core, its peripherals, software, and the RF transceiver, making these true system-on-chip solutions easy to use as well as improving performance. The CC430F61xx series are microcontroller system-on-chip configurations combining the excellent performance of the state-of-the-art CC1101 sub-1-GHz RF transceiver with the MSP430 CPUXV2, up to 32 kB of in-system programmable flash memory, up to 4 kB of RAM, two 16-bit timers, a high-performance 12-bit A/D converter with eight external inputs plus internal temperature and battery sensors on CC430F613x devices, comparator, universal serial communication interfaces (USCI), 128-bit AES security accelerator, hardware multiplier, DMA, real-time clock module with alarm capabilities, LCD driver, and up to 44 I/O pins. The CC430F513x series are microcontroller system-on-chip configurations combining the excellent performance of the state-of-the-art CC1101 sub-1-GHz RF transceiver with the MSP430 CPUXV2, up to 32 kB of in-system programmable flash memory, up to 4 kB of RAM, two 16-bit timers, a high performance 12-bit A/D converter with six external inputs plus internal temperature and battery sensors, comparator, universal serial communication interfaces (USCI), 128-bit AES security accelerator, hardware multiplier, DMA, real-time clock module with alarm capabilities, and up to 30 I/O pins. Typical applications for these devices include wireless analog and digital sensor systems, heat cost allocators, thermostats, metering (AMR/AMI), smart grid wireless networks, etc. Family members available are summarized in Table 1. For complete module descriptions, see the CC430 Family User's Guide, literature number SLAU259. Table 1. Family Members USCI Channel B: SPI/ I2C Device Program (KB) SRAM (KB) Timer_A CC430F6137 32 4 5, 3 96 seg 1 CC430F6135 16 2 5, 3 96 seg CC430F6127 32 4 5, 3 CC430F6126 32 2 CC430F6125 16 2 (2) Comp_B I/O Package Type 1 8 ext/ 4 int ch. 8 ch. 44 64 RGC 1 1 8 ext/ 4 int ch. 8 ch. 44 64 RGC 96 seg 1 1 n/a 8 ch. 44 64 RGC 5, 3 96 seg 1 1 n/a 8 ch. 44 64 RGC 5, 3 96 seg 1 1 n/a 8 ch. 44 64 RGC 6 ch. 30 48 RGZ (1) LCD_B (2) ADC12_A CC430F5137 32 4 5, 3 n/a 1 1 6 ext/ 4 int ch. CC430F5135 16 2 5, 3 n/a 1 1 6 ext/ 4 int ch. 6 ch. 30 48 RGZ CC430F5133 8 2 5, 3 n/a 1 1 6 ext/ 4 int ch. 6 ch. 30 48 RGZ (1) (2) 2 Channel A: UART/LIN /IrDA/SPI Each number in the sequence represents an instantiation of Timer_A with its associated number of capture compare registers and PWM output generators available. For example, a number sequence of 5, 3 would represent two instantiations of Timer_A, the first instantiation having 5 and the second instantiation having 3 capture compare registers and PWM output generators, respectively. n/a = not available Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com ORDERING INFORMATION (1) TA PACKAGED DEVICES (2) PLASTIC 64-PIN QFN (RGC) PLASTIC 48-PIN QFN (RGZ) CC430F6137IRGC CC430F5137IRGZ CC430F6135IRGC CC430F5135IRGZ CC430F6127IRGC CC430F5133IRGZ -40C to 85C CC430F6126IRGC CC430F6125IRGC (1) (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 3 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com CC430F613x Functional Block Diagram XIN XOUT (32kHz) MCLK Unified Clock System P1.x/P2.x 2x8 REF ACLK Comp_B ADC12 SMCLK Voltage Reference DMA Controller 3 Channel Bus Cntrl Logic MAB P3.x/P4.x 2x8 I/O Ports P1/P2 2x8 I/Os I/O Ports P3/P4 2x8 I/Os PA 1x16 I/Os PB 1x16 I/Os P5.x 1x8 I/O Ports P5 1x8 I/Os MDB Sub-1GHz Radio (CC1101) SYS MDB EEM (S: 3+1) Flash RAM 32kB 16kB 4kB 2kB CRC16 Watchdog CPU Interface MPY32 Port Mapping Controller MODEM MDB Spy-BiWire Packet Handler Digital RSSI Carrier Sense PQI / LQI CCA MAB CPUXV2 incl. 16 Registers JTAG Interface RF_XIN RF_XOUT (26MHz) MAB Frequency Synthesizer Power Mgmt LDO SVM/SVS Brownout TA0 5 CC Registers TA1 3 CC Registers RTC_A USCI_A0 (UART, IrDA, SPI) USCI_B0 (SPI, I2C) LCD_B 96 Segments 1,2,3,4 Mux AES128 Security En-/Decryption RF/ANALOG TX & RX RF_P 4 Submit Documentation Feedback RF_N Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com P2.0/PM_CBOUT1/PM_TA1CLK/CB0/A0 P2.1/PM_TA1CCR0A/CB1/A1 P2.2/PM_TA1CCR1A/CB2/A2 P2.3/PM_TA1CCR2A/CB3/A3 P2.4/PM_RTCCLK/CB4/A4/VREF-/VeREFP2.5/PM_SVMOUT/CB5/A5/VREF+/VeREF+ P2.6/PM_ACLK/CB6/A6 P2.7/PM_ADC12CLK/PM_DMAE0/CB7/A7 AVCC P5.0/XIN P5.1/XOUT AVSS DVCC RST/NMI/SBWTDIO TEST/SBWTCK PJ.3/TCK RGC PACKAGE (TOP VIEW) 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 1 2 47 3 46 4 45 5 44 6 43 7 42 8 9 CC430F613x PJ.2/TMS PJ.1/TDI/TCLK PJ.0/TDO GUARD R_BIAS AVCC_RF AVCC_RF RF_N RF_P AVCC_RF AVCC_RF RF_XOUT RF_XIN P5.2/S0 P5.3/S1 P4.0/S2 41 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 P3.7/PM_SMCLK/S17 P3.6/PM_RFGDO1/S16 P3.5/PM_TA0CCR4A/S15 P3.4/PM_TA0CCR3A/S14 P3.3/PM_TA0CCR2A/S13 P3.2/PM_TA0CCR1A/S12 P3.1/PM_TA0CCR0A/S11 P3.0/PM_CBOUT0/PM_TA0CLK/S10 DVCC P4.7/S9 P4.6/S8 P4.5/S7 P4.4/S6 P4.3/S5 P4.2/S4 P4.1/S3 P1.7/PM_UCA0CLK/PM_UCB0STE/R03 P1.6/PM_UCA0TXD/PM_UCA0SIMO/R13/LCDREF P1.5/PM_UCA0RXD/PM_UCA0SOMI/R23 LCDCAP/R33 COM0 P5.7/COM1/S26 P5.6/COM2/S25 P5.5/COM3/S24 P5.4/S23 VCORE DVCC P1.4/PM_UCB0CLK/PM_UCA0STE/S22 P1.3/PM_UCB0SIMO/PM_UCB0SDA/S21 P1.2/PM_UCB0SOMI/PM_UCB0SCL/S20 P1.1/PM_RFGDO2/S19 P1.0/PM_RFGDO0/S18 VSS Exposed die attached pad The secondary digital functions on ports P1, P2, and P3 are fully mappable. Pinout above shows only the default mapping. See Table 9 for details. CAUTION: the LCDCAP/R33 must be connected to VSS if not used. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 5 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com CC430F612x Functional Block Diagram XIN XOUT (32kHz) MCLK Unified Clock System P1.x/P2.x 2x8 REF ACLK Comp_B Voltage Reference SMCLK DMA Controller 3 Channel Bus Cntrl Logic MAB P3.x/P4.x 2x8 I/O Ports P1/P2 2x8 I/Os I/O Ports P3/P4 2x8 I/Os PA 1x16 I/Os PB 1x16 I/Os P5.x 1x8 I/O Ports P5 1x8 I/Os MDB Sub-1GHz Radio (CC1101) SYS MDB EEM (S: 3+1) Flash RAM 32kB 32kB 16kB 4kB 2kB 2kB CRC16 Watchdog CPU Interface MPY32 Port Mapping Controller MODEM MDB Spy-BiWire Packet Handler Digital RSSI Carrier Sense PQI / LQI CCA MAB CPUXV2 incl. 16 Registers JTAG Interface RF_XIN RF_XOUT (26MHz) MAB Frequency Synthesizer Power Mgmt LDO SVM/SVS Brownout TA0 5 CC Registers TA1 3 CC Registers RTC_A USCI_A0 (UART, IrDA, SPI) USCI_B0 (SPI, I2C) LCD_B 96 Segments 1,2,3,4 Mux AES128 Security En-/Decryption RF/ANALOG TX & RX RF_P 6 Submit Documentation Feedback RF_N Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com P2.0/PM_CBOUT1/PM_TA1CLK/CB0 P2.1/PM_TA1CCR0A/CB1 P2.2/PM_TA1CCR1A/CB2 P2.3/PM_TA1CCR2A/CB3 P2.4/PM_RTCCLK/CB4 P2.5/PM_SVMOUT/CB5 P2.6/PM_ACLK/CB6 P2.7/PM_DMAE0/CB7 AVCC P5.0/XIN P5.1/XOUT AVSS DVCC RST/NMI/SBWTDIO TEST/SBWTCK PJ.3/TCK RGC PACKAGE (TOP VIEW) 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 1 2 47 3 46 4 45 5 44 6 43 7 42 8 9 CC430F612x 41 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 P3.7/PM_SMCLK/S17 P3.6/PM_RFGDO1/S16 P3.5/PM_TA0CCR4A/S15 P3.4/PM_TA0CCR3A/S14 P3.3/PM_TA0CCR2A/S13 P3.2/PM_TA0CCR1A/S12 P3.1/PM_TA0CCR0A/S11 P3.0/PM_CBOUT0/PM_TA0CLK/S10 DVCC P4.7/S9 P4.6/S8 P4.5/S7 P4.4/S6 P4.3/S5 P4.2/S4 P4.1/S3 P1.7/PM_UCA0CLK/PM_UCB0STE/R03 P1.6/PM_UCA0TXD/PM_UCA0SIMO/R13/LCDREF P1.5/PM_UCA0RXD/PM_UCA0SOMI/R23 LCDCAP/R33 COM0 P5.7/COM1/S26 P5.6/COM2/S25 P5.5/COM3/S24 P5.4/S23 VCORE DVCC P1.4/PM_UCB0CLK/PM_UCA0STE/S22 P1.3/PM_UCB0SIMO/PM_UCB0SDA/S21 P1.2/PM_UCB0SOMI/PM_UCB0SCL/S20 P1.1/PM_RFGDO2/S19 P1.0/PM_RFGDO0/S18 PJ.2/TMS PJ.1/TDI/TCLK PJ.0/TDO GUARD R_BIAS AVCC_RF AVCC_RF RF_N RF_P AVCC_RF AVCC_RF RF_XOUT RF_XIN P5.2/S0 P5.3/S1 P4.0/S2 VSS Exposed die attached pad The secondary digital functions on ports P1, P2, and P3 are fully mappable. Pin out above shows only the default mapping. See Table 9 for details. CAUTION: The LCDCAP/R33 must be connected to VSS if not used. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 7 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com CC430F513x Functional Block Diagram XIN XOUT (32kHz) MCLK Unified Clock System P1.x/P2.x 2x8 REF ACLK Comp_B ADC12 SMCLK Voltage Reference DMA Controller 3 Channel Bus Cntrl Logic MAB I/O Ports P1/P2 2x8 I/Os P5.x P3.x 1x8 I/O Ports P3 1x8 I/Os 1x2 I/O Ports P5 1x2 I/Os PA 1x16 I/Os MDB Sub-1GHz Radio (CC1101) SYS MDB EEM (S: 3+1) Flash RAM 32kB 16kB 8kB 4kB 2kB CRC16 Watchdog CPU Interface MPY32 Port Mapping Controller MODEM MDB Spy-BiWire Packet Handler Digital RSSI Carrier Sense PQI / LQI CCA MAB CPUXV2 incl. 16 Registers JTAG Interface RF_XIN RF_XOUT (26MHz) MAB Frequency Synthesizer Power Mgmt LDO SVM/SVS Brownout TA0 5 CC Registers TA1 3 CC Registers RTC_A USCI_A0 (UART, IrDA, SPI) USCI_B0 (SPI, I2C) AES128 Security En-/Decryption RF/ANALOG TX & RX RF_P 8 Submit Documentation Feedback RF_N Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 P2.2/PM_TA1CCR1A/CB2/A2 P2.1/PM_TA1CCR0A/CB1/A1 PJ.3/TCK PJ.2/TMS TEST/SBWTCK RST/NMI/SBWTDIO AVSS DVCC P5.0/XIN P5.1/XOUT RGZ PACKAGE (TOP VIEW) AVCC P2.5/PM_SVMOUT/CB5/A5/VREF+/VeREF+ P2.4/PM_RTCCLK/CB4/A4/VREF-/VeREF- P2.3/PM_TA1CCR2A/CB3/A3 www.ti.com 1 48 47 46 45 44 43 42 41 40 39 38 37 36 2 35 PJ.0/TDO PJ.1/TDI/TCLK P2.0/PM_CBOUT1/PM_TA1CLK/CB0/A0 3 34 GUARD P1.7/PM_UCA0CLK/PM_UCB0STE 4 33 R_BIAS P1.6/PM_UCA0TXD/PM_UCA0SIMO 5 32 AVCC_RF P1.5/PM_UCA0RXD/PM_UCA0SOMI 6 31 AVCC_RF VCORE 7 30 RF_N CC430F513x DVCC 8 29 RF_P P1.4/PM_UCB0CLK/PM_UCA0STE 9 28 AVCC_RF P1.3/PM_UCB0SIMO/PM_UCB0SDA 10 27 AVCC_RF P1.2/PM_UCB0SOMI/PM_UCB0SCL 11 26 RF_XOUT P2.6/PM_ACLK P2.7/PM_ADC12CLK/PM_DMAE0 DVCC P3.0/PM_CBOUT0/PM_TA0CLK P3.1/PM_TA0CCR0A P3.2/PM_TA0CCR1A P3.4/PM_TA0CCR3A P3.3/PM_TA0CCR2A P3.5/PM_TA0CCR4A P3.7/PM_SMCLK P3.6/PM_RFGDO1 25 12 13 14 15 16 17 18 19 20 21 22 23 24 P1.0/PM_RFGDO0 P1.1/PM_RFGDO2 RF_XIN VSS Exposed die attached pad The secondary digital functions on ports P1, P2, and P3 are fully mappable. Pin out above shows only the default mapping. See Table 9 for details. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 9 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 2. CC430F613x and CC430F612x Terminal Functions TERMINAL NAME P1.7/ PM_UCA0CLK/ PM_UCB0STE/ R03 NO. 1 I/O (1) DESCRIPTION I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: USCI_A0 clock input/output / USCI_B0 SPI slave transmit enable Input/output port of lowest analog LCD voltage (V5) P1.6/ PM_UCA0TXD/ PM_UCA0SIMO/ R13/ LCDREF 2 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: USCI_A0 UART transmit data; USCI_A0 SPI slave in master out Input/output port of third most positive analog LCD voltage (V3 or V4) External reference voltage input for regulated LCD voltage P1.5/ PM_UCA0RXD/ PM_UCA0SOMI/ R23 3 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: USCI_A0 UART receive data; USCI_A0 SPI slave out master in Input/output port of second most positive analog LCD voltage (V2) LCDCAP/ R33 4 I/O LCD capacitor connection Input/output port of most positive analog LCD voltage (V1) CAUTION: Must be connected to VSS if not used. COM0 5 O LCD common output COM0 for LCD backplane P5.7/ COM1/ S26 6 I/O General-purpose digital I/O LCD common output COM1 for LCD backplane LCD segment output S26 P5.6/ COM2/ S25 7 I/O General-purpose digital I/O LCD common output COM2 for LCD backplane LCD segment output S25 P5.5/ COM3/ S24 8 I/O General-purpose digital I/O LCD common output COM3 for LCD backplane LCD segment output S24 P5.4/ S23 9 I/O General-purpose digital I/O LCD segment output S23 VCORE 10 Regulated core power supply DVCC 11 Digital power supply P1.4/ PM_UCB0CLK/ PM_UCA0STE/ S22 12 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: USCI_B0 clock input/output / USCI_A0 SPI slave transmit enable LCD segment output S22 P1.3/ PM_UCB0SIMO/ PM_UCB0SDA/ S21 13 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: USCI_B0 SPI slave in master out/USCI_B0 I2C data LCD segment output S21 P1.2/ PM_UCB0SOMI/ PM_UCB0SCL/ S20 14 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: USCI_B0 SPI slave out master in/UCSI_B0 I2C clock LCD segment output S20 P1.1/ PM_RFGDO2/ S19 15 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: Radio GDO2 output LCD segment output S19 P1.0/ PM_RFGDO0/ S18 16 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: Radio GDO0 output LCD segment output S18 P3.7/ PM_SMCLK/ S17 17 I/O General-purpose digital I/O with map-able secondary function Default mapping: SMCLK output LCD segment output S17 P3.6/ PM_RFGDO1/ S16 18 I/O General-purpose digital I/O with map-able secondary function Default mapping: Radio GDO1 output LCD segment output S16 P3.5/ PM_TA0CCR4A/ S15 19 I/O General-purpose digital I/O with map-able secondary function Default mapping: TA0 CCR4 compare output/capture input LCD segment output S15 P3.4/ PM_TA0CCR3A/ S14 20 I/O General-purpose digital I/O with map-able secondary function Default mapping: TA0 CCR3 compare output/capture input LCD segment output S14 P3.3/ PM_TA0CCR2A/ S13 21 I/O General-purpose digital I/O with map-able secondary function Default mapping: TA0 CCR2 compare output/capture input LCD segment output S13 (1) 10 I = input, O = output Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 2. CC430F613x and CC430F612x Terminal Functions (continued) TERMINAL NAME NO. I/O (1) DESCRIPTION P3.2/ PM_TA0CCR1A/ S12 22 I/O General-purpose digital I/O with map-able secondary function Default mapping: TA0 CCR1 compare output/capture input LCD segment output S12 P3.1/ PM_TA0CCR0A/ S11 23 I/O General-purpose digital I/O with map-able secondary function Default mapping: TA0 CCR0 compare output/capture input LCD segment output S11 P3.0/ PM_CBOUT0/PM_TA0CLK/ S10 24 I/O General-purpose digital I/O with map-able secondary function Default mapping: Comparator_B output; TA0 clock input LCD segment output S10 DVCC 25 P4.7/ S9 26 I/O General-purpose digital I/O LCD segment output S9 P4.6/ S8 27 I/O General-purpose digital I/O LCD segment output S8 P4.5/ S7 28 I/O General-purpose digital I/O LCD segment output S7 P4.4/ S6 29 I/O General-purpose digital I/O LCD segment output S6 P4.3/ S5 30 I/O General-purpose digital I/O LCD segment output S5 P4.2/ S4 31 I/O General-purpose digital I/O LCD segment output S4 P4.1/ S3 32 I/O General-purpose digital I/O LCD segment output S3 P4.0/ S2 33 I/O General-purpose digital I/O LCD segment output S2 P5.3/ S1 34 I/O General-purpose digital I/O LCD segment output S1 P5.2/ S0 35 I/O General-purpose digital I/O LCD segment output S0 RF_XIN 36 I Input terminal for RF crystal oscillator, or external clock input RF_XOUT 37 O Output terminal for RF crystal oscillator AVCC_RF 38 AVCC_RF 39 Digital power supply Radio analog power supply Radio analog power supply RF_P 40 RF I/O RF_N 41 RF I/O AVCC_RF 42 Radio analog power supply AVCC_RF 43 Radio analog power supply RBIAS 44 External bias resistor for radio reference current GUARD 45 Power supply connection for digital noise isolation PJ.0/ TDO 46 I/O General-purpose digital I/O Test data output port PJ.1/ TDI/ TCLK 47 I/O General-purpose digital I/O Test data input or test clock input PJ.2/ TMS 48 I/O General-purpose digital I/O Test mode select PJ.3/ TCK 49 I/O General-purpose digital I/O Test clock TEST/ SBWTCK 50 I Copyright (c) 2009-2011, Texas Instruments Incorporated Positive RF input to LNA in receive mode Positive RF output from PA in transmit mode Negative RF input to LNA in receive mode Negative RF output from PA in transmit mode Test mode pin - select digital I/O on JTAG pins Spy-bi-wire input clock Submit Documentation Feedback 11 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 2. CC430F613x and CC430F612x Terminal Functions (continued) TERMINAL NAME NO. I/O (1) Reset input active low Non-maskable interrupt input Spy-bi-wire data input/output RST/NMI/ SBWTDIO 51 DVCC 52 Digital power supply AVSS 53 Analog ground supply for ADC12 P5.1/ XOUT 54 I/O General-purpose digital I/O Output terminal of crystal oscillator XT1 P5.0/ XIN 55 I/O General-purpose digital I/O Input terminal for crystal oscillator XT1 AVCC 56 P2.7/ PM_ADC12CLK/ PM_DMAE0/ CB7 (/A7) 57 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: ADC12CLK output; DMA external trigger input Comparator_B input CB7 Analog input A7 - 12-bit ADC (CC430F613x only) P2.6/ PM_ACLK/ CB6 (/A6) 58 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: ACLK output Comparator_B input CB6 Analog input A6 - 12-bit ADC (CC430F613x only) I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: SVM output Comparator_B input CB5 Analog input A5 - 12-bit ADC (CC430F613x only) Output of reference voltage to the ADC (CC430F613x only) Input for an external reference voltage to the ADC (CC430F613x only) P2.5/ PM_SVMOUT/ CB5 (/A5/ VREF+/ VeREF+) 59 I/O DESCRIPTION Analog power supply P2.4/ PM_RTCCLK/ CB4 (/A4/ VREF-/ VeREF-) 60 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: RTCCLK output Comparator_B input CB4 Analog input A4 - 12-bit ADC (CC430F613x only) Negative terminal for the ADC's reference voltage for both sources, the internal reference voltage, or an external applied reference voltage (CC430F613x only) P2.3/ PM_TA1CCR2A/ CB3 (/A3) 61 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: TA1 CCR2 compare output/capture input Comparator_B input CB3 Analog input A3 - 12-bit ADC (CC430F613x only) P2.2/ PM_TA1CCR1A/ CB2 (/A2) 62 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: TA1 CCR1 compare output/capture input Comparator_B input CB2 Analog input A2 - 12-bit ADC (CC430F613x only) P2.1/PM_TA1CCR0A/CB1(/A1) 63 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: TA1 CCR0 compare output/capture input Comparator_B input CB1 Analog input A1 - 12-bit ADC (CC430F613x only) P2.0/ PM_CBOUT1/ PM_TA1CLK/ CB0 (/A0) 64 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: Comparator_B output; TA1 clock input Comparator_B input CB0 Analog input A0 - 12-bit ADC (CC430F613x only) VSS - Exposed die attach pad 12 Submit Documentation Feedback Ground supply The exposed die attach pad must be connected to a solid ground plane as this is the ground connection for the chip. Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 3. CC430F513x Terminal Functions TERMINAL NAME NO. I/O (1) DESCRIPTION P2.2/ PM_TA1CCR1A/ CB2/ A2 1 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: TA1 CCR1 compare output/capture input Comparator_B input CB2 Analog input A2 - 12-bit ADC P2.1/ PM_TA1CCR0A/ CB1/ A1 2 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: TA1 CCR0 compare output/capture input Comparator_B input CB1 Analog input A1 - 12-bit ADC P2.0/ PM_CBOUT1/ PM_TA1CLK/ CB0/ A0 3 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: Comparator_B output; TA1 clock input Comparator_B input CB0 Analog input A0 - 12-bit ADC P1.7/ PM_UCA0CLK/ PM_UCB0STE 4 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: USCI_A0 clock input/output / USCI_B0 SPI slave transmit enable P1.6/ PM_UCA0TXD/ PM_UCA0SIMO 5 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: USCI_A0 UART transmit data; USCI_A0 SPI slave in master out P1.5/ PM_UCA0RXD/ PM_UCA0SOMI 6 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: USCI_A0 UART receive data; USCI_A0 SPI slave out master in VCORE 7 Regulated core power supply DVCC 8 Digital power supply P1.4/ PM_UCB0CLK/ PM_UCA0STE 9 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: USCI_B0 clock input/output / USCI_A0 SPI slave transmit enable P1.3/ PM_UCB0SIMO/ PM_UCB0SDA 10 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: USCI_B0 SPI slave in master out/USCI_B0 I2C data P1.2/ PM_UCB0SOMI/ PM_UCB0SCL 11 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: USCI_B0 SPI slave out master in/UCSI_B0 I2C clock P1.1/ PM_RFGDO2 12 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: Radio GDO2 output P1.0/ PM_RFGDO0 13 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: Radio GDO0 output P3.7/ PM_SMCLK 14 I/O General-purpose digital I/O with map-able secondary function Default mapping: SMCLK output P3.6/ PM_RFGDO1 15 I/O General-purpose digital I/O with map-able secondary function Default mapping: Radio GDO1 output P3.5/ PM_TA0CCR4A 16 I/O General-purpose digital I/O with map-able secondary function Default mapping: TA0 CCR4 compare output/capture input P3.4/ PM_TA0CCR3A 17 I/O General-purpose digital I/O with map-able secondary function Default mapping: TA0 CCR3 compare output/capture input P3.3/ PM_TA0CCR2A 18 I/O General-purpose digital I/O with map-able secondary function Default mapping: TA0 CCR2 compare output/capture input P3.2/ PM_TA0CCR1A 19 I/O General-purpose digital I/O with map-able secondary function Default mapping: TA0 CCR1 compare output/capture input P3.1/ PM_TA0CCR0A 20 I/O General-purpose digital I/O with map-able secondary function Default mapping: TA0 CCR0 compare output/capture input P3.0/ PM_CBOUT0/ PM_TA0CLK 21 I/O General-purpose digital I/O with map-able secondary function Default mapping: Comparator_B output; TA0 clock input DVCC 22 P2.7/ PM_ADC12CLK/ PM_DMAE0 23 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: ADC12CLK output; DMA external trigger input P2.6/ PM_ACLK 24 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: ACLK output RF_XIN 25 I Input terminal for RF crystal oscillator, or external clock input RF_XOUT 26 O Output terminal for RF crystal oscillator AVCC_RF 27 (1) Digital power supply Radio analog power supply I = input, O = output Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 13 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 3. CC430F513x Terminal Functions (continued) TERMINAL NAME AVCC_RF NO. I/O (1) 28 DESCRIPTION Radio analog power supply RF_P 29 RF I/O RF_N 30 RF I/O AVCC_RF 31 Radio analog power supply AVCC_RF 32 Radio analog power supply RBIAS 33 External bias resistor for radio reference current GUARD 34 Power supply connection for digital noise isolation PJ.0/ TDO 35 I/O General-purpose digital I/O Test data output port PJ.1/ TDI/ TCLK 36 I/O General-purpose digital I/O Test data input or test clock input PJ.2/ TMS 37 I/O General-purpose digital I/O Test mode select PJ.3/ TCK 38 I/O General-purpose digital I/O Test clock TEST/ SBWTCK 39 I RST/NMI/ SBWTDIO 40 I/O DVCC 41 Digital power supply AVSS 42 Analog ground supply for ADC12 P5.1/ XOUT 43 I/O General-purpose digital I/O Output terminal of crystal oscillator XT1 P5.0/ XIN 44 I/O General-purpose digital I/O Input terminal for crystal oscillator XT1 AVCC 45 Analog power supply 46 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: SVM output Comparator_B input CB5 Analog input A5 - 12-bit ADC Output of reference voltage to the ADC Input for an external reference voltage to the ADC P2.5/ PM_SVMOUT/ CB5/ A5/ VREF+/ VeREF+ Positive RF input to LNA in receive mode Positive RF output from PA in transmit mode Negative RF input to LNA in receive mode Negative RF output from PA in transmit mode Test mode pin - select digital I/O on JTAG pins Spy-bi-wire input clock Reset input active low Non-maskable interrupt input Spy-bi-wire data input/output P2.4/ PM_RTCCLK/ CB4/ A4/ VREF-/ VeREF- 47 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: RTCCLK output Comparator_B input CB4 Analog input A4 - 12-bit ADC Negative terminal for the ADC's reference voltage for both sources, the internal reference voltage, or an external applied reference voltage P2.3/ PM_TA1CCR2A/ CB3/ A3 48 I/O General-purpose digital I/O with port interrupt and map-able secondary function Default mapping: TA1 CCR2 compare output/capture input Comparator_B input CB3 Analog input A3 - 12-bit ADC VSS - Exposed die attach pad 14 Submit Documentation Feedback Ground supply The exposed die attach pad must be connected to a solid ground plane as this is the ground connection for the chip. Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com SHORT-FORM DESCRIPTION Sub-1-GHz Radio The implemented sub-1-GHz radio module is based on the industry-leading CC1101, requiring very few external components. Figure 1 shows a high-level block diagram of the implemented radio. 0 RF_N FREQ SYNTH 90 PA BIAS RC OSC RBIAS XOSC RF_XIN MODULATOR RF_P INTERFACE TO MCU ADC RXFIFO LNA TXFIFO ADC PACKET HANDLER DEMODULATOR RADIO CONTROL RF_XOUT Figure 1. Sub-1-GHz Radio Block Diagram The radio features a low-IF receiver. The received RF signal is amplified by a low-noise amplifier (LNA) and down-converted in quadrature to the intermediate frequency (IF). At IF, the I/Q signals are digitized. Automatic gain control (AGC), fine channel filtering, demodulation bit/packet synchronization are performed digitally. The transmitter part is based on direct synthesis of the RF frequency. The frequency synthesizer includes a completely on-chip LC VCO and a 90 degrees phase shifter for generating the I and Q LO signals to the down-conversion mixers in receive mode. The 26-MHz crystal oscillator generates the reference frequency for the synthesizer, as well as clocks for the ADC and the digital part. A memory mapped register interface is used for data access, configuration and status request by the CPU. The digital baseband includes support for channel configuration, packet handling and data buffering. For complete module descriptions, see the CC430 Family User's Guide, literature number SLAU259. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 15 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com CPU The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All operations, other than program-flow instructions, are performed as register operations in conjunction with seven addressing modes for source operand and four addressing modes for destination operand. The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-to-register operation execution time is one cycle of the CPU clock. Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and constant generator, respectively. The remaining registers are general-purpose registers. Peripherals are connected to the CPU using data, address, and control buses, and can be handled with all instructions. The instruction set consists of the original 51 instructions with three formats and seven address modes and additional instructions for the expanded address range. Each instruction can operate on word and byte data. Operating Modes The CC430 has one active mode and five software-selectable low-power modes of operation. An interrupt event can wake up the device from any of the low-power modes, service the request, and restore back to the low-power mode on return from the interrupt program. The following six operating modes can be configured by software: * Active mode (AM) - All clocks are active * Low-power mode 0 (LPM0) - CPU is disabled - ACLK and SMCLK remain active, MCLK is disabled - FLL loop control remains active * Low-power mode 1 (LPM1) - CPU is disabled - FLL loop control is disabled - ACLK and SMCLK remain active, MCLK is disabled * Low-power mode 2 (LPM2) - CPU is disabled - MCLK and FLL loop control and DCOCLK are disabled - DCO's dc-generator remains enabled - ACLK remains active * Low-power mode 3 (LPM3) - CPU is disabled - MCLK, FLL loop control, and DCOCLK are disabled - DCO's dc-generator is disabled - ACLK remains active * Low-power mode 4 (LPM4) - CPU is disabled - ACLK is disabled - MCLK, FLL loop control, and DCOCLK are disabled - DCO's dc-generator is disabled - Crystal oscillator is stopped - Complete data retention 16 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Interrupt Vector Addresses The interrupt vectors and the power-up start address are located in the address range 0FFFFh to 0FF80h. The vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence. Table 4. Interrupt Sources, Flags, and Vectors SYSTEM INTERRUPT WORD ADDRESS PRIORITY Reset 0FFFEh 63, highest SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG, VLRLIFG, VLRHIFG, VMAIFG, JMBNIFG, JMBOUTIFG (SYSSNIV) (1) (3) (Non)maskable 0FFFCh 62 NMIIFG, OFIFG, ACCVIFG (SYSUNIV) (1) (Non)maskable 0FFFAh 61 INTERRUPT SOURCE System Reset Power-Up External Reset Watchdog Timeout, Password Violation Flash Memory Password Violation System NMI PMM Vacant Memory Access JTAG Mailbox User NMI NMI Oscillator Fault Flash Memory Access Violation INTERRUPT FLAG WDTIFG, KEYV (SYSRSTIV) (1) (3) Comparator_B Comparator_B Interrupt Flags (CBIV) (1) Maskable 0FFF8h 60 Watchdog Interval Timer Mode WDTIFG Maskable 0FFF6h 59 USCI_A0 Receive/Transmit UCA0RXIFG, UCA0TXIFG (UCA0IV) (1) Maskable 0FFF4h 58 USCI_B0 Receive/Transmit UCB0RXIFG, UCB0TXIFG, I2C Status Interrupt Flags (UCB0IV) (1) Maskable 0FFF2h 57 ADC12_A (Reserved on CC430F612x) ADC12IFG0 ... ADC12IFG15 (ADC12IV) (1) Maskable 0FFF0h 56 TA0 TA0CCR0 CCIFG0 Maskable 0FFEEh 55 TA0 TA0CCR1 CCIFG1 ... TA0CCR4 CCIFG4, TA0IFG (TA0IV) (1) Maskable 0FFECh 54 RF1A CC1101-based Radio Radio Interface Interrupt Flags (RF1AIFIV) Radio Core Interrupt Flags (RF1AIV) Maskable 0FFEAh 53 Maskable 0FFE8h 52 DMA DMA0IFG, DMA1IFG, DMA2IFG (DMAIV) (1) TA1 TA1CCR0 CCIFG0 Maskable 0FFE6h 51 TA1 TA1CCR1 CCIFG1 ... TA1CCR2 CCIFG2, TA1IFG (TA1IV) (1) Maskable 0FFE4h 50 I/O Port P1 P1IFG.0 to P1IFG.7 (P1IV) (1) Maskable 0FFE2h 49 I/O Port P2 (1) Maskable 0FFE0h 48 Maskable 0FFDEh 47 LCD_B (Reserved on CC430F513x) P2IFG.0 to P2IFG.7 (P2IV) LCD_B Interrupt Flags (LCDBIV) (1) RTC_A RTCRDYIFG, RTCTEVIFG, RTCAIFG, RT0PSIFG, RT1PSIFG (RTCIV) (1) Maskable 0FFDCh 46 AES AESRDYIFG Maskable 0FFDAh 45 0FFD8h 44 Reserved (1) (2) (3) (4) (2) Reserved (4) 0FF80h 0, lowest Multiple source flags A reset is generated if the CPU tries to fetch instructions from within peripheral space. (Non)maskable: the individual interrupt-enable bit can disable an interrupt event, but the general-interrupt enable cannot disable it. Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To maintain compatibility with other devices, it is recommended to reserve these locations. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 17 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Memory Organization Table 5. Memory Organization Main Memory (flash) CC430F6137/F6127 CC430F5137 (1) CC430F6126 (1) CC430F6135/F6125 CC430F5135 (1) CC430F5133 (1) 32kB 32kB 16kB 8kB 00FFFFh to 00FF80h 00FFFFh to 00FF80h 00FFFFh to 00FF80h 00FFFFh to 00FF80h 32kB 00FFFFh to 008000h 32kB 00FFFFh to 008000h 16kB 00FFFFh to 00C000h 8kB 00FFFFh to 00E000h 4kB 2kB 2kB 2kB Sect 1 2kB 002BFFh to 002400h not available not available not available Sect 0 2kB 0023FFh to 001C00h 2kB 0023FFh to 001C00h 2kB 0023FFh to 001C00h 2kB 0023FFh to 001C00h 128 B 001AFFh to 001A80h 128 B 001AFFh to 001A80h 128 B 001AFFh to 001A80h 128 B 001AFFh to 001A80h 128 B 001A7Fh to 001A00h 128 B 001A7Fh to 001A00h 128 B 001A7Fh to 001A00h 128 B 001A7Fh to 001A00h Info A 128 B 0019FFh to 001980h 128 B 0019FFh to 001980h 128 B 0019FFh to 001980h 128 B 0019FFh to 001980h Info B 128 B 00197Fh to 001900h 128 B 00197Fh to 001900h 128 B 00197Fh to 001900h 128 B 00197Fh to 001900h Info C 128 B 0018FFh to 001880h 128 B 0018FFh to 001880h 128 B 0018FFh to 001880h 128 B 0018FFh to 001880h Info D 128 B 00187Fh to 001800h 128 B 00187Fh to 001800h 128 B 00187Fh to 001800h 128 B 00187Fh to 001800h BSL 3 512 B 0017FFh to 001600h 512 B 0017FFh to 001600h 512 B 0017FFh to 001600h 512 B 0017FFh to 001600h BSL 2 512 B 0015FFh to 001400h 512 B 0015FFh to 001400h 512 B 0015FFh to 001400h 512 B 0015FFh to 001400h BSL 1 512 B 0013FFh to 001200h 512 B 0013FFh to 001200h 512 B 0013FFh to 001200h 512 B 0013FFh to 001200h BSL 0 512 B 0011FFh to 001000h 512 B 0011FFh to 001000h 512 B 0011FFh to 001000h 512 B 0011FFh to 001000h 4 KB 000FFFh to 0h 4 KB 000FFFh to 0h 4 KB 000FFFh to 0h 4 KB 000FFFh to 0h Total Size Main: Interrupt vector Main: code memory Bank 0 Total Size RAM Device Descriptor Information memory (flash) Bootstrap loader (BSL) memory (flash) Peripherals (1) All memory regions not specified here are vacant memory, and any access to them causes a Vacant Memory Interrupt. Bootstrap Loader (BSL) The BSL enables users to program the flash memory or RAM using various serial interfaces. Access to the device memory via the BSL is protected by an user-defined password. BSL entry requires a specific entry sequence on the RST/NMI/SBWTDIO and TEST/SBWTCK pins. For complete description of the features of the BSL and its implementation, see the MSP430 Programming Via the Bootstrap Loader User's Guide, literature number SLAU319. Table 6. UART BSL Pin Requirements and Functions 18 DEVICE SIGNAL BSL FUNCTION RST/NMI/SBWTDIO Entry sequence signal TEST/SBWTCK Entry sequence signal P1.6 Data transmit Submit Documentation Feedback P1.5 Data receive VCC Power supply VSS Ground supply Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com JTAG Operation JTAG Standard Interface The CC430 family supports the standard JTAG interface which requires four signals for sending and receiving data. The JTAG signals are shared with general-purpose I/O. The TEST/SBWTCK pin is used to enable the JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface with MSP430 development tools and device programmers. The JTAG pin requirements are shown in Table 7. For further details on interfacing to development tools and device programmers, see the MSP430 Hardware Tools User's Guide, literature number SLAU278. Table 7. JTAG Pin Requirements and Functions DEVICE SIGNAL Direction FUNCTION PJ.3/TCK IN JTAG clock input PJ.2/TMS IN JTAG state control PJ.1/TDI/TCLK IN JTAG data input/TCLK input PJ.0/TDO OUT JTAG data output TEST/SBWTCK IN Enable JTAG pins RST/NMI/SBWTDIO IN External reset VCC Power supply VSS Ground supply Spy-Bi-Wire Interface In addition to the standard JTAG interface, the CC430 family supports the two wire Spy-Bi-Wire interface. Spy-Bi-Wire can be used to interface with MSP430 development tools and device programmers. The Spy-Bi-Wire interface pin requirements are shown in Table 8. For further details on interfacing to development tools and device programmers, see the MSP430 Hardware Tools User's Guide, literature number SLAU278. Table 8. Spy-Bi-Wire Pin Requirements and Functions DEVICE SIGNAL Direction FUNCTION TEST/SBWTCK IN Spy-Bi-Wire clock input RST/NMI/SBWTDIO IN, OUT Spy-Bi-Wire data input/output VCC Power supply VSS Ground supply Flash Memory The flash memory can be programmed via the JTAG port, Spy-Bi-Wire (SBW), or in-system by the CPU. The CPU can perform single-byte, single-word, and long-word writes to the flash memory. Features of the flash memory include: * Flash memory has n segments of main memory and four segments of information memory (Info A to Info D) of 128 bytes each. Each segment in main memory is 512 bytes in size. * Segments 0 to n may be erased in one step, or each segment may be individually erased. * Segments Info A to Info D can be erased individually, or as a group with the main memory segments. Segments Info A to Info D are also called information memory. * Segment A can be locked separately. RAM Memory The RAM memory is made up of n sectors. Each sector can be completely powered down to save leakage, however, all data is lost. Features of the RAM memory include: * RAM memory has n sectors of 2k bytes each. * Each sector 0 to n can be complete disabled, however data retention is lost. * Each sector 0 to n automatically enters low power retention mode when possible. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 19 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Peripherals Peripherals are connected to the CPU through data, address, and control busses and can be handled using all instructions. For complete module descriptions, see the CC430 Family User's Guide, literature number SLAU259. Oscillator and System Clock The Unified Clock System (UCS) module includes support for a 32768-Hz watch crystal oscillator, an internal very-low-power low-frequency oscillator (VLO), an internal trimmed low-frequency oscillator (REFO), an integrated internal digitally-controlled oscillator (DCO), and a high-frequency crystal oscillator. The UCS module is designed to meet the requirements of both low system cost and low-power consumption. The UCS module features digital frequency locked loop (FLL) hardware that, in conjunction with a digital modulator, stabilizes the DCO frequency to a programmable multiple of the watch crystal frequency. The internal DCO provides a fast turn-on clock source and stabilizes in less than 5 s. The UCS module provides the following clock signals: * Auxiliary clock (ACLK), sourced from a 32768-Hz watch crystal, a high-frequency crystal, the internal low-frequency oscillator (VLO), or the trimmed low-frequency oscillator (REFO). * Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources made available to ACLK. * Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be sourced by same sources made available to ACLK. * ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32. Power Management Module (PMM) The PMM includes an integrated voltage regulator that supplies the core voltage to the device and contains programmable output levels to provide for power optimization. The PMM also includes supply voltage supervisor (SVS) and supply voltage monitoring (SVM) circuitry, as well as brownout protection. The brownout circuit is implemented to provide the proper internal reset signal to the device during power-on and power-off. The SVS/SVM circuitry detects if the supply voltage drops below a user-selectable level and supports both supply voltage supervision (the device is automatically reset) and supply voltage monitoring (SVM, the device is not automatically reset). SVS and SVM circuitry is available on the primary supply and core supply. Digital I/O There are up to five 8-bit I/O ports implemented: ports P1 through P5. * All individual I/O bits are independently programmable. * Any combination of input, output, and interrupt conditions is possible. * Programmable pullup or pulldown on all ports. * Programmable drive strength on all ports. * Edge-selectable interrupt input capability for all the eight bits of ports P1 and P2. * Read/write access to port-control registers is supported by all instructions. * Ports can be accessed byte-wise (P1 through P5) or word-wise in pairs (PA and PB). 20 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Port Mapping Controller The port mapping controller allows the flexible and re-configurable mapping of digital functions to port pins of ports P1 through P3. Table 9. Port Mapping, Mnemonics, and Functions Value PxMAPy Mnemonic Input Pin Function (PxDIR.y=0) 0 PM_NONE None 1 (1) TA0 clock input - PM_CBOUT1 - Comparator_B output (on TA1 clock input) PM_TA1CLK TA1 clock input - 3 PM_ACLK None ACLK output 4 PM_MCLK None MCLK output 5 PM_SMCLK None SMCLK output 2 (1) 6 7 (1) RTCCLK output - ADC12CLK output PM_DMAE0 DMA external trigger input - PM_SVMOUT None SVM output PM_TA0CCR0A TA0 CCR0 capture input CCI0A TA0 CCR0 compare output Out0 10 PM_TA0CCR1A TA0 CCR1 capture input CCI1A TA0 CCR1 compare output Out1 11 PM_TA0CCR2A TA0 CCR2 capture input CCI2A TA0 CCR2 compare output Out2 12 PM_TA0CCR3A TA0 CCR3 capture input CCI3A TA0 CCR3 compare output Out3 13 PM_TA0CCR4A TA0 CCR4 capture input CCI4A TA0 CCR4 compare output Out4 14 PM_TA1CCR0A TA1 CCR0 capture input CCI0A TA1 CCR0 compare output Out0 15 PM_TA1CCR1A TA1 CCR1 capture input CCI1A TA1 CCR1 compare output Out1 16 PM_TA1CCR2A TA1 CCR2 capture input CCI2A TA1 CCR2 compare output Out2 19 (3) 20 (4) 21 (4) 22 (5) (5) None 9 18 (2) (4) PM_RTCCLK PM_ADC12CLK 8 17 (2) (1) (2) (3) DVSS Comparator_B output (on TA0 clock input) PM_CBOUT0 PM_TA0CLK Output Pin Function (PxDIR.y=1) PM_UCA0RXD USCI_A0 UART RXD (Direction controlled by USCI - input) PM_UCA0SOMI USCI_A0 SPI slave out master in (direction controlled by USCI) PM_UCA0TXD USCI_A0 UART TXD (Direction controlled by USCI - output) PM_UCA0SIMO USCI_A0 SPI slave in master out (direction controlled by USCI) PM_UCA0CLK USCI_A0 clock input/output (direction controlled by USCI) PM_UCB0STE USCI_B0 SPI slave transmit enable (direction controlled by USCI - input) PM_UCB0SOMI USCI_B0 SPI slave out master in (direction controlled by USCI) PM_UCB0SCL USCI_B0 I2C clock (open drain and direction controlled by USCI) PM_UCB0SIMO USCI_B0 SPI slave in master out (direction controlled by USCI) PM_UCB0SDA USCI_B0 I2C data (open drain and direction controlled by USCI) PM_UCB0CLK USCI_B0 clock input/output (direction controlled by USCI) PM_UCA0STE USCI_A0 SPI slave transmit enable (direction controlled by USCI - input) 23 PM_RFGDO0 Radio GDO0 (direction controlled by Radio) 24 PM_RFGDO1 Radio GDO1 (direction controlled by Radio) 25 PM_RFGDO2 Radio GDO2 (direction controlled by Radio) 26 Reserved None DVSS Input or output function is selected by the corresponding setting in the port direction register PxDIR. UART or SPI functionality is determined by the selected USCI mode. UCA0CLK function takes precedence over UCB0STE function. If the mapped pin is required as UCA0CLK input or output USCI_B0 will be forced to 3-wire SPI mode even if 4-wire mode is selected. SPI or I2C functionality is determined by the selected USCI mode. In case the I2C functionality is selected the output of the mapped pin drives only the logical 0 to VSS level. UCB0CLK function takes precedence over UCA0STE function. If the mapped pin is required as UCB0CLK input or output USCI_A0 will be forced to 3-wire SPI mode even if 4-wire mode is selected. