(0,80 mm) .0315"
HSEC8-DV SERIES
HSEC8–125–01–L–DV–A
HSEC8–149–01–L–DV–A
Mates with (1,60 mm) .062"
WWW.SAMTEC.COMWWW.SAMTEC.COM
OTHER
OPTION
HSEC8
09, 10, 13, 20, 25, 30,
37, 40, 49, 50, 60
(13, 25, 49 only available
with –L or –L2 option;
09 only available with –L2 option;
37 only available with –L option)
F-213-1
Mates with:
1,60 mm thick cards,
ECDP, HSC8
PLATING
OPTION DV
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?HSEC8-DV
Insulator Material:
Black Liquid
Crystal Polymer
Contact: BeCu
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
1.9A per contact
@ 30°C Temperature Rise
(See website for details)
Operating Temp:
-55°C to +125°C
Card Insertion Depth:
(3,15 mm) .125" nominal
RoHS Compliant: Ye s
Processing:
Lead–Free Solderable: Ye s
SMT Lead Coplanarity:
(0,10 mm) .004" max (10-60)
Note: Some lengths, styles
and options are non-standard,
non-returnable.
Note: While optimized for 50Ω
applications, this connector
with alternative signal/ground
patterns may also perform well
in certain 75Ω applications.
Contact Samtec for further
information.
1CARD
THICKNESS A
POSITIONS
PER ROW
–EM to –DV
10, 20 & 30
STANDARD &
CUSTOM CARDS
AVAILABLE
• Standard high speed
interface cards for 19 mm,
25 mm & 30 mm mated
heights, single-ended &
differential applications.
See HSC8 Series.
• (2,36 mm) .093" thick card
• Custom cards for low-cost
stack height customization
• Samtec supplied card
layout/
artwork
to make
your
own
cards
• Specialty card shapes
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–DV to –DV PCB to –DV
BOARD-TO-BOARD
APPLICATIONS
–DV to ECDP
HIGH SPEED CABLE
APPLICATIONS
01
02
01
02
(0,80) .0315
(7,80)
.307
(7,00)
.276
No. of Positions x (0,80) .0315 + (4,60) .181
No. of Positions x(0,80) .0315 + (2,20) .087
(7,98)
.314
(1,75)
.070
(5,60)
.220
(1,12) .044 DIA
D
E
No. of Positions x (0,80) .0315 + (7,80) .307
(7,98)
.314
(4,25)
.167
(1,32)
.052
–L
SPECIFICATIONS
Note: Other Gold plating
options available.
Contact Samtec.
–L
= 10µ" (0,25 µm)
Gold on contact,
Matte Tin on tail
™
APPLICATION
SPECIFIC OPTION
Guide rails and
pass-through options.
Call Samtec.
VERTICAL EDGE RATE™ CARD SOCKET
POSITIONS
PER ROW DE
09 (4.50) .177 (11,80) .458
13* (6,10) .240 (15,00) .591
25* (6,10) .240 (24,60) .969
37 (18,10) .713 (34,20) 1.346
40 (18,90) .744 (36,60) 1.441
49* (22,90) .902 (43,80) 1.724
50 (22,90) .902 (44,60) 1.756
60 (26,90) 1.059 (52,60) 2.071
Positions where no dimensions are given
do not have keying feature.
*Mates with ECDP Series.
–BL
–K
= (5,50 mm) .217" DIA
Polyimide Film
Pick & Place Pad
–BL
= Board Locks
(40, 50, 60 only)
(Other sizes available.
Contact Samtec.)
–L
= Latching Option
(13, 25, 37, 49 only)
–L2
= ECDP Latching
09, 13, 25, 49 only
(For use with ECDP)
–WT
= Weld tab
–TR
= Tape & Reel
HSEC8
7,98 mm Stack Height
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
Single-Ended Signaling 8 GHz / 16 Gbps 9 GHz / 18 Gbps
Differential Pair Signaling 10.5 GHz / 21 Gbps 14 GHz / 28 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Complete test data available at www.samtec.com?HSEC8-DV
or contact sig@samtec.com
–01
= (1,60 mm) .062"
thick card
CABLE CONNECTOR
ECDP–04 HSEC8–109–L2
ECDP–08 HSEC8–113–L2
ECDP–16 HSEC8–125–L2
ECDP–32 HSEC8–149–L2