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 21 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 9. Port Mapping, Mnemonics, and Functions (continued) (6) Value PxMAPy Mnemonic Input Pin Function (PxDIR.y=0) Output Pin Function (PxDIR.y=1) 27 Reserved None DVSS 28 Reserved None DVSS 29 Reserved None DVSS 30 Reserved None DVSS 31 (0FFh) (6) PM_ANALOG Disables the output driver as well as the input Schmitt-trigger to prevent parasitic cross currents when applying analog signals. The value of the PMPAP_ANALOG mnemonic is set to 0FFh. The port mapping registers are only 5 bits wide and the upper bits are ignored resulting in a read out value of 31. Table 10. Default Mapping 22 Pin PxMAPy Mnemonic Input Pin Function (PxDIR.y=0) Output Pin Function (PxDIR.y=1) P1.0/P1MAP0 PM_RFGDO0 None Radio GDO0 P1.1/P1MAP1 PM_RFGDO2 None Radio GDO2 P1.2/P1MAP2 PM_UCB0SOMI/PM_UCB0SCL USCI_B0 SPI slave out master in (direction controlled by USCI)/USCI_B0 I2C clock (open drain and direction controlled by USCI) P1.3/P1MAP3 PM_UCB0SIMO/PM_UCB0SDA USCI_B0 SPI slave in master out (direction controlled by USCI)/USCI_B0 I2C data (open drain and direction controlled by USCI) P1.4/P1MAP4 PM_UCB0CLK/PM_UCA0STE USCI_B0 clock input/output (direction controlled by USCI)/USCI_A0 SPI slave transmit enable (direction controlled by USCI - input) P1.5/P1MAP5 PM_UCA0RXD/PM_UCA0SOMI USCI_A0 UART RXD (Direction controlled by USCI - input)/USCI_A0 SPI slave out master in (direction controlled by USCI) P1.6/P1MAP6 PM_UCA0TXD/PM_UCA0SIMO USCI_A0 UART TXD (Direction controlled by USCI - output)/USCI_A0 SPI slave in master out (direction controlled by USCI) P1.7/P1MAP7 PM_UCA0CLK/PM_UCB0STE USCI_A0 clock input/output (direction controlled by USCI)/USCI_B0 SPI slave transmit enable (direction controlled by USCI - input) P2.0/P2MAP0 PM_CBOUT1/PM_TA1CLK TA1 clock input Comparator_B output P2.1/P2MAP1 PM_TA1CCR0A TA1 CCR0 capture input CCI0A TA1 CCR0 compare output Out0 P2.2/P2MAP2 PM_TA1CCR1A TA1 CCR1 capture input CCI1A TA1 CCR1 compare output Out1 P2.3/P2MAP3 PM_TA1CCR2A TA1 CCR2 capture input CCI2A TA1 CCR2 compare output Out2 P2.4/P2MAP4 PM_RTCCLK None RTCCLK output P2.5/P2MAP5 PM_SVMOUT None SVM output P2.6/P2MAP6 PM_ACLK None ACLK output P2.7/P2MAP7 PM_ADC12CLK/PM_DMAE0 DMA external trigger input ADC12CLK output P3.0/P3MAP0 PM_CBOUT0/PM_TA0CLK TA0 clock input Comparator_B output P3.1/P3MAP1 PM_TA0CCR0A TA0 CCR0 capture input CCI0A TA0 CCR0 compare output Out0 P3.2/P3MAP2 PM_TA0CCR1A TA0 CCR1 capture input CCI1A TA0 CCR1 compare output Out1 P3.3/P3MAP3 PM_TA0CCR2A TA0 CCR2 capture input CCI2A TA0 CCR2 compare output Out2 P3.4/P3MAP4 PM_TA0CCR3A TA0 CCR3 capture input CCI3A TA0 CCR3 compare output Out3 P3.5/P3MAP5 PM_TA0CCR4A TA0 CCR4 capture input CCI4A TA0 CCR4 compare output Out4 P3.6/P3MAP6 PM_RFGDO1 None Radio GDO1 P3.7/P3MAP7 PM_SMCLK None SMCLK output Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com System Module (SYS) The SYS module handles many of the system functions within the device. These include power on reset and power up clear handling, NMI source selection and management, reset interrupt vector generators, boot strap loader entry mechanisms, as well as, configuration management (device descriptors). It also includes a data exchange mechanism via JTAG called a JTAG mailbox that can be used in the application. Table 11. System Module Interrupt Vector Registers INTERRUPT VECTOR REGISTER ADDRESS INTERRUPT EVENT VALUE SYSRSTIV , System Reset 019Eh No interrupt pending 00h Brownout (BOR) 02h RST/NMI (POR) 04h DoBOR (BOR) 06h Reserved 08h SYSSNIV , System NMI SYSUNIV, User NMI 019Ch 019Ah Copyright (c) 2009-2011, Texas Instruments Incorporated Security violation (BOR) 0Ah SVSL (POR) 0Ch SVSH (POR) 0Eh SVML_OVP (POR) 10h SVMH_OVP (POR) 12h DoPOR (POR) 14h WDT timeout (PUC) 16h WDT password violation (PUC) 18h KEYV flash password violation (PUC) 1Ah FLL unlock (PUC) 1Ch Peripheral area fetch (PUC) 1Eh PMM password violation (PUC) 20h Reserved 22h to 3Eh No interrupt pending 00h SVMLIFG 02h SVMHIFG 04h DLYLIFG 06h DLYHIFG 08h VMAIFG 0Ah JMBINIFG 0Ch JMBOUTIFG 0Eh VLRLIFG 10h VLRHIFG 12h Reserved 14h to 1Eh No interrupt pending 00h NMIFG 02h OFIFG 04h ACCVIFG 06h Reserved 08h to 1Eh PRIORITY Highest Lowest Highest Lowest Highest Lowest Submit Documentation Feedback 23 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com DMA Controller The DMA controller allows movement of data from one memory address to another without CPU intervention. Using the DMA controller can increase the throughput of peripheral modules. The DMA controller reduces system power consumption by allowing the CPU to remain in sleep mode, without having to awaken to move data to or from a peripheral. Table 12. DMA Trigger Assignments (1) Trigger (1) (2) Channel 0 1 2 0 DMAREQ DMAREQ DMAREQ 1 TA0CCR0 CCIFG TA0CCR0 CCIFG TA0CCR0 CCIFG 2 TA0CCR2 CCIFG TA0CCR2 CCIFG TA0CCR2 CCIFG 3 TA1CCR0 CCIFG TA1CCR0 CCIFG TA1CCR0 CCIFG 4 TA1CCR2 CCIFG TA1CCR2 CCIFG TA1CCR2 CCIFG 5 Reserved Reserved Reserved 6 Reserved Reserved Reserved 7 Reserved Reserved Reserved 8 Reserved Reserved Reserved 9 Reserved Reserved Reserved 10 Reserved Reserved Reserved 11 Reserved Reserved Reserved 12 Reserved Reserved Reserved 13 Reserved Reserved Reserved 14 Reserved Reserved Reserved 15 Reserved Reserved Reserved 16 UCA0RXIFG UCA0RXIFG UCA0RXIFG 17 UCA0TXIFG UCA0TXIFG UCA0TXIFG 18 UCB0RXIFG UCB0RXIFG UCB0RXIFG 19 UCB0TXIFG UCB0TXIFG UCB0TXIFG 20 Reserved Reserved Reserved 21 Reserved Reserved Reserved 22 Reserved Reserved Reserved 23 Reserved Reserved (2) ADC12IFGx Reserved (2) ADC12IFGx (2) 24 ADC12IFGx 25 Reserved Reserved Reserved 26 Reserved Reserved Reserved 27 Reserved Reserved Reserved 28 Reserved Reserved Reserved 29 MPY ready MPY ready MPY ready 30 DMA2IFG DMA0IFG DMA1IFG 31 DMAE0 DMAE0 DMAE0 Reserved DMA triggers may be used by other devices in the family. Reserved DMA triggers will not cause any DMA trigger event when selected. Only on CC430F613x and CC430F513x. Reserved on CC430F612x. Watchdog Timer (WDT_A) The primary function of the watchdog timer is to perform a controlled system restart after a software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed in an application, the timer can be configured as an interval timer and can generate interrupts at selected time intervals. 24 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available www.ti.com CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 CRC16 The CRC16 module produces a signature based on a sequence of entered data values and can be used for data checking purposes. The CRC16 module signature is based on the CRC-CCITT standard. Hardware Multiplier The multiplication operation is supported by a dedicated peripheral module. The module performs operations with 32-bit, 24-bit, 16-bit, and 8-bit operands. The module is capable of supporting signed and unsigned multiplication as well as signed and unsigned multiply and accumulate operations. AES128 Accelerator The AES accelerator module performs encryption and decryption of 128-bit data with 128-bit keys according to the Advanced Encryption Standard (AES) (FIPS PUB 197) in hardware. Universal Serial Communication Interface (USCI) The USCI module is used for serial data communication. The USCI module supports synchronous communication protocols such as SPI (3 or 4 pin) and I2C, and asynchronous communication protocols such as UART, enhanced UART with automatic baudrate detection, and IrDA. The USCI_An module provides support for SPI (3 or 4 pin), UART, enhanced UART, and IrDA. The USCI_Bn module provides support for SPI (3 or 4 pin) and I2C. A USCI_A0 and USCI_B0 module are implemented. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 25 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com TA0 TA0 is a 16-bit timer/counter (Timer_A type) with five capture/compare registers. TA0 can support multiple capture/compares, PWM outputs, and interval timing. TA0 also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers. Table 13. TA0 Signal Connections DEVICE INPUT SIGNAL MODULE INPUT NAME PM_TA0CLK TACLK (1) (2) 26 ACLK (internal) ACLK SMCLK (internal) SMCLK RFCLK/192 (1) INCLK PM_TA0CCR0A CCI0A DVSS CCI0B DVSS GND MODULE BLOCK MODULE OUTPUT SIGNAL Timer NA DEVICE OUTPUT SIGNAL PM_TA0CCR0A CCR0 TA0 DVCC VCC PM_TA0CCR1A CCI1A PM_TA0CCR1A CBOUT (internal) CCI1B ADC12 (internal) (2) ADC12SHSx = {1} DVSS GND DVCC VCC PM_TA0CCR2A CCI2A ACLK (internal) CCI2B DVSS GND DVCC VCC PM_TA0CCR3A CCI3A GDO1 from Radio (internal) CCI3B DVSS GND DVCC VCC PM_TA0CCR4A CCI4A GDO2 from Radio (internal) CCI4B DVSS GND DVCC VCC CCR1 TA1 PM_TA0CCR2A CCR2 TA2 PM_TA0CCR3A CCR3 TA3 PM_TA0CCR4A CCR4 TA4 If a different RFCLK divider setting is selected for a radio GDO output, this divider setting is also used for the Timer_A INCLK. Only on CC430F613x and CC430F513x Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com TA1 TA1 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. TA1 can support multiple capture/compares, PWM outputs, and interval timing. TA1 also has extensive interrupt capabilities. Interrupts may be generated from the counter on overflow conditions and from each of the capture/compare registers. Table 14. TA1 Signal Connections DEVICE INPUT SIGNAL MODULE INPUT NAME PM_TA1CLK TACLK ACLK (internal) ACLK SMCLK (internal) SMCLK RFCLK/192 (1) INCLK PM_TA1CCR0A CCI0A RF Async. Output (internal) CCI0B (1) DVSS GND DVCC VCC PM_TA1CCR1A CCI1A CBOUT (internal) CCI1B DVSS GND DVCC VCC PM_TA1CCR2A CCI2A ACLK (internal) CCI2B DVSS GND DVCC VCC MODULE BLOCK Timer MODULE OUTPUT SIGNAL DEVICE OUTPUT SIGNAL PZ NA PM_TA1CCR0A CCR0 TA0 RF Async. Input (internal) PM_TA1CCR1A CCR1 TA1 PM_TA1CCR2A CCR2 TA2 If a different RFCLK divider setting is selected for a radio GDO output, this divider setting is also used for the Timer_A INCLK. Real-Time Clock (RTC_A) The RTC_A module can be used as a general-purpose 32-bit counter (counter mode) or as an integrated real-time clock (RTC) (calendar mode). In counter mode, the RTC_A also includes two independent 8-bit timers that can be cascaded to form a 16-bit timer/counter. Both timers can be read and written by software. Calendar mode integrates an internal calendar which compensates for months with less than 31 days and includes leap year correction. The RTC_A also supports flexible alarm functions and offset-calibration hardware. REF Voltage Reference The reference module (REF) is responsible for generation of all critical reference voltages that can be used by the various analog peripherals in the device. These include the ADC12_A, LCD_B, and COMP_B modules. LCD_B (Only CC430F613x and CC430F612x) The LCD_B driver generates the segment and common signals required to drive a Liquid Crystal Display (LCD). The LCD_B controller has dedicated data memories to hold segment drive information. Common and segment signals are generated as defined by the mode. Static, 2-mux, 3-mux, and 4-mux LCDs are supported. The module can provide a LCD voltage independent of the supply voltage with its integrated charge pump. It is possible to control the level of the LCD voltage and thus contrast by software. The module also provides an automatic blinking capability for individual segments. Comparator_B The primary function of the Comparator_B module is to support precision slope analog-to-digital conversions, battery voltage supervision, and monitoring of external analog signals. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 27 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com ADC12_A (Only CC430F613x and CC430F513x) The ADC12_A module supports fast, 12-bit analog-to-digital conversions. The module implements a 12-bit SAR core, sample select control, reference generator and a 16 word conversion-and-control buffer. The conversion-and-control buffer allows up to 16 independent ADC samples to be converted and stored without any CPU intervention. Embedded Emulation Module (EEM, S Version) The Embedded Emulation Module (EEM) supports real-time in-system debugging. The S version of the EEM implemented on all devices has the following features: * Three hardware triggers/breakpoints on memory access * One hardware trigger/breakpoint on CPU register write access * Up to four hardware triggers can be combined to form complex triggers/breakpoints * One cycle counter * Clock control on module level 28 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Peripheral File Map Table 15. Peripherals MODULE NAME BASE ADDRESS OFFSET ADDRESS RANGE Special Functions (see Table 16) 0100h 000h - 01Fh PMM (see Table 17) 0120h 000h - 00Fh Flash Control (see Table 18) 0140h 000h - 00Fh CRC16 (see Table 19) 0150h 000h - 007h RAM Control (see Table 20) 0158h 000h - 001h Watchdog (see Table 21) 015Ch 000h - 001h UCS (see Table 22) 0160h 000h - 01Fh SYS (see Table 23) 0180h 000h - 01Fh Shared Reference (see Table 24) 01B0h 000h - 001h Port Mapping Control (see Table 25) 01C0h 000h - 007h Port Mapping Port P1 (see Table 26) 01C8h 000h - 007h Port Mapping Port P2 (see Table 27) 01D0h 000h - 007h Port Mapping Port P3 (see Table 28) 01D8h 000h - 007h Port P1/P2 (see Table 29) 0200h 000h - 01Fh Port P3/P4 (see Table 30) (P4 not available on CC430F513x) 0220h 000h - 01Fh Port P5 (see Table 31) 0240h 000h - 01Fh Port PJ (see Table 32) 0320h 000h - 01Fh TA0 (see Table 33) 0340h 000h - 03Fh TA1 (see Table 34) 0380h 000h - 03Fh RTC_A (see Table 35) 04A0h 000h - 01Fh 32-bit Hardware Multiplier (see Table 36) 04C0h 000h - 02Fh DMA Module Control (see Table 37) 0500h 000h - 00Fh DMA Channel 0 (see Table 38) 0510h 000h - 00Fh DMA Channel 1 (see Table 39) 0520h 000h - 00Fh DMA Channel 2 (see Table 40) 0530h 000h - 00Fh USCI_A0 (see Table 41) 05C0h 000h - 01Fh USCI_B0 (see Table 42) 05E0h 000h - 01Fh ADC12 (see Table 43) (only CC430F613x and CC430F513x) 0700h 000h - 03Fh Comparator_B (see Table 44) 08C0h 000h - 00Fh AES Accelerator (see Table 45) 09C0h 000h - 00Fh LCD_B (see Table 46) (only CC430F613x and CC430F612x) 0A00h 000h - 05Fh Radio Interface (see Table 47) 0F00h 000h - 03Fh Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 29 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 16. Special Function Registers (Base Address: 0100h) REGISTER DESCRIPTION REGISTER OFFSET SFR interrupt enable SFRIE1 00h SFR interrupt flag SFRIFG1 02h SFR reset pin control SFRRPCR 04h Table 17. PMM Registers (Base Address: 0120h) REGISTER DESCRIPTION REGISTER OFFSET PMM Control 0 PMMCTL0 00h PMM control 1 PMMCTL1 02h SVS high side control SVSMHCTL 04h SVS low side control SVSMLCTL 06h PMM interrupt flags PMMIFG 0Ch PMM interrupt enable PMMIE 0Eh PMM power mode 5 control PM5CTL0 10h Table 18. Flash Control Registers (Base Address: 0140h) REGISTER DESCRIPTION REGISTER OFFSET Flash control 1 FCTL1 00h Flash control 3 FCTL3 04h Flash control 4 FCTL4 06h Table 19. CRC16 Registers (Base Address: 0150h) REGISTER DESCRIPTION REGISTER OFFSET CRC data input CRC16DI 00h CRC data input reverse byte CRCDIRB 02h CRC initialization and result CRCINIRES 04h CRC result reverse byte CRCRESR 06h Table 20. RAM Control Registers (Base Address: 0158h) REGISTER DESCRIPTION RAM control 0 REGISTER RCCTL0 OFFSET 00h Table 21. Watchdog Registers (Base Address: 015Ch) REGISTER DESCRIPTION Watchdog timer control REGISTER WDTCTL OFFSET 00h Table 22. UCS Registers (Base Address: 0160h) REGISTER DESCRIPTION REGISTER OFFSET UCS control 0 UCSCTL0 00h UCS control 1 UCSCTL1 02h UCS control 2 UCSCTL2 04h UCS control 3 UCSCTL3 06h UCS control 4 UCSCTL4 08h UCS control 5 UCSCTL5 0Ah UCS control 6 UCSCTL6 0Ch UCS control 7 UCSCTL7 0Eh UCS control 8 UCSCTL8 10h 30 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 23. SYS Registers (Base Address: 0180h) REGISTER DESCRIPTION REGISTER OFFSET System control SYSCTL 00h Bootstrap loader configuration area SYSBSLC 02h JTAG mailbox control SYSJMBC 06h JTAG mailbox input 0 SYSJMBI0 08h JTAG mailbox input 1 SYSJMBI1 0Ah JTAG mailbox output 0 SYSJMBO0 0Ch JTAG mailbox output 1 SYSJMBO1 0Eh Bus Error vector generator SYSBERRIV 18h User NMI vector generator SYSUNIV 1Ah System NMI vector generator SYSSNIV 1Ch Reset vector generator SYSRSTIV 1Eh Table 24. Shared Reference Registers (Base Address: 01B0h) REGISTER DESCRIPTION Shared reference control REGISTER REFCTL OFFSET 00h Table 25. Port Mapping Control Registers (Base Address: 01C0h) REGISTER DESCRIPTION REGISTER OFFSET Port mapping key register PMAPKEYID 00h Port mapping control register PMAPCTL 02h Table 26. Port Mapping Port P1 Registers (Base Address: 01C8h) REGISTER DESCRIPTION REGISTER OFFSET Port P1.0 mapping register P1MAP0 00h Port P1.1 mapping register P1MAP1 01h Port P1.2 mapping register P1MAP2 02h Port P1.3 mapping register P1MAP3 03h Port P1.4 mapping register P1MAP4 04h Port P1.5 mapping register P1MAP5 05h Port P1.6 mapping register P1MAP6 06h Port P1.7 mapping register P1MAP7 07h Table 27. Port Mapping Port P2 Registers (Base Address: 01D0h) REGISTER DESCRIPTION REGISTER OFFSET Port P2.0 mapping register P2MAP0 00h Port P2.1 mapping register P2MAP1 01h Port P2.2 mapping register P2MAP2 02h Port P2.3 mapping register P2MAP3 03h Port P2.4 mapping register P2MAP4 04h Port P2.5 mapping register P2MAP5 05h Port P2.6 mapping register P2MAP6 06h Port P2.7 mapping register P2MAP7 07h Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 31 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 28. Port Mapping Port P3 Registers (Base Address: 01D8h) REGISTER DESCRIPTION REGISTER OFFSET Port P3.0 mapping register P3MAP0 00h Port P3.1 mapping register P3MAP1 01h Port P3.2 mapping register P3MAP2 02h Port P3.3 mapping register P3MAP3 03h Port P3.4 mapping register P3MAP4 04h Port P3.5 mapping register P3MAP5 05h Port P3.6 mapping register P3MAP6 06h Port P3.7 mapping register P3MAP7 07h Table 29. Port P1/P2 Registers (Base Address: 0200h) REGISTER DESCRIPTION REGISTER OFFSET Port P1 input P1IN 00h Port P1 output P1OUT 02h Port P1 direction P1DIR 04h Port P1 pullup/pulldown enable P1REN 06h Port P1 drive strength P1DS 08h Port P1 selection P1SEL 0Ah Port P1 interrupt vector word P1IV 0Eh Port P1 interrupt edge select P1IES 18h Port P1 interrupt enable P1IE 1Ah Port P1 interrupt flag P1IFG 1Ch Port P2 input P2IN 01h Port P2 output P2OUT 03h Port P2 direction P2DIR 05h Port P2 pullup/pulldown enable P2REN 07h Port P2 drive strength P2DS 09h Port P2 selection P2SEL 0Bh Port P2 interrupt vector word P2IV 1Eh Port P2 interrupt edge select P2IES 19h Port P2 interrupt enable P2IE 1Bh Port P2 interrupt flag P2IFG 1Dh Table 30. Port P3/P4 Registers (Base Address: 0220h) REGISTER DESCRIPTION REGISTER OFFSET Port P3 input P3IN 00h Port P3 output P3OUT 02h Port P3 direction P3DIR 04h Port P3 pullup/pulldown enable P3REN 06h Port P3 drive strength P3DS 08h Port P3 selection P3SEL 0Ah Port P4 input P4IN 01h Port P4 output P4OUT 03h Port P4 direction P4DIR 05h Port P4 pullup/pulldown enable P4REN 07h Port P4 drive strength P4DS 09h Port P4 selection P4SEL 0Bh 32 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 31. Port P5 Registers (Base Address: 0240h) REGISTER DESCRIPTION REGISTER OFFSET Port P5 input P5IN 00h Port P5 output P5OUT 02h Port P5 direction P5DIR 04h Port P5 pullup/pulldown enable P5REN 06h Port P5 drive strength P5DS 08h Port P5 selection P5SEL 0Ah Table 32. Port J Registers (Base Address: 0320h) REGISTER DESCRIPTION REGISTER OFFSET Port PJ input PJIN 00h Port PJ output PJOUT 02h Port PJ direction PJDIR 04h Port PJ pullup/pulldown enable PJREN 06h Port PJ drive strength PJDS 08h Table 33. TA0 Registers (Base Address: 0340h) REGISTER DESCRIPTION REGISTER OFFSET TA0 control TA0CTL 00h Capture/compare control 0 TA0CCTL0 02h Capture/compare control 1 TA0CCTL1 04h Capture/compare control 2 TA0CCTL2 06h Capture/compare control 3 TA0CCTL3 08h Capture/compare control 4 TA0CCTL4 0Ah TA0 counter register TA0R 10h Capture/compare register 0 TA0CCR0 12h Capture/compare register 1 TA0CCR1 14h Capture/compare register 2 TA0CCR2 16h Capture/compare register 3 TA0CCR3 18h Capture/compare register 4 TA0CCR4 1Ah TA0 expansion register 0 TA0EX0 20h TA0 interrupt vector TA0IV 2Eh Table 34. TA1 Registers (Base Address: 0380h) REGISTER DESCRIPTION REGISTER OFFSET TA1 control TA1CTL 00h Capture/compare control 0 TA1CCTL0 02h Capture/compare control 1 TA1CCTL1 04h Capture/compare control 2 TA1CCTL2 06h TA1 counter register TA1R 10h Capture/compare register 0 TA1CCR0 12h Capture/compare register 1 TA1CCR1 14h Capture/compare register 2 TA1CCR2 16h TA1 expansion register 0 TA1EX0 20h TA1 interrupt vector TA1IV 2Eh Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 33 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 35. Real Time Clock Registers (Base Address: 04A0h) REGISTER DESCRIPTION REGISTER OFFSET RTC control 0 RTCCTL0 00h RTC control 1 RTCCTL1 01h RTC control 2 RTCCTL2 02h RTC control 3 RTCCTL3 03h RTC prescaler 0 control RTCPS0CTL 08h RTC prescaler 1 control RTCPS1CTL 0Ah RTC prescaler 0 RTCPS0 0Ch RTC prescaler 1 RTCPS1 0Dh RTC interrupt vector word RTCIV 0Eh RTC seconds/counter register 1 RTCSEC/RTCNT1 10h RTC minutes/counter register 2 RTCMIN/RTCNT2 11h RTC hours/counter register 3 RTCHOUR/RTCNT3 12h RTC day of week/counter register 4 RTCDOW/RTCNT4 13h RTC days RTCDAY 14h RTC month RTCMON 15h RTC year low RTCYEARL 16h RTC year high RTCYEARH 17h RTC alarm minutes RTCAMIN 18h RTC alarm hours RTCAHOUR 19h RTC alarm day of week RTCADOW 1Ah RTC alarm days RTCADAY 1Bh Table 36. 32-bit Hardware Multiplier Registers (Base Address: 04C0h) REGISTER DESCRIPTION REGISTER OFFSET 16-bit operand 1 - multiply MPY 00h 16-bit operand 1 - signed multiply MPYS 02h 16-bit operand 1 - multiply accumulate MAC 04h 16-bit operand 1 - signed multiply accumulate MACS 06h 16-bit operand 2 OP2 08h 16 x 16 result low word RESLO 0Ah 16 x 16 result high word RESHI 0Ch 16 x 16 sum extension register SUMEXT 0Eh 32-bit operand 1 - multiply low word MPY32L 10h 32-bit operand 1 - multiply high word MPY32H 12h 32-bit operand 1 - signed multiply low word MPYS32L 14h 32-bit operand 1 - signed multiply high word MPYS32H 16h 32-bit operand 1 - multiply accumulate low word MAC32L 18h 32-bit operand 1 - multiply accumulate high word MAC32H 1Ah 32-bit operand 1 - signed multiply accumulate low word MACS32L 1Ch 32-bit operand 1 - signed multiply accumulate high word MACS32H 1Eh 32-bit operand 2 - low word OP2L 20h 32-bit operand 2 - high word OP2H 22h 32 x 32 result 0 - least significant word RES0 24h 32 x 32 result 1 RES1 26h 32 x 32 result 2 RES2 28h 32 x 32 result 3 - most significant word RES3 2Ah MPY32 control register 0 MPY32CTL0 2Ch 34 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 37. DMA Module Control Registers (Base Address: 0500h) REGISTER DESCRIPTION REGISTER OFFSET DMA module control 0 DMACTL0 00h DMA module control 1 DMACTL1 02h DMA module control 2 DMACTL2 04h DMA module control 3 DMACTL3 06h DMA module control 4 DMACTL4 08h DMA interrupt vector DMAIV 0Ah Table 38. DMA Channel 0 Registers (Base Address: 0510h) REGISTER DESCRIPTION REGISTER OFFSET DMA channel 0 control DMA0CTL 00h DMA channel 0 source address low DMA0SAL 02h DMA channel 0 source address high DMA0SAH 04h DMA channel 0 destination address low DMA0DAL 06h DMA channel 0 destination address high DMA0DAH 08h DMA channel 0 transfer size DMA0SZ 0Ah Table 39. DMA Channel 1 Registers (Base Address: 0520h) REGISTER DESCRIPTION REGISTER OFFSET DMA channel 1 control DMA1CTL 00h DMA channel 1 source address low DMA1SAL 02h DMA channel 1 source address high DMA1SAH 04h DMA channel 1 destination address low DMA1DAL 06h DMA channel 1 destination address high DMA1DAH 08h DMA channel 1 transfer size DMA1SZ 0Ah Table 40. DMA Channel 2 Registers (Base Address: 0530h) REGISTER DESCRIPTION REGISTER OFFSET DMA channel 2 control DMA2CTL 00h DMA channel 2 source address low DMA2SAL 02h DMA channel 2 source address high DMA2SAH 04h DMA channel 2 destination address low DMA2DAL 06h DMA channel 2 destination address high DMA2DAH 08h DMA channel 2 transfer size DMA2SZ 0Ah Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 35 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 41. USCI_A0 Registers (Base Address: 05C0h) REGISTER DESCRIPTION REGISTER OFFSET USCI control 1 UCA0CTL1 00h USCI control 0 UCA0CTL0 01h USCI baud rate 0 UCA0BR0 06h USCI baud rate 1 UCA0BR1 07h USCI modulation control UCA0MCTL 08h USCI status UCA0STAT 0Ah USCI receive buffer UCA0RXBUF 0Ch USCI transmit buffer UCA0TXBUF 0Eh USCI LIN control UCA0ABCTL 10h USCI IrDA transmit control UCA0IRTCTL 12h USCI IrDA receive control UCA0IRRCTL 13h USCI interrupt enable UCA0IE 1Ch USCI interrupt flags UCA0IFG 1Dh USCI interrupt vector word UCA0IV 1Eh Table 42. USCI_B0 Registers (Base Address: 05E0h) REGISTER DESCRIPTION REGISTER OFFSET USCI synchronous control 1 UCB0CTL1 00h USCI synchronous control 0 UCB0CTL0 01h USCI synchronous bit rate 0 UCB0BR0 06h USCI synchronous bit rate 1 UCB0BR1 07h USCI synchronous status UCB0STAT 0Ah USCI synchronous receive buffer UCB0RXBUF 0Ch USCI synchronous transmit buffer UCB0TXBUF 0Eh USCI I2C own address UCB0I2COA 10h USCI I2C slave address UCB0I2CSA 12h USCI interrupt enable UCB0IE 1Ch USCI interrupt flags UCB0IFG 1Dh USCI interrupt vector word UCB0IV 1Eh 36 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 43. ADC12_A Registers (Base Address: 0700h) REGISTER DESCRIPTION REGISTER OFFSET Control register 0 ADC12CTL0 00h Control register 1 ADC12CTL1 02h Control register 2 ADC12CTL2 04h Interrupt-flag register ADC12IFG 0Ah Interrupt-enable register ADC12IE 0Ch Interrupt-vector-word register ADC12IV 0Eh ADC memory-control register 0 ADC12MCTL0 10h ADC memory-control register 1 ADC12MCTL1 11h ADC memory-control register 2 ADC12MCTL2 12h ADC memory-control register 3 ADC12MCTL3 13h ADC memory-control register 4 ADC12MCTL4 14h ADC memory-control register 5 ADC12MCTL5 15h ADC memory-control register 6 ADC12MCTL6 16h ADC memory-control register 7 ADC12MCTL7 17h ADC memory-control register 8 ADC12MCTL8 18h ADC memory-control register 9 ADC12MCTL9 19h ADC memory-control register 10 ADC12MCTL10 1Ah ADC memory-control register 11 ADC12MCTL11 1Bh ADC memory-control register 12 ADC12MCTL12 1Ch ADC memory-control register 13 ADC12MCTL13 1Dh ADC memory-control register 14 ADC12MCTL14 1Eh ADC memory-control register 15 ADC12MCTL15 1Fh Conversion memory 0 ADC12MEM0 20h Conversion memory 1 ADC12MEM1 22h Conversion memory 2 ADC12MEM2 24h Conversion memory 3 ADC12MEM3 26h Conversion memory 4 ADC12MEM4 28h Conversion memory 5 ADC12MEM5 2Ah Conversion memory 6 ADC12MEM6 2Ch Conversion memory 7 ADC12MEM7 2Eh Conversion memory 8 ADC12MEM8 30h Conversion memory 9 ADC12MEM9 32h Conversion memory 10 ADC12MEM10 34h Conversion memory 11 ADC12MEM11 36h Conversion memory 12 ADC12MEM12 38h Conversion memory 13 ADC12MEM13 3Ah Conversion memory 14 ADC12MEM14 3Ch Conversion memory 15 ADC12MEM15 3Eh Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 37 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 44. Comparator_B Registers (Base Address: 08C0h) REGISTER DESCRIPTION REGISTER OFFSET Comp_B control register 0 CBCTL0 00h Comp_B control register 1 CBCTL1 02h Comp_B control register 2 CBCTL2 04h Comp_B control register 3 CBCTL3 06h Comp_B interrupt register CBINT 0Ch Comp_B interrupt vector word CBIV 0Eh Table 45. AES Accelerator Registers (Base Address: 09C0h) REGISTER DESCRIPTION AES accelerator control register 0 REGISTER AESACTL0 Reserved OFFSET 00h 02h AES accelerator status register AESASTAT 04h AES accelerator key register AESAKEY 06h AES accelerator data in register AESADIN 008h AES accelerator data out register AESADOUT 00Ah Table 46. LCD_B Registers (Base Address: 0A00h) REGISTER DESCRIPTION REGISTER OFFSET LCD_B control register 0 LCDBCTL0 000h LCD_B control register 1 LCDBCTL1 002h LCD_B blinking control register LCDBBLKCTL 004h LCD_B memory control register LCDBMEMCTL 006h LCD_B voltage control register LCDBVCTL 008h LCD_B port control register 0 LCDBPCTL0 00Ah LCD_B port control register 1 LCDBPCTL1 00Ch LCD_B charge pump control register LCDBCTL0 012h LCD_B interrupt vector word LCDBIV 01Eh LCD_B memory 1 LCDM1 020h LCD_B memory 2 LCDM2 021h LCD_B memory 14 LCDM14 02Dh LCD_B blinking memory 1 LCDBM1 040h LCD_B blinking memory 2 LCDBM2 041h LCDBM14 04Dh ... ... LCD_B blinking memory 14 38 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 47. Radio Interface Registers (Base Address: 0F00h) REGISTER DESCRIPTION REGISTER OFFSET Radio interface control register 0 RF1AIFCTL0 00h Radio interface control register 1 RF1AIFCTL1 02h Radio interface error flag register RF1AIFERR 06h Radio interface error vector word RF1AIFERRV 0Ch Radio interface interrupt vector word RF1AIFIV 0Eh Radio instruction word register RF1AINSTRW 10h Radio instruction word register, 1-byte auto-read RF1AINSTR1W 12h Radio instruction word register, 2-byte auto-read RF1AINSTR2W 14h Radio data in register RF1ADINW 16h Radio status word register RF1ASTATW 20h Radio status word register, 1-byte auto-read RF1ASTAT1W 22h Radio status word register, 2-byte auto-read RF1AISTAT2W 24h Radio data out register RF1ADOUTW 28h Radio data out register, 1-byte auto-read RF1ADOUT1W 2Ah Radio data out register, 2-byte auto-read RF1ADOUT2W 2Ch Radio core signal input register RF1AIN 30h Radio core interrupt flag register RF1AIFG 32h Radio core interrupt edge select register RF1AIES 34h Radio core interrupt enable register RF1AIE 36h Radio core interrupt vector word RF1AIV 38h Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 39 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) -0.3 V to 4.1 V Voltage applied at DVCC and AVCC pins to VSS -0.3 V to (VCC + 0.3 V), 4.1 V Max Voltage applied to any pin (excluding VCORE, RF_P, RF_N, and R_BIAS) (2) Voltage applied to VCORE, RF_P, RF_N, and R_BIAS (2) -0.3 V to 2.0 V Input RF level at pins RF_P and RF_N 10 dBm 2 mA Diode current at any device terminal Storage temperature range (3), Tstg -55C to 150C Maximum junction temperature, TJ 95C (1) (2) (3) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages referenced to VSS. Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels. Thermal Packaging Characteristics CC430F51xx JA Junction to ambient thermal resistance, still air Low-K board 48 QFN (RGZ) 98C/W High-K board 48 QFN (RGZ) 28C/W Low-K board 64 QFN (RGC) 83C/W High-K board 64 QFN (RGC) 26C/W Thermal Packaging Characteristics CC430F61xx JA Junction to ambient thermal resistance, still air Recommended Operating Conditions MIN NOM MAX UNIT Supply voltage range applied at all DVCC and AVCC pins (1) during program execution and flash programming with PMM default settings. Radio is not operational with PMMCOREVx = 0, 1. (2) PMMCOREVx = 0 (default after POR) 1.8 3.6 V PMMCOREVx = 1 2.0 3.6 V Supply voltage range applied at all DVCC and AVCC pins (1) during program execution, flash programming and radio operation with PMM default settings. (2) PMMCOREVx = 2 2.2 3.6 V VCC PMMCOREVx = 3 2.4 3.6 V VCC Supply voltage range applied at all DVCC and AVCC pins (1) during program execution, flash programming and radio operation with PMMCOREVx = 2, high-side SVS level lowered (SVSHRVLx=SVSHRRRLx=1) or high-side SVS disabled (SVSHE=0). (3) (2) PMMCOREVx = 2, SVSHRVLx = SVSHRRRLx = 1 or SVSHE = 0 2.0 3.6 V VSS Supply voltage applied at the exposed die attach VSS and AVSS pin TA Operating free-air temperature -40 TJ Operating junction temperature -40 CVCORE Recommended capacitor at VCORE CDVCC/ CVCORE Capacitor ratio of capacitor at DVCC to capacitor at VCORE VCC fSYSTEM (1) (2) (3) (4) 40 Processor (MCLK) frequency (4) (see Figure 2) 0 V 85 85 470 C C nF 10 PMMCOREVx = 0 (default condition) 0 8 MHz PMMCOREVx = 1 0 12 MHz PMMCOREVx = 2 0 16 MHz PMMCOREVx = 3 0 20 MHz It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be tolerated during power up and operation. Modules may have a different supply voltage range specification. See the specification of the respective module in this data sheet. Lowering the high-side SVS level or disabling the high-side SVS might cause the LDO to operate out of regulation but the core voltage will still stay within it's limits and is still supervised by the low-side SVS ensuring reliable operation. Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Recommended Operating Conditions (continued) MIN PINT PIO I/O power dissipation of I/O pins powered by DVCC PMAX Maximum allowed power dissipation, PMAX > PIO + PINT NOM MAX UNIT VCC x I(DVCC) W (VCC - VIOH) x IIOH + VIOL x IIOL W (TJ - TA) / JA W Internal power dissipation System Frequency - MHz 20 3 16 2 2, 3 1 1, 2 1, 2, 3 0, 1 0, 1, 2 0, 1, 2, 3 12 8 0 0 1.8 2.0 2.2 2.4 3.6 Supply Voltage - V The numbers within the fields denote the supported PMMCOREVx settings. Figure 2. Maximum System Frequency Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 41 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Electrical Characteristics Active Mode Supply Current Into VCC Excluding External Current over recommended operating free-air temperature (unless otherwise noted) (1) (2) (3) FREQUENCY (fDCO = fMCLK = fSMCLK) PARAMETER IAM, IAM, (1) (2) (3) (4) (5) Flash RAM (4) (5) EXECUTION MEMORY Flash RAM VCC PMMCOREVx 3.0 V 3.0 V 1 MHz 8 MHz 12 MHz TYP MAX 1.55 2.30 2.65 1.75 16 MHz TYP MAX TYP MAX 0 0.23 0.26 1.35 1.60 TYP MAX 1 0.25 0.28 2 0.27 0.30 2.60 3.45 3.90 3 0.28 0.32 1.85 0 0.18 0.20 0.95 2.75 3.65 1 0.20 0.22 1.10 1.60 2 0.21 0.24 1.20 1.80 2.40 3 0.22 0.25 1.30 1.90 2.50 20 MHz TYP UNIT MAX mA 4.55 5.10 1.10 1.85 mA 2.70 3.10 3.60 All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current. The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load capacitance are chosen to closely match the required 12.5 pF. Characterized with program executing typical data processing. fACLK = 32786 Hz, fDCO = fMCLK = fSMCLK at specified frequency. XTS = CPUOFF = SCG0 = SCG1 = OSCOFF= SMCLKOFF = 0. Active mode supply current when program executes in flash at a nominal supply voltage of 3.0 V. Active mode supply current when program executes in RAM at a nominal supply voltage of 3.0 V. Typical Characteristics - Active Mode Supply Currents Active Mode Supply Current vs MCLK Frequency IAM - Active Mode Supply Current - mA 5 V CC = 3.0 V PMMVCOREx=3 4 3 PMMVCOREx=2 2 PMMVCOREx=1 1 PMMVCOREx=0 0 0 5 10 15 20 MCLK Frequency - MHz Figure 3. 42 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Low-Power Mode Supply Currents (Into VCC) Excluding External Current over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) (2) Temperature (TA) PARAMETER VCC PMMCOREVx -40C TYP ILPM0,1MHz Low-power mode 0 (3) (4) ILPM2 Low-power mode 2 (5) (4) ILPM3,XT1LF ILPM3,VLO ILPM4 (1) (2) (3) (4) (5) (6) (7) (8) Low-power mode 3, crystal mode (6) (4) Low-power mode 3, VLO mode (7) (4) Low-power mode 4 (8) MAX TYP 60C MAX TYP 85C MAX TYP UNIT MAX 2.2 V 0 80 100 80 100 80 100 80 100 3.0 V 3 90 110 90 110 90 110 90 110 2.2 V 0 6.5 11 6.5 11 6.5 11 6.5 11 3.0 V 3 7.5 12 7.5 12 7.5 12 7.5 12 0 1.8 2.0 2.6 3.0 4.0 4.4 5.9 1 1.9 2.1 3.2 4.8 2 2.0 2.2 3.4 5.1 3 2.0 2.2 2.9 3.5 4.8 5.3 7.4 0 0.9 1.1 2.3 2.1 3.7 3.5 5.6 1 1.0 1.2 2.3 3.9 2 1.1 1.3 2.5 4.2 3 1.1 1.3 2.6 2.6 4.5 4.4 7.1 0 0.8 1.0 2.2 2.0 3.6 3.4 5.5 1 0.9 1.1 2.2 3.8 2 1.0 1.2 2.4 4.1 3 1.0 1.2 3.0 V 3.0 V (4) 25C 3.0 V 2.5 2.5 4.4 4.3 A A A A A 7.0 All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current. The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load capacitance are chosen to closely match the required 12.5 pF. Current for watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0). CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz Current for brownout, high side supervisor (SVSH) normal mode included. Low side supervisor and monitors disabled (SVSL, SVML). High side monitor disabled (SVMH). RAM retention enabled. Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0). CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 0 MHz; DCO setting = 1 MHz operation, DCO bias generator enabled. Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0). CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz Current for watchdog timer and RTC clocked by ACLK included. ACLK = VLO. CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = fVLO, fMCLK = fSMCLK = fDCO = 0 MHz CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 43 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Typical Characteristics - Low-Power Mode Supply Currents LPM3 Supply Current vs Temperature LPM4 Supply Current vs Temperature 5 5 V DD = 3.0 V ILPM4 - LPM4 Supply Current - uA ILPM3,XT1LF - LPM3 Supply Current - uA V CC = 3.0 V 4 3 PMMCOREVx = 3 2 PMMCOREVx = 0 1 4 3 2 PMMCOREVx = 3 1 PMMCOREVx = 0 0 -40 -20 0 20 40 60 TA - Free-Air Tem perature - C Figure 4. 44 Submit Documentation Feedback 80 0 -40 -20 0 20 40 60 80 TA - Free-Air Tem perature - C Figure 5. Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Low-Power Mode with LCD Supply Currents (Into VCC) Excluding External Current over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) (2) Temperature (TA) PARAMETER VCC PMMCOREVx -40C TYP ILPM3 LCD, ext. bias ILPM3 LCD, int. bias Low-power mode 3 (LPM3) current, LCD 4-mux mode, external biasing (3) (4) Low-power mode 3 (LPM3) current, LCD 4-mux mode, internal biasing, charge pump disabled (3) (5) 3.0 V 3.0 V 2.2 V ILPM3 LCD,CP (1) (2) (3) (4) (5) (6) Low-power mode 3 (LPM3) current, LCD 4-mux mode, internal biasing, charge pump enabled (3) (6) 3.0 V MAX 25C TYP 60C MAX TYP MAX 85C TYP 0 2.2 2.4 3.5 4.9 1 2.3 2.5 3.7 5.3 2 2.4 2.6 3.9 5.6 3 2.4 2.6 4.0 5.8 0 3.1 3.3 4.3 5.8 1 3.2 3.4 4.5 6.2 2 3.3 3.5 4.7 6.5 3 3.3 3.5 4.8 6.7 0 4.0 1 4.1 2 4.2 0 4.2 1 4.3 2 4.5 3 4.5 4.0 4.3 UNIT MAX A 7.4 A 8.9 A All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current. The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load capacitance are chosen to closely match the required 12.5 pF. Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0). CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz Current for brownout, high side supervisor (SVSH) normal mode included. Low side supervisor and monitors disabled (SVSL, SVML). High side monitor disabled (SVMH). RAM retention enabled. LCDMx = 11 (4-mux mode), LCDREXT=1, LCDEXTBIAS=1 (external biasing), LCD2B=0 (1/3 bias), LCDCPEN=0 (charge pump disabled), LCDSSEL=0, LCDPREx=101, LCDDIVx=00011 (fLCD = 32768 Hz/32/4 = 256 Hz) Current through external resistors not included (voltage levels are supplied by test equipment). Even segments S0, S2,...=0, odd segments S1, S3,...=1. No LCD panel load. LCDMx = 11 (4-mux mode), LCDREXT=0, LCDEXTBIAS=0 (internal biasing), LCD2B=0 (1/3 bias), LCDCPEN=0 (charge pump disabled), LCDSSEL=0, LCDPREx=101, LCDDIVx=00011 (fLCD = 32768 Hz/32/4 = 256 Hz) Even segments S0, S2,...=0, odd segments S1, S3,...=1. No LCD panel load. LCDMx = 11 (4-mux mode), LCDREXT=0, LCDEXTBIAS=0 (internal biasing), LCD2B=0 (1/3 bias), LCDCPEN=1 (charge pump enabled), VLCDx=1000 (VLCD= 3 V typ.), LCDSSEL=0, LCDPREx=101, LCDDIVx=00011 (fLCD = 32768 Hz/32/4 = 256 Hz) Even segments S0, S2,...=0, odd segments S1, S3,...=1. No LCD panel load. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 45 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Digital Inputs over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VIT+ Positive-going input threshold voltage VIT- Negative-going input threshold voltage Vhys Input voltage hysteresis (VIT+ - VIT-) RPull Pullup/pulldown resistor For pullup: VIN = VSS For pulldown: VIN = VCC CI Input capacitance VIN = VSS or VCC Ilkg(Px.x) High-impedance leakage current t(int) External interrupt timing (External trigger pulse width to set interrupt flag) (3) (1) (2) (3) 46 VCC MIN 1.8 V 0.80 1.40 3V 1.50 2.10 1.8 V 0.45 1.00 3V 0.75 1.65 1.8 V 0.3 0.8 3V 0.4 1.0 20 TYP 35 MAX 1.8 V/3 V Ports with interrupt capability (see block diagram and terminal function descriptions). 1.8 V/3 V 20 V V V 50 k 50 nA 5 (1) (2) UNIT pF ns The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted. The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup/pulldown resistor is disabled. An external signal sets the interrupt flag every time the minimum interrupt pulse width t(int) is met. It may be set by trigger signals shorter than t(int). Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Digital Outputs over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS I(OHmax) = -1 mA, PxDS.y = 0 High-level output voltage, Reduced Drive Strength (1) VOH VCC (2) I(OHmax) = -3 mA, PxDS.y = 0 (3) I(OHmax) = -2 mA, PxDS.y = 0 (2) I(OHmax) = -6 mA, PxDS.y = 0 (3) I(OLmax) = 1 mA, PxDS.y = 0 Low-level output voltage, Reduced Drive Strength (1) VOL I(OLmax) = 3 mA, PxDS.y = 0 (3) I(OLmax) = 2 mA, PxDS.y = 0 (2) I(OHmax) = -3 mA, PxDS.y = 1 (2) High-level output voltage, Full Drive Strength I(OHmax) = -10 mA, PxDS.y = 1 (3) I(OHmax) = -5 mA, PxDS.y = 1 I(OLmax) = 3 mA, PxDS.y = 1 (2) Low-level output voltage, Full Drive Strength I(OLmax) = 10 mA, PxDS.y = 1 (3) I(OLmax) = 5 mA, PxDS.y = 1 Port output frequency (with load) fPx.y fPort_CLK (1) (2) (3) (4) (5) Clock output frequency CL = 20 pF, RL CL = 20 pF (5) (4) (5) VCC - 0.25 VCC VCC - 0.60 VCC VCC - 0.25 VCC VCC - 0.60 VCC VSS VSS + 0.60 VSS VSS + 0.25 3.0 V UNIT V V VSS VSS + 0.60 1.8 V 3V VCC - 0.25 VCC VCC - 0.60 VCC VCC - 0.25 VCC VCC - 0.60 VCC V VSS VSS + 0.25 1.8 V VSS VSS + 0.60 (2) I(OLmax) = 15 mA, PxDS.y = 1 (3) MAX VSS VSS + 0.25 1.8 V (2) I(OHmax) = -15 mA, PxDS.y = 1 (3) VOL 3.0 V (2) I(OLmax) = 6 mA, PxDS.y = 0 (3) VOH 1.8 V MIN VSS VSS + 0.25 3V V VSS VSS + 0.60 VCC = 1.8 V PMMCOREVx = 0 16 VCC = 3 V PMMCOREVx = 2 25 VCC = 1.8 V PMMCOREVx = 0 16 VCC = 3 V PMMCOREVx = 2 25 MHz MHz Selecting reduced drive strength may reduce EMI. The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed 48 mA to hold the maximum voltage drop specified. The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed 100 mA to hold the maximum voltage drop specified. A resistive divider with 2 x R1 between VCC and VSS is used as load. The output is connected to the center tap of the divider. For full drive strength, R1 = 550 . For reduced drive strength, R1 = 1.6 k. CL = 20 pF is connected to the output to VSS. The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 47 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Typical Characteristics - Outputs, Reduced Drive Strength (PxDS.y = 0) TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE 8 V CC = 3.0 V P4.3 IOL - Typical Low-Level Output Current - mA IOL - Typical Low-Level Output Current - mA 25 TA = 25C 20 TA = 85C 15 10 5 0 V CC = 1.8 V V DD = 5.5 V P4.3 7 6 TA = 85C 5 4 3 2 1 0 0 0.5 1 1.5 2 2.5 3 3.5 0 V OL - Low -Level Output Voltage - V 0.5 1.5 2 Figure 7. TYPICAL HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE TYPICAL HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE 0 0 V CC = 3.0 V V CC = 3.0 V P4.3 IOH - Typical High-Level Output Current - mA IOH - Typical High-Level Output Current - mA 1 V OL - Low -Level Output Voltage - V Figure 6. -5 -10 -15 TA = 85C -20 TA = 25C -25 V CC = 1.8 V V DD = 5.5 V P4.3 -1 -2 -3 -4 -5 TA = 85C -6 TA = 25C -7 -8 0 0.5 1 1.5 2 2.5 3 V OH - High-Level Output Voltage - V Figure 8. 48 TA = 25C Submit Documentation Feedback 3.5 0 0.5 1 1.5 2 V OH - High-Level Output Voltage - V Figure 9. Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Typical Characteristics - Outputs, Full Drive Strength (PxDS.y = 1) TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE TYPICAL LOW-LEVEL OUTPUT CURRENT vs LOW-LEVEL OUTPUT VOLTAGE 25 V CC = 3.0 V P4.3 TA = 25C IOL - Typical Low-Level Output Current - mA IOL - Typical Low-Level Output Current - mA 60 50 TA = 85C 40 30 20 10 0 V CC = 1.8 V V DD = 5.5 V P4.3 TA = 25C 20 TA = 85C 15 10 5 0 0 0.5 1 1.5 2 2.5 3 3.5 0 V OL - Low -Level Output Voltage - V 0.5 1.5 2 V OL - Low -Level Output Voltage - V Figure 10. Figure 11. TYPICAL HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE TYPICAL HIGH-LEVEL OUTPUT CURRENT vs HIGH-LEVEL OUTPUT VOLTAGE 0 0 V CC = 3.0 V V CC = 3.0 V P4.3 IOH - Typical High-Level Output Current - mA IOH - Typical High-Level Output Current - mA 1 -10 -20 -30 -40 TA = 85C -50 TA = 25C -60 V CC = 1.8 V V DD = 5.5 V P4.3 -5 -10 -15 TA = 85C -20 TA = 25C -25 0 0.5 1 1.5 2 2.5 3 V OH - High-Level Output Voltage - V Figure 12. Copyright (c) 2009-2011, Texas Instruments Incorporated 3.5 0 0.5 1 1.5 2 V OH - High-Level Output Voltage - V Figure 13. Submit Documentation Feedback 49 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Crystal Oscillator, XT1, Low-Frequency Mode (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 1, TA = 25C IDVCC.LF Differential XT1 oscillator crystal current consumption from lowest drive setting, LF mode fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 2, TA = 25C fXT1,LF,SW XT1 oscillator logic-level square-wave input frequency, LF mode XTS = 0, XT1BYPASS = 1 (2) (3) 10 Integrated effective load capacitance, LF mode (5) fFault,LF tSTART,LF (1) (2) (3) (4) (5) (6) (7) (8) 50 32.768 XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 0, fXT1,LF = 32768 Hz, CL,eff = 6 pF 210 XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 1, fXT1,LF = 32768 Hz, CL,eff = 12 pF 300 Hz 50 kHz k XTS = 0, XCAPx = 0 (6) CL,eff UNIT A 0.170 32768 XTS = 0, XT1BYPASS = 0 Oscillation allowance for LF crystals (4) 3.0 V 0.290 XT1 oscillator crystal frequency, LF mode MAX 0.075 fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 3, TA = 25C fXT1,LF0 OALF TYP 2 XTS = 0, XCAPx = 1 5.5 XTS = 0, XCAPx = 2 8.5 XTS = 0, XCAPx = 3 12.0 pF Duty cycle, LF mode XTS = 0, Measured at ACLK, fXT1,LF = 32768 Hz 30 70 % Oscillator fault frequency, LF mode (7) XTS = 0 (8) 10 10000 Hz Startup time, LF mode fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 0, TA = 25C, CL,eff = 6 pF fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 3, TA = 25C, CL,eff = 12 pF 1000 3.0 V ms 500 To improve EMI on the XT1 oscillator, the following guidelines should be observed. (a) Keep the trace between the device and the crystal as short as possible. (b) Design a good ground plane around the oscillator pins. (c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT. (d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins. (e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins. (f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins. When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in the Schmitt-trigger Inputs section of this datasheet. Maximum frequency of operation of the entire device cannot be exceeded. Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following guidelines, but should be evaluated based on the actual crystal selected for the application: (a) For XT1DRIVEx = 0, CL,eff 6 pF (b) For XT1DRIVEx = 1, 6 pF CL,eff 9 pF (c) For XT1DRIVEx = 2, 6 pF CL,eff 10 pF (d) For XT1DRIVEx = 3, CL,eff 6 pF Includes parasitic bond and package capacitance (approximately 2 pF per pin). Because the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal. Requires external capacitors at both terminals. Values are specified by crystal manufacturers. Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies in between might set the flag. Measured with logic-level input frequency but also applies to operation with crystals. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Internal Very-Low-Power Low-Frequency Oscillator (VLO) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC fVLO VLO frequency Measured at ACLK 1.8 V to 3.6 V dfVLO/dT VLO frequency temperature drift Measured at ACLK (1) 1.8 V to 3.6 V Measured at ACLK (2) 1.8 V to 3.6 V Measured at ACLK 1.8 V to 3.6 V dfVLO/dVCC VLO frequency supply voltage drift Duty cycle (1) (2) MIN TYP MAX 6 9.4 14 0.5 kHz %/C 4 40 UNIT %/V 50 60 TYP MAX % Calculated using the box method: (MAX(-40 to 85C) - MIN(-40 to 85C)) / MIN(-40 to 85C) / (85C - (-40C)) Calculated using the box method: (MAX(1.8 to 3.6 V) - MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V - 1.8 V) Internal Reference, Low-Frequency Oscillator (REFO) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC MIN IREFO REFO oscillator current consumption TA = 25C 1.8 V to 3.6 V 3 fREFO REFO frequency calibrated Measured at ACLK 1.8 V to 3.6 V 32768 Full temperature range 1.8 V to 3.6 V REFO absolute tolerance calibrated TA = 25C A Hz 3.5 1.5 3V UNIT % % dfREFO/dT REFO frequency temperature drift Measured at ACLK (1) 1.8 V to 3.6 V 0.01 %/C dfREFO/dVCC REFO frequency supply voltage drift Measured at ACLK (2) 1.8 V to 3.6 V 1.0 %/V Duty cycle Measured at ACLK 1.8 V to 3.6 V REFO startup time 40%/60% duty cycle 1.8 V to 3.6 V tSTART (1) (2) 40 50 60 25 % s Calculated using the box method: (MAX(-40 to 85C) - MIN(-40 to 85C)) / MIN(-40 to 85C) / (85C - (-40C)) Calculated using the box method: (MAX(1.8 to 3.6 V) - MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V - 1.8 V) Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 51 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com DCO Frequency over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT fDCO(0,0) DCO frequency (0, 0) DCORSELx = 0, DCOx = 0, MODx = 0 0.07 0.20 MHz fDCO(0,31) DCO frequency (0, 31) DCORSELx = 0, DCOx = 31, MODx = 0 0.70 1.70 MHz fDCO(1,0) DCO frequency (1, 0) DCORSELx = 1, DCOx = 0, MODx = 0 0.15 0.36 MHz fDCO(1,31) DCO frequency (1, 31) DCORSELx = 1, DCOx = 31, MODx = 0 1.47 3.45 MHz fDCO(2,0) DCO frequency (2, 0) DCORSELx = 2, DCOx = 0, MODx = 0 0.32 0.75 MHz fDCO(2,31) DCO frequency (2, 31) DCORSELx = 2, DCOx = 31, MODx = 0 3.17 7.38 MHz fDCO(3,0) DCO frequency (3, 0) DCORSELx = 3, DCOx = 0, MODx = 0 0.64 1.51 MHz fDCO(3,31) DCO frequency (3, 31) DCORSELx = 3, DCOx = 31, MODx = 0 6.07 14.0 MHz fDCO(4,0) DCO frequency (4, 0) DCORSELx = 4, DCOx = 0, MODx = 0 1.3 3.2 MHz fDCO(4,31) DCO frequency (4, 31) DCORSELx = 4, DCOx = 31, MODx = 0 12.3 28.2 MHz fDCO(5,0) DCO frequency (5, 0) DCORSELx = 5, DCOx = 0, MODx = 0 2.5 6.0 MHz fDCO(5,31) DCO frequency (5, 31) DCORSELx = 5, DCOx = 31, MODx = 0 23.7 54.1 MHz fDCO(6,0) DCO frequency (6, 0) DCORSELx = 6, DCOx = 0, MODx = 0 4.6 10.7 MHz fDCO(6,31) DCO frequency (6, 31) DCORSELx = 6, DCOx = 31, MODx = 0 39.0 88.0 MHz fDCO(7,0) DCO frequency (7, 0) DCORSELx = 7, DCOx = 0, MODx = 0 8.5 19.6 MHz fDCO(7,31) DCO frequency (7, 31) DCORSELx = 7, DCOx = 31, MODx = 0 60 135 MHz SDCORSEL Frequency step between range DCORSEL and DCORSEL + 1 SRSEL = fDCO(DCORSEL+1,DCO)/fDCO(DCORSEL,DCO) 1.2 2.3 ratio SDCO Frequency step between tap DCO and DCO + 1 SDCO = fDCO(DCORSEL,DCO+1)/fDCO(DCORSEL,DCO) 1.02 1.12 ratio Duty cycle Measured at SMCLK dfDCO/dT DCO frequency temperature drift fDCO = 1 MHz 0.1 %/C dfDCO/dVCC DCO frequency voltage drift fDCO = 1 MHz 1.9 %/V 40 50 60 % Typical DCO Frequency, VCC = 3.0 V, TA = 25C 100 fDCO - MHz 10 DCOx = 31 1 0.1 DCOx = 0 0 1 2 3 4 5 6 7 DCORSEL Figure 14. Typical DCO frequency 52 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com PMM, Brown-Out Reset (BOR) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS V(DVCC_BOR_IT-) BORH on voltage, DVCC falling level | dDVCC/dt | < 3 V/s V(DVCC_BOR_IT+) BORH off voltage, DVCC rising level | dDVCC/dt | < 3 V/s V(DVCC_BOR_hys) BORH hysteresis tRESET Pulse length required at RST/NMI pin to accept a reset MIN 0.80 TYP 1.30 60 MAX UNIT 1.45 V 1.50 V 250 mV s 2 PMM, Core Voltage over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VCORE3(AM) Core voltage, active mode, PMMCOREV = 3 2.4 V DVCC 3.6 V 1.90 V VCORE2(AM) Core voltage, active mode, PMMCOREV = 2 2.2 V DVCC 3.6 V 1.80 V VCORE1(AM) Core voltage, active mode, PMMCOREV = 1 2.0 V DVCC 3.6 V 1.60 V VCORE0(AM) Core voltage, active mode, PMMCOREV = 0 1.8 V DVCC 3.6 V 1.40 V VCORE3(LPM) Core voltage, low-current 2.4 V DVCC 3.6 V mode, PMMCOREV = 3 1.94 V VCORE2(LPM) Core voltage, low-current 2.2 V DVCC 3.6 V mode, PMMCOREV = 2 1.84 V VCORE1(LPM) Core voltage, low-current 2.0 V DVCC 3.6 V mode, PMMCOREV = 1 1.64 V VCORE0(LPM) Core voltage, low-current 1.8 V DVCC 3.6 V mode, PMMCOREV = 0 1.44 V Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 53 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com PMM, SVS High Side over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN SVSHE = 0, DVCC = 3.6 V I(SVSH) SVS current consumption V(SVSH_IT+) tpd(SVSH) t(SVSH) 54 SVSH off voltage level (1) SVSH propagation delay SVSH on/off delay time dVDVCC/dt (1) SVSH on voltage level (1) DVCC rise time MAX 0 SVSHE = 1, DVCC = 3.6 V, SVSHFP = 0 A 1.5 SVSHE = 1, SVSHRVL = 0 1.53 1.60 1.67 SVSHE = 1, SVSHRVL = 1 1.73 1.80 1.87 SVSHE = 1, SVSHRVL = 2 1.93 2.00 2.07 SVSHE = 1, SVSHRVL = 3 2.03 2.10 2.17 SVSHE = 1, SVSMHRRL = 0 1.60 1.70 1.80 SVSHE = 1, SVSMHRRL = 1 1.80 1.90 2.00 SVSHE = 1, SVSMHRRL = 2 2.00 2.10 2.20 SVSHE = 1, SVSMHRRL = 3 2.10 2.20 2.30 SVSHE = 1, SVSMHRRL = 4 2.25 2.35 2.50 SVSHE = 1, SVSMHRRL = 5 2.52 2.65 2.78 SVSHE = 1, SVSMHRRL = 6 2.85 3.00 3.15 SVSHE = 1, SVSMHRRL = 7 2.85 3.00 3.15 SVSHE = 1, dVDVCC/dt = 10 mV/s, SVSHFP = 1 2.5 SVSHE = 1, dVDVCC/dt = 1 mV/s, SVSHFP = 0 20 UNIT nA 200 SVSHE = 1, DVCC = 3.6 V, SVSHFP = 1 V(SVSH_IT-) TYP V V s SVSHE = 0 1, dVDVCC/dt = 10 mV/s, SVSHFP = 1 12.5 SVSHE = 0 1, dVDVCC/dt = 1 mV/s, SVSHFP = 0 100 s 0 1000 V/s The SVSH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage Supervisor chapter in the CC430 Family User's Guide (SLAU259) on recommended settings and usage. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com PMM, SVM High Side over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN SVMHE = 0, DVCC = 3.6 V I(SVMH) SVMH current consumption V(SVMH) SVMH on/off voltage level t(SVMH) (1) SVMH propagation delay SVMH on/off delay time UNIT nA 200 A 1.5 SVMHE = 1, SVSMHRRL = 0 1.60 1.70 1.80 SVMHE = 1, SVSMHRRL = 1 1.80 1.90 2.00 SVMHE = 1, SVSMHRRL = 2 2.00 2.10 2.20 SVMHE = 1, SVSMHRRL = 3 2.10 2.20 2.30 SVMHE = 1, SVSMHRRL = 4 2.25 2.35 2.50 SVMHE = 1, SVSMHRRL = 5 2.52 2.65 2.78 SVMHE = 1, SVSMHRRL = 6 2.85 3.00 3.15 SVMHE = 1, SVSMHRRL = 7 2.85 3.00 3.15 SVMHE = 1, SVMHOVPE = 1 tpd(SVMH) MAX 0 SVMHE= 1, DVCC = 3.6 V, SVMHFP = 0 SVMHE = 1, DVCC = 3.6 V, SVMHFP = 1 (1) TYP V 3.75 SVMHE = 1, dVDVCC/dt = 10 mV/s, SVMHFP = 1 2.5 SVMHE = 1, dVDVCC/dt = 1 mV/s, SVMHFP = 0 20 s SVMHE = 0 1, dVDVCC/dt = 10 mV/s, SVMHFP = 1 12.5 SVMHE = 0 1, dVDVCC/dt = 1 mV/s, SVMHFP = 0 100 s The SVMH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage Supervisor chapter in the CC430 Family User's Guide (SLAU259) on recommended settings and usage. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 55 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com PMM, SVS Low Side over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP SVSLE = 0, PMMCOREV = 2 I(SVSL) SVSL current consumption tpd(SVSL) t(SVSL) SVSL propagation delay SVSL on/off delay time MAX UNIT 0 nA SVSLE = 1, PMMCOREV = 2, SVSLFP = 0 200 nA SVSLE = 1, PMMCOREV = 2, SVSLFP = 1 1.5 A SVSLE = 1, dVCORE/dt = 10 mV/s, SVSLFP = 1 2.5 SVSLE = 1, dVCORE/dt = 1 mV/s, SVSLFP = 0 20 s SVSLE = 0 1, dVCORE/dt = 10 mV/s, SVSLFP = 1 12.5 SVSLE = 0 1, dVCORE/dt = 1 mV/s, SVSLFP = 0 100 s PMM, SVM Low Side over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP SVMLE = 0, PMMCOREV = 2 I(SVML) SVML current consumption tpd(SVML) t(SVML) SVML propagation delay SVML on/off delay time MAX UNIT 0 nA SVMLE= 1, PMMCOREV = 2, SVMLFP = 0 200 nA SVMLE= 1, PMMCOREV = 2, SVMLFP = 1 1.5 A SVMLE = 1, dVCORE/dt = 10 mV/s, SVMLFP = 1 2.5 SVMLE = 1, dVCORE/dt = 1 mV/s, SVMLFP = 0 20 s SVMLE = 0 1, dVCORE/dt = 10 mV/s, SVMLFP = 1 12.5 SVMLE = 0 1, dVCORE/dt = 1 mV/s, SVMLFP = 0 100 s Wake-up from Low Power Modes and Reset over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER tWAKE-UPFAST tWAKE-UPSLOW tWAKE-UPRESET (1) (2) (3) 56 Wake-up time from LPM2, LPM3, or LPM4 to active mode (1) TEST CONDITIONS PMMCOREV = SVSMLRRL = n, where n = 0, 1, 2, or 3, SVSLFP = 1 MIN 5 fMCLK < 4.0 MHz 6 Wake-up time from PMMCOREV = SVSMLRRL = n, where n = 0, 1, 2, or 3, LPM2, LPM3 or LPM4 to SVSLFP = 0 active mode (2) Wake-up time from RST or BOR event to active mode (3) TYP MAX UNIT fMCLK 4.0 MHz s 150 165 s 2 3 ms This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance mode of the low side supervisor (SVSL) and low side monitor (SVML). Fastest wakeup times are possible with SVSLand SVML in full performance mode or disabled when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the CC430 Family User's Guide (SLAU259). This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance mode of the low side supervisor (SVSL) and low side monitor (SVML). In this case, the SVSLand SVML are in normal mode (low current) mode when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the CC430 Family User's Guide (SLAU259). This value represents the time from the wakeup event to the reset vector execution. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Timer_A over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC fTA Timer_A input clock frequency Internal: SMCLK, ACLK External: TACLK Duty cycle = 50% 10% 1.8 V/ 3.0 V tTA,cap Timer_A capture timing All capture inputs. Minimum pulse width required for capture. 1.8 V/ 3.0 V Copyright (c) 2009-2011, Texas Instruments Incorporated MIN TYP MAX UNIT 25 MHz 20 Submit Documentation Feedback ns 57 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com USCI (UART Mode) Recommended Operating Conditions PARAMETER CONDITIONS VCC MIN TYP Internal: SMCLK, ACLK External: UCLK Duty cycle = 50% 10% fUSCI USCI input clock frequency fBITCLK BITCLK clock frequency (equals baud rate in MBaud) MAX UNIT fSYSTEM MHz 1 MHz MAX UNIT USCI (UART Mode) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER UART receive deglitch time (1) t (1) TEST CONDITIONS VCC MIN 2.2 V 50 TYP 600 3V 50 600 ns Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are correctly recognized their width should exceed the maximum specification of the deglitch time. USCI (SPI Master Mode) Recommended Operating Conditions PARAMETER fUSCI CONDITIONS VCC MIN TYP Internal: SMCLK, ACLK Duty cycle = 50% 10% USCI input clock frequency MAX UNIT fSYSTEM MHz USCI (SPI Master Mode) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note (1), Figure 15 and Figure 16) PARAMETER TEST CONDITIONS PMMCOR EVx 0 tSU,MI SOMI input data setup time 3 0 tHD,MI SOMI input data hold time 3 0 tVALID,MO SIMO output data valid time (2) UCLK edge to SIMO valid, CL = 20 pF 3 0 tHD,MO SIMO output data hold time (3) CL = 20 pF 3 (1) (2) (3) 58 VCC MIN 1.8 V 55 3.0 V 38 2.4 V 30 3.0 V 25 1.8 V 0 3.0 V 0 2.4 V 0 3.0 V 0 TYP MAX UNIT ns ns ns ns 1.8 V 20 3.0 V 18 2.4 V 16 3.0 V 15 1.8 V -10 3.0 V -8 2.4 V -10 3.0 V -8 ns ns ns ns fUCxCLK = 1/2tLO/HI with tLO/HI max(tVALID,MO(USCI) + tSU,SI(Slave), tSU,MI(USCI) + tVALID,SO(Slave)). For the slave's parameters tSU,SI(Slave) and tVALID,SO(Slave) see the SPI parameters of the attached slave. Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams in Figure 15 and Figure 16. Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in Figure 15 and Figure 16. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com 1/fUCxCLK CKPL = 0 UCLK CKPL = 1 tLO/HI tLO/HI tSU,MI tHD,MI SOMI tHD,MO tVALID,MO SIMO Figure 15. SPI Master Mode, CKPH = 0 1/fUCxCLK CKPL = 0 UCLK CKPL = 1 tLO/HI tLO/HI tSU,MI tHD,MI SOMI tHD,MO tVALID,MO SIMO Figure 16. SPI Master Mode, CKPH = 1 Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 59 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com USCI (SPI Slave Mode) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note (1), Figure 17 and Figure 18) PARAMETER TEST CONDITIONS PMMCOR EVx 0 tSTE,LEAD STE lead time, STE low to clock 3 0 tSTE,LAG STE lag time, Last clock to STE high 3 0 tSTE,ACC STE access time, STE low to SOMI data out 3 0 STE disable time, STE high to SOMI high impedance tSTE,DIS 3 0 tSU,SI SIMO input data setup time 3 0 tHD,SI SIMO input data hold time 3 0 tVALID,SO SOMI output data valid time (2) UCLK edge to SOMI valid, CL = 20 pF 3 0 tHD,SO SOMI output data hold time (3) CL = 20 pF 3 (1) (2) (3) 60 VCC MIN 1.8 V 11 3.0 V 8 2.4 V 7 3.0 V 6 1.8 V 3 3.0 V 3 2.4 V 3 3.0 V 3 TYP MAX ns ns 1.8 V 66 3.0 V 50 2.4 V 36 3.0 V 30 1.8 V 30 3.0 V 23 2.4 V 16 3.0 V UNIT ns ns 13 1.8 V 5 3.0 V 5 2.4 V 2 3.0 V 2 1.8 V 5 3.0 V 5 2.4 V 5 3.0 V 5 ns ns ns ns 1.8 V 76 3.0 V 60 2.4 V 44 3.0 V 40 1.8 V 18 3.0 V 12 2.4 V 10 3.0 V 8 ns ns ns ns fUCxCLK = 1/2tLO/HI with tLO/HI max(tVALID,MO(Master) + tSU,SI(USCI), tSU,MI(Master) + tVALID,SO(USCI)). For the master's parameters tSU,MI(Master) and tVALID,MO(Master) see the SPI parameters of the attached master. Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams in Figure 15 and Figure 16. Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure 15 and Figure 16. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com tSTE,LEAD tSTE,LAG STE 1/fUCxCLK CKPL = 0 UCLK CKPL = 1 tLO/HI tSU,SI tLO/HI tHD,SI SIMO tHD,SO tVALID,SO tSTE,ACC tSTE,DIS SOMI Figure 17. SPI Slave Mode, CKPH = 0 tSTE,LAG tSTE,LEAD STE 1/fUCxCLK CKPL = 0 UCLK CKPL = 1 tLO/HI tLO/HI tHD,SI tSU,SI SIMO tSTE,ACC tHD,MO tVALID,SO tSTE,DIS SOMI Figure 18. SPI Slave Mode, CKPH = 1 Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 61 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com USCI (I2C Mode) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 19) PARAMETER TEST CONDITIONS VCC MIN TYP Internal: SMCLK, ACLK External: UCLK Duty cycle = 50% 10% MAX UNIT fSYSTEM MHz 400 kHz fUSCI USCI input clock frequency fSCL SCL clock frequency tHD,STA Hold time (repeated) START tSU,STA Setup time for a repeated START tHD,DAT Data hold time 2.2 V/3 V 0 ns tSU,DAT Data setup time 2.2 V/3 V 250 ns 2.2 V/3 V fSCL 100 kHz fSCL > 100 kHz fSCL 100 kHz fSCL > 100 kHz fSCL 100 kHz tSU,STO Setup time for STOP tSP Pulse width of spikes suppressed by input filter fSCL > 100 kHz tSU,STA tHD,STA 2.2 V/3 V 2.2 V/3 V 2.2 V/3 V 0 4.0 s 0.6 4.7 s 0.6 4.0 s 0.6 2.2 V 50 600 3V 50 600 tHD,STA ns tBUF SDA tLOW tHIGH tSP SCL tSU,DAT tSU,STO tHD,DAT Figure 19. I2C Mode Timing 62 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com LCD_B Recommended Operating Conditions PARAMETER CONDITIONS MIN NOM MAX UNIT VCC,LCD_B,CP en,3.6 Supply voltage range, LCDCPEN=1, 0000 < VLCDx 1111 (charge charge pump enabled, pump enabled, VLCD 3.6 V) VLCD 3.6 V 2.2 3.6 V VCC,LCD_B,CP en,3.3 Supply voltage range, LCDCPEN=1, 0000 < VLCDx 1100 (charge charge pump enabled, pump enabled, VLCD 3.3 V) VLCD 3.3 V 2.0 3.6 V VCC,LCD_B,int. bias Supply voltage range, internal biasing, LCDCPEN=0, VLCDEXT=0 charge pump disabled 2.4 3.6 V VCC,LCD_B,ext. Supply voltage range, external biasing, LCDCPEN=0, VLCDEXT=0 charge pump disabled 2.4 3.6 V VCC,LCD_B,VLCDEXT Supply voltage range, external LCD voltage, internal or external biasing, charge pump disabled LCDCPEN=0, VLCDEXT=1 2.0 3.6 V VLCDCAP/R33 External LCD voltage at LCDCAP/R33, internal or external biasing, charge pump disabled LCDCPEN=0, VLCDEXT=1 2.4 3.6 V CLCDCAP Capacitor on LCDCAP LCDCPEN=1, VLCDx > 0000 (charge pump when charge pump enabled) enabled 10 F fFrame LCD frame frequency range 100 Hz fACLK,in ACLK input frequency range 40 kHz CPanel Panel capacitance 100-Hz frame frequency 10000 pF VR33 Analog input voltage at R33 LCDCPEN=0, VLCDEXT=1 VCC+0.2 V VR23,1/3bias Analog input voltage at R23 LCDREXT=1, LCDEXTBIAS=1, LCD2B=0 VR03 + VR13 2/3*(VR33 -VR03) VR33 V VR13,1/3bias Analog input voltage at R13 with 1/3 biasing LCDREXT=1, LCDEXTBIAS=1, LCD2B=0 VR03 + VR03 1/3*(VR33 -VR03) VR23 V VR13,1/2bias Analog input voltage at R13 with 1/2 biasing LCDREXT=1, LCDEXTBIAS=1, LCD2B=1 VR03 + VR03 1/2*(VR33 -VR03) VR33 V VR03 Analog input voltage at R03 R0EXT=1 VSS VLCD-VR03 Voltage difference between VLCD and R03 LCDCPEN=0, R0EXT=1 2.4 VLCDREF/R13 External LCD reference voltage applied at LCDREF/R13 VLCDREFx = 01 0.8 bias fLCD = 2 x mux x fFRAME with mux= 1 (static), 2, 3, 4. 4.7 0 30 Copyright (c) 2009-2011, Texas Instruments Incorporated 4.7 32 2.4 V 1.2 VCC+0.2 V 1.5 V Submit Documentation Feedback 63 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com LCD_B Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER VLCD LCD voltage TEST CONDITIONS VCC MIN TYP MAX UNIT VLCDx=0000, VLCDEXT=0 2.4 V to 3.6 V VCC V LCDCPEN=1, VLCDx=0001 2.0 V to 3.6 V 2.54 V LCDCPEN=1, VLCDx=0010 2.0 V to 3.6 V 2.60 V LCDCPEN=1, VLCDx=0011 2.0 V to 3.6 V 2.66 V LCDCPEN=1, VLCDx=0100 2.0 V to 3.6 V 2.72 V LCDCPEN=1, VLCDx=0101 2.0 V to 3.6 V 2.78 V LCDCPEN=1, VLCDx=0110 2.0 V to 3.6 V 2.84 V LCDCPEN=1, VLCDx=0111 2.0 V to 3.6 V 2.90 V LCDCPEN=1, VLCDx=1000 2.0 V to 3.6 V 2.96 V LCDCPEN=1, VLCDx=1001 2.0 V to 3.6 V 3.02 V LCDCPEN=1, VLCDx=1010 2.0 V to 3.6 V 3.08 V LCDCPEN=1, VLCDx=1011 2.0 V to 3.6 V 3.14 V LCDCPEN=1, VLCDx=1100 2.0 V to 3.6 V 3.20 V LCDCPEN=1, VLCDx=1101 2.2 V to 3.6 V 3.26 V LCDCPEN=1, VLCDx=1110 2.2 V to 3.6 V 3.32 V LCDCPEN=1, VLCDx=1111 2.2 V to 3.6 V 3.38 3.6 V A ICC,Peak,CP Peak supply currents due to charge pump activities LCDCPEN=1, VLCDx=1111 2.2V 200 tLCD,CP,on Time to charge CLCD when discharge CLCDCAP=4.7F, LCDCPEN=01, VLCDx=1111 2.2V 100 ICP,Load Max. charge pump load current LCDCPEN=1, VLCDx=1111 2.2V RLCD,Seg LCD driver output impedance, segment lines LCDCPEN=1, VLCDx=1000, ILOAD=10A 2.2V 10 k RLCD,COM LCD driver output impedance, common lines LCDCPEN=1, VLCDx=1000, ILOAD=10A 2.2V 10 k 64 Submit Documentation Feedback 500 ms A 50 Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com 12-Bit ADC, Power Supply and Input Range Conditions over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) PARAMETER TEST CONDITIONS AVCC Analog supply voltage Full performance AVCC and DVCC are connected together, AVSS and DVSS are connected together, V(AVSS) = V(DVSS) = 0 V V(Ax) Analog input voltage range (2) All ADC12 analog input pins Ax IADC12_A Operating supply current into AVCC terminal (3) fADC12CLK = 5.0 MHz, ADC12ON = 1, REFON = 0, SHT0 = 0, SHT1 = 0, ADC12DIV = 0 CI Input capacitance Only one terminal Ax can be selected at one time RI Input MUX ON resistance 0 V VAx AVCC (1) (2) (3) VCC MIN TYP MAX UNIT 2.2 3.6 V 0 AVCC V 2.2 V 125 155 3V 150 220 2.2 V 20 25 pF 200 1900 10 A The leakage current is specified by the digital I/O input leakage. The analog input voltage range must be within the selected reference voltage range VR+ to VR- for valid conversion results. If the reference voltage is supplied by an external source or if the internal reference voltage is used and REFOUT = 1, then decoupling capacitors are required. See REF, External Reference and REF, Built-In Reference. The internal reference supply current is not included in current consumption parameter IADC12_A. 12-Bit ADC, Timing Parameters over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS VCC For specified performance of ADC12 linearity parameters using an external reference voltage or AVCC as reference. (1) fADC12CLK ADC conversion clock For specified performance of ADC12 linearity parameters using the internal reference. (2) 2.2 V/3 V For specified performance of ADC12 linearity parameters using the internal reference. (3) fADC12OSC Internal ADC12 oscillator (4) tCONVERT Conversion time tSample (1) (2) (3) (4) (5) (6) Sampling time MIN TYP MAX 0.45 4.8 5.0 0.45 2.4 4.0 0.45 2.4 2.7 4.8 5.4 ADC12DIV = 0, fADC12CLK = fADC12OSC 2.2 V/3 V 4.2 REFON = 0, Internal oscillator, fADC12OSC = 4.2 MHz to 5.4 MHz 2.2 V/3 V 2.4 MHz MHz 3.1 s External fADC12CLK from ACLK, MCLK or SMCLK, ADC12SSEL 0 RS = 400 , RI = 1000 , CI = 30 pF, = [RS + RI] x CI (6) UNIT (5) 2.2 V/3 V 1000 ns REFOUT = 0, external reference voltage: SREF2 = 0, SREF1 = 1, SREF0 = 0. AVCC as reference voltage: SREF2 = 0, SREF1 = 0, SREF0 = 0. The specified performance of the ADC12 linearity is ensured when using the ADC12OSC. For other clock sources, the specified performance of the ADC12 linearity is ensured with fADC12CLK maximum of 5.0 MHz. SREF2 = 0, SREF1 = 1, SREF0 = 0, ADC12SR = 0, REFOUT = 1 SREF2 = 0, SREF1 = 1, SREF0 = 0, ADC12SR = 0, REFOUT = 0. The specified performance of the ADC12 linearity is ensured when using the ADC12OSC divided by 2. The ADC12OSC is sourced directly from MODOSC inside the UCS. 13 x ADC12DIV x 1/fADC12CLK Approximately ten Tau () are needed to get an error of less than 0.5 LSB: tSample = ln(2n+1) x (RS + RI) x CI + 800 ns, where n = ADC resolution = 12, RS = external source resistance Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 65 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com 12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference Voltage over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER EI Integral linearity error (1) ED Differential linearity error (1) EO Offset error (3) EG Gain error (3) ET (1) (2) (3) Total unadjusted error TEST CONDITIONS 1.4 V dVREF 1.6 V (2) 1.6 V < dVREF (2) VCC MIN TYP MAX 2.0 2.2 V/3 V 1.7 (2) 2.2 V/3 V dVREF 2.2 V (2) 2.2 V/3 V 1.0 2.0 dVREF > 2.2 V (2) 2.2 V/3 V 1.0 2.0 (2) 2.2 V/3 V 1.0 2.0 dVREF 2.2 V (2) 2.2 V/3 V 1.4 3.5 dVREF > 2.2 V (2) 2.2 V/3 V 1.4 3.5 1.0 UNIT LSB LSB LSB LSB LSB Parameters are derived using the histogram method. The external reference voltage is selected by: SREF2 = 0 or 1, SREF1 = 1, SREF0 = 0. dVREF = VR+ - VR-, VR+ < AVCC, VR- > AVSS. Unless otherwise mentioned, dVREF > 1.5 V. Impedance of the external reference voltage R < 100 and two decoupling capacitors, 10 F and 100 nF, should be connected to VREF+/VREF- to decouple the dynamic current. See also the CC430 Family User's Guide (SLAU259). Parameters are derived using a best fit curve. 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) TEST CONDITIONS (1) PARAMETER EI Integral linearity error (2) ED Differential linearity error (2) ADC12SR = 0, REFOUT = 1 fADC12CLK 4.0 MHz ADC12SR = 0, REFOUT = 0 fADC12CLK 2.7 MHz ADC12SR = 0, REFOUT = 1 fADC12CLK 4.0 MHz ADC12SR = 0, REFOUT = 1 fADC12CLK 2.7 MHz ADC12SR = 0, REFOUT = 0 fADC12CLK 2.7 MHz ADC12SR = 0, REFOUT = 1 fADC12CLK 4.0 MHz ADC12SR = 0, REFOUT = 0 fADC12CLK 2.7 MHz ADC12SR = 0, REFOUT = 1 fADC12CLK 4.0 MHz EO Offset error (3) EG Gain error (3) ADC12SR = 0, REFOUT = 0 fADC12CLK 2.7 MHz ET Total unadjusted ADC12SR = 0, REFOUT = 1 error ADC12SR = 0, REFOUT = 0 fADC12CLK 4.0 MHz (1) (2) (3) (4) 66 fADC12CLK 2.7 MHz VCC MIN TYP 1.7 2.2 V/3 V 2.2 V/3 V 2.2 V/3 V 2.2 V/3 V 2.2 V/3 V MAX 2.5 -1.0 +2.0 -1.0 +1.5 -1.0 +2.5 1.0 2.0 1.0 2.0 1.0 2.0 UNIT LSB LSB LSB LSB 1.5% (4) VREF 1.4 3.5 1.5% (4) LSB VREF The internal reference voltage is selected by: SREF2 = 0 or 1, SREF1 = 1, SREF0 = 1. dVREF = VR+ - VR-. Parameters are derived using the histogram method. Parameters are derived using a best fit curve. The gain error and total unadjusted error are dominated by the accuracy of the integrated reference module absolute accuracy. In this mode the reference voltage used by the ADC12_A is not available on a pin. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com 12-Bit ADC, Temperature Sensor and Built-In VMID (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS ADC12ON = 1, INCH = 0Ah, TA = 0C VSENSOR See (2) (3) TCSENSOR See (3) tSENSOR(sample) Sample time required if channel 10 is selected (4) ADC12ON = 1, INCH = 0Ah, Error of conversion result 1 LSB AVCC divider at channel 11, VAVCC factor ADC12ON = 1, INCH = 0Bh AVCC divider at channel 11 ADC12ON = 1, INCH = 0Bh Sample time required if channel 11 is selected (5) ADC12ON = 1, INCH = 0Bh, Error of conversion result 1 LSB ADC12ON = 1, INCH = 0Ah VMID tVMID(sample) (1) (2) (3) (4) (5) VCC MIN TYP 2.2 V 680 3V 680 2.2 V 2.25 3V 2.25 2.2 V 30 3V 30 MAX UNIT mV mV/C s 0.48 0.5 0.52 VAVCC 2.2 V 1.06 1.1 1.14 3V 1.44 1.5 1.56 2.2 V/3 V 1000 V ns The temperature sensor is provided by the REF module. See the REF module parametric, IREF+, regarding the current consumption of the temperature sensor. The temperature sensor offset can be as much as 20C. A single-point calibration is recommended in order to minimize the offset error of the built-in temperature sensor. The device descriptor structure contains calibration values for 30C 3C and 85C 3C for each of the available reference voltage levels. The sensor voltage can be computed as VSENSE = TCSENSOR * (Temperature, C) + VSENSOR, where TCSENSOR and VSENSOR can be computed from the calibration values for higher accuracy. The typical equivalent impedance of the sensor is 51 k. The sample time required includes the sensor-on time tSENSOR(on). The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed. Typical Temperature Sensor Voltage - mV 1000 950 900 850 800 750 700 650 600 550 500 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Ambient Temperature - C Figure 20. Typical Temperature Sensor Voltage Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 67 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com REF, External Reference over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT VeREF+ Positive external reference voltage input VeREF+ > VREF-/VeREF- (2) 1.4 AVCC V VREF-/VeREF- Negative external reference voltage input VeREF+ > VREF-/VeREF- (3) 0 1.2 V (VeREF+ - VREF-/VeREF-) Differential external reference voltage input VeREF+ > VREF-/VeREF- (4) 1.4 AVCC V 26 A 1 A IVeREF+ IVREF-/VeREF- CVREF+/(1) (2) (3) (4) (5) 68 Static input current Capacitance at VREF+/- terminal, external reference (5) 1.4 V VeREF+ VAVCC , VeREF- = 0 V fADC12CLK = 5 MHz,ADC12SHTx = 1h, Conversion rate 200ksps 2.2 V/3 V 1.4 V VeREF+ VAVCC , VeREF- = 0 V fADC12CLK = 5 MHz,ADC12SHTx = 8h, Conversion rate 20ksps 2.2 V/3 V 8.5 10 F The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, Ci, is also the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy. The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced accuracy requirements. The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced accuracy requirements. The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with reduced accuracy requirements. Two decoupling capacitors, 10 F and 100 nF, should be connected to VREF to decouple the dynamic current required for an external reference source if it is used for the ADC12_A. See also the CC430 Family User's Guide (SLAU259). Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com REF, Built-In Reference over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) PARAMETER VREF+ AVCC(min) Positive built-in reference voltage output AVCC minimum voltage, Positive built-in reference active TEST CONDITIONS VCC 2.41 1.5% REFVSEL = 1 for 2.0 V REFON = REFOUT = 1 IVREF+= 0 A 3V 1.93 1.5% REFVSEL = 0 for 1.5 V REFON = REFOUT = 1 IVREF+= 0 A 2.2 V/ 3 V 1.45 1.5% REFVSEL = 0 for 1.5 V, reduced performance 1.8 REFVSEL = 0 for 1.5 V 2.2 REFVSEL = 1 for 2.0 V 2.3 100 140 A 0.9 1.5 mA CVREF+ Capacitance at VREF+ terminals, internal reference REFON = REFOUT = 1 TCREF+ Temperature coefficient of built-in reference (5) IVREF+ = 0 A REFVSEL = 0, 1, 2; REFON = 1, REFOUT = 0 or 1 PSRR_DC Power supply rejection ratio (DC) Power supply rejection ratio (AC) (4) (5) (6) 2.8 3V REFVSEL = 0, 1, 2 IVREF+ = +10 A/-1000 A AVCC = AVCC (min) for each reference level. REFVSEL = 0, 1, 2; REFON = REFOUT = 1 (3) V REFON = 1, REFOUT = 1, REFBURST = 0 Load-current regulation, VREF+ terminal (4) (2) V 3V IL(VREF+) (1) UNIT REFON = 1, REFOUT = 0, REFBURST = 0 Operating supply current into AVCC terminal (2) (3) Settling time of reference voltage (6) MAX 3V IREF+ tSETTLE TYP REFVSEL = 2 for 2.5 V REFON = REFOUT = 1 IVREF+= 0 A REFVSEL = 2 for 2.5 V PSRR_AC MIN 2500 V/mA 100 pF 30 50 ppm/ C AVCC = AVCC (min) - AVCC(max) TA = 25 C REFVSEL = 0, 1, 2; REFON = 1, REFOUT = 0 or 1 120 300 V/V AVCC = AVCC (min) - AVCC(max) TA = 25 C f = 1 kHz, Vpp = 100 mV REFVSEL = 0, 1, 2; REFON = 1, REFOUT = 0 or 1 6.4 AVCC = AVCC (min) - AVCC(max) REFVSEL = 0, 1, 2; REFOUT = 0, REFON = 0 1 75 AVCC = AVCC (min) - AVCC(max) CVREF = CVREF(max) REFVSEL = 0, 1, 2; REFOUT = 1, REFON = 0 1 20 mV/V s 75 The reference is supplied to the ADC by the REF module and is buffered locally inside the ADC. The ADC uses two internal buffers, one smaller and one larger for driving the VREF+ terminal. When REFOUT = 1, the reference is available at the VREF+ terminal, as well as, used as the reference for the conversion and utilizes the larger buffer. When REFOUT = 0, the reference is only used as the reference for the conversion and utilizes the smaller buffer. The internal reference current is supplied via terminal AVCC. Consumption is independent of the ADC12ON control bit, unless a conversion is active. The REFON bit enables to settle the built-in reference before starting an A/D conversion. REFOUT = 0 represents the current contribution of the smaller buffer. REFOUT = 1 represents the current contribution of the larger buffer without external load. The temperature sensor is provided by the REF module. Its current is supplied via terminal AVCC and is equivalent to IREF+ with REFON =1 and REFOUT = 0. Contribution only due to the reference and buffer including package. This does not include resistance due to PCB trace, etc. Calculated using the box method: (MAX(-40 to 85C) - MIN(-40 to 85C)) / MIN(-40 to 85C)/(85C - (-40C)). The condition is that the error in a conversion started after tREFON is less than 0.5 LSB. The settling time depends on the external capacitive load when REFOUT = 1. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 69 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Comparator B over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER VCC TEST CONDITIONS VCC Supply voltage MIN TYP MAX 1.8 3.6 1.8 V IAVCC_COMP Comparator operating supply current into AVCC, Excludes reference resistor ladder IAVCC_REF Quiescent current of local reference voltage amplifier into AVCC VIC Common mode input range VOFFSET Input offset voltage CIN Input capacitance RSIN Series input resistance tPD 2.2 V 30 50 3.0 V 40 65 CBPWRMD = 01 2.2/3.0 V 10 30 CBPWRMD = 10 2.2/3.0 V 0.1 0.5 CBREFACC = 1, CBREFLx = 01 22 0 VCC-1 CBPWRMD = 00 CBPWRMD = 01, 10 ON - switch closed 3 A A V 20 mV 10 mV 4 k 5 OFF - switch opened V 40 pF 30 M CBPWRMD = 00, CBF = 0 450 ns Propagation delay, response time CBPWRMD = 01, CBF = 0 600 ns CBPWRMD = 10, CBF = 0 50 s Propagation delay with filter active tPD,filter CBPWRMD = 00 UNIT CBPWRMD = 00, CBON = 1, CBF = 1, CBFDLY = 00 0.35 0.6 1.0 s CBPWRMD = 00, CBON = 1, CBF = 1, CBFDLY = 01 0.6 1.0 1.8 s CBPWRMD = 00, CBON = 1, CBF = 1, CBFDLY = 10 1.0 1.8 3.4 s CBPWRMD = 00, CBON = 1, CBF = 1, CBFDLY = 11 1.8 3.4 6.5 s tEN_CMP Comparator enable time, settling time CBON = 0 to CBON = 1, CBPWRMD = 00, 01, 10 1 2 s tEN_REF Resistor reference enable time CBON = 0 to CBON = 1 0.3 1.5 s Reference voltage for a given tap VIN = reference into resistor ladder, n = 0 to 31 VCB_REF 70 Submit Documentation Feedback VIN x (n+1) / 32 V Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Flash Memory over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) TEST CONDITIONS PARAMETER DVCC(PGM/ERASE) Program and erase supply voltage MIN TYP 1.8 IPGM Average supply current from DVCC during program IERASE Average supply current from DVCC during erase IMERASE, IBANK Average supply current from DVCC during mass erase or bank erase tCPT Cumulative program time (1) MAX 3.6 3 104 mA 2 mA 2 mA 105 ms cycles tRetention Data retention duration tWord Word or byte program time (2) 64 85 s tBlock, 0 Block program time for first byte or word (2) 49 65 s 1-(N-1) Block program time for each additional byte or word, except for last byte or word (2) 37 49 s 55 73 s 23 32 ms 0 1 MHz tBlock, tBlock, N Block program time for last byte or word TJ = 25C V 5 16 Program/erase endurance UNIT (2) tErase Erase time for segment erase, mass erase, and bank erase when available (2) fMCLK,MGR MCLK frequency in marginal read mode (FCTL4.MGR0 = 1 or FCTL4. MGR1 = 1) (1) (2) 100 years The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming methods: individual word/byte write and block write modes. These values are hardwired into the flash controller's state machine. JTAG and Spy-Bi-Wire Interface over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT fSBW Spy-Bi-Wire input frequency 2.2 V/3 V 0 20 MHz tSBW,Low Spy-Bi-Wire low clock pulse length 2.2 V/3 V 0.025 15 s tSBW, Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge) (1) 2.2 V/3 V 1 s En tSBW,Rst Spy-Bi-Wire return to normal operation time fTCK TCK input frequency - 4-wire JTAG (2) Rinternal Internal pull-down resistance on TEST (1) (2) 2.2 V s 15 100 0 5 MHz 10 MHz 80 k 3V 0 2.2 V/3 V 45 60 Tools accessing the Spy-Bi-Wire interface need to wait for the minimum tSBW,En time after pulling the TEST/SBWTCK pin high before applying the first SBWTCK clock edge. fTCK may be restricted to meet the timing requirements of the module selected. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 71 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com RF1A CC1101-Based Radio Parameters Recommended Operating Conditions PARAMETER TEST CONDITIONS MIN VCC Supply voltage range during radio operation PMMCOREVx Core voltage range, PMMCOREVx setting during radio operation 3.6 3 300 348 (1) 464 779 928 2-FSK 0.6 500 2-GFSK, OOK, and ASK 0.6 250 kBaud 389 (Shaped) MSK (also known as differential offset QPSK) (2) 26 V MHz 500 26 26 27 40 Total tolerance including initial tolerance, crystal loading, aging and temperature dependency. (3) RF crystal load capacitance 10 MHz ppm 13 RF crystal effective series resistance (1) (2) (3) UNIT 2 RF crystal frequency RF crystal tolerance MAX 2.0 RF frequency range Data rate TYP 20 pF 100 If using a 27-MHz crystal, the lower frequency limit for this band is 392 MHz. If using optional Manchester encoding, the data rate in kbps is half the baud rate. The acceptable crystal tolerance depends on frequency band, channel bandwidth, and spacing. Also see Design Note DN005 -- CC11xx Sensitivity versus Frequency Offset and Crystal Accuracy, literature number SWRA122. RF Crystal Oscillator, XT2 TA = 25C, VCC = 3 V (unless otherwise noted) (1) PARAMETER TEST CONDITIONS MIN Start-up time (2) Duty cycle (1) (2) 45 TYP MAX UNIT 150 810 s 50 55 % All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). The start-up time depends to a very large degree on the used crystal. Current Consumption, Reduced-Power Modes TA = 25C, VCC = 3 V (unless otherwise noted) (1) PARAMETER Current consumption (1) (2) 72 TEST CONDITIONS MIN TYP MAX UNIT RF crystal oscillator only (e.g., SLEEP state with MCSM0.OSC_FORCE_ON = 1) 100 A IDLE state (including RF crystal oscillator) 1.7 mA FSTXON state (only the frequency synthesizer is running) (2) 9.5 mA All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). This current consumption is also representative of other intermediate states when going from IDLE to RX or TX, including the calibration state. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Current Consumption, Receive Mode TA = 25C, VCC = 3 V (unless otherwise noted) (1) PARAMETER FREQ (MHz) DATA RATE (kBaud) (2) TEST CONDITIONS 1.2 315 38.4 Register settings optimized for reduced current 250 433 38.4 Register settings optimized for reduced current 1.2 868, 915 38.4 Register settings optimized for reduced current (3) 250 (1) (2) (3) 17 Input at -40 dBm (well above sensitivity limit) 16 Input at -100 dBm (close to sensitivity limit) 17 Input at -40 dBm (well above sensitivity limit) 16 Input at -100 dBm (close to sensitivity limit) 18 MAX UNIT 16.5 Input at -100 dBm (close to sensitivity limit) 18 Input at -40 dBm (well above sensitivity limit) 17 Input at -100 dBm (close to sensitivity limit) 18 Input at -40 dBm (well above sensitivity limit) 17 Input at -100 dBm (close to sensitivity limit) 250 TYP Input at -100 dBm (close to sensitivity limit) Input at -40 dBm (well above sensitivity limit) 1.2 Current consumption, RX MIN mA 18.5 Input at -40 dBm (well above sensitivity limit) 17 Input at -100 dBm (close to sensitivity limit) 16 Input at -40 dBm (well above sensitivity limit) 15 Input at -100 dBm (close to sensitivity limit) 16 Input at -40 dBm (well above sensitivity limit) 15 Input at -100 dBm (close to sensitivity limit) 16 Input at -40 dBm (well above sensitivity limit) 15 All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). Reduced current setting (MDMCFG2.DEM_DCFILT_OFF = 1) gives a slightly lower current consumption at the cost of a reduction in sensitivity. See tables "RF Receive" for additional details on current consumption and sensitivity. For 868/915 MHz, see Figure 21 for current consumption with register settings optimized for sensitivity. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 73 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com 19 19 TA = 85C TA = 25C TA = 25C TA = -40C TA = -40C Radio Current [mA] Radio Current [mA] TA = 85C 18 17 16 -100 -80 -60 -40 18 17 16 -100 -20 -80 Input Pow er [dBm ] -60 -20 Input Pow er [dBm ] 1.2 kBaud GFSK 38.4 kBaud GFSK 19 19 TA = 85C TA = 85C TA = 25C TA = 25C TA = -40C TA = -40C Radio Current [mA] Radio Current [mA] -40 18 17 16 -100 -80 -60 Input Pow er [dBm ] 250 kBaud GFSK -40 -20 18 17 16 -100 -80 -60 -40 -20 Input Pow er [dBm ] 500 kBaud MSK Figure 21. Typical RX Current Consumption Over Temperature and Input Power Level, 868 MHz, Sensitivity-Optimized Setting 74 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Current Consumption, Transmit Mode TA = 25C, VCC = 3 V (unless otherwise noted) (1) PARAMETER (2) FREQUENCY [MHz} 315 433 Current consumption, TX 868 915 (1) (2) PATABLE Setting OUTPUT POWER [dBm] 0xC0 max. 26 mA 0xC4 +10 25 mA 0x51 0 15 mA MIN TYP MAX UNIT 0x29 -6 15 mA 0xC0 max. 33 mA 0xC6 +10 29 mA 0x50 0 17 mA 0x2D -6 17 mA 0xC0 max. 36 mA 0xC3 +10 33 mA 0x8D 0 18 mA 0x2D -6 18 mA 0xC0 max. 35 mA 0xC3 +10 32 mA 0x8D 0 18 mA 0x2D -6 18 mA All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). Reduced current setting (MDMCFG2.DEM_DCFILT_OFF = 1) gives a slightly lower current consumption at the cost of a reduction in sensitivity. See tables "RF Receive" for additional details on current consumption and sensitivity. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 75 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Typical TX Current Consumption, 315 MHz PARAMETER Current consumption, TX PATABLE Setting Output Power [dBm] VCC 2.0 V 3.0 V 3.6 V TA 25C 25C 25C 0xC0 max. 27.5 26.4 28.1 0xC4 +10 25.1 25.2 25.3 0x51 0 14.4 14.6 14.7 0x29 -6 14.2 14.7 15.0 UNIT mA Typical TX Current Consumption, 433 MHz PARAMETER Current consumption, TX PATABLE Setting Output Power [dBm] VCC 2.0 V 3.0 V 3.6 V TA 25C 25C 25C 0xC0 0xC6 max. 33.1 33.4 33.8 +10 28.6 28.8 28.8 0x50 0 16.6 16.8 16.9 0x2D -6 16.8 17.5 17.8 3.0 V 3.6 V UNIT mA Typical TX Current Consumption, 868 MHz PARAMETER Current consumption, TX PATABLE Setting Output Power [dBm] 0xC0 0xC3 VCC TA 2.0 V -40C 25C 85C -40C 25C 85C -40C 25C 85C max. 36.7 35.2 34.2 38.5 35.5 34.9 37.1 35.7 34.7 +10 34.0 32.8 32.0 34.2 33.0 32.5 34.3 33.1 32.2 0x8D 0 18.0 17.6 17.5 18.3 17.8 18.1 18.4 18.0 17.7 0x2D -6 17.1 17.0 17.2 17.8 17.8 18.3 18.2 18.1 18.1 UNIT mA Typical TX Current Consumption, 915 MHz PARAMETER Current consumption, TX 76 PATABLE Setting Output Power [dBm] 0xC0 VCC TA 2.0 V 3.0 V 3.6 V -40C 25C 85C -40C 25C 85C -40C 25C 85C max. 35.5 33.8 33.2 36.2 34.8 33.6 36.3 35.0 33.8 0xC3 +10 33.2 32.0 31.0 33.4 32.1 31.2 33.5 32.3 31.3 0x8D 0 17.8 17.4 17.1 18.1 17.6 17.3 18.2 17.8 17.5 0x2D -6 17.0 16.9 16.9 17.7 17.6 17.6 18.1 18.0 18.0 Submit Documentation Feedback UNIT mA Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com RF Receive, Overall TA = 25C, VCC = 3 V (unless otherwise noted) (1) PARAMETER TEST CONDITIONS Digital channel filter bandwidth Spurious emissions (3) (4) TYP 58 MAX UNIT 812 kHz 25 MHz to 1 GHz -68 -57 Above 1 GHz -66 -47 Serial operation (5) RX latency (1) (2) (3) (4) (5) MIN (2) 9 dBm bit All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). User programmable. The bandwidth limits are proportional to crystal frequency (given values assume a 26.0 MHz crystal) Typical radiated spurious emission is -49 dBm measured at the VCO frequency Maximum figure is the ETSI EN 300 220 limit Time from start of reception until data is available on the receiver data output pin is equal to 9 bit. RF Receive, 315 MHz TA = 25C, VCC = 3 V (unless otherwise noted) (1) 2-FSK, 1% packet error rate, 20-byte packet length, Sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF = 0 (unless otherwise noted) PARAMETER DATA RATE (kBaud) 0.6 Receiver sensitivity (1) (2) (3) (4) TEST CONDITIONS MIN 14.3kHz deviation, 58kHz digital channel filter bandwidth TYP MAX UNIT -117 (2) 1.2 5.2kHz deviation, 58kHz digital channel filter bandwidth 38.4 20kHz deviation, 100kHz digital channel filter bandwidth (3) -111 250 127kHz deviation, 540kHz digital channel filter bandwidth 500 MSK, 812kHz digital channel filter bandwidth (4) -103 (4) dBm -95 -86 All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then reduced by about 2mA close to the sensitivity limit. The sensitivity is typically reduced to -109dBm. Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then reduced by about 2mA close to the sensitivity limit. The sensitivity is typically reduced to -102dBm. MDMCFG2.DEM_DCFILT_OFF=1 can not be used for data rates 250kBaud. RF Receive, 433 MHz TA = 25C, VCC = 3 V (unless otherwise noted) (1) 2-FSK, 1% packet error rate, 20-byte packet length, Sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF = 0 (unless otherwise noted) PARAMETER Receiver sensitivity DATA RATE (kBaud) (4) TYP 14.3kHz deviation, 58kHz digital channel filter bandwidth -114 1.2 5.2-kHz deviation, 58-kHz digital channel filter bandwidth (2) -111 38.4 20-kHz deviation, 100-kHz digital channel filter bandwidth (3) -104 500 (3) MIN 0.6 250 (1) (2) TEST CONDITIONS 127-kHz deviation, 540-kHz digital channel filter bandwidth (4) MSK, 812kHz digital channel filter bandwidth (4) MAX UNIT dBm -93 -85 All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then reduced by about 2mA close to the sensitivity limit. The sensitivity is typically reduced to -109dBm. Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then reduced by about 2mA close to the sensitivity limit. The sensitivity is typically reduced to -101dBm. MDMCFG2.DEM_DCFILT_OFF=1 can not be used for data rates 250kBaud. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 77 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com RF Receive, 868/915 MHz TA = 25C, VCC = 3 V (unless otherwise noted) (1) 1% packet error rate, 20-byte packet length, Sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF = 0 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 0.6-kBaud data rate, 2-FSK, 14.3-kHz deviation, 58-kHz digital channel filter bandwidth (unless otherwise noted) Receiver sensitivity -115 dBm 1.2-kBaud data rate, 2-FSK, 5.2-kHz deviation, 58-kHz digital channel filter bandwidth (unless otherwise noted) -109 Receiver sensitivity (2) 2-GFSK modulation by setting MDMCFG2.MOD_FORMAT=2, Gaussian filter with BT = 0.5 Saturation FIFOTHR.CLOSE_IN_RX=0 (3) -109 -28 Adjacent channel rejection Desired channel 3 dB above the sensitivity limit, 100 kHz channel spacing (4) Image channel rejection IF frequency 152 kHz, desired channel 3 dB above the sensitivity limit Blocking Desired channel 3 dB above the sensitivity limit (5) -100-kHz offset 39 +100-kHz offset 39 dBm dBm dB 29 dB 2 MHz offset -48 dBm 10 MHz offset -40 dBm 38.4-kBaud data rate, 2-FSK, 20-kHz deviation, 100-kHz digital channel filter bandwidth (unless otherwise noted) Receiver sensitivity (6) -102 2-GFSK modulation by setting MDMCFG2.MOD_FORMAT = 2, Gaussian filter with BT = 0.5 -101 Saturation FIFOTHR.CLOSE_IN_RX=0 (3) Adjacent channel rejection Desired channel 3 dB above the sensitivity limit, 200 kHz channel spacing (5) Image channel rejection IF frequency 152 kHz, Desired channel 3 dB above the sensitivity limit Blocking Desired channel 3 dB above the sensitivity limit (5) -19 -200-kHz offset 20 +200-kHz offset 25 dBm dBm dB 23 dB 2-MHz offset -48 dBm 10-MHz offset -40 dBm 250-kBaud data rate, 2-FSK, 127-kHz deviation, 540-kHz digital channel filter bandwidth (unless otherwise noted) Receiver sensitivity (7) -90 2-GFSK modulation by setting MDMCFG2.MOD_FORMAT = 2, Gaussian filter with BT = 0.5 -90 Saturation FIFOTHR.CLOSE_IN_RX=0 (3) -19 Adjacent channel rejection Desired channel 3 dB above the sensitivity limit, 750-kHz channel spacing (8) Image channel rejection IF frequency 304 kHz, Desired channel 3 dB above the sensitivity limit Blocking Desired channel 3 dB above the sensitivity limit (8) -750-kHz offset 24 +750-kHz offset 30 dBm dBm dB 18 dB 2-MHz offset -53 dBm 10-MHz offset -39 dBm -84 dBm -2 dB 2-MHz offset -53 dBm 10-MHz offset -38 dBm 500-kBaud data rate, MSK, 812-kHz digital channel filter bandwidth (unless otherwise noted) Receiver sensitivity (7) Image channel rejection Blocking (1) (2) (3) (4) (5) (6) (7) (8) (9) 78 IF frequency 355 kHz, Desired channel 3 dB above the sensitivity limit Desired channel 3 dB above the sensitivity limit (9) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then reduced by about 2mA close to the sensitivity limit. The sensitivity is typically reduced to -107dBm See Design Note DN010 Close-in Reception with CC1101, literature number SWRA147. See Figure 22 for blocking performance at other offset frequencies. See Figure 23 for blocking performance at other offset frequencies. Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then reduced by about 2mA close to the sensitivity limit. The sensitivity is typically reduced to -100dBm. MDMCFG2.DEM_DCFILT_OFF = 1 cannot be used for data rates 250kBaud. See Figure 24 for blocking performance at other offset frequencies. See Figure 25 for blocking performance at other offset frequencies. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com 60 80 70 50 60 40 Selectivity [dB] Blocking [dB] 50 40 30 20 10 30 20 10 0 0 -10 -20 -40 -10 -30 -20 -10 0 10 20 30 -1 40 Offset [MHz] -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 Offset [MHz] NOTE: 868.3 MHz, 2-FSK, 5.2-kHz deviation, IF frequency is 152.3 kHz, digital channel filter bandwidth is 58 kHz Figure 22. Typical Selectivity at 1.2-kBaud Data Rate 80 50 70 40 60 30 Selectivity [dB] Blocking [dB] 50 40 30 20 10 20 10 0 0 -10 -10 -20 -40 -20 -30 -20 -10 0 10 Offset [MHz] 20 30 40 -1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1 Offset [MHz] NOTE: 868 MHz, 2-FSK, 20 kHz deviation, IF frequency is 152.3 kHz, digital channel filter bandwidth is 100 kHz Figure 23. Typical Selectivity at 38.4-kBaud Data Rate Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 79 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com 50 80 70 40 60 30 Selectivity [dB] Blocking [dB] 50 40 30 20 10 20 10 0 0 -10 -10 -20 -40 -20 -30 -20 -10 0 10 20 30 -3 40 -2 -1 Offset [MHz] 0 1 2 3 1 2 3 Offset [MHz] NOTE: 868 MHz, 2-FSK, IF frequency is 304 kHz, digital channel filter bandwidth is 540 kHz Figure 24. Typical Selectivity at 250-kBaud Data Rate 80 50 70 40 60 30 Selectivity [dB] Blocking [dB] 50 40 30 20 10 20 10 0 0 -10 -10 -20 -40 -20 -30 -20 -10 0 10 20 30 40 -3 -2 Offset [MHz] -1 0 Offset [MHz] NOTE: 868 MHz, 2-FSK, IF frequency is 355 kHz, digital channel filter bandwidth is 812 kHz Figure 25. Typical Selectivity at 500-kBaud Data Rate 80 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Typical Sensitivity, 315 MHz, Sensitivity Optimized Setting PARAMETER Sensitivity, 315MHz DATA RATE (kBaud) VCC TA 2.0 V 3.0 V 3.6 V -40C 25C 85C -40C 25C 85C -40C 25C 85C 1.2 -112 -112 -110 -112 -111 -109 -112 -111 -108 38.4 -105 -105 -104 -105 -103 -102 -105 -104 -102 250 -95 -95 -92 -94 -95 -92 -95 -94 -91 UNIT dBm Typical Sensitivity, 433 MHz, Sensitivity Optimized Setting PARAMETER Sensitivity, 433MHz DATA RATE (kBaud) VCC TA 2.0 V 3.0 V 3.6 V -40C 25C 85C -40C 25C 85C -40C 25C 85C 1.2 -111 -110 -108 -111 -111 -108 -111 -110 -107 38.4 -104 -104 -101 -104 -104 -101 -104 -103 -101 250 -93 -94 -91 -93 -93 -90 -93 -93 -90 UNIT dBm Typical Sensitivity, 868 MHz, Sensitivity Optimized Setting PARAMETER Sensitivity, 868MHz DATA RATE (kBaud) VCC TA 2.0 V 3.0 V 3.6 V -40C 25C 85C -40C 25C 85C -40C 25C 85C 1.2 -109 -109 -107 -109 -109 -106 -109 -108 -106 38.4 -102 -102 -100 -102 -102 -99 -102 -101 -99 250 -90 -90 -88 -89 -90 -87 -89 -90 -87 500 -84 -84 -81 -84 -84 -80 -84 -84 -80 UNIT dBm Typical Sensitivity, 915 MHz, Sensitivity Optimized Setting PARAMETER Sensitivity, 915MHz DATA RATE (kBaud) VCC TA 2.0 V 3.0 V 3.6 V -40C 25C 85C -40C 25C 85C -40C 25C 85C 1.2 -109 -109 -107 -109 -109 -106 -109 -108 -105 38.4 -102 -102 -100 -102 -102 -99 -103 -102 -99 250 -92 -92 -89 -92 -92 -88 -92 -92 -88 500 -87 -86 -81 -86 -86 -81 -86 -85 -80 Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback UNIT dBm 81 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com RF Transmit TA = 25C, VCC = 3 V (unless otherwise noted) (1) PTX = +10 dBm (unless otherwise noted) PARAMETER FREQUENCY (MHz) TEST CONDITIONS MIN 315 Differential load impedance (2) 116 + j41 868/915 86.5 + j43 433 868 433 Harmonics, radiated (4) (5) (6) 868 915 315 433 Harmonics, conducted 868 915 315 Delivered to a 50 single-ended load via CC430 reference design's RF matching network Spurious emissions, conducted, harmonics not included (8) 868 (1) (2) (3) (4) (5) (6) (7) (8) 82 +13 +11 Delivered to a 50 single-ended load via CC430 reference design's RF matching network -30 Second harmonic -56 Third harmonic -57 Second harmonic -50 Third harmonic -52 Second harmonic -50 Third harmonic Frequencies below 960 MHz dBm Frequencies above 960 MHz Frequencies below 1 GHz Frequencies above 1 GHz Second harmonic Other harmonics Second harmonic Other harmonics Frequencies below 960 MHz Frequencies above 960 MHz Frequencies above 1 GHz +10 dBm CW +10 dBm CW +10 dBm CW +11 dBm CW (7) +10 dBm CW < -48 -45 < -48 -59 -53 < -47 < -58 < -53 < -54 +10 dBm CW < -54 Frequencies below 1 GHz < -46 Frequencies above 960 MHz dBm < -71 < -63 Frequencies below 960 MHz dBm < -38 Frequencies within 47 to 74, 87.5 to 118, 174 to 230, 470 to 862 MHz Frequencies above 1 GHz dBm -54 +10 dBm CW Frequencies within 47 to 74, 87.5 to 118, 174 to 230, 470 to 862 MHz 915 +11 Frequencies below 1 GHz 433 UNIT +12 915 Output power, lowest setting (3) MAX 122 + j31 433 315 Output power, highest setting (3) TYP dBm < -59 < -56 +11 dBm CW < -49 < -63 All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). Differential impedance as seen from the RF-port (RF_P and RF_N) towards the antenna. Follow the CC430 reference designs available from the TI website. Output power is programmable, and full range is available in all frequency bands. Output power may be restricted by regulatory limits. See also Application Note AN050 Using the CC1101 in the European 868MHz SRD Band, literature number SWRA146 and Design Note DN013 Programming Output Power on CC1101, literature number SWRA168, which gives the output power and harmonics when using multi-layer inductors. The output power is then typically +10 dBm when operating at 868/915 MHz. The antennas used during the radiated measurements (SMAFF-433 from R.W.Badland and Nearson S331 868/915) play a part in attenuating the harmonics. Measured on EM430F6137RF900 with CW, maximum output power All harmonics are below -41.2 dBm when operating in the 902 - 928 MHz band. Requirement is -20 dBc under FCC 15.247 All radiated spurious emissions are within the limits of ETSI. Also see Design Note DN017 CC11xx 868/915 MHz RF Matching, literature number SWRA168. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com RF Transmit (continued) TA = 25C, VCC = 3 V (unless otherwise noted)(1) PTX = +10 dBm (unless otherwise noted) PARAMETER TX latency (9) (9) FREQUENCY (MHz) TEST CONDITIONS MIN Serial operation TYP MAX 8 UNIT bits Time from sampling the data on the transmitter data input pin until it is observed on the RF output ports Optimum PATABLE Settings for Various Output Power Levels and Frequency Bands TA = 25C, VCC = 3 V (unless otherwise noted) (1) Output Power [dBm] (1) PATABLE Setting 315 MHz 433 MHz 868 MHz 915 MHz -30 0x12 0x05 0x03 0x03 -12 0x33 0x26 0x25 0x25 -6 0x29 0x2D 0x2D 0x2D 0 0x51 0x50 0x8D 0x8D 10 0xC4 0xC4 0xC3 0xC3 Maximum 0xC0 0xC0 0xC0 0xC0 All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 83 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Typical Output Power, 315 MHz (1) PARAMETER Output power, 315 MHz (1) PATABLE Setting VCC TA 2.0 V -40C 25C 3.0 V 85C -40C 25C 3.6 V 85C -40C 25C 0xC0 (max) 11.9 11.8 11.8 0xC4 (10 dBm) 10.3 10.3 10.3 0xC6 (default) 85C 9.3 UNIT dBm 0x51 (0 dBm) 0.7 0.6 0.7 0x29 (-6 dBm) -6.8 -5.6 -5.3 All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). Typical Output Power, 433 MHz (1) PARAMETER Output power, 433 MHz (1) PATABLE Setting VCC TA 2.0 V -40C 25C 3.0 V 85C -40C 25C 3.6 V 85C -40C 25C 0xC0 (max) 12.6 12.6 12.6 0xC4 (10 dBm) 10.3 10.2 10.2 0xC6 (default) 85C 10.0 UNIT dBm 0x50 (0 dBm) 0.3 0.3 0.3 0x2D (-6 dBm) -6.4 -5.4 -5.1 All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). Typical Output Power, 868 MHz (1) PARAMETER Output power, 868 MHz (1) PATABLE Setting VCC TA 2.0 V 3.0 V 3.6 V -40C 25C 85C -40C 25C 85C -40C 25C 85C 0xC0 (max) 11.9 11.2 10.5 11.9 11.2 10.5 11.9 11.2 10.5 0xC3 (10 dBm) 10.8 10.1 9.4 10.8 10.1 9.4 10.7 10.1 9.4 0xC6 (default) 8.8 UNIT dBm 0x8D (0 dBm) 1.0 0.3 -0.3 1.1 0.3 -0.3 1.1 0.3 -0.3 0x2D (-6 dBm) -6.5 -6.8 -7.3 -5.3 -5.8 -6.3 -4.9 -5.4 -6.0 All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). Typical Output Power, 915 MHz (1) PARAMETER Output power, 915 MHz (1) 84 PATABLE Setting VCC TA 2.0 V 3.0 V 3.6 V -40C 25C 85C -40C 25C 85C -40C 25C 85C 0xC0 (max) 12.2 11.4 10.6 12.1 11.4 10.7 12.1 11.4 10.7 0xC3 (10 dBm) 11.0 10.3 9.5 11.0 10.3 9.5 11.0 10.3 9.6 0xC6 (default) 8.8 UNIT dBm 0x8D (0 dBm) 1.9 1.0 0.3 1.9 1.0 0.3 1.9 1.1 0.3 0x2D (-6 dBm) -5.5 -6.0 -6.5 -4.3 -4.8 -5.5 -3.9 -4.4 -5.1 All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Frequency Synthesizer Characteristics TA = 25C, VCC = 3 V (unless otherwise noted) (1) MIN figures are given using a 27MHz crystal. TYP and MAX figures are given using a 26MHz crystal. PARAMETER Programmed frequency resolution (2) Synthesizer frequency tolerance TEST CONDITIONS 26- to 27-MHz crystal MIN TYP MAX UNIT 397 fXOSC/216 412 Hz (3) 40 50-kHz offset from carrier -95 100-kHz offset from carrier -94 200-kHz offset from carrier -94 -98 500-kHz offset from carrier RF carrier phase noise 1-MHz offset from carrier -107 2-MHz offset from carrier -112 5-MHz offset from carrier -118 Crystal oscillator running 85.1 88.4 s 9.6 9.6 s 21.5 21.5 s 721 s 88.4 (5) 9.3 PLL TX/RX settling time (6) 20.7 PLL calibration time (7) 694 721 PLL RX/TX settling time (1) (2) (3) (4) (5) (6) (7) dBc/Hz -129 10-MHz offset from carrier PLL turn-on / hop time (4) ppm All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). The resolution (in Hz) is equal for all frequency bands. Depends on crystal used. Required accuracy (including temperature and aging) depends on frequency band and channel bandwidth / spacing. Time from leaving the IDLE state until arriving in the RX, FSTXON, or TX state, when not performing calibration. Settling time for the 1-IF frequency step from RX to TX Settling time for the 1-IF frequency step from TX to RX Calibration can be initiated manually or automatically before entering or after leaving RX/TX. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 85 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Typical RSSI_offset Values TA = 25C, VCC = 3 V (unless otherwise noted) (1) RSSI_OFFSET (dB) DATA RATE (kBaud) (1) 433 MHz 868 MHz 1.2 74 74 38.4 74 74 250 74 74 500 74 74 All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48). 0 0 250kBaud 1.2kBaud -20 RSSI Readout [dBm] RSSI Readout [dBm] -20 38.4kBaud -40 -60 -80 -100 500kBaud -40 -60 -80 -100 -120 -120 -100 -80 -60 -40 Input Pow er [dBm ] -20 0 -120 -120 -100 -80 -60 -40 -20 0 Input Pow er [dBm ] Figure 26. Typical RSSI Value vs Input Power Level for Different Data Rates at 868 MHz 86 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated C19 Copyright (c) 2009-2011, Texas Instruments Incorporated C11 C10 DVCC VCORE R2 TCK TEST/SBWTCK CC430F61xx 34 35 36 37 38 39 40 41 42 43 44 45 46 47 C9 C8 VDD 16 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 15 14 13 12 11 10 9 8 7 6 5 4 3 2 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 1 C20 TMS RF_XIN RF_XOUT AVCC_RF AVCC_RF RF_P RF_N AVCC_RF AVCC_RF R_BIAS GUARD TDO TDI/TCLK R1 C21 26MHz AVDD (JTAG / SBW signals) C22 C4 C5 C1 C6 C2 C7 C3 (May be added close to the respective pins to reduce emissions at 5GHz to levels required by ETSI.) C16 C17 C18 L1 L2 L4 C23 C24 C25 C26 L3 C27 L5 L6 C28 L7 C29 SMA STRAIGHT JACK, SMT www.ti.com DVCC VDD C14 AVCC C12 AVSS C15 DVCC C13 VDD nRST/NMI/SBWTDIO AVDD ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 APPLICATION CIRCUIT For a complete reference design including layout see the CC430 Wireless Development Tools and related documentation (MSP430 Hardware Tools User's Guide, literature number SLAU278). Figure 27. Typical Application Circuit CC430F61xx Submit Documentation Feedback 87 C19 C11 VDD C10 DVCC VCORE C12 C13 C14 C15 R2 C20 32 31 5 6 C9 C8 VDD 25 12 13 14 15 16 17 18 19 20 21 22 23 24 27 26 11 28 9 10 29 8 30 33 4 7 34 3 CC430F513x 35 AVSS 2 TEST/SBWTCK 48 47 46 45 44 43 42 41 40 39 38 37 36 TCK 1 DVCC Submit Documentation Feedback AVCC VDD nRST/NMI/SBWTDIO AVDD TMS 88 DVCC RF_XIN RF_XOUT AVCC_RF AVCC_RF RF_P RF_N AVCC_RF AVCC_RF R_BIAS GUARD TDO TDI/TCLK C21 C16 C17 C18 R1 C22 C4 C5 C1 C6 C2 (May be added close to the respective pins to reduce emissions at 5GHz to levels required by ETSI.) 26MHz AVDD (JTAG / SBW signals) C7 C3 L1 L2 L4 C23 C24 C25 C26 L3 C27 L5 L6 C28 L7 C29 SMA STRAIGHT JACK, SMT CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com For a complete reference design including layout see the CC430 Wireless Development Tools and related documentation (MSP430 Hardware Tools User's Guide, literature number SLAU278). Figure 28. Typical Application Circuit CC430F51xx Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 48. Bill of Materials Component(s) (1) (2) For 315 MHz For 433 MHz For 868/915 MHz Comment C1,3,4,5,7,9,11,13,15 100 nF Decoupling capacitors C8,10,12,14 10 F Decoupling capacitors C2,6,16,17,18 2 pF Decoupling capacitors C19 470 nF VCORE capacitor C20 2.2 nF RST decoupling cap (optimized for SBW) C21,22 27 pF Load capacitors for 26 MHz crystal (1) R1 56 k R_BIAS (1% required) R2 47 k RST pullup L1,2 Capacitors: 220 pF 0.016 H 0.012 H L3,4 0.033 H 0.027 H 0.018 H L5 0.033 H 0.047 H 0.015 H L6 dnp (2) dnp (2) 0.0022 H L7 0.033 H 0.051 H 0.015 H (2) C23 dnp 2.7 pF 1 pF C24 220 pF 220 pF 100 pF C25 6.8 pF 3.9 pF 1.5 pF C26 6.8 pF 3.9 pF 1.5 pF C27 220 pF 220 pF 1.5 pF C28 10 pF 4.7 pF 8.2 pF C29 220 pF 220 pF 1.5 pF The load capacitance CL seen by the crystal is CL = 1/((1/C21)+(1/C22)) + Cparasitic. The parasitic capacitance Cparasitic includes pin capacitance and PCB stray capacitance. It can be typically estimated to be approximately 2.5 pF. dnp = do not populate Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 89 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com INPUT/OUTPUT SCHEMATICS Port P1, P1.0 to P1.4, Input/Output With Schmitt Trigger S18...S22 (n/a CC430F513x) LCDS18...LCDS22 Pad Logic P1REN.x P1MAP.x = PMAP_ANALOG P1DIR.x 0 from Port Mapping 1 P1OUT.x 0 from Port Mapping 1 DVSS 0 DVCC 1 1 Direction 0: Input 1: Output P1DS.x 0: Low drive 1: High drive P1SEL.x P1IN.x Bus Keeper EN to Port Mapping P1.0/P1MAP0(/S18) P1.1/P1MAP1(/S19) P1.2/P1MAP2(/S20) P1.3/P1MAP3(/S21) P1.4/P1MAP4(/S22) D P1IE.x EN P1IRQ.x Q P1IFG.x P1SEL.x P1IES.x Set Interrupt Edge Select CC430F513x devices don't provide LCD functionality on port P1 pins. 90 Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 49. Port P1 (P1.0 to P1.4) Pin Functions CONTROL BITS/SIGNALS (1) PIN NAME (P1.x) P1.0/P1MAP/S18 x 0 FUNCTION P1.0 (I/O) P1.2/P1MAP2/S20 P1.3/P1MAP3/S21 1 2 3 (1) (2) (3) 4 P1MAPx LCDS19... 22 (2) I: 0; O: 1 0 X 0 0; 1 (3) 1 30 (3) 0 Output driver and input Schmitt trigger disabled X 1 = 31 0 X X X 1 I: 0; O: 1 0 X 0 Mapped secondary digital function - see Table 9 0; 1 (3) 1 30 (3) 0 Output driver and input Schmitt trigger disabled X 1 = 31 0 S19 (not available on CC430F513x) X X X 1 I: 0; O: 1 0 X 0 Mapped secondary digital function - see Table 9 0; 1 (3) 1 30 (3) 0 Output driver and input Schmitt trigger disabled X 1 = 31 0 S22 (not available on CC430F513x) X X X 1 I: 0; O: 1 0 X P1.1 (I/O) P1.2 (I/O) P1.3 (I/O) Mapped secondary digital function - see Table 9 P1.4/P1MAP4/S22 P1SEL.x Mapped secondary digital function - see Table 9 S18 (not available on CC430F513x) P1.1/P1MAP1/S19 P1DIR.x 0; 1 (3) 1 30 0 (3) 0 Output driver and input Schmitt trigger disabled X 1 = 31 0 S21 (not available on CC430F513x) X X X 1 P1.4 (I/O) I: 0; O: 1 0 X 0 Mapped secondary digital function - see Table 9 0; 1 (3) 1 30 (3) 0 Output driver and input Schmitt trigger disabled X 1 = 31 0 S22 (not available on CC430F513x) X X X 1 X = don't care LCDSx not available in CC430F513x. According to mapped function - see Table 9. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 91 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Port P1, P1.5 to P1.7, Input/Output With Schmitt Trigger to LCD_B (n/a CC430F513x) Pad Logic P1REN.x P1MAP.x = PMAP_ANALOG P1DIR.x 0 from Port Mapping 1 P1OUT.x 0 from Port Mapping 1 DVSS 0 DVCC 1 1 Direction 0: Input 1: Output P1.5/P1MAP5(/R23) P1.6/P1MAP6(/R13) P1.7/P1MAP7(/R03) P1DS.x 0: Low drive 1: High drive P1SEL.x P1IN.x Bus Keeper EN to Port Mapping D P1IE.x EN P1IRQ.x Q P1IFG.x P1SEL.x P1IES.x Set Interrupt Edge Select CC430F513x devices don't provide LCD functionality on port P1 pins. Table 50. Port P1 (P1.5 to P1.7) Pin Functions PIN NAME (P1.x) P1.5/P1MAP5/R23 x 5 FUNCTION P1.5 (I/O) Mapped secondary digital function - see Table 9 R23 (3) (not available on CC430F513x) P1.6/P1MAP6/R13/ LCDREF P1.7/P1MAP7/R03 6 7 P1.6 (I/O) P1SEL.x 0 P1MAPx X 0; 1 (2) 1 30 (2) X 1 = 31 I: 0; O: 1 0 X 0; 1 (2) 1 30 (2) R13/LCDREF (3) (not available on CC430F513x) X 1 = 31 I: 0; O: 1 0 X 0; 1 (2) 1 30 (2) X 1 = 31 P1.7 (I/O) R03 (3) (not available on CC430F513x) 92 P1DIR.x I: 0; O: 1 Mapped secondary digital function - see Table 9 Mapped secondary digital function - see Table 9 (1) (2) (3) CONTROL BITS/SIGNALS (1) X = don't care According to mapped function - see Table 9. Setting P1SEL.x bit together with P1MAPx = PM_ANALOG disables the output driver as well as the input Schmitt trigger. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Port P2, P2.0 to P2.3, Input/Output With Schmitt Trigger Pad Logic To ADC12 (n/a CC430F612x) INCHx = x To Comparator_B from Comparator_B CBPD.x P2REN.x P2MAP.x = PMAP_ANALOG P2DIR.x 0 from Port Mapping 1 P2OUT.x 0 from Port Mapping 1 DVSS 0 DVCC 1 Direction 0: Input 1: Output P2DS.x 0: Low drive 1: High drive P2SEL.x P2IN.x P2.0/P2MAP0/CB0(/A0) P2.1/P2MAP2/CB1(/A1) P2.2/P2MAP2/CB2(/A2) P2.3/P2MAP3/CB3(/A3) Bus Keeper EN to Port Mapping 1 D P2IE.x EN P2IRQ.x Q P2IFG.x P2SEL.x P2IES.x Copyright (c) 2009-2011, Texas Instruments Incorporated Set Interrupt Edge Select Submit Documentation Feedback 93 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Port P2, P2.4 to P2.5, Input/Output With Schmitt Trigger Pad Logic to/from Reference (n/a CC430F612x) To ADC12 (n/a CC430F612x) INCHx = x To Comparator_B from Comparator_B CBPD.x P2REN.x P2MAP.x = PMAP_ANALOG P2DIR.x 0 from Port Mapping 1 P2OUT.x 0 from Port Mapping 1 DVSS 0 DVCC 1 1 Direction 0: Input 1: Output P2DS.x 0: Low drive 1: High drive P2SEL.x P2.4/P2MAP4/CB4(/A4/VREF-/VeREF-) P2.5/P2MAP5/CB5(/A5/VREF+/VeRF+) P2IN.x Bus Keeper EN to Port Mapping D P2IE.x EN P2IRQ.x Q P2IFG.x P2SEL.x P2IES.x 94 Submit Documentation Feedback Set Interrupt Edge Select Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Port P2, P2.6 and P2.7, Input/Output With Schmitt Trigger Pad Logic To ADC12 (n/a CC430F513x) INCHx = x To Comparator_B (n/a CC430F513x) from Comparator_B CBPD.x (n/a CC430F513x) P2REN.x P2MAP.x = PMAP_ANALOG P2DIR.x 0 from Port Mapping 1 P2OUT.x 0 from Port Mapping 1 DVSS 0 DVCC 1 1 Direction 0: Input 1: Output P2DS.x 0: Low drive 1: High drive P2SEL.x P2.6/P2MAP6(/CB6/A6) P2.7/P2MAP7(/CB7/A7) P2IN.x Bus Keeper EN to Port Mapping D P2IE.x EN P2IRQ.x Q P2IFG.x P2SEL.x P2IES.x Set Interrupt Edge Select CC430F513x devices don't provide analog functionality on port P2.6 and P2.7 pins. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 95 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 51. Port P2 (P2.0 to P2.7) Pin Functions PIN NAME (P2.x) P2.0/P2MAP0/CB0 (/A0) P2.1/P2MAP1/CB1 (/A1) x 0 CONTROL BITS/SIGNALS (1) FUNCTION P2DIR.x P2SEL.x I: 0; O: 1 0; 1 (2) A0 (not available on CC430F612x) (3) CB0 (4) P2.0 (I/O) Mapped secondary digital function - see Table 9 1 P2.1 (I/O) Mapped secondary digital function - see Table 9 A1 (not available on CC430F612x) (3) CB1 (4) P2.2/P2MAP2/CB2 (/A2) 2 P2.2 (I/O) Mapped secondary digital function - see Table 9 A2 (not available on CC430F612x) (3) CB2 (4) P2.3/P2MAP3/CB3 (/A3) 3 P2.3 (I/O) Mapped secondary digital function - see Table 9 A3 (not available on CC430F612x) (3) CB3 (4) P2.4/P2MAP4/CB4 (/A4/VREF-/VeREF-) P2.5/P2MAP5/CB5 (/A5/VREF+/VeREF+) P2.6/P2MAP6(/CB6) (/A6) 4 P2.4 (I/O) Mapped secondary digital function - see Table 9 5 96 0 30 (2) 0 X 1 = 31 X X X X 1 I: 0; O: 1 0 X 0 0; 1 (2) 1 30 (2) 0 X 1 = 31 X X X X 1 I: 0; O: 1 0 X 0 0; 1 (2) 1 30 (2) 0 X 1 = 31 X X X X 1 I: 0; O: 1 0 X 0 0; 1 (2) 1 30 (2) 0 X 1 = 31 X X X X 1 I: 0; O: 1 0 X 0; 1 (2) 1 30 0 (2) 0 = 31 X CB4 (4) X X X 1 I: 0; O: 1 0 X 0 0; 1 (2) 1 30 (2) 0 A5/VREF+/VeREF+ (not available on CC430F612x) (3) X 1 = 31 X CB5 (4) X X X 1 I: 0; O: 1 0 X 0 0; 1 (2) 1 30 (2) 0 X 1 = 31 X P2.5 (I/O) P2.6 (I/O) CB6 (not available on CC430F513x) (4) (1) (2) (3) (4) X 1 1 Mapped secondary digital function - see Table 9 7 0 X A6 (not available on CC430F612x and CC430F513x) (3) P2.7/P2MAP7(/CB7) (/A7) CBPD.x A4/VREF-/VeREF- (not available on CC430F612x) (3) Mapped secondary digital function - see Table 9 6 P2MAPx X X X 1 I: 0; O: 1 0 X 0 0; 1 (2) 1 30 (2) 0 A7 (not available on CC430F612x and CC430F513x) (3) X 1 = 31 X CB7 (not available on CC430F513x) (4) X X X 1 P2.7 (I/O) Mapped secondary digital function - see Table 9 X = don't care According to mapped function - see Table 9. Setting P2SEL.x bit together with P2MAPx = PM_ANALOG disables the output driver as well as the input Schmitt trigger. Setting the CBPD.x bit disables the output driver as well as the input Schmitt trigger to prevent parasitic cross currents when applying analog signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input buffer for that pin, regardless of the state of the associated CBPD.x bit. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger S10...S17 (n/a CC430F513x) LCDS10...LCDS17 Pad Logic P3REN.x P3MAP.x = PMAP_ANALOG P3DIR.x 0 from Port Mapping 1 P3OUT.x 0 from Port Mapping 1 DVSS 0 DVCC 1 Direction 0: Input 1: Output P3DS.x 0: Low drive 1: High drive P3SEL.x P3IN.x EN to Port Mapping 1 D Bus Keeper P3.0/P3MAP0(/S10) P3.1/P3MAP1(/S11) P3.2/P3MAP2(/S12) P3.3/P3MAP3(/S13) P3.4/P3MAP4(/S14) P3.5/P3MAP5(/S15) P3.6/P3MAP6(/S16) P3.7/P3MAP7(/S17) CC430F513x devices don't provide LCD functionality on port P3 pins. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 97 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 52. Port P3 (P3.0 to P3.7) Pin Functions CONTROL BITS/SIGNALS (1) PIN NAME (P3.x) P3.0/P3MAP0/S10 x 0 FUNCTION P3.0 (I/O) P3.2/P3MAP7/S12 P3.3/P3MAP3/S13 1 2 3 P3.5/P3MAP5/S15 4 5 P3.7/P3MAP7/S17 (1) (2) (3) 98 6 7 LCDS10... 17 (2) 0 X 0 0; 1 (3) 1 30 (3) 0 Output driver and input Schmitt trigger disabled X 1 = 31 0 X X X 1 I: 0; O: 1 0 X 0 Mapped secondary digital function - see Table 9 0; 1 (3) 1 30 (3) 0 Output driver and input Schmitt trigger disabled X 1 = 31 0 S11 (not available on CC430F513x) X X X 1 I: 0; O: 1 0 X 0 Mapped secondary digital function - see Table 9 0; 1 (3) 1 30 (3) 0 Output driver and input Schmitt trigger disabled X 1 = 31 0 S12 (not available on CC430F513x) X X X 1 I: 0; O: 1 0 X P3.1 (I/O) P3.2 (I/O) P3.3 (I/O) 0; 1 (3) 1 30 0 (3) 0 Output driver and input Schmitt trigger disabled X 1 = 31 0 S13 (not available on CC430F513x) X X X 1 P3.4 (I/O) I: 0; O: 1 0 X 0 Mapped secondary digital function - see Table 9 0; 1 (3) 1 30 (3) 0 Output driver and input Schmitt trigger disabled X 1 = 31 0 S14 (not available on CC430F513x) X X X 1 P3.5 (I/O) I: 0; O: 1 0 X 0 Mapped secondary digital function - see Table 9 0; 1 (3) 1 30 (3) 0 Output driver and input Schmitt trigger disabled X 1 = 31 0 S15 (not available on CC430F513x) P3.6/P3MAP6/S16 P3MAPx I: 0; O: 1 Mapped secondary digital function - see Table 9 P3.4/P3MAP4/S14 P3SEL.x Mapped secondary digital function - see Table 9 S10 (not available on CC430F513x) P3.1/P3MAP1/S11 P3DIR.x X X X 1 I: 0; O: 1 0 X 0 Mapped secondary digital function - see Table 9 0; 1 (3) 1 30 (3) 0 Output driver and input Schmitt trigger disabled X 1 = 31 0 S16 (not available on CC430F513x) X X X 1 I: 0; O: 1 0 X 0 Mapped secondary digital function - see Table 9 0; 1 (3) 1 30 (3) 0 Output driver and input Schmitt trigger disabled X 1 = 31 0 S17 (not available on CC430F513x) X X X 1 P3.6 (I/O) P3.7 (I/O) X = don't care LCDSx not available in CC430F513x. According to mapped function - see Table 9. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger (CC430F613x and CC430F612x only) S2...S9 LCDS2...LCDS9 Pad Logic P4REN.x P4DIR.x 0 0 DVSS 1 0 DVCC 1 P4DS.x 0: Low drive 1: High drive P4SEL.x P4IN.x EN Not Used 1 Direction 0: Input 1: Output 1 P4OUT.x DVSS D Copyright (c) 2009-2011, Texas Instruments Incorporated Bus Keeper P4.0/S2 P4.1/S3 P4.2/S4 P4.3/S5 P4.4/S6 P4.5/S7 P4.6/S8 P4.7/S9 Submit Documentation Feedback 99 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 53. Port P4 (P4.0 to P4.7) Pin Functions (CC430F613x and CC430F612x only) PIN NAME (P4.x) P4.0/P4MAP0/S2 P4.1/P4MAP1/S3 x 0 1 FUNCTION P4.0 (I/O) 2 3 P4.5/P4MAP5/S7 P4.6/P4MAP6/S8 4 5 6 0 0 1 0 DVSS 1 1 0 S2 X X 1 P4.1 (I/O) I: 0; O: 1 0 0 N/A 0 1 0 DVSS 1 1 0 P4.2 (I/O) 7 100 X 1 0 0 0 1 0 1 1 0 S4 X X 1 I: 0; O: 1 0 0 0 1 0 P4.3 (I/O) DVSS 1 1 0 S5 X X 1 I: 0; O: 1 0 0 N/A 0 1 0 DVSS 1 1 0 S6 X X 1 P4.4 (I/O) P4.5 (I/O) I: 0; O: 1 0 0 N/A 0 1 0 DVSS 1 1 0 S7 X X 1 P4.6 (I/O) I: 0; O: 1 0 0 N/A 0 1 0 DVSS 1 1 0 P4.7 (I/O) N/A (1) X I: 0; O: 1 DVSS S8 P4.7/P4MAP7/S9 LCDS2...7 0 N/A P4.4/P4MAP4/S6 P4SEL.x I: 0; O: 1 N/A P4.3/P4MAP3/S5 P4DIR.x N/A S3 P4.2/P4MAP7/S4 CONTROL BITS/SIGNALS (1) X X 1 I: 0; O: 1 0 0 0 1 0 DVSS 1 1 0 S9 X X 1 X = don't care Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Port P5, P5.0, Input/Output With Schmitt Trigger Pad Logic to XT1 P5REN.0 P5DIR.0 DVSS 0 DVCC 1 1 0 1 P5OUT.0 0 Module X OUT 1 P5DS.x 0: Low drive 1: High drive P5SEL.0 P5.0/XIN P5IN.0 EN Module X IN Bus Keeper D Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 101 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Port P5, P5.1, Input/Output With Schmitt Trigger Pad Logic to XT1 P5REN.1 P5DIR.1 DVSS 0 DVCC 1 1 0 1 P5OUT.1 0 Module X OUT 1 P5.1/XOUT P5DS.x 0: Low drive 1: High drive P5SEL.0 XT1BYPASS P5IN.1 Bus Keeper EN Module X IN D Table 54. Port P5 (P5.0 and P5.1) Pin Functions PIN NAME (P5.x) P5.0/XIN P5.1/XOUT (1) (2) (3) 102 x 0 1 FUNCTION P5.0 (I/O) CONTROL BITS/SIGNALS (1) P5DIR.x P5SEL.0 P5SEL.1 XT1BYPASS I: 0; O: 1 0 X X XIN crystal mode (2) X 1 X 0 XIN bypass mode (2) X 1 X 1 I: 0; O: 1 0 X X XOUT crystal mode (3) X 1 X 0 P5.1 (I/O) (3) X 1 X 1 P5.1 (I/O) X = don't care Setting P5SEL.0 causes the general-purpose I/O to be disabled. Pending the setting of XT1BYPASS, P5.0 is configured for crystal mode or bypass mode. Setting P5SEL.0 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.1 can be used as general-purpose I/O. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Port P5, P5.2 to P5.4, Input/Output With Schmitt Trigger (CC430F613x and CC430F612x only) S0(P5.2)/S1(P5.3)/S23(P5.4) LCDS0(P5.2)/LCDS1(P5.3)/LCDS23(P5.4) Pad Logic P5REN.x P5DIR.x DVSS 0 DVCC 1 1 0 1 P5OUT.x 0 DVSS 1 P5.2/S0 P5.3/S1 P5.4/S23 P5DS.x 0: Low drive 1: High drive P5SEL.x P5IN.x Bus Keeper EN Not Used D Table 55. Port P5 (P5.2 to P5.3) Pin Functions (CC430F613x and CC430F612x only) PIN NAME (P5.x) P5.2/S0 x 2 FUNCTION P5.2 (I/O) N/A P5.3/S1 (1) 3 CONTROL BITS/SIGNALS (1) P5DIR.x P5SEL.x LCDS0...1 I: 0; O: 1 0 0 0 1 0 DVSS 1 1 0 S0 X X 1 I: 0; O: 1 0 0 N/A 0 1 0 DVSS 1 1 0 S1 X X 1 P5.3 (I/O) X = don't care Table 56. Port P5 (P5.4) Pin Functions (CC430F613x and CC430F612x only) PIN NAME (P5.x) P5.4/S23 (1) x 4 FUNCTION CONTROL BITS/SIGNALS (1) P5DIR.x P5SEL.x LCDS23 I: 0; O: 1 0 0 N/A 0 1 0 DVSS 1 1 0 S23 X X 1 P5.4 (I/O) X = don't care Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 103 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Port P5, P5.5 to P5.7, Input/Output With Schmitt Trigger (CC430F613x and CC430F612x only) S24(P5.5)/S25(P5.6)/S26(P5.7) LCDS24(P5.5)/LCDS25(P5.6)/LCDS26(P5.7) COM3(P5.5)/COM2(P5.6)/COM1(P5.7) Pad Logic P5REN.x DVSS 0 DVCC 1 1 P5DIR.x P5OUT.x P5.5/COM3/S24 P5.6/COM2/S25 P5.7/COM1/S26 P5DS.x 0: Low drive 1: High drive P5SEL.x P5IN.x Bus Keeper Table 57. Port P5 (P5.5 to P5.7) Pin Functions (CC430F613x and CC430F612x only) PIN NAME (P5.x) P5.5/COM3/S24 P5.6/COM2/S25 P5.7/COM1/S26 (1) (2) 104 x 5 6 7 FUNCTION CONTROL BITS/SIGNALS (1) P5DIR.x P5SEL.x P5.5 (I/O) I: 0; O: 1 0 LCDS24...26 0 COM3 (2) X 1 X S24 (2) X 0 1 P5.6 (I/O) I: 0; O: 1 0 0 COM2 (2) X 1 X S25 (2) X 0 1 P5.7 (I/O) I: 0; O: 1 0 0 COM1 (2) X 1 X S26 (2) X 0 1 X = don't care Setting P5SEL.x bit disables the output driver as well as the input Schmitt trigger. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output Pad Logic PJREN.0 PJDIR.0 0 DVCC 1 PJOUT.0 0 From JTAG 1 DVSS 0 DVCC 1 1 PJ.0/TDO PJDS.0 0: Low drive 1: High drive From JTAG PJIN.0 Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output Pad Logic PJREN.x PJDIR.x 0 DVSS 1 PJOUT.x 0 From JTAG 1 DVSS 0 DVCC 1 1 PJDS.x 0: Low drive 1: High drive From JTAG PJ.1/TDI/TCLK PJ.2/TMS PJ.3/TCK PJIN.x EN To JTAG D Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 105 CC430F613x CC430F612x CC430F513x ECCN 5E002 TSPA - Technology / Software Publicly Available SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 58. Port PJ (PJ.0 to PJ.3) Pin Functions PIN NAME (PJ.x) x CONTROL BITS/ SIGNALS (1) FUNCTION PJDIR.x PJ.0/TDO 0 (2) I: 0; O: 1 PJ.1 (I/O) (2) I: 0; O: 1 PJ.0 (I/O) TDO (3) PJ.1/TDI/TCLK 1 X TDI/TCLK (3) PJ.2/TMS 2 PJ.2 (I/O) TMS (3) PJ.3/TCK 3 (1) (2) (3) (4) 106 X I: 0; O: 1 (4) PJ.3 (I/O) TCK (3) (4) (2) X (2) I: 0; O: 1 (4) X X = don't care Default condition The pin direction is controlled by the JTAG module. In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are do not care. Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Device Descriptor Structures Table 59 lists the content of the device descriptor tag-length-value (TLV) structure for CC430F613x and CC430F613x device types. Table 60 lists the content of the device descriptor tag-length-value (TLV) structure for CC430F612x device types. Table 59. Device Descriptor Table Info Block Die Record ADC12 Calibration REF Calibration Description Address Size bytes 'F6137 'F6135 'F5137 'F5135 'F5133 Value Value Value Value Value 06h Info length 01A00h 1 06h 06h 06h 06h CRC length 01A01h 1 06h 06h 06h 06h 06h CRC value 01A02h 2 per unit per unit per unit per unit per unit Device ID 01A04h 1 61h 61h 51h 51h 51h Device ID 01A05h 1 37h 35h 37h 35h 33h Hardware revision 01A06h 1 per unit per unit per unit per unit per unit Firmware revision 01A07h 1 per unit per unit per unit per unit per unit Die Record Tag 01A08h 1 08h 08h 08h 08h 08h Die Record length 01A09h 1 0Ah 0Ah 0Ah 0Ah 0Ah Lot/Wafer ID 01A0Ah 4 per unit per unit per unit per unit per unit Die X position 01A0Eh 2 per unit per unit per unit per unit per unit Die Y position 01A10h 2 per unit per unit per unit per unit per unit Test results 01A12h 2 per unit per unit per unit per unit per unit ADC12 Calibration Tag 01A14h 1 11h 11h 11h 11h 11h ADC12 Calibration length 01A15h 1 10h 10h 10h 10h 10h ADC Gain Factor 01A16h 2 per unit per unit per unit per unit per unit ADC Offset 01A18h 2 per unit per unit per unit per unit per unit ADC 1.5V Reference Temp. Sensor 30C 01A1Ah 2 per unit per unit per unit per unit per unit ADC 1.5V Reference Temp. Sensor 85C 01A1Ch 2 per unit per unit per unit per unit per unit ADC 2.0V Reference Temp. Sensor 30C 01A1Eh 2 per unit per unit per unit per unit per unit ADC 2.0V Reference Temp. Sensor 85C 01A20h 2 per unit per unit per unit per unit per unit ADC 2.5V Reference Temp. Sensor 30C 01A22h 2 per unit per unit per unit per unit per unit ADC 2.5V Reference Temp. Sensor 85C 01A24h 2 per unit per unit per unit per unit per unit REF Calibration Tag 01A26h 1 12h 12h 12h 12h 12h REF Calibration length 01A27h 1 06h 06h 06h 06h 06h Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 107 ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com Table 59. Device Descriptor Table (continued) Peripheral Descriptor (PD) Description Address Size bytes 'F6137 'F6135 'F5137 'F5135 'F5133 Value Value Value Value Value 1.5V Reference Factor 01A28h 2 per unit per unit per unit per unit per unit 2.0V Reference Factor 01A2Ah 2 per unit per unit per unit per unit per unit 2.5V Reference Factor 01A2Ch 2 per unit per unit per unit per unit per unit Peripheral Descriptor Tag 01A2Eh 1 02h 02h 02h 02h 02h Peripheral Descriptor Length 01A2Fh 1 57h 57h 55h 55h 55h Peripheral Descriptors 01A30h PD Length ... ... ... ... ... Table 60. Device Descriptor Table CC430F612x Info Block Die Record Empty Descriptor REF Calibration Peripheral Descriptor (PD) 108 Description Address Size bytes 'F6127 'F6126 'F6125 Value Value Value 06h Info length 01A00h 1 06h 06h CRC length 01A01h 1 06h 06h 06h CRC value 01A02h 2 per unit per unit per unit Device ID 01A04h 1 61h 61h 61h Device ID 01A05h 1 27h 26h 25h Hardware revision 01A06h 1 per unit per unit per unit Firmware revision 01A07h 1 per unit per unit per unit Die Record Tag 01A08h 1 08h 08h 08h Die Record length 01A09h 1 0Ah 0Ah 0Ah Lot/Wafer ID 01A0Ah 4 per unit per unit per unit Die X position 01A0Eh 2 per unit per unit per unit Die Y position 01A10h 2 per unit per unit per unit Test results 01A12h 2 per unit per unit per unit Empty Tag 01A14h 1 05h 05h 05h Empty Tag Length 01A15h 1 10h 10h 10h 01A16h 16 undefined undefined undefined REF Calibration Tag 01A26h 1 12h 12h 12h REF Calibration length 01A27h 1 06h 06h 06h 1.5V Reference Factor 01A28h 2 per unit per unit per unit 2.0V Reference Factor 01A2Ah 2 per unit per unit per unit 2.5V Reference Factor 01A2Ch 2 per unit per unit per unit Peripheral Descriptor Tag 01A2Eh 1 02h 02h 02h Peripheral Descriptor Length 01A2Fh 1 55h 55h 55h Peripheral Descriptors 01A30h PD Length ... ... ... Submit Documentation Feedback Copyright (c) 2009-2011, Texas Instruments Incorporated ECCN 5E002 TSPA - Technology / Software Publicly Available CC430F613x CC430F612x CC430F513x SLAS554F - MAY 2009 - REVISED DECEMBER 2011 www.ti.com REVISION HISTORY REVISION DESCRIPTION SLAS554 Product Preview data sheet release SLAS554A Product Preview data sheet updated with electrical parameters SLAS554B Production Data release data sheet for CC430F51xx devices. CC430F61xx devices are Product Preview. SLAS554C Production Data release data sheet for CC430F61xx devices. SLAS554D Added correct termination of LCDCAP/R33 if not used. Corrected unit in Frequency Synthesizer Characteristics from "ms" to "s". SLAS554E Removed RFRXIFG (14) and RFTXIFG (15) from DMA Trigger Assignments table Corrected USCI control register location in Peripheral File Map. Changed Tstg maximum limit from 105C to 150C in Absolute Maximum Ratings. Replaced values for "Hardware revision" and "Firmware revision" in Device Descriptor Tables with "per unit". SLAS554F Table 3, Corrected USCI signal names for pins 5 and 6 (descriptions unchanged). 12-Bit ADC, Linearity Parameters Using an External Reference Voltage or AVCC as Reference Voltage, ADC12 linearity parameter test conditions revised. 12-Bit ADC, Linearity Parameters Using the Internal Reference Voltage, linearity parameters with internal reference added. Copyright (c) 2009-2011, Texas Instruments Incorporated Submit Documentation Feedback 109 PACKAGE OPTION ADDENDUM www.ti.com 26-Jun-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) CC430F5133IRGZ ACTIVE VQFN RGZ 48 52 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F5133IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F5133IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F5135IRGZ ACTIVE VQFN RGZ 48 52 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F5135IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F5135IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F5137IRGZ ACTIVE VQFN RGZ 48 52 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F5137IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F5137IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F6125IRGC ACTIVE VQFN RGC 64 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F6125IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F6125IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F6126IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F6126IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F6127IRGC ACTIVE VQFN RGC 64 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F6127IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F6127IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Addendum-Page 1 Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 26-Jun-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) CC430F6135IRGC ACTIVE VQFN RGC 64 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F6135IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F6135IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F6137IRGC ACTIVE VQFN RGC 64 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F6137IRGCR ACTIVE VQFN RGC 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR CC430F6137IRGCT ACTIVE VQFN RGC 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 26-Jun-2012 Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 16-Feb-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CC430F5133IRGZR VQFN RGZ 48 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 CC430F5133IRGZT VQFN RGZ 48 250 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 CC430F5135IRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 CC430F5135IRGZT VQFN RGZ 48 250 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 CC430F5137IRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 CC430F5137IRGZT VQFN RGZ 48 250 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 CC430F6125IRGCT VQFN RGC 64 250 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 CC430F6126IRGCT VQFN RGC 64 250 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 CC430F6127IRGCT VQFN RGC 64 250 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 CC430F6135IRGCT VQFN RGC 64 250 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 CC430F6137IRGCT VQFN RGC 64 250 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Feb-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC430F5133IRGZR VQFN RGZ 48 2500 336.6 336.6 28.6 CC430F5133IRGZT VQFN RGZ 48 250 336.6 336.6 28.6 CC430F5135IRGZR VQFN RGZ 48 2500 336.6 336.6 28.6 CC430F5135IRGZT VQFN RGZ 48 250 336.6 336.6 28.6 CC430F5137IRGZR VQFN RGZ 48 2500 336.6 336.6 28.6 CC430F5137IRGZT VQFN RGZ 48 250 336.6 336.6 28.6 CC430F6125IRGCT VQFN RGC 64 250 336.6 336.6 28.6 CC430F6126IRGCT VQFN RGC 64 250 336.6 336.6 28.6 CC430F6127IRGCT VQFN RGC 64 250 336.6 336.6 28.6 CC430F6135IRGCT VQFN RGC 64 250 336.6 336.6 28.6 CC430F6137IRGCT VQFN RGC 64 250 336.6 336.6 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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